Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 (503) 268-8000 [email protected] Package: 1704 fcBGA (organic) with SAC305 Solder Balls 19.56 Total Device Weight Grams Die % of Total Pkg. Wt. 1.71% Bumps 0.071% December, 2010 Lid Ring Adhesive Underfill 39.20% 26.27% 0.72% 0.36% Thermally conductive adhesive 0.59% Solder Balls 4.87% Substrate 26.21% Weight (g) % of Total Pkg. Wt. Weight (g) 0.334 MSL: 4 Peak Reflow Temp: 245°C Substance CAS # Silicon (Si) 7440-21-3 Die Size: 18.20 x 15.7mm Notes / Assumptions: 0.0138 0.069% 0.002% 0.0134 0.0004 Tin (Sn) Silver (Ag) 7440-31-5 7440-22-4 97.4% 2.6% 39.009% 0.196% 7.630 0.038 Copper Nickel 7440-50-8 7440-02-0 99.5% 0.5% 26.144% 0.131% 5.114 0.026 Copper Nickel 7440-50-8 7440-02-0 99.5% 0.5% 0.644% 0.072% 0.126 0.014 Alumina Others 1344-28-1 Trade Secret 90% 10% 0.018% 0.036% 0.047% 0.036% 0.200% 0.004% 0.018% 0.0035 0.0070 0.0091 0.0070 0.0392 0.0007 0.0035 Bisphenol A type liquid epoxy resin Bisphenol F type liquid epoxy resin Naphthalene Amine type accelerator Silicon dioxide Carbon black Additives 25068-38-6 9003-36-5 27610-48-6 Trade Secret 60676-86-0 1333-86-4 Trade Secret 5% 10% 13% 10% 56% 1% 5% 0.500% 0.088% 0.098 0.017 Aluminum Resin and additive mixture 7429-90-5 Trade Secret 85% 15% 4.697% 0.146% 0.024% 0.919 0.029 0.005 Tin (Sn) Sliver(Ag) Copper(Cu) 7440-31-5 7440-22-4 7440-50-8 96.5% 3.0% 0.5% 5.688% 10.267% 10.260% 1.112 2.008 2.007 Glass fiber Resin and additive mixture Copper(Cu) 65997-17-3 Trade Secret 7440-50-8 21.7% 39.2% 39.1% 7.668 5.139 0.140 0.070 0.115 0.952 5.127 Notes: The values listed above are nominal values based on the data provided by outside sources and have not been validated. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com Rev. A