MB39C603 DS405-00021-E

The following document contains information on Cypress products.
MB39C603
ASSP
Phase Dimmable PSR LED Driver IC for LED Lighting
Data Sheet (Full Production)
Notice to Readers: This document states the current technical specifications regarding the Spansion
product(s) described herein. Spansion Inc. deems the products to have been in sufficient production volume
such that subsequent versions of this document are not expected to change. However, typographical or
specification corrections, or modifications to the valid combinations offered may occur.
Publication Number MB39C603_DS405-00021
CONFIDENTIAL
Revision 2.0
Issue Date February 20, 2015
v1.2
D a t a S h e e t
Notice On Data Sheet Designations
Spansion Inc. issues data sheets with Advance Information or Preliminary designations to advise readers of
product information or intended specifications throughout the product life cycle, including development,
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Inc. therefore places the following conditions upon Advance Information content:
“This document contains information on one or more products under development at Spansion Inc.
The information is intended to help you evaluate this product. Do not design in this product without
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“This document states the current technical specifications regarding the Spansion product(s)
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conditions to documents in this category:
“This document states the current technical specifications regarding the Spansion product(s)
described herein. Spansion Inc. deems the products to have been in sufficient production volume
such that subsequent versions of this document are not expected to change. However,
typographical or specification corrections, or modifications to the valid combinations offered may
occur.”
Questions regarding these document designations may be directed to your local sales office.
2
CONFIDENTIAL
MB39C603_DS405-00021-2v0-E, February 20, 2015
v1.2
MB39C603
ASSP
Phase Dimmable PSR LED Driver IC for LED Lighting
Data Sheet (Full Production)
1.
Description
MB39C603 is a Primary Side Regulation (PSR) LED driver IC for LED lighting. Using the information of the
primary peak current and the transformer-energy-zero time, it is able to deliver a well regulated current to the
secondary side without using an opto-coupler in an isolated flyback topology. Operating in critical conduction
mode, a smaller transformer is required. In addition, MB39C603 has a built-in phase dimmable circuit and
can constitute flicker less lighting systems for phase dimming with low-component count. It is most suitable
for the general lighting applications, for example replacement of commercial and residential incandescent
lamps.
2.
Features




PSR topology in an isolated flyback circuit
High power factor (>0.9 : without dimmer) in Single Conversion
High efficiency (>80% : without dimmer) and low EMI by detecting transformer zero energy
Built-in phase dimmable circuit
− Dimming curve based on conduction angle
− Dimmer hold current control
 Highly reliable protection functions
− Under voltage lock out (UVLO)
− Over voltage protection (OVP)
− Over current protection (OCP)
− Over temperature protection (OTP)





3.
Switching frequency setting : 30 kHz to 133 kHz
Input voltage range VDD : 9V to 20V
Input voltage for LED lighting applications : AC110VRMS
Output power range for LED lighting applications : 15W to 50W
Package : SOP-14 (5.30 mm × 10.15 mm × 2.25 mm[Max])
Applications
 Phase dimmable (Leading/Trailing) LED lighting
 LED lighting
Publication Number MB39C603_DS405-00021
Revision 2.0
Issue Date February 20, 2015
This document states the current technical specifications regarding the Spansion product(s) described herein. Spansion Inc. deems the products to have been in sufficient
production volume such that subsequent versions of this document are not expected to change. However, typographical or specification corrections, or modifications to the
valid combinations offered may occur.
CONFIDENTIAL
v1.2
D a t a S h e e t
Table of Contents
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16.
17.
18.
19.
4
CONFIDENTIAL
Description ..................................................................................................................................... 3
Features ......................................................................................................................................... 3
Applications .................................................................................................................................... 3
Pin Assignment............................................................................................................................... 5
Pin Descriptions.............................................................................................................................. 5
Block Diagram ................................................................................................................................ 6
Absolute Maximum Ratings ............................................................................................................ 7
Recommended Operating Conditions............................................................................................. 8
Electrical Characteristics ................................................................................................................ 9
Standard Characteristics .............................................................................................................. 11
Function Explanations .................................................................................................................. 12
11.1 LED Current Control by PSR(Primary Side Regulation) .................................................... 12
11.2 PFC (Power Factor Correction) Function .......................................................................... 13
11.3 Phase Dimming Function .................................................................................................. 13
11.4 HOLD Current Control Function ........................................................................................ 14
11.5 Power-On Sequence ......................................................................................................... 15
11.6 Power-Off Sequence ......................................................................................................... 16
11.7 IP_PEAK Detection Function ................................................................................................. 16
11.8 Zero Voltage Switching Function ....................................................................................... 16
11.9 Protection Functions.......................................................................................................... 17
I/O Pin Equivalent Circuit Diagram ............................................................................................... 18
Application Examples ................................................................................................................... 20
13.1 17W Isolated and Phase Dimming Application .................................................................. 20
Usage Precautions ....................................................................................................................... 28
Ordering Information..................................................................................................................... 29
Marking Format ............................................................................................................................ 29
Recommended Mounting Condition [JEDEC Level3] Lead Free .................................................. 30
17.1 Recommended Reflow Condition ...................................................................................... 30
17.2 Reflow Profile .................................................................................................................... 30
Package Dimensions .................................................................................................................... 31
Major Changes ............................................................................................................................. 32
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4.
Pin Assignment
Figure 4-1 Pin Assignment
(TOP VIEW)
NC
1
14 NC
VDD
2
13 DRV
TZE
3
12 GND
COMP
4
11 CS
HOLDDET
5
10 ADJ
HOLDCNT
6
9
VAC
NC
7
8
NC
(FPT-14P-M04)
5.
Pin Descriptions
Table 5-1 Pin Descriptions
Pin No.
Pin Name
I/O
Description
1
NC
-
Not used. Leave this pin open.
2
VDD
-
Power supply pin.
3
TZE
I
Transformer Zero Energy detecting pin.
4
COMP
O
External Capacitor connection pin for the compensation.
5
HOLDDET
I
Phase Dimmer current detecting pin.
6
HOLDCNT
O
External BIP base current control pin.
7
NC
-
Not used. Leave this pin open.
8
NC
-
Not used. Leave this pin open.
9
VAC
I
Phase Dimmer conduction angle detecting pin.
10
ADJ
O
Pin for adjusting the switch-on timing.
11
CS
I
Pin for detecting peak current of transformer primary winding.
12
GND
-
Ground pin.
13
DRV
O
External MOSFET gate connection pin.
14
NC
-
Not used. Leave this pin open.
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CONFIDENTIAL
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6.
