Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 (503) 268-8000 [email protected] Package: Total Device Weight Die % of Total Pkg. Wt. 2.26% Bumps 0.105% August, 2010 Lid Thermal Paste Adhesive Underfill Thermal Conductive Paste Solder Balls 49.93% 0.76% 0.42% 0.87% 10.27% Weight (g) 1020 fcBGA 9.50 Grams % of Total Weight (g) Pkg. Wt. 0.215 with SnPb Solder Balls Version 2 MSL: 4 Peak Reflow Temp: 225°C Substance CAS # Notes / Assumptions: Silicon (Si) 7440-21-3 Die Size: 13.60 x 13.07mm 0.010 0.105% 0.003% 0.0099 0.0003 Tin (Sn) Silver (Ag) 7440-31-5 7440-22-4 97.4% 2.6% 49.63% 0.300% 4.714 0.0285 Copper (Cu) Nickel (Ni) 7440-50-8 7440-02-0 99.4% 0.6% 0.68% 0.08% 0.065 0.007 Alumina Others 0.013% 0.042% 0.063% 0.042% 0.236% 0.004% 0.021% 0.0012 0.004 0.006 0.004 0.0224 0.0004 0.002 Bisphenol A type liquid epoxy resin Bisphenol F type liquid epoxy resin Naphthalene Amine type accelerator Silicon dioxide Carbon black Additives 0.66% 0.22% 0.0623 0.0208 Aluminum Resin and additive mixture 8.73% 1.540% 0.829 0.1463 Tin (Sn) Lead (Pb) 4.742 0.072 1344-28-1 90.0% Trade Secret 10.0% 0.040 25068-38-6 9003-36-5 27610-48-6 Trade Secret 60676-86-0 1333-86-4 Trade Secret 3.0% 10.0% 15.0% 10.0% 56.0% 1.0% 5.0% 0.083 7429-90-5 75.0% Trade Secret 25.0% 0.975 Page 1 of 2 7440-31-5 7439-92-1 85.0% 15.0% Substrate 21.53% 2.045 2.33% 0.26% 0.26% 3.33% 7.68% 7.68% Foil 13.85% 0.221 0.0247 0.0247 0.317 0.729 0.729 Bisphenol A: Epoxy Resin Cyclohexane N-dimethylformamide Silica Powder Epoxy Resin Glass Cloth 80-05-7 110-82-7 68-12-2 60676-86-0 Trade Secret 65997-17-3 Copper (Cu) 7440-50-8 1.315 10.8% 1.2% 1.2% 15.5% 35.6% 35.6% Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. - The above material declaration can be used only as reference in identifying the Hazardous material content of the product. - There is no guarantee on the Material composition accuracy as it is based on data provided by outside sources and has not been validated. - This material declaration does not include data from any active and passive component assembled in the package. www.latticesemi.com Rev. F Page 2 of 2