MB39C811 - Spansion

The following document contains information on Cypress products.
MB39C811
Ultra Low Power Buck Power Management IC
for Solar/Vibrations Energy Harvesting
Data Sheet (Full Production)
Notice to Readers: This document states the current technical specifications regarding the Spansion
product(s) described herein. Spansion Inc. deems the products to have been in sufficient production volume
such that subsequent versions of this document are not expected to change. However, typographical or
specification corrections, or modifications to the valid combinations offered may occur.
Publication Number MB39C811_DS405-00013
CONFIDENTIAL
Revision 3.0
Issue Date December 05, 2014
v1.2
D a t a S h e e t
Notice On Data Sheet Designations
Spansion Inc. issues data sheets with Advance Information or Preliminary designations to advise readers of
product information or intended specifications throughout the product life cycle, including development,
qualification, initial production, and full production. In all cases, however, readers are encouraged to verify
that they have the latest information before finalizing their design. The following descriptions of Spansion
data sheet designations are presented here to highlight their presence and definitions.
Advance Information
The Advance Information designation indicates that Spansion Inc. is developing one or more specific
products, but has not committed any design to production. Information presented in a document with this
designation is likely to change, and in some cases, development on the product may discontinue. Spansion
Inc. therefore places the following conditions upon Advance Information content:
“This document contains information on one or more products under development at Spansion Inc.
The information is intended to help you evaluate this product. Do not design in this product without
contacting the factory. Spansion Inc. reserves the right to change or discontinue work on this
proposed product without notice.”
Preliminary
The Preliminary designation indicates that the product development has progressed such that a commitment
to production has taken place. This designation covers several aspects of the product life cycle, including
product qualification, initial production, and the subsequent phases in the manufacturing process that occur
before full production is achieved. Changes to the technical specifications presented in a Preliminary
document should be expected while keeping these aspects of production under consideration. Spansion
places the following conditions upon Preliminary content:
“This document states the current technical specifications regarding the Spansion product(s)
described herein. The Preliminary status of this document indicates that product qualification has
been completed, and that initial production has begun. Due to the phases of the manufacturing
process that require maintaining efficiency and quality, this document may be revised by subsequent
versions or modifications due to changes in technical specifications.”
Combination
Some data sheets contain a combination of products with different designations (Advance Information,
Preliminary, or Full Production). This type of document distinguishes these products and their designations
wherever necessary, typically on the first page, the ordering information page, and pages with the DC
Characteristics table and the AC Erase and Program table (in the table notes). The disclaimer on the first
page refers the reader to the notice on this page.
Full Production (No Designation on Document)
When a product has been in production for a period of time such that no changes or only nominal changes
are expected, the Preliminary designation is removed from the data sheet. Nominal changes may include
those affecting the number of ordering part numbers available, such as the addition or deletion of a speed
option, temperature range, package type, or VIO range. Changes may also include those needed to clarify a
description or to correct a typographical error or incorrect specification. Spansion Inc. applies the following
conditions to documents in this category:
“This document states the current technical specifications regarding the Spansion product(s)
described herein. Spansion Inc. deems the products to have been in sufficient production volume
such that subsequent versions of this document are not expected to change. However,
typographical or specification corrections, or modifications to the valid combinations offered may
occur.”
Questions regarding these document designations may be directed to your local sales office.
2
CONFIDENTIAL
MB39C811_DS405-00013-3v0-E, December 05, 2014
v1.2
MB39C811
Ultra Low Power Buck Power Management IC
for Solar/Vibrations Energy Harvesting
Data Sheet (Full Production)
1.
Description
The MB39C811 is the high efficient buck DC/DC converter IC which adopts the all-wave bridge rectifier
using the low-dissipation and the comparator system. It achieves the energy harvest solution for the energy
source of the high output impedance such as the piezoelectric transducer.
It is possible to select from eight preset output voltages and supply up to 100 mA of the output current.
2.
Features










3.
Quiescent current (No load, Output in regulation) : 1.5µA
Quiescent current (VIN = 2.5V UVLO) : 550nA
Integrated Low Loss Full-Wave Bridge Rectifier
VIN input voltage range : 2.6V to 23V
Preset output voltage: 1.5V, 1.8V, 2.5V, 3.3V, 3.6V, 4.1V, 4.5V, 5.0V
Output current : Up to 100mA
Protection functions
Shunt for input protection: VIN ≥ 21V, Up to 100mA Pull-down
Over current limit
I/O power-good detection signal output
Applications





Light energy harvesting
Piezoelectric energy harvesting
Electro-Mechanical energy harvesting
Wireless HVAC sensor
Stand-alone nano-power buck regulator
Online Design Simulation
Easy DesignSim
This product supports the web-based design simulation tool.
It can easily select external components and can display useful information.
Please access from the following URL.
http://www.spansion.com/easydesignsim/
Publication Number MB39C811_DS405-00013
Revision 3.0
Issue Date December 05, 2014
This document states the current technical specifications regarding the Spansion product(s) described herein. Spansion Inc. deems the products to have been in sufficient
production volume such that subsequent versions of this document are not expected to change. However, typographical or specification corrections, or modifications to the
valid combinations offered may occur.
CONFIDENTIAL
v1.2
D a t a S h e e t
Table of Contents
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16.
17.
18.
19.
20.
21.