Block Diagram
Figure 6-1 Block Diagram(Isolated Flyback Application)
Phase
Dimmer
9
VAC
5
HOLDDET
6
HOLDCNT
2
Hold Amp
Phase Comp
Err Ref
Internal Bias
generator
TZE
3
VDD
Generator
OVP Comp
LEB
UVLO
TZE Comp
Err Ref
OTP
Err Amp
Ton Comp
PWM
Driver
Control
COMP
ADJ
DRV
13
Logic
4
OCP Comp
Sawtooth
10
Current
Calculator
CONFIDENTIAL
11
CS
Generator
Peak Current
Detector
6
LEB
12
GND
MB39C603_DS405-00021-2v0-E, February 20, 2015
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7.
Absolute Maximum Ratings
Table 7-1 Absolute Maximum Ratings
Parameter
Power Supply Voltage
Input Voltage
Symbol
Unit
-0.3
+25
V
VCS
CS pin
-0.3
+6.0
V
VTZE
TZE pin
-0.3
+6.0
V
HOLDDET pin
-0.3
+6.0
V
VVAC
VAC pin
-0.3
+6.0
V
VDRV
DRV pin
-0.3
+25
V
HOLDCNT pin
-0.3
+6.0
V
IADJ
ADJ pin
-1
-
mA
IDRV
DRV pin DC level
-50
+50
mA
HOLDCNT pin
-400
-
μA
-
500(*1)
mW
-55
+125
°C
IHOLDCNT
Power Dissipation
Max
VDD pin
VHOLDCNT
Output Current
Min
VVDD
VHOLDDET
Output Voltage
Rating
Condition
PD
Ta  +25°C
Storage Temperature
TSTG
-
ESD Voltage 1
VESDH
Human Body Model
-2000
+2000
V
ESD Voltage 2
VESDC
Charged Device Model
-1000
+1000
V
*1: The value when using two layers PCB.
Reference: θja (wind speed 0m/s): 200°C/W
Figure 7-1 Power Dissipation
700
Power Dissipation [mW]
600
500
400
300
200
100
0
-50
-25
0
25
50
75
100 125 150
Ta [°C]
WARNING:
1. Semiconductor devices may be permanently damaged by application of stress (including, without
limitation, voltage, current or temperature) in excess of absolute maximum ratings. Do not exceed any of
these ratings.
February 20, 2015, MB39C603_DS405-00021-2v0-E
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8.
Recommended Operating Conditions
Table 8-1 Recommended Operating Conditions
Parameter
Symbol
Condition
Value
Min
Typ
Max
Unit
VDD pin Input Voltage
VVDD
VDD pin
9
-
20
V
VAC pin Resistance
RVAC
VAC pin
-
510
-
kΩ
TZE pin Resistance
RTZE
TZE pin
50
-
200
kΩ
ADJ pin Resistance
RADJ
ADJ pin
9.3
-
185.5
kΩ
COMP pin
-
4.7
-
μF
Set between VDD pin and GND pin
-
100
-
μF
-40
-
+125
°C
COMP pin Capacitance
VDD pin Capacitance
Operating Junction Temperature
CCOMP
CBP
Tj
-
WARNING:
1. The recommended operating conditions are required in order to ensure the normal operation of the
semiconductor device. All of the device's electrical characteristics are warranted when the device is
operated under these conditions.
2. Any use of semiconductor devices will be under their recommended operating condition.
3. Operation under any conditions other than these conditions may adversely affect reliability of device and
could result in device failure.
4. No warranty is made with respect to any use, operating conditions or combinations not represented on
this data sheet. If you are considering application under any conditions other than listed herein, please
contact sales representatives beforehand.
8
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MB39C603_DS405-00021-2v0-E, February 20, 2015
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9.
Electrical Characteristics
Table 9-1 Electrical Characteristics
(Ta = +25°C, VVDD = 12V)
Parameter
Condition
VTH
VDD
VTL
VDD
ISTART
VDD
VTZETL
Value
Unit
Typ
Max
-
9.6
10.2
10.8
V
-
7.55
8
8.5
V
VVDD = 7V
-
65
160
μA
TZE
TZE = “H” to “L”
-
20
-
mV
VTZETH
TZE
TZE = “L” to “H”
0.6
0.7
0.8
V
TZE clamp voltage
VTZECLAMP
TZE
ITZE = -10 μA
-200
-160
-100
mV
OVP threshold voltage
VTZEOVP
TZE
-
4.15
4.3
4.45
V
OVP blanking time
tOVPBLANK
TZE
-
0.6
1
1.7
μs
TZE input current
ITZE
TZE
-1
-
+1
μA
-
-27
-
μA
-
96
-
1.81
1.85
1.89
V
-650
-450
-250
μA
490
550
610
ns
-
6.75
7.5
8.25
μs
UVLO Turn-on
UVLO Turn-off
threshold voltage
Startup current
Zero energy
threshold voltage
Zero energy
threshold voltage
TRANSFORMER
Pin
Min
threshold voltage
UVLO
Symbol
ZERO ENERGY
DETECTION
VTZE = 5V
VCOMP = 2V, VCS = 0V,
Source current
ISO
COMP
Trans conductance
gm
COMP
ADJ voltage
VADJ
ADJ
ADJ source current
IADJ
ADJ
VADJ = 0V
ADJ time
tADJ
TZE
tADJ (RADJ = 51 kΩ) -
DRV
tADJ (RADJ = 9.1 kΩ)
ADJUSTMENT
Minimum switching
period
CURRENT
SENSE
TSW
VCOMP = 2.5V, VCS = 1V
-
TZE
DRV
μA/
V
OCP threshold voltage
VOCPTH
CS
-
1.9
2
2.1
V
OCP delay time
tOCPDLY
CS
-
-
400
500
ns
CS input current
ICS
CS
-1
-
+1
μA
February 20, 2015, MB39C603_DS405-00021-2v0-E
CONFIDENTIAL
Conduction Angle =
165deg
COMPENSATION
VCS = 5V
9
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D a t a S h e e t
(Ta = +25°C, VVDD = 12V)
Parameter
Symbol
Pin
Condition
DRV high voltage
VDRVH
DRV
DRV low voltage
VDRVL
Rise time
Value
Unit
Min
Typ
Max
VDD = 18V, IDRV = -30 mA
7.6
9.4
-
V
DRV
VDD = 18V, IDRV = 30 mA
-
130
260
mV
tRISE
DRV
VDD = 18V, CLOAD = 1 nF
-
94
-
ns
Fall time
tFALL
DRV
VDD = 18V, CLOAD = 1 nF
-
16
-
ns
Minimum on time
tONMIN
DRV
TZE trigger
300
500
700
ns
Maximum on time
tONMAX
DRV
-
27
44
60
μs
Minimum off time
tOFFMIN
DRV
-
1
1.5
1.93
μs
Maximum off time
tOFFMAX
DRV
37
46
55
μs
OTP threshold
TOTP
-
-
150
-
°C
OTP hysteresis
TOTPHYS
-
-
25
-
°C
VPHTH1
VAC
VAC = “L” to “H”
0.9
1.0
1.1
V
VPHTH2
VAC
VAC = “H” to “L”
0.45
0.5
0.55
V
VPHHYS
VAC
-
-
0.5
-
V
-
-10.09
-9.7
-9.32
μA
-
375
400
425
mV
3.4
-
-
V
0.8
V
DRV
OTP
Phase Comp
DIMMER
CONDUCTION
ANGLE
DETECTION
threshold voltage
Phase Comp
threshold voltage
Phase Comp
hysteresis
HOLDDET input current
Hold Amp
threshold voltage
TRIAC HOLD
CURRENT
CONTROL
HOLDCNT
Maximum output voltage
HOLDCNT
Minimum output voltage
HOLDCNT
source current
POWER SUPPLY
CURRENT
10
CONFIDENTIAL
IHOLDDET
VHOLDTH
VCNTOH
VCNTOL
ICNTSO
TZE = GND
Tj, temperature rising
Tj, temperature falling,
degrees below TOTP
HOLD
DET
HOLD
CNT
HOLD
CNT
HOLD
CNT
HOLD
CNT
IVDD(STATIC)
VDD
IVDD(OPERATING)
VDD
Power supply current
VHOLDDET = 0.6V,
RBASE = 16 kΩ,
VBASE = 0.7V
VHOLDDET = 0.2V,
RBASE = 16 kΩ,
VBASE = 0.7V
VHOLDDET = 0.6V,
RBASE = 16 kΩ,
-250
-200
-167
μA
-
3.3
4
mA
-
5.9
-
mA
VBASE = 0.7V
VVDD = 20V, VTZE = 1V
VVDD = 20V, Qg = 20 nC,
fSW = 133 kHz
MB39C603_DS405-00021-2v0-E, February 20, 2015
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10. Standard Characteristics
Figure 10-1 Standard Characteristics
IVDD(OPERATING) - VDD
IHOLDDET - Ta
7.0
-9.0
VVAC=2.0V
VCS=1.0V
VCOMP=1.3V
RADJ=51k
6.0
-9.2
5.0
4.5
4.0
8
10
12
14
VDD[V]
16
18
-9.6
-9.8
-10.0
Ta=-25℃
Ta=25℃
Ta=85℃
3.5
3.0
VDD=12V
VVAC=2.0V
VCS=1.0V
VCOMP=1.3V
-9.4
5.5
IHOLDDET[uA]
IVDD(OPERATING)[mA]
6.5
-10.2
20
-10.4
-30
-10
50
70
90
VDRVH - VDD
14
2500
VDD=12V
VVAC=2.0V
VCS=1.0V
VCOMP=1.3V
DRV pin : open
2000
13
12
1500
VDRVH[V]
tADJ[nsec]
30
Ta[℃]
tADJ - RADJ
1000
Ta=-25℃
Ta=25℃
Ta=85℃
500
0
10
11
9
50
100
RADJ[kΩ]
150
Ta=-25℃
Ta=25℃
Ta=85℃
8
7
6
0
VVAC=2.0V
VCS=1.0V
VCOMP=3.0V
RADJ=51k
10
200
8
10
12
14
VDD[V]
16
18
20
TON - VCOMP
60
VDD=12V
VVAC=2.0V
VCS=1.0V
RADJ=51k
50
TON[usec]
40
30
20
Ta=-25℃
Ta=25℃
Ta=85℃
10
0
1.4
1.8
2.2
2.6
VCOMP[V]
3
3.4
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11. Function Explanations
11.1 LED Current Control by PSR(Primary Side Regulation)
MB39C603 regulates the average LED current (ILED) by feeding back the information based on Primary
Winding peak current (IP_PEAK), Secondary Winding energy discharge time (TDIS) and switching period (TSW).
Figure 11-1 shows the operating waveform in steady state. IP is Primary Winding current and IS is Secondary
Winding current. ILED as an average current of the Secondary Winding is described by the following
equation.
𝐼𝐿𝐸𝐷 =
1
𝑇𝐷𝐼𝑆
×𝐼
×
2 𝑆_𝑃𝐸𝐴𝐾 𝑇𝑆𝑊
Using IP_PEAK and the transformer Secondary to Primary turns ratio (NP/NS), Secondary Winding peak current
(IS_PEAK) is described by the following equation.
𝐼𝑆_𝑃𝐸𝐴𝐾 =
𝑁𝑃
× 𝐼𝑃_𝑃𝐸𝐴𝐾
𝑁𝑆
Therefore,
𝐼𝐿𝐸𝐷 =
1 𝑁𝑃
𝑇𝐷𝐼𝑆
×
× 𝐼𝑃_𝑃𝐸𝐴𝐾 ×
𝑇𝑆𝑊
2 𝑁𝑆
MB39C603 detects TDIS by monitoring the TZE pin and IP_PEAK by monitoring the CS pin and then controls
ILED. An internal Err Amp sinks gm current proportional to IP_PEAK from the COMP pin during TDIS period. In
steady state, since the average of the gm current is equal to internal reference current (ISO), the voltage on
the COMP pin (VCOMP) is nearly constant.
𝐼𝑃_𝑃𝐸𝐴𝐾 × 𝑅𝐶𝑆 × 𝑔𝑚 × 𝑇𝐷𝐼𝑆 = 𝐼𝑆𝑂 × 𝑇𝑆𝑊
In above equation, gm is transconductance of the Err Amp and RCS is a sense resistance.
Eventually, ILED can be calculated by the following equation.
𝐼𝐿𝐸𝐷 =
1 𝑁𝑃 𝐼𝑆𝑂
1
×
×
×
2 𝑁𝑆 𝑔𝑚 𝑅𝐶𝑆
Figure 11-1 LED Current Control Waveform
IP_PEAK
System Power supply
through Diode Bridge
(VBULK)
IP
IS_PEAK
IP
LP
VAUX
MB39C603
ADJ
GND
ILED
IS
VD
VTZE
TZE
IS
ILED
TON
DRV
TDIS
TSW
TZE threshold
CS
RCS
CD
VD
(VAUX)
1/4 x TRING
VTZE
1/4 x TRING
12
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11.2 PFC (Power Factor Correction) Function
Switching on time (TON) is generated by comparing VCOMP with an internal sawtooth waveform (refer to
Figure 6-1). Since VCOMP is slow varying with connecting an external capacitor (CCOMP) from the COMP pin to
the GND pin, TON is nearly constant within an AC line cycle. In this state, IP_PEAK is nearly proportional to the
AC line voltage (VBULK). It can bring the phase differences between the input voltage and the input current
close to zero, so that high Power Factor can be achieved.