Description ..................................................................................................................................... 3
Features ......................................................................................................................................... 3
Applications .................................................................................................................................... 3
Pin Assignments ............................................................................................................................. 6
Pin Descriptions.............................................................................................................................. 7
Block Diagram ................................................................................................................................ 8
Absolute Maximum Ratings ............................................................................................................ 9
Recommended Operating Conditions........................................................................................... 10
Electrical Characteristics .............................................................................................................. 11
9.1
DC characteristics ............................................................................................................. 11
9.2
Characteristics of built-in bridge rectification circuit ........................................................... 12
9.3
AC characteristics (Input/output power-good) ................................................................... 12
Function........................................................................................................................................ 13
10.1 Operational summary ........................................................................................................ 13
10.2 Start-up/shut-down sequences .......................................................................................... 14
10.3 Function descriptions ........................................................................................................ 15
Typical Application Circuits ........................................................................................................... 17
Application Notes.......................................................................................................................... 19
Typical Characteristics ................................................................................................................. 23
Layout for Printed Circuit Board ................................................................................................... 29
Usage Precaution ......................................................................................................................... 30
Ordering Information..................................................................................................................... 31
Marking ......................................................................................................................................... 31
Product Labels.............................................................................................................................. 32
Recommended Mounting Conditions............................................................................................ 35
Package Dimensions .................................................................................................................... 36
Major Changes ............................................................................................................................. 37
Figures
Figure 4-1 Pin assignments ........................................................................................................................ 6
Figure 6-1 Block diagram ........................................................................................................................... 8
Figure 7-1 Power dissipation - Operating ambient temperature ................................................................. 9
Figure 9-1 AC characteristics ................................................................................................................... 12
Figure 10-1 Timing chart .......................................................................................................................... 14
Figure 10-2 Input/output power-good signal output .................................................................................. 16
Figure 11-1 Application circuit for photovoltaic energy harvester.............................................................. 17
Figure 11-2 Application circuit for vibration energy harvester ................................................................... 17
Figure 11-3 Voltage doubler rectification circuit for vibration harvester .................................................... 18
Figure 12-1 Application example using the power gating by the OPGOOD signal ................................... 21
Figure 12-2 Waiting for a period of time after the OPGOOD signal goes high ......................................... 22
Figure 13-1 Typical characteristics of DC/DC conveter ............................................................................ 23
Figure 13-2 Typical characteristics of bridge rectifier ............................................................................... 26
Figure 13-3 DC/DC converter sudden load change.................................................................................. 26
Figure 13-4 Switching waveforms of DC/DC converter ............................................................................ 27
Figure 14-1 Example of a layout design ................................................................................................... 29
Figure 17-1 Marking ................................................................................................................................. 31
Figure 18-1 Inner box label [Q-Pack label (4 × 8.5inch)] .......................................................................... 32
Figure 18-2 Al(Aluminum) bag label [2-in-1 label (4 × 8.5inch)]................................................................ 33
Figure 18-3 Reel label [Reel label (4 × 2.5inch)] ...................................................................................... 34
Figure 18-4 Reel label [Dry pack & Reel label (4 × 2.5inch)] .................................................................... 34
4
CONFIDENTIAL
MB39C811_DS405-00013-3v0-E, December 05, 2014
v1.2
D a t a S h e e t
Figure 18-5 Outer box label [Shopping label (4 × 8.5inch)] ...................................................................... 34
Figure 19-1 Recommended mounting conditions ..................................................................................... 35
Tables
Table 5-1 Pin descriptions .......................................................................................................................... 7
Table 7-1 Absolute maximum ratings.......................................................................................................... 9
Table 8-1 Recommended operating conditions ........................................................................................ 10
Table 9-1 DC characteristics ..................................................................................................................... 11
Table 9-2 Characteristics of built-in bridge rectification circuit .................................................................. 12
Table 9-3 AC characteristics ..................................................................................................................... 12
Table 10-1 Output voltage setting & under voltage lockout protection (UVLO) function ........................... 15
Table 10-2 Input power-good signal output (IPGOOD) ............................................................................. 15
Table 10-3 Output power-good signal output (OPGOOD) ........................................................................ 15
Table 11-1 Parts list .................................................................................................................................. 18
Table 12-1 Manufactures of recommended inductors ............................................................................... 19
Table 12-2 Manufactures of photovoltaic harvesters ................................................................................ 19
Table 12-3 Manufactures of vibration harvesters ...................................................................................... 19
Table 12-4 Manufactures of capacitors..................................................................................................... 20
Table 16-1 Ordering information ............................................................................................................... 31
Table 19-1 Recommended mounting conditions ...................................................................................... 35
Table 19-2 Recommended mounting conditions (J-STD-020D) ............................................................... 35
December 05, 2014, MB39C811_DS405-00013-3v0-E
CONFIDENTIAL
5
v1.2
D a t a S h e e t
4.
Pin Assignments
Figure 4-1 Pin assignments
N.C.
N.C.
N.C.
N.C.
N.C.
N.C.
N.C.
N.C.
N.C.
N.C.
(TOP VIEW)
40
39
38
37
36
35
34
33
32
31
28
VOUT
N.C.
4
27
IPGOOD
VIN
5
26
OPGOOD
LX
6
25
GND
PGND
7
24
S0
N.C.
8
23
S1
GND
9
22
S2
N.C.
10
21
GND
11
12
13
14
15
16
17
18
19
20
N.C.
3
AC2_1
N.C.
DCOUT2
VB
AC2_2
29
DCGND2
2
DCGND1
N.C.
AC1_2
GND
DCOUT1
30
AC1_1
１
N.C.
N.C.
(QFN_40PIN)
6
CONFIDENTIAL
MB39C811_DS405-00013-3v0-E, December 05, 2014
v1.2
D a t a S h e e t
5.
Pin Descriptions
Table 5-1 Pin descriptions
Pin No.
Pin Name
I/O
1 to 4
N.C.
-
Non connection pins (Leave these pins open)
5
VIN
-
DC power supply input pin
6
LX
O
DC/DC output pin
7
PGND
-
PGND pin
8
N.C.
-
Non connection pin (Leave this pin open)
9
GND
-
GND pin
10,11
N.C.
-
Non connection pins (Leave these pins open)
12
AC1_1
I
Bridge Rectifier1 AC input pin 1
13
DCOUT1
O
Bridge Rectifier1 DC output pin
14
AC1_2
I
Bridge Rectifier1 AC input pin 2
15
DCGND1
-
GND pin
16
DCGND2
-
GND pin
17
AC2_2
I
Bridge Rectifier2 AC input pin 2
18
DCOUT2
O
Bridge Rectifier2 DC output pin
19
AC2_1
I
Bridge Rectifier2 AC input pin 1
20
N.C.
-
Non connection pin (Leave this pin open)
21
GND
-
GND pin
22
S2
I
Output voltage select pin 2
23
S1
I
Output voltage select pin 1
24
S0
I
Output voltage select pin 0
25
GND
-
GND pin
26
OPGOOD
O
Output power-good output pin
27
IPGOOD
O
Input power-good output pin
28
VOUT
I
Output voltage feedback pin
29
VB
O
Internal circuit power supply pin
30
GND
-
GND pin
31 to 40
N.C.