11.3 Phase Dimming Function
MB39C603 is compatible with both leading-edge dimmers (TRIAC dimming) and trailing-edge dimmers.
To realize the phase dimming, this device has two functions, dimmer conduction angle detect function for
LED current control and TRIAC dimmer hold current control function.
Figure 11-2 shows how MB39C603 detects the conduction angle. VBULK is scaled via a resistor divider
connected to the VAC pin. The conduction angle is detected by monitoring the voltage on the VAC pin
(VVAC).
MB39C603 measures a half of power cycle period (Tpow) as duration between negative crossings of V VAC
and a Phase Comp threshold voltage (VPHTH2). Dimmer-ON period (Tdim) is measured as duration between
a positive crossing of VVAC and another Phase Comp threshold voltage (VPHTH1) and the following negative
crossing. Conduction angle is defined as Tdim/Tpow × 180°.
Figure 11-2 Conduction Angle Detection Waveform
VBULK
VVAC
VPHTH1
VPHTH2
Phase Comp
output
Tpow
Tdim
Conduction angle = Tdim / Tpow × 180°
MB39C603 regulates LED current by changing a reference of Err Amp as a function of the conduction angle.
Table 11-1 shows ILED dimming ratio based on the conduction angle.
In addition, the initial ILED ratio in Power–On state is 5%.
Table 11-1 ILED Ratio Based on Conduction Angles
Conduction Angle
θ < 45deg
5
45deg ≤ θ < 90deg
(25/45) × θ -20
90deg ≤ θ < 135deg
(70/45) × θ -110
135deg ≤ θ
100
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ILED Ratio [%]
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11.4 HOLD Current Control Function
The hold current control function prevents LEDs from flickering caused by shortage of hold current. The hold
current (IHOLD) is the minimum current required to flow through TRIAC dimmer in order to keep the TRIAC on
(refer to Figure 11-3). In small conduction angle, since ILED can be low, AC/DC Converter current (IBULK) and
TRIAC dimmer current (ITRIAC) are reduced. Once ITRIAC falls below IHOLD, TRIAC goes off and this results in
LED flickering. MB39C603 controls ITRIAC larger than IHOLD by adding the current (IBIP) via a BIP transistor
(M1) with sensing ITRIAC and keeps the TRIAC on.
ITRIAC is sensed with a resistor (RS). A bypass diode (DBYPASS) is used to clamp the voltage between RS
terminals (VRS) and prevent the voltage on the HOLDDET pin (VHOLDDET) from exceeding absolute maximum
ratings. An offset resistor (ROFFSET) is used to add an offset voltage to VHOLDDET and prevent VHOLDDET from
the above ratings.
RS is set as the following equation.
𝑅𝑆 =
𝑅𝑂𝐹𝐹𝑆𝐸𝑇 × 𝐼𝐻𝑂𝐿𝐷𝐷𝐸𝑇 − 𝑉𝐻𝑂𝐿𝐷𝑇𝐻
𝐼𝑇𝑅𝐼𝐴𝐶𝑀𝐼𝑁
where IHOLDDET is the current of the HOLDDET pin, VHOLDTH is Hold Amp threshold voltage, and ITRIACMIN is
minimum TRIAC current chosen by designers.
ROFFSET is set as the following equation.
𝑅𝑂𝐹𝐹𝑆𝐸𝑇 >
𝑉𝐵𝑌𝑃𝐴𝑆𝑆𝑀𝐴𝑋 − 0.3𝑉
𝐼𝐻𝑂𝐿𝐷𝐷𝐸𝑇
where VBYPASSMAX is the maximum forward voltage of DBYPASS.
Hold Amp is designed only for driving BIP transistors. Connecting a resistor (RBASE) between the HOLDCNT
pin and M1 base terminal limits the maximum IBIP value and clamp the rush current at TRIAC dimmer-on
timing.
Figure 11-3 HOLD Current Control Waveform
IT R IAC = IBULK + IBIP
IBU LK
V BU LK
AC/DC
Converter
Phase
VBULK
Dimmer
D BYPASS
IBIP
R O FFSET
RS
R BASE
IHO LDDET
5
HOLDDET
Hold Amp
6
M1
IBIP
HOLDCNT
ITRIAC
Added
IBIP
ITRIACMIN
V HO LDTH
14
CONFIDENTIAL
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D a t a S h e e t
11.5 Power-On Sequence
When the AC line voltage is supplied, VBULK is powered from the AC line through a diode bridge, and the
VDD pin is charged from VBULK through an external source-follower BiasMOS.(Figure 11-4 red path)
When the VDD pin is charged up and the voltage on the VDD pin (VVDD) rises above the UVLO threshold
voltage, an internal Bias circuit starts operating, and MB39C603 starts the conduction angle detection (refer
to 11.3). After the UVLO is released, this device enables switching and is operating in a forced switching
mode (TON = 1.5 µs, TOFF = 78 µs to 320 µs). When the voltage on the TZE pin reaches the Zero energy
threshold voltage (VTZETH = 0.7V), MB39C603 enters normal operation mode. After the switching begins, the
VDD pin is also charged from Auxiliary Winding through an external diode (DBIAS).(Figure 11-4 blue path)
During non-conduction period VVDD is not supplied from VBULK or Auxiliary Winding. It is necessary to set an
appropriate capacitor of the VDD pin in order to keep VVDD above the UVLO threshold voltage in this period.
An external diode (D1) between BiasMOS and the VDD pin is used to prevent discharge from the VDD pin to
VBULK at zero cross points of the AC line voltage.
Figure 11-4 VDD Supply Path at Power-On
Phase
Dimmer
VBULK
Rst
Bias
MOS
Zbias
To TZE
DBIAS
D1
2
VDD
Internal Bias
Generator
UVLO
Driver
PWM
DRV
13
Control
Logic
11
CS
12
GND
Figure 11-5 Power-On Waveform
VBULK
UVLO Vth = 10.2V
Force switching (ton=1.5us / toff=78us~320us)
VDD
Normal switching
Switching start
DRV
VLED
VTZETH = 0.7V
TZE
February 20, 2015, MB39C603_DS405-00021-2v0-E
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15
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D a t a S h e e t
11.6 Power-Off Sequence
After the AC line voltage is removed, VBULK is discharged by switching operation and the Hold current circuit.
Since any Secondary Winding current does not flow, ILED is supplied only from output capacitors and
decreases gradually. VVDD also decreases because there is no current supply from both Auxiliary Winding
and VBULK. When VVDD falls below the UVLO threshold voltage, MB39C603 shuts down.
Figure 11-6 Power-Off Waveform
AC line removed
VBULK
VDD
UVLO Vth = 8V
DRV
Shutdown
VLED
11.7 IP_PEAK Detection Function
MB39C603 detects Primary Winding peak current (IP_PEAK) of Transformer. ILED is set by connecting a sense
resistance (RCS) between the CS pin and the GND pin. Maximum IP_PEAK (IP_PEAKMAX) limited by Over Current
Protection (OCP) can also be set with the resistance.