-
Non connection pins (Leave these pins open)
December 05, 2014, MB39C811_DS405-00013-3v0-E
CONFIDENTIAL
Description
7
v1.2
D a t a S h e e t
6.
Block Diagram
C1
CVIN
VIN
DCOUT2
DCOUT1
Figure 6-1 Block diagram
AC1_1
SHUNT
DCGND1
AC1_2
AC2_1
LX
L1
C2
CVOUT
DCGND2
AC2_2
PGND
ERR
CMP
S2,S1,S0
VOUT
CONTROL
3
VOUT
CTL
VOUT
VIN
BGR
IPGOOD
UVLO
VB
C3
CVB
OPGOOD
VB REG.
PGOOD
UVLO_VB
8
CONFIDENTIAL
MB39C811_DS405-00013-3v0-E, December 05, 2014
v1.2
D a t a S h e e t
7.
Absolute Maximum Ratings
Table 7-1 Absolute maximum ratings
Parameter
Symbol
VIN pin input voltage
VVINMAX
VIN pin
VIN pin input slew rate
SRMAX
VIN pin
VIN pin input current
IINMAX
VIN pin
AC pin input voltage
VACMAX
AC pin input current
IPVMAX
LX pin input voltage
VLXMAX
Input voltage
VVINPUTMAX
Power dissipation
PD
Storage temperature
TSTG
Rating
Condition
(VIN ≥ 7V)
AC1_1 pin, AC1_2 pin,
AC2_1 pin, AC2_2 pin
AC1_1 pin, AC1_2 pin,
AC2_1 pin, AC2_2 pin
LX pin
Unit
Min
Max
-0.3
+24
V
-
0.25
V/ms
-
100
mA
-0.3
+24
V
-
50
mA
+24
V
-0.3
VVB + 0.3
S0 pin, S1 pin, S2 pin
-0.3
VOUT pin
-0.3
+7.0
V
-
2500
mW
-
-55
+125
°C
Ta ≤ +25°C
(≤ +7.0)
V
ESD voltage 1
VESDH
Human Body Model (100pF, 5kΩ)
-900
+2000
V
ESD voltage 2
VESDM
Machine Model (200pF, 0Ω)
-150
+150
V
ESD voltage 3
VCDM
Charged Device Model
-1000
+1000
V
Figure 7-1 Power dissipation - Operating ambient temperature
Power dissipation [W]
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-50
-25
0
25
50
75
100
Temperature [℃]
WARNING:
1. Semiconductor devices may be permanently damaged by application of stress (including, without
limitation, voltage, current or temperature) in excess of absolute maximum ratings.Do not exceed any of
these ratings.
December 05, 2014, MB39C811_DS405-00013-3v0-E
CONFIDENTIAL
9
v1.2
D a t a S h e e t
8.
Recommended Operating Conditions
Table 8-1 Recommended operating conditions
Parameter
Symbol
VIN pin input voltage
VVIN
AC pin input voltage
VPV
Input voltage
Operating ambient temperature
Condition
VIN pin
AC1_1 pin, AC1_2 pin,
AC2_1 pin, AC2_2 pin
VSI
S0 pin, S1 pin, S2 pin
VFB
VOUT pin
Ta
-
Value
Unit
Min
Typ
Max
2.6
-
23
V
-
-
23
V
0
-
VVB
V
0
-
5.5
V
-40
-
+85
°C
WARNING:
1. The recommended operating conditions are required in order to ensure the normal operation of the
semiconductor device. All of the device's electrical characteristics are warranted when the device is
operated under these conditions.
2. Any use of semiconductor devices will be under their recommended operating condition.
3. Operation under any conditions other than these conditions may adversely affect reliability of device and
could result in device failure.
4. No warranty is made with respect to any use, operating conditions or combinations not represented on
this data sheet. If you are considering application under any conditions other than listed herein, please
contact sales representatives beforehand.
10
CONFIDENTIAL
MB39C811_DS405-00013-3v0-E, December 05, 2014
v1.2
D a t a S h e e t
9.
Electrical Characteristics
9.1
DC characteristics
Table 9-1 DC characteristics
(Ta=-40°C to +85°C, VVIN=7.0V, L1=22µH, C2=47µF)
Parameter
Quiescent current
Symbol
IVIN
Preset output voltage
Peak switching current
Maximum Output current
VVOUT
Condition
Unit
Typ
Max
VVIN = 2.5V (UVLO), Ta = +25°C
-
550
775
nA
VVIN = 4.5V (sleep mode), Ta = +25°C
-
1.5
2.25
µA
VVIN = 18V (sleep mode), Ta = +25°C
-
1.9
2.85
µA
S2 = L, S1 = L, S0 = L, IOUT = 1mA
1.457
1.5
1.544
V
S2 = L, S1 = L, S0 = H, IOUT = 1mA
1.748
1.8
1.852
V
S2 = L, S1 = H, S0 = L, IOUT = 1mA
2.428
2.5
2.573
V
S2 = L, S1 = H, S0 = H, IOUT = 1mA
3.214
3.3
3.386
V
S2 = H, S1 = L, S0 = L, IOUT = 1mA
3.506
3.6
3.694
V
S2 = H, S1 = L, S0 = H, IOUT = 1mA
3.993
4.1
4.207
V
S2 = H, S1 = H, S0 = L, IOUT = 1mA
4.383
4.5
4.617
V
S2 = H, S1 = H, S0 = H, IOUT = 1mA
4.870
5.0
5.130
V
200
250
400
mA
100*
-
-
mA
3.8
4.0
4.2
V
4.94
5.2
5.46
V
6.84
7.2
7.56
V
2.6
2.8
3.0
V
3.8
4.0
4.2
V
5.7
6.0
6.3
V
19
21
23
V
100
-
-
mA
90
94
98
%
65.5
70
74.5
%
-
5.0(*1)
-
V
IPEAK
IOUTMAX
Value
Min
Ta = +25°C
S2 = L, S1 = L, S0 = L
S2 = L, S1 = L, S0 = H
S2 = L, S1 = H, S0 = L
UVLO release voltage
(Input power-good detection voltage)
VUVLOH
S2 = L, S1 = H, S0 = H
S2 = H, S1 = L, S0 = L
S2 = H, S1 = L, S0 = H
S2 = H, S1 = H, S0 = L
S2 = H, S1 = H, S0 = H
S2 = L, S1 = L, S0 = L
S2 = L, S1 = L, S0 = H
S2 = L, S1 = H, S0 = L
UVLO detection voltage
(Input power-good reset voltage)
VUVLOL
S2 = L, S1 = H, S0 = H
S2 = H, S1 = L, S0 = L
S2 = H, S1 = L, S0 = H
S2 = H, S1 = H, S0 = L
S2 = H, S1 = H, S0 = H
VIN pin shunt voltage
VSHUNT
VIN pin shunt current
ISHUNT
Output power-good detection voltage
(Rising)
Output power-good reset voltage
(Falling)
Power supply output voltage for
internal circuit
VOPGH
VOPGL
VVB
IVIN = 1mA
To preset voltage ratio
VVOUT ≥ 3.3V (*2)
To preset voltage ratio
VVIN = 6V to 20V
*1: This parameter is not be specified. This should be used as a reference to support designing the circuits.