Using the Secondary to Primary turns ratio (NP/NS) and ILED, RCS is set as the following equation (refer to
11.1).
𝑅𝐶𝑆 =
𝑁𝑃 0.132
×
𝐼𝐿𝐸𝐷
𝑁𝑆
In addition, using the OCP threshold voltage (VOCPTH) and RCS, IP_PEAKMAX is calculated with the following
equation.
𝐼𝑃_𝑃𝐸𝐴𝐾𝑀𝐴𝑋 =
𝑉𝑂𝐶𝑃𝑇𝐻
𝑅𝐶𝑆
11.8 Zero Voltage Switching Function
MB39C603 has built-in zero voltage switching function to minimize switching loss of the external switching
MOSFET. This device detects a zero crossing point through a resistor divider connected from the TZE pin to
Auxiliary Winding. A zero energy detection circuit detects a negative crossing point of the voltage on the TZE
pin to Zero energy threshold voltage (VTZETL). On-timing of switching MOSFET is decided with waiting an
adjustment time (tADJ) after the negative crossing occurs.
tADJ is set by connecting an external resistance (RADJ) between the ADJ pin and the GND pin. Using Primary
Winding inductance (LP) and the parasitic drain capacitor of switching MOSFET (C D), tADJ is calculated with
the following equation.
𝑡𝐴𝐷𝐽 =
𝜋√𝐿𝑃 × 𝐶𝐷
2
Using tADJ, RADJ is set as the following equation.
𝑅𝐴𝐷𝐽 [𝑘𝛺] = 0.0927 × 𝑡𝐴𝐷𝐽 [𝑛𝑠]
16
CONFIDENTIAL
MB39C603_DS405-00021-2v0-E, February 20, 2015
v1.2
D a t a S h e e t
11.9 Protection Functions
Under Voltage Lockout Protection (UVLO)
The under voltage lockout protection (UVLO) prevents IC from a malfunction in the transient state during
VVDD startup and a malfunction caused by a momentary drop of VVDD, and protects the system from
destruction/deterioration. An UVLO comparator detects the voltage decrease below the UVLO threshold
voltage on the VDD pin, and then the DRV pin is turned to “L” and the switching stops. MB39C603
automatically returns to normal operation mode when VVDD increases above the UVLO threshold voltage.
Over Voltage Protection (OVP)
The over voltage protection (OVP) protects Secondary side components from an excessive stress voltage. If
the LED is disconnected, the output voltage of Secondary Winding rises up. The output overvoltage can be
detected by monitoring the TZE pin. During Secondary Winding energy discharge time, VTZE is proportional
to VAUX and the voltage of Secondary Winding (refer to 11.1). When VTZE rises higher than the OVP threshold
voltage for 3 continues switching cycles, the DRV pin is turned to “L”, and the switching stops (latch off).
When VVDD drops below the UVLO threshold voltage, the latch is removed.
Over Current Protection (OCP)
The over current protection (OCP) prevents inductor or transformer from saturation. The drain current of the
external switching MOSFET is limited by OCP. When the voltage on the CS pin reaches the OCP threshold
voltage, the DRV pin is turned to “L” and the switching cycle ends. After zero crossing is detected on the TZE
pin again, the DRV pin is turned to “H” and the next switching cycle begins.
Over Temperature Protection (OTP)
The over temperature protection (OTP) protects IC from thermal destruction. When the junction temperature
reaches +150°C, the DRV pin is turned to “L”, and the switching stops. It automatically returns to normal
operation mode if the junction temperature falls back below +125°C.
Table 11-2 Protection Functions Table
PIN Operation
Function
DRV
Normal Operation
Under Voltage Lockout
Protection (UVLO)
Over Voltage Protection
(OVP)
Over Current Protection
(OCP)
Over Temperature
Protection (OTP)
HOLD
CNT
ADJ
Return
Condition
Remarks
Active
Active
Active
Active
-
-
-
L
L
L
L
VDD < 8V
VDD > 10.2V
Auto Restart
L
L
Active
TZE > 4.3V
L
Active
Active
CS > 2V
Cycle by cycle
Auto Restart
L
L
Active
Tj > +150°C
Tj < +125°C
Auto Restart
February 20, 2015, MB39C603_DS405-00021-2v0-E
CONFIDENTIAL
COMP
Detection
Condition
1.5V
fixed
Active
1.5V
fixed
VDD < 8V
→ VDD > 10.2V
Latch off
17
v1.2
D a t a S h e e t
12. I/O Pin Equivalent Circuit Diagram
Figure 12-1 I/O Pin Equivalent Circuit Diagram
Pin
Pin No.
Equivalent Circuit Diagram
Name
VREF5V
GND
VREF5V
3
TZE
TZE
3
GND
VREF5V
GND
12
VREF5V
GND
4
COMP
COMP
VREF5V
4
GND 12
VREF5V
5,
HOLDDET,
6
HOLDCNT
HOLDDET
5
6
HOLDCNT
GND 12
VREF5V
9
VAC
VAC
9
GND 12
18
CONFIDENTIAL
MB39C603_DS405-00021-2v0-E, February 20, 2015
v1.2
D a t a S h e e t
Pin No.
Pin
Equivalent Circuit Diagram
Name
VREF5V
10
ADJ
ADJ 10
GND 12
VREF5V
GND
11
CS
CS 11
VREF5V
GND 12
VDD
2
GND
13
DRV
VREF5V
13 DRV
GND 12
February 20, 2015, MB39C603_DS405-00021-2v0-E
CONFIDENTIAL
19
v1.2
20
CONFIDENTIAL
AC2
AC1
VR1
F1
C13
C14
ZD2
D5
R6
BR1
C16
NA
TZE
3
M1
7
NC
NC
VAC
HOLDCNT
6
8
9
ADJ 10
HOLDDET
CS 11
GND 12
DRV 13
NC 14
Q3
R8
C10
Q2
5
COMP
VDD
2
4
NC
1
R19
D4
C11
R5
ZD1
R1
MB39C603
R10
+
R7
R9
C2
C1
L1
R18
R21
C18
C12
NA
Q1
D3
R4
R12 Short
C19 C4
NA
R3 NA
L3
R11 Short
C15
NA
R13
R17
R2
C3
D1
R14
C8
C9
7
8
R15
NA
5
3
4
2
1
T1
NA
R20
D2
C5
NA
C17
C6
+
C7
+
R16
LED-
LED+
D a t a S h e e t
13. Application Examples
13.1 17W Isolated and Phase Dimming Application
Input: AC85VRMS to 145VRMS, Output: 470mA/32V to 42V, Ta = +25°C
Figure 13-1 17W EVB Schematic
MB39C603_DS405-00021-2v0-E, February 20, 2015
v1.2
D a t a S h e e t
Table 13-1 17W BOM List
No.