*2: Please contact the department in charge if use this output power-good function under the conditions of
VVOUT ≤ 2.5V.
December 05, 2014, MB39C811_DS405-00013-3v0-E
CONFIDENTIAL
11
v1.2
D a t a S h e e t
9.2
Characteristics of built-in bridge rectification circuit
Table 9-2 Characteristics of built-in bridge rectification circuit
(Ta=+25°C)
Parameter
Symbol
Forward bias voltage
VF
Value
Condition
IF = 10µA
Typ
Max
150
280
450
mV
Forward direction current
IF
-
-
50
mA
Reverse bias leak current
IR
VR = 18V
-
-
20
nA
VBREAK
IR = 1µA
VSHUNT
25
-
V
Break down voltage
9.3
-
Unit
Min
AC characteristics (Input/output power-good)
Table 9-3 AC characteristics
(Ta=+25°C, VOUT=3.3V)
Parameter
Symbol
Value
Condition
Min
Typ
Max
Unit
Input power-good detection delay time (Rising)
tIPGH
SRVIN = 0.1V/ms
-
1
-
ms
Input power-good reset delay time (Falling)
tIPGL
SRVIN = 0.1V/ms
-
1
-
ms
Input power-good undefined time
tIPGX
OPGOOD rising
-
1
3
ms
Output power-good detection delay time (Rising)
tOPGH
-
1
-
ms
-
1
-
ms
IOUT = 0mA,
L1 = 22μH,
C2 = 47μF,
Output power-good reset delay time (Falling)
tOPGL
IOUT = 1mA,
C2 = 47μF
Figure 9-1 AC characteristics
VUVLOH
VIN
VUVLOL
VOPGH
VOPGL
VOUT
tIPGH
IPGOOD
tIPGL
tIPGX
OPGOOD
tOPGH
tOPGL
12
CONFIDENTIAL
MB39C811_DS405-00013-3v0-E, December 05, 2014
v1.2
D a t a S h e e t
10. Function
10.1 Operational summary
Bridge rectifier
The A/C voltage which is input to the AC1_1 and AC1_2 pins or the AC2_1 and AC2_2 pins is all-wave
rectified at the bridge rectifier of the low-dissipation diode. The bridge rectifier output is output from the
DCOUT1 pin and the DCOUT2 pin. By connecting those outputs to the VIN pin, the electric charge is
accumulated to the capacitor and it is used as the energy condenser of the buck converter.
Power supply for internal circuit
When the VIN pin voltage is 3.5 V or lower, the power supply is supplied from the VIN pin to the internal
circuit directly. If the VIN pin is over 3.5 V, the internal regulator is activated and the power supply is supplied
from the internal regulator to the internal circuit. Therefore, the stable output voltage is maintained in the
wide input voltage range 2.6 V to 23 V.
DC/DC start-up/shut-down
When the VIN pin voltage is over the release voltage VUVLOH for the under voltage lockout protection
circuit (UVLO), the converter circuit is enabled and the electric charge is supplied from the input capacitor to
the output capacitor. When the VIN pin voltage is below the UVLO detection voltage VUVLOL, the converter
is disabled. The 1.2 V hysteresis between the release voltage and the detection voltage for UVLO prevents
the converter from noise or frequent ON/OFF which is caused by the VIN pin voltage-drop during start-up.
Sleep/auto active control
When the feedback voltage VFB for the converter reaches the determinate voltage, the sleep state to stop
the switching operation starts and that can reduce the consumption power from the internal circuit. When the
VOUT voltage is below the threshold value, the VOUT voltage is maintained to the rated value by making the
converter active again.
December 05, 2014, MB39C811_DS405-00013-3v0-E
CONFIDENTIAL
13
v1.2
D a t a S h e e t
10.2 Start-up/shut-down sequences
Figure 10-1 Timing chart
AC1_1,
AC1_2
or
AC2_1,
AC2_2
VSHUNT
Charge
Voltage
VVB
VIN
VUVLOH
VUVLOL
VB
UVLO
(internal signal)
UVLO
Rising
active
Transfer Charge
to the Output
14
CONFIDENTIAL
VOPGH
sleep
Output
IPGOOD
IPGOOD
OPGOOD
UVLO
Falling
UVLO
Falling
DC/DC
Enable
LX
VOUT
VVB
Internal
Regulator
Start-up
Output
OPGOOD
VOPGL
Rest
IPGOOD
Reset
OPGOOD
MB39C811_DS405-00013-3v0-E, December 05, 2014
v1.2
D a t a S h e e t
10.3 Function descriptions
Output voltage setting & under voltage lockout protection (UVLO) function
It is possible to select the output voltage from eight kinds of presets using the S2, S1 and S0 pins.
Also, the under voltage lockout protection circuit is provided to prevent IC's malfunction by the transient state
or the instant drop during the VIN pin voltage activation, system destroy and deterioration, and it is set as
follows according to the preset voltage. When the VIN pin exceeds the release voltage for the UVLO circuit,
the system is recovered.