Component
Description
1
M1
LED driver IC, SOP-14
2
Q1
MOSFET, N-channel, 800V, 5.5A, TO-220F
3
Q2
MOSFET, N-channel, 650V, 7.3A, TO-220
4
Q3
Bipolar transistor, NPN, 60V, 3A, hfe = 250min, SOT-223
5
BR1
Bridge rectifier, 1A, 600V, Micro-DIP
6
D1
7
D2
8
Part No.
Vendor
MB39C603
Spansion
FQPF8N80C
Fairchild
FDPF10N60NZ
Fairchild
NZT560A
Fairchild
MDB6S
Fairchild
Diode, ultra fast rectifier, 1A, 600V, SMA
ES1J
Fairchild
Diode, ultra fast rectifier, 3A, 200V, SMC
ES3D
Fairchild
D3
Diode, fast rectifier, 1A, 800V, SMA
RS1K
Fairchild
9
D4
Diode, ultra fast rectifier, 1A, 200V, SMA
10
D5
Diode, 200 mA, 200V, SOT-23
11
ZD1, ZD2
Diode, Zener, 18V, 500 mW, SOD-123
12
T1
Transformer, 600 μH
13
L1
Common mode inductor, 20 mH, 0.5A
14
L3
Inductor, 3.3 mH, 0.27A, 5.0Ω, ϕ10×14.4
15
C1
Capacitor, X2, 305VAC, 0.1 μF
16
C2
Capacitor, aluminum electrolytic, 100 μF, 25V, ϕ6.3×11
17
C3
18
C4
19
C5
Capacitor, ceramic, 10 μF, 50V, X7S, 1210
20
C6, C7
Capacitor, aluminum electrolytic, 470 μF 50V, ϕ10.0×20
21
C8
Capacitor, ceramic, 15 nF, 250V,
22
C9
Capacitor, ceramic, 2.2 nF, X1/Y1 radial
23
C10, C11
Capacitor, ceramic, 0.1 μF, 50V, X5R, 0603
24
C12, C15, C16
25
26
ES1D
Fairchild
MMBD1404
Fairchild
MMSZ18T1G
ON Semi
EI-2520
-
744821120
Wurth Electronic
RCH114NP-332KB
Sumida
B32921C3104M
EPCOS
EKMG250ELL101MF11D
NIPPON-CHEMI-CON
Capacitor,polyester film, 220 nF, 400V, 18.5×5.9
ECQ-E4224KF
Panasonic
Capacitor,polyester film, 100 nF, 400V, 12×6.3
ECQ-E4104KF
Panasonic
-
-
EKMG500ELL471MJ20S
NIPPON-CHEMI-CON
-
-
DE1E3KX222M
muRata
-
-
NA (Open), 0603
-
-
C13
Capacitor, ceramic, 10 μF, 35V, X5R, 0805
-
-
C14
Capacitor, ceramic, 4.7 μF, 16V, JB, 0805
-
-
27
C17
NA (Open), 1206
-
-
28
C18
Capacitor, ceramic, 100 pF, 50V, CH, 0603
-
-
29
C19
NA (Open)
-
-
30
R1, R17
Resistor, chip, 1 MΩ, 1/4W, 1206
-
-
31
R2
Resistor, metal film, 510Ω, 2W,
-
-
32
R3
NA (Open), 1206
-
-
33
R4
Resistor, metal oxide film, 68 kΩ, 3W
-
-
34
R5
Resistor, chip, 5.1Ω, 1W, 2512
-
-
35
R6
Resistor, chip, 62 kΩ, 1/10W, 0603
-
-
36
R7
Resistor, chip, 10Ω, 1/8W, 0805
-
-
37
R8
Resistor, chip, 22Ω, 1/10W, 0603
-
-
38
R9
Resistor, chip, 91 kΩ, 1/10W, 0603
-
-
39
R10
Resistor, chip, 24 kΩ, 1/10W, 0603
-
-
40
R11, R12
NA (Short), 0603
-
-
41
R13
Resistor, chip, 39 kΩ, 1/10W, 0603
-
-
42
R14
Resistor, chip, 1.1Ω, 1/4W, 1206
-
-
43
R16
Resistor, chip, 51 kΩ, 1/10W, 0603
-
-
44
R18
Resistor, chip, 33 kΩ, 1/10W, 0603
-
-
45
R19
Resistor, chip, 12 kΩ, 1/10W, 0603
-
-
46
R20, R15
NA (Open), 1206
-
-
47
R21
Resistor, chip, 510 kΩ, 1/10W, 0603
-
-
48
VR1
Varistor,
ERZ-V07D431
Panasonic
49
F1
Fuse, 1A, 300VAC
3691100000
Littelfuse
275VAC, 7 mm DISK
February 20, 2015, MB39C603_DS405-00021-2v0-E
CONFIDENTIAL
X7R, 1206
21
v1.2
D a t a S h e e t
Spansion
:
Spansion Inc.
Fairchild
:
Fairchild Semiconductor International, lnc.
On Semi
:
ON Semiconductor
Wurth Electronic
:
Wurth Electronics Midcom Inc.
Sumida
:
SUMIDA CORPORATION
EPCOS
:
EPCOS AG
NIPPON-CHEMI-CON
:
Nippon Chemi-Con Corporation
Panasonic
:
Panasonic Corporation
muRata
:
Murata Manufacturing Co., Ltd.
Littelfuse
:
Littelfuse, Inc.