Table 10-1 Output voltage setting & under voltage lockout protection (UVLO) function
Under voltage lockout protection (UVLO) -TypS2
L
S1
S0
VOUT[V]
L
L
1.5
L
L
H
1.8
L
H
L
2.5
L
H
H
3.3
H
L
L
3.6
H
L
H
4.1
H
H
L
4.5
H
H
H
5.0
Detection voltage
Release voltage
(Falling) VUVLOL [V]
(Rising) VUVLOH [V]
2.8
4.0
4.0
5.2
6.0
7.2
Input/output power-good signal output
When the VIN pin input voltage is equal to the release voltage VUVLOH for UVLO or more, the output for the
IPGOOD pin is set to the “H” level as the input power-good. When the VIN pin input voltage is equal to the
detection voltage VUVLOL for UVLO or less, the output for the IPGOOD pin is reset to the “L” level. The
IPGOOD output is enabled only when the following output power-good signal output OPGOOD is “H” level.
The output power-good signal OPGOOD is set to the “H” level when the feedback voltage VFB for the VOUT
pin is equal to the detection voltage VOPGH or more. When the feedback voltage VFB is equal to the reset
voltage VOPGL or less, the output for the OPGOOD pin is reset to the “L” level.
Table 10-2 Input power-good signal output (IPGOOD)
OPGOOD
UVLO
IPGOOD
L
Don’t care
L
H
L
L
H
H
H
Table 10-3 Output power-good signal output (OPGOOD)
VFB
OPGOOD
≤ VOPGL
L
≥ VOPGH
(VVOUT ≥ 3.3V) (*1)
H
*1 : Please contact the department in charge if use this output power-good function under the conditions of
VVOUT ≤ 2.5V.
December 05, 2014, MB39C811_DS405-00013-3v0-E
CONFIDENTIAL
15
v1.2
D a t a S h e e t
Figure 10-2 Input/output power-good signal output
OPGOOD
Logic
High
Logic
Low
VOPGL
VOPGH
VOUT
Input over voltage protection
If the voltage exceeding VSHUNT (Typ : 21V) is input to the VIN pin, the input level is clamped enabling the
over voltage protection circuit. The flowing current is ISHUNT (Min 100mA) during clamp.
Over current protection
If the output current for the LX pin reaches the over current detection level IPEAK, the circuit is protected by
controlling the peak value for the inductor current setting the main side FET to the OFF state.
16
CONFIDENTIAL
MB39C811_DS405-00013-3v0-E, December 05, 2014
v1.2
D a t a S h e e t
11. Typical Application Circuits
Figure 11-1 Application circuit for photovoltaic energy harvester
PV
AC1_1
DCGND1
AC1_2
C3
4.7uF
DCOUT1
VIN
C1
10uF
VB
L1
22uH
VOUT
LX
S2
S1
S0
Output voltage
select
GND
VOUT
C2
47uF
IPGOOD
OPGOOD
PGND
Figure 11-2 Application circuit for vibration energy harvester
AC2_1
DCGND2
PZ1
AC2_2
C3
4.7uF
DCOUT2
VIN
C1
10uF
VB
LX
S2
S1
S0
Output voltage
select
December 05, 2014, MB39C811_DS405-00013-3v0-E
CONFIDENTIAL
GND
VOUT
L1
22uH
VOUT
C2
47uF
IPGOOD
OPGOOD
PGND
17
v1.2
D a t a S h e e t
Figure 11-3 Voltage doubler rectification circuit for vibration harvester
C4
10uF
PZ1
DD
DCGND1
1
C5
10uF
DD
2
AC1_1
DCOUT1
AC1_2
C3
4.7uF
VIN
VB
L1
22uH
LX
VOUT
S2
S1
S0
Output voltage
select
VOUT
C2
47uF
IPGOOD
OPGOOD
GND
PGND
Operation of the double voltage rectifier circuit rectifying an AC input voltage
When the AC1_1 input voltage is positive, the capacitor C4 charges up through the diode DD1, and when
the AC1_1 input voltage is negative, the capacitor C5 charges up through the diode DD2. Each capacitor
takes on a charge of the positive peak of the AC input. The output voltage at the VIN pin is the series total of
C4+C5.
Table 11-1 Parts list
Part number
Value
Description
C1
10μF(*1)
Capacitor
C2
47μF(*1)
Capacitor
C3
4.7μF
Capacitor
C4
10μF(*1)
Capacitor
C5
10μF(*1)
Capacitor
L1
10μH to 22μH
Inductor
*1: Adjust the values according to the source supply ability and the load power.
18
CONFIDENTIAL
MB39C811_DS405-00013-3v0-E, December 05, 2014
v1.2
D a t a S h e e t
12. Application Notes
Inductor
The MB39C811 is optimized to work with an inductor in the range of 10µH to 22µH. Also, since the peak
switching current is up to 400mA, select an inductor with a DC current rating greater than 400mA.
Table 12-1 Manufactures of recommended inductors
Part number
Value
LPS5030-223ML
22μH
Manufacture
Coilcraft, Inc.
VLF403215MT-220M
22μH
TDK Corporation
Harvester (Photovoltaic power generator)
In case of photovoltaic energy harvesting, such as solar or light energy harvesting, use a solar cell with high
open-circuit voltage which must be higher than the UVLO release voltage. Electric power obtained from light
or solar is increased in proportion to the ambient illuminance.
There are silicone-based solar cells and organic-based solar cells about photovoltaic power generators.
Silicone-based solar cells are single crystal silicon solar cell, polycrystalline silicon solar cell, and
amorphous silicon solar cell. Organic-based solar cells are dye-sensitized solar cell (DSC), and organic thin
film solar cell. Crystal silicon and polycrystalline silicon solar cells have high energy conversion efficiency.
Amorphous silicon solar cells are lightweight, flexible, and produced at low cost. Dye-sensitized solar cells
are composed by sensitizing dye and electrolytes, and are low-cost solar cell. Organic thin film solar cells
are lightweight, flexible, and easily manufactured.
Table 12-2 Manufactures of photovoltaic harvesters
Part number/Series name
Type
Manufacture
BCS4630B9
Film amorphous silicon solar cells
TDK Corporation
Amorton
Amorphous silicon solar cells
Panasonic Corporation
Harvester (Vibration power generator, Piezoelectric generator)
Vibration power generators produce AC power by vibration. For AC to DC rectification, the MB39C811
integrates two bridge rectifiers. Electric power obtained from a vibration power generator depends on
frequency of vibration and usage of the generator. Although, vibration generators produce high voltage, the
shunt circuit protects from higher voltage than 21V.
There are electromagnetic induction generators and piezoelectric generators about vibration harvesters.
The electromagnetic induction generator is consists of coil and magnet. The piezoelectric generators are
made from plastics or ceramics. Plastic-based piezoelectric generators made from polyvinylidene fluoride
are lightweight, flexible. Ceramic-based piezoelectric generators are made from barium titanate or leas
zirconate titanate ceramics.
Table 12-3 Manufactures of vibration harvesters
Part number
Type
Manufacture
EH12, EH13, EH15
Electromagnetic induction
Star Micronics Co., Ltd.
December 05, 2014, MB39C811_DS405-00013-3v0-E
CONFIDENTIAL
19
v1.2
D a t a S h e e t
Sizing of input and output capacitors
Energy from harvester should be stored on the Cin and Cout to operate the application block. If the size of
these capacitors were too big, it would take too much time to charge energy into these capacitors, and the
system cannot be operated frequently. On the other hand, if these capacitors were too small, enough energy
cannot be stored on these capacitors for the application block. The sizing of the Cin and Cout is important.
Common capacitors are layered ceramic capacitor, electrolytic capacitor, electric double layered capacitor,
and so on. Electrostatic capacitance of layered ceramic capacitors is relatively small. However, layered
ceramic capacitors are small and have high voltage resistance characteristic. Electrolytic capacitors have
high electrostatic capacitance from µF order to mF order. The size of capacitor becomes large in proportion
to the size of capacitance. Electric double layered capacitors have high electrostatic capacitance around
0.5F to 1F, but have low voltage resistance characteristics around 3V to 5V. Be very careful with a voltage
resistance characteristic. Also, leak current, equivalent series resistance (ESR), and temperature
characteristic are criteria for selecting,
Table 12-4 Manufactures of capacitors
Part number/Series name
Type, Capacitance
EDLC351420-501-2F-50
EDLC, 500mF
EDLC082520-500-1F-81
EDLC, 50mF
EDLC041720-050-2F-52
EDLC, 5mF
Gold capacitor
EDLC
Manufacture
TDK Corporation
Panasonic Corporation
First of all, apply the following equation and calculate energy consumption for an application from voltage,
current, and time during an operation.
EAppli. [J] = VAppli. × IAppli. × t Appli.
1
2
The energy stored on a capacitor is calculated by the following equation.
1
Ec [J] = CV 2
2
Since the energy in a capacitor is proportional to the square of the voltage, it is energetically advantageous
for the buck DC/DC converter to make the Cin larger.
An example of an application using the power gating by the OPGOOD signal is shown in the Figure 12-1.
The Cin and the Cout are sized so as to satisfy the following equation. The η, the efficiency of the
MB39C811, is determined from the current of application and the graph shown in Figure 13-1, Efficiency vs
IOUT.
EAppli. ≤ dECin × η + dECout
1
2
dECin and dECout are the available energies for the application.
dECin [J] =
1
Cin(VUVLOH 2 − VUVLOL2 )
2
dECout [J] =
20
CONFIDENTIAL
1
Cout(VVOUT 2 − VOPGL2 )
2
MB39C811_DS405-00013-3v0-E, December 05, 2014
v1.2
D a t a S h e e t
Figure 12-1 Application example using the power gating by the OPGOOD signal
OPGOOD
VIN
Cin
Harvester
VUVLOH
VUVLOL
+
VUVLOH : UVLO release voltage
VUVLOL : UVLO detection voltage
Power
Gating
Cout
MB39C811
Efficiency(η)
0V
Available Energy
VOUT
Appli.
VVOUT
VOPGL
0V
Total Energy
VVOUT : Preset output voltage
VUVLOL : Output power-good reset voltage
Before calculating the initial charging time (TInitial[s]), calculate the total energy (ECin and ECout) stored on both
Cin and Cout.
ECout [J] =
1
Cin × VUVLOH2
2
ECout [J] =
1
Cout × VVOUT 2
2
A PHarvester[W] is a power generation capability of a harvester. An initial charging time (TInitial[s]) is calculated
by the following equation.
TInitial =
ECin
ECout
+
PHarvester PHarvester × η
A repeat charging time (TRepeat[s]) is calculated by the following equation. The TRepeat[s] become shorter than
the TInitial[s].
TRepeat =
dECin
dECout
+
PHarvester PHarvester × η
December 05, 2014, MB39C811_DS405-00013-3v0-E
CONFIDENTIAL
21
v1.2
D a t a S h e e t
Additionally, waiting for a period of time after the OPGOOD signal goes high can store more energy on the
capacitor Cin (Figure 12-2).
dECout [J] =
1
2
Cin(VOpenCircuitVoltage
− VUVLOL2 )
2
Figure 12-2 Waiting for a period of time after the OPGOOD signal goes high
OPGOOD
Light
VIN
Solar
Cell
Open circuit
voltage of
solar cell
Cin
VOUT
VVOUT
VOPGL
0V
0V
Available Energy
Cout
MB39C811
VUVLOL
+
VUVLOL : UVLO detection voltage
Power
Gating
Appli.
Wait after
OPGOOD
was High.
Total Energy
VVOUT : Preset output voltage
VUVLOL : Output power-good reset voltage
For more information about the energy calculation, refer to the APPLICATION NOTE, Energy Calculation
For Energy Harvesting.