22
CONFIDENTIAL
MB39C603_DS405-00021-2v0-E, February 20, 2015
v1.2
D a t a S h e e t
Efficiency
Power Factor
LED: 470mA, 37V (without Dimmer)
LED: 470mA, 37V (without Dimmer)
100%
1.00
95%
0.95
90%
0.90
85%
0.85
80%
0.80
PF
Efficiency [%]
Figure 13-2 17W Reference Data
0.75
75%
70%
60Hz
65%
60%
0.70
50Hz
80
90
100
50Hz
60Hz
0.65
110
120
130
140
0.60
150
80
90
100
110
Line Regulation
Load Regulation
(without Dimmer)
(without Dimmer)
50Hz
500
140
150
100V/50Hz
500
100V/60Hz
60Hz
IOUT [mA]
480
IOUT [mA]
130
520
520
460
480
460
440
440
420
120
VIN [VRMS]
VIN [VRMS]
80
90
100
110
120
130
140
VIN [VRMS]
February 20, 2015, MB39C603_DS405-00021-2v0-E
CONFIDENTIAL
150
420
30
35
40
45
VOUT [V]
23
v1.2
D a t a S h e e t
Output Ripple Waveform
Switching Waveform
VIN=100VRMS / 60Hz
VIN=100VRMS / 60Hz
LED: 470mA, 37V (without Dimmer)
LED: 470mA, 37V (without Dimmer)
VBULK(D1 +)
VOUT
VSW(Q1 drain)
IOUT
IOUT
Turn-On Waveform
Turn-Off Waveform
VIN=100VRMS / 60Hz
VIN=100VRMS / 60Hz
LED: 470mA, 37V (without Dimmer)
LED: 470mA, 37V (without Dimmer)
VBULK
VBULK
VDD(M1 VDD)
VDD
VOUT
VOUT
IOUT
IOUT
LED Open Waveform
Total Harmonic Distortion(THD)
VIN=100VRMS / 60Hz
LED: 470mA, 37V (without Dimmer)
LED: 470mA, 37V (without Dimmer)
40
VSW
35
50Hz
60Hz
30
25
VOUT
THD [%]
20
15
10
IOUT
5
0
80
90
100
110
120
130
140
150
VIN [VRMS]
24
CONFIDENTIAL
MB39C603_DS405-00021-2v0-E, February 20, 2015
v1.2
D a t a S h e e t
Figure 13-3 17W Japan Dimmer Performance Data
Dimming Curve
Dimming Curve
VIN=100VRMS / 50Hz
VIN=100VRMS / 60Hz
LED: 470mA, 37V
LED: 470mA, 37V
500
500
Leading Edge
400
Trailing Edge
300
Iout [mA]
Iout [mA]
300
200
100
0
Leading Edge
400
Trailing Edge
200
100
0
45
90
135
0
180
0
45
Conduction Angle [°]
90
135
180
Conduction Angle [°]
Table 13-2 17W Japan Dimmer Performance Data
Dimmer
Vendor
LUTRON
Panasonic
DAIKO
Mitsubishi
Minimum
Minimum
Maximum
Maximum
Angle (°)
IOUT (mA)
Angle (°)
IOUT (mA)
DVCL-123P-JA
31.9
19.2
141.8
468.4
WTC57521
38.0
19.2
145.6
467.6
WN575280K
27.7
19.8
147.2
467.0
NQ20203T
31.0
19.4
146.7
466.9
32.4
19.1
142.9
466.9
28.3
19.7
147.8
466.9
46.4
19.4
151.9
467.2
34.0
19.2
155.3
466.6
30.4
18.8
145.4
468.4
DVCL-123P-JA
22.7
19.1
138.5
468.7
WTC57521
38.9
19.1
146.7
468.4
WN575280K
27.4
19.6
146.2
466.8
27.6
19.6
144.3
467.3
33.0
19.1
144.3
467.0
Parts Name
DP-37154
DEM1003B
Input
Condition
VIN=100VRMS
50Hz
Type
Leading Edge
(Japan Dimmer)
DG9022H
TOSHIBA
DG9048N
WDG9001
LUTRON
Panasonic
DAIKO
Mitsubishi
TOSHIBA
Trailing Edge
NQ20203T
VIN=100VRMS
DP-37154
60Hz
DEM1003B
(Japan Dimmer)
25.9
19.9
145.2
467.2
DG9022H
22.0
18.8
150.8
467.0
DG9048N
22.7
19.6
153.6
466.5
35.9
18.7
150.1
468.3
WDG9001
February 20, 2015, MB39C603_DS405-00021-2v0-E
CONFIDENTIAL
Leading Edge
Trailing Edge
25
v1.2
D a t a S h e e t
Figure 13-4 17W USA Dimmer Performance Data
Dimming Curve
VIN=120VRMS / 60Hz
LED: 470mA, 37V
500
Leading Edge
Trailing Edge IPE04-1LZ
Trailing Edge Other
400
Iout [mA]
300
200
100
0
0
45
90
135
180
Conduction Angle [°]
Table 13-3 17W USA Dimmer Performance Data
Dimmer
Vendor
LEVITON
Minimum
Minimum
Maximum
Maximum
Angle (°)
IOUT (mA)
Angle (°)
IOUT (mA)
IPI06-1LZ
42.3
25.3
156.0
477.5
6631-LW
21.8
20.1
144.1
470.2
6641-W
39.1
19.5
147.7
471.5
6683
35.2
19.5
155.5
468.9
SLV-600-WH
19.7
18.0
135.4
454.2
S-600P-WH
35.0
19.5
137.6
470.6
TG-600PH-WH
45.4
19.8
140.4
470.5
AY-600P-WH
40.2
19.5
143.6
470.6
GL-600H-DK
25.1
20.0
135.9
457.3
34.1
19.5
141.0
470.8
33.3
19.4
135.0
455.4
TT-300NLH-WH
60Hz
41.7
19.5
143.2
470.5
DV-603PG-WH
(USA Dimmer)
35.6
19.4
116.4
316.5
DVCL-153-WH
38.0
19.4
133.9
445.7
DV603PH-WH
33.0
19.5
136.9
471.2
LGCL-153PLH-WH
39.3
19.2
133.9
444.4
D-603PH
24.2
20.0
133.5
439.1
DV-600PH-WH
32.8
19.3
139.3
470.7
52129
23.8
20.2
157.0
469.8
18023
36.9
19.4
158.5
469.5
IPE04-1LZ
45.6
33.1
136.9
477.3
34.1
19.1
130.9
447.2
34.1
19.0
131.8
455.2
Parts Name
Input
Condition
TG-600PNLH-WH
LUTRON
GE
LEVITON
LUTRON
26
CONFIDENTIAL
TGCL-153PH-WH
SELV-300P-WH
DVELV-300P-WH
VIN=120VRMS
Type
Leading Edge
Trailing Edge
MB39C603_DS405-00021-2v0-E, February 20, 2015
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Figure 13-5 17W Parts Surface Temperature
Top Side Temperature Image
Bottom Side Temperature Image
VIN=100VRMS / 50Hz
VIN=100VRMS / 50Hz
LED: 470mA, 37V (without Dimmer)
LED: 470mA, 37V (without Dimmer)
Top Side Temperature Image
Bottom Side Temperature Image
VIN=100VRMS / 60Hz
VIN=100VRMS / 60Hz
LED: 470mA, 37V (without Dimmer)
LED: 470mA, 37V (without Dimmer)
Table 13-4 17W Parts Surface Temperature Data
Side
Top
Bottom
Cursor Point
ΔTemperature [Δ℃]
50Hz
60Hz
50Hz
60Hz
a
T2
68.0
66.5
38.3
36.8
b
Q1
61.8
61.8
32.2
32.0
c
R4
70.8
70.1
41.2
40.3
d
R2
52.8
52.5
23.1
22.8
e
Q2
58.5
56.0
28.9
26.2
14.0
f
PCB
44.5
43.8
14.8
g
Out of PCB
29.6
29.8
-
-
a
M1
55.1
56.6
26.8
25.2
b
Back side of R4
63.5
67.1
35.2
35.8
c
BR1
58.0
61.6
29.7
30.2
d
PCB
45.1
46.9
16.7
15.5
e
Out of PCB
28.3
31.4
-
-
February 20, 2015, MB39C603_DS405-00021-2v0-E
CONFIDENTIAL
Surface Temperature [℃]
27
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14. Usage Precautions
Do not configure the IC over the maximum ratings.