22
CONFIDENTIAL
MB39C811_DS405-00013-3v0-E, December 05, 2014
v1.2
D a t a S h e e t
13. Typical Characteristics
Figure 13-1 Typical characteristics of DC/DC conveter
Line Regulation: VOUT vs VIN
3.34
Preset output voltage = 1.5V
Preset output voltage = 3.3V
1.50
3.30
4.98
1.48
VOUT [V]
5.00
3.28
3.26
1.44
6
8
10
12
VIN [V]
14
16
3.34
Preset output voltage = 1.5V
8
10
12
VIN [V]
14
16
4.92
6
18
5.02
Preset output voltage = 3.3V
1.50
3.30
4.98
VOUT [V]
5.00
VOUT [V]
3.32
1.46
3.28
3.26
1.44
10µ
100µ
1m
IOUT [A]
10m
Efficiency vs IOUT
100
100
Preset output voltage = 5.0V
90
100µ
1m
IOUT [A]
10m
100
Preset output voltage = 5.0V
90
90
70
70
40
30
Efficiency [%]
70
Efficiency [%]
80
Preset output voltage = 3.3V
Preset output voltage = 1.5V
Preset output voltage = 3.3V
60 Preset output voltage = 1.5V
50
40
30
20
10
10m
100m
December 05, 2014, MB39C811_DS405-00013-3v0-E
CONFIDENTIAL
4
6
8
10
12
VIN [V]
14
16
18
10m
100m
L = 22µH
Preset output voltage = 3.3V
IOUT = 100mA
IOUT = 30mA
IOUT = 1mA
IOUT = 100µA
IOUT = 10µA
30
10
100µ
1m
IOUT [A]
1m
IOUT [A]
40
10
10µ
100µ
50
20
0
2
18
Preset output voltage = 5.0V
60
20
0
1µ
16
Efficiency in VOUT=3.3V vs VIN
IOUT = 100mA, L = 22µH
80
50
14
VIN = 7.0V, L = 22µH
4.92
10µ
100m
80
60
12
VIN [V]
4.96
Efficiency in IOUT=100mA vs VIN
VIN = 7.0V, L = 22µH
10
4.94
3.24
10µ
100m
8
Load Regulation: VOUT vs IOUT
VIN = 7.0V, L = 22µH
1.52
1.48
Preset output voltage = 5.0V
4.96
Load Regulation: VOUT vs IOUT
VIN = 7.0V, L = 22µH
IOUT = 100mA, L = 22µH
4.94
3.24
6
18
Load Regulation: VOUT vs IOUT
1.54
VOUT [V]
5.02
3.32
1.46
Efficiency [%]
Line Regulation: VOUT vs VIN
IOUT = 100mA, L = 22µH
1.52
VOUT [V]
VOUT [V]
Line Regulation: VOUT vs VIN
IOUT = 100mA, L = 22µH
1.54
0
2
IOUT = 1µA
4
6
8
10
12
VIN [V]
14
16
18
23
v1.2
D a t a S h e e t
Line Regulation: VOUT vs VIN
3.38
Preset output voltage = 1.5V
Preset output voltage = 3.3V
1.50
3.34
4.98
1.48
VOUT [V]
5.00
3.32
3.30
1.44
6
8
10
12
VIN [V]
14
3.34
Preset output voltage = 1.5V
8
10
12
VIN [V]
14
16
4.92
6
18
5.02
Preset output voltage = 3.3V
1.50
3.30
4.98
VOUT [V]
5.00
VOUT [V]
3.32
1.46
3.28
3.26
1.44
10µ
100µ
1m
IOUT [A]
10m
Efficiency vs IOUT
100
100
Preset output voltage = 5.0V
90
100µ
1m
IOUT [A]
10m
100
Preset output voltage = 5.0V
90
90
70
70
40
30
Efficiency [%]
70
Efficiency [%]
80
50
Preset output voltage = 3.3V
60 Preset output voltage = 1.5V
50
40
30
20
10
24
CONFIDENTIAL
10m
100m
4
6
8
10
12
VIN [V]
14
16
18
10m
100m
L = 10µH
Preset output voltage = 3.3V
IOUT = 100mA
IOUT = 30mA
IOUT = 1mA
IOUT = 100µA
IOUT = 10µA
30
10
100µ
1m
IOUT [A]
1m
IOUT [A]
40
20
10µ
100µ
50
10
0
2
18
Preset output voltage = 5.0V
60
20
0
1µ
16
Efficiency in VOUT=3.3V vs VIN
IOUT = 100mA, L = 10µH
80
Preset output voltage = 3.3V
Preset output voltage = 1.5V
14
VIN = 7.0V, L = 10µH
4.92
10µ
100m
80
60
12
VIN [V]
4.96
Efficiency in IOUT=100mA vs VIN
VIN = 7.0V, L = 10µH
10
4.94
3.24
10µ
100m
8
Load Regulation: VOUT vs IOUT
VIN = 7.0V, L = 10µH
1.52
1.48
Preset output voltage = 5.0V
4.96
Load Regulation: VOUT vs IOUT
VIN = 7.0V, L = 10µH
IOUT = 100mA, L = 10µH
4.94
3.28
6
18
16
Load Regulation: VOUT vs IOUT
1.54
VOUT [V]
5.02
3.36
1.46
Efficiency [%]
Line Regulation: VOUT vs VIN
IOUT = 100mA, L = 10µH
1.52
VOUT [V]
VOUT [V]
Line Regulation: VOUT vs VIN
IOUT = 100mA, L = 10µH
1.54
0
2
IOUT = 1µA
4
6
8
10
12
VIN [V]
14
16
18
MB39C811_DS405-00013-3v0-E, December 05, 2014
v1.2
D a t a S h e e t
IVIN in Start-up vs VIN
IVIN in Sleep mode vs VIN
IOUT = 0A, L = 22µH
3.0
Preset output voltage = 3.3V
2.5
Preset output voltage = 3.3V
1.5
85oC
25 C
－40oC
3
VIN [V]
4
5
1.0
0.5
0.5
0.0
0
6
2
4
6
8
10
VIN [V]
12
14
16
24
7
VUVLOL : VIN [V]
6
5 Preset output voltage = 3.3V
Preset output voltage = 1.5V
-20
0
20
40
Temp. [oC]
60
6
5
Preset output voltage = 3.3V
4
2
-40
80 90
IPEAK vs Temp.