If the IC is used over the maximum ratings, the LSI may be permanently damaged.
It is preferable for the device to normally operate within the recommended usage conditions. Usage outside
of these conditions can have an adverse effect on the reliability of the LSI.
Use the device within the recommended operating conditions.
The recommended values guarantee the normal LSI operation under the recommended operating
conditions.
The electrical ratings are guaranteed when the device is used within the recommended operating conditions
and under the conditions stated for each item.
Take appropriate measures against static electricity.
 Containers for semiconductor materials should have anti-static protection or be made of conductive
material.
 After mounting, printed circuit boards should be stored and shipped in conductive bags or containers.
 Work platforms, tools, and instruments should be properly grounded.
 Working personnel should be grounded with resistance of 250 kΩ to 1 MΩ in serial between body and
ground.
Do not apply negative voltages.
The use of negative voltages below - 0.3 V may make the parasitic transistor activated to the LSI, and can
cause malfunctions.
28
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MB39C603_DS405-00021-2v0-E, February 20, 2015
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15. Ordering Information
Table 15-1 Ordering Information
Part Number
Shipping Form
Package
MB39C603PF-G-JNEFE1
Emboss
14-pin plastic SOP
(FPT-14P-M04)
MB39C603PF-G-JNE1
Tube
16. Marking Format
Figure 16-1 Marking Format
XXXX XXX
INDEX
February 20, 2015, MB39C603_DS405-00021-2v0-E
CONFIDENTIAL
Lead-free version
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17. Recommended Mounting Condition [JEDEC Level3] Lead Free
17.1 Recommended Reflow Condition
Table 17-1 Recommended Reflow Condition
Items
Contents
Method
IR(Infrared Reflow) / Convection
Times
3 times in succession
Before unpacking
Floor life
Please use within 2 years after production.
From unpacking to reflow
Within 7 days
In case over period of floor life(*1)
Floor life
condition
Baking with 125°C+/-3°C for 24hrs+2hrs/-0hrs is required. Then please
use within 7 days. (Please remember baking is up to 2 times)
Between 5°C and 30°C and also below 60%RH required. (It is preferred lower humidity in the required temp range.)
*1: Concerning the Tape & Reel product, please transfer product to heatproof tray and so on when
you perform baking.
Also please prevent lead deforming and ESD damage during baking process.
17.2 Reflow Profile
Figure 17-1 Reflow Profile
260°C Max. (J-STD-020D)
TL to TP : Ramp Up Rate
3°C/s Max.
TS
150 to 200°C, 60 to 120s
: Preheat & Soak
TP - tP : Peak Temperature
260°C Down, within 30s
TL - tL : Liquidous Temperature
217°C, 60 to 150s
TP to TL : Ramp Down Rate
6°C/s Max.
Time 25°C to Peak
8min Max.
Temperature on the top of the package body is measured.
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18. Package Dimensions
14-pin plastic SOP
(FPT-14P-M04)
14-pin plastic SOP
(FPT-14P-M04)
1.27 mm
Package width ×
package length
5.3 × 10.15 mm
Lead shape
Gullwing
Sealing method
Plastic mold
Mounting height
2.25 mm MAX
Weight
0.20 g
Code
(Reference)
P-SOP14-5.3×10.15-1.27
Note 1) *1 : These dimensions include resin protrusion.
Note 2) *2 : These dimensions do not include resin protrusion.
Note 3) Pins width and pins thickness include plating thickness.
Note 4) Pins width do not include tie bar cutting remainder.
+.010
*110.15 +0.25
–0.20 .400 –.008
14
Lead pitch
+0.03
0.17 –0.04
+.001
.007 –.002
8
*2 5.30±0.30 7.80±0.40
(.209±.012) (.307±.016)
INDEX
Details of "A" part
+0.25
2.00 –0.15
+.010 (Mounting height)
.079 –.006
1
"A"
7
1.27(.050)
0.47±0.08
(.019±.003)
0.13(.005)
M
0.25(.010)
0~8°
0.50±0.20
(.020±.008)
0.60±0.15
(.024±.006)
+0.10
0.10 –0.05
+.004
.004 –.002
(Stand off)
0.10(.004)
C
February 20, 2015, MB39C603_DS405-00021-2v0-E
CONFIDENTIAL
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
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19. Major Changes
Page
Section
Descriptions
Revision1.0
-
-
Initial release
Revision2.0
7
7. Absolute Maximum Ratings
32
CONFIDENTIAL
Removed ESD Voltage (Machine Model) from Table 7-1
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February 20, 2015, MB39C603_DS405-00021-2v0-E
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Colophon
The products described in this document are designed, developed and manufactured as contemplated for general use,
including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not
designed, developed and manufactured as contemplated (1) for any use that includes fatal risks or dangers that, unless
extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal injury,
severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control,
mass transport control, medical life support system, missile launch control in weapon system), or (2) for any use where
chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion will not be liable
to you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products.
Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such
failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and
prevention of over-current levels and other abnormal operating conditions. If any products described in this document
represent goods or technologies subject to certain restrictions on export under the Foreign Exchange and Foreign Trade Law
of Japan, the US Export Administration Regulations or the applicable laws of any other country, the prior authorization by the
respective government entity will be required for export of those products.
Trademarks and Notice
The contents of this document are subject to change without notice. This document may contain information on a Spansion
product under development by Spansion. Spansion reserves the right to change or discontinue work on any product without
notice. The information in this document is provided as is without warranty or guarantee of any kind as to its accuracy,
completeness, operability, fitness for particular purpose, merchantability, non-infringement of third-party rights, or any other
warranty, express, implied, or statutory. Spansion assumes no liability for any damages of any kind arising out of the use of
the information in this document.
®
®
®
TM
Copyright © 2014-2015 Spansion
All rights reserved. Spansion , the Spansion logo, MirrorBit , MirrorBit Eclipse ,
TM
TM
TM
ORNAND , Easy DesignSim , Traveo and combinations thereof, are trademarks and registered trademarks of Spansion
LLC in the United States and other countries. Other names used are for informational purposes only and may be trademarks
of their respective owners.
36
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MB39C603_DS405-00021-2v0-E, February 20, 2015
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