290
VIN = 7.0V, L = 22µH
2.6
0
20
40
Temp. [oC]
60
80 90
60
80 90
IVIN = 1mA, IOUT = 0A, L = 22µH
Preset output voltage = 1.5V
23
Preset output voltage = 5.0V
-20
0
20
40
Temp. [oC]
22
21
20
3 Preset output voltage = 1.5V
3
-20
VSHUNT vs Temp.
VIN = 7.0V, L = 22µH
8
7 Preset output voltage = 5.0V
2
-40
VIN=4.5V (Sleep mode)
0.0
-40
18
VUVLOL vs Temp.
VIN = 7.0V, L = 22µH
4
1.5
1.0
VUVLOH vs Temp.
8
－40oC
1.5
VSHUNT : VIN [V]
2
25 C
VIN=2.5V
o
1
2.0
o
IVIN [µA]
IVIN [µA]
IVIN [µA]
2.0
0.0
0
VIN=18V (Sleep mode)
85oC
2.0
0.5
Preset output voltage = 1.5V
2.5
2.5
1.0
IOUT = 0A, L = 22µH
3.0
VUVLOH
VUVLOH : VIN [V]
IVIN in Sleep mode vs Temp.
IOUT = 0A, L = 22µH
3.0
60
80 90
19
-40
-20
0
20
40
Temp. [oC]
On-Resistance of PMOS/NMOS
vs Temp.
Preset output voltage = 1.5V
2.4
270
260
Preset output voltage = 3.3V
250
Preset output voltage = 5.0V
240
230
-40
On-Resistance [Ω]
IPEAK : ILX [mA]
280
2.2
2.0
NMOS
1.8
1.6
PMOS
1.4
-20
0
20
40
Temp. [oC]
60
80 90
1.2
-40
December 05, 2014, MB39C811_DS405-00013-3v0-E
CONFIDENTIAL
-20
0
20
40
Temp. [oC]
60
80 85
25
v1.2
D a t a S h e e t
Figure 13-2 Typical characteristics of bridge rectifier
Bridge Rectifier
Frequency Characteristics
In applying 1.64Vp-p to AC1_1/AC1_2
1m
100m
-40 C
25oC
85oC
0.2
0.1
1m
100µ
25oC
10µ
1µ
-40oC
100n
10n
1n
100
1k
10k 100k
Freq. [Hz]
1M
10M 100M
10µ
1µ
85oC
100n
10n
25oC
1n
-40oC
100p
100p
0.0
10
Diode in Bridge Rectifier
IR vs VR
100µ
85oC
10m
o
0.3
Diode in Bridge Rectifier
IF vs VF
Reverse Current : IR [A]
0.4
DCOUT1 [V]
1
Forward Current : IF [A]
0.5
10p
0.0
0.2
0.6
0.8
1.0
0.4
Forward Voltage: VF [V]
1.2
10p
0
10
20
30
40
50
Reverse Voltage: VR [V]
60
70
Figure 13-3 DC/DC converter sudden load change
Load Change Waveforms
VIN = 5.0V, L = 22µH, IOUT = 5mA and 65mA
Preset output voltage = 3.3V
VOUT
20mV/DIV
17.2mV
IOUT
50mA/DIV
200µs/DIV
26
CONFIDENTIAL
MB39C811_DS405-00013-3v0-E, December 05, 2014
v1.2
D a t a S h e e t
Figure 13-4 Switching waveforms of DC/DC converter
Waveforms
Waveforms
VIN = 7.0V, L = 22µH, IOUT = 1mA
VIN = 7.0V, L = 22µH, IOUT = 1mA
Preset output voltage = 3.3V
Preset output voltage = 3.3V
VOUT
20mV/DIV
VOUT
20mV/DIV
VLX
5.0V/DIV
VLX
5.0V/DIV
ILX
200mA/DIV
ILX
200mA/DIV
2µs/DIV
100µs/DIV
Waveforms
Waveforms
VIN = 7.0V, L = 22µH, IOUT = 30mA
VIN = 7.0V, L = 22µH, IOUT = 30mA
Preset output voltage = 3.3V
Preset output voltage = 3.3V
VOUT
20mV/DIV
VOUT
20mV/DIV
VLX
5.0V/DIV
VLX
5.0V/DIV
ILX
200mA/DIV
ILX
200mA/DIV
2µs/DIV
5µs/DIV
Waveforms
Waveforms
VIN = 7.0V, L = 22µH, IOUT = 100mA
VIN = 7.0V, L = 22µH, IOUT = 100mA
VOUT setting
Preset
output =voltage
3.3V = 3.3V
Preset output voltage = 3.3V
VOUT
50mV/DIV
VOUT
50mV/DIV
VLX
5.0V/DIV
VLX
5.0V/DIV
ILX
200mA/DIV
ILX
200mA/DIV
5µs/DIV
December 05, 2014, MB39C811_DS405-00013-3v0-E
CONFIDENTIAL
10µs/DIV
27
v1.2
D a t a S h e e t
Waveforms
Waveforms
VIN = 7.0V, L = 10µH, IOUT = 1mA
VIN = 7.0V, L = 10µH, IOUT = 1mA
Preset output voltage = 3.3V
Preset output voltage = 3.3V
VOUT
20mV/DIV
VOUT
20mV/DIV
VLX
5.0V/DIV
VLX
5.0V/DIV
ILX
200mA/DIV
ILX
200mA/DIV
2µs/DIV
100µs/DIV
Waveforms
Waveforms
VIN = 7.0V, L = 10µH, IOUT = 30mA
VIN = 7.0V, L = 10µH, IOUT = 30mA
Preset output voltage = 3.3V
Preset output voltage = 3.3V
VOUT
20mV/DIV
VOUT
20mV/DIV
VLX
5.0V/DIV
VLX
5.0V/DIV
ILX
200mA/DIV
ILX
200mA/DIV
2µs/DIV
5µs/DIV
Waveforms
Waveforms
VIN = 7.0V, L = 10µH, IOUT = 30mA
VIN = 7.0V, L = 10µH, IOUT = 30mA
Preset output voltage = 3.3V
Preset output voltage = 3.3V
VOUT
50mV/DIV
VOUT
50mV/DIV
VLX
5.0V/DIV
VLX
5.0V/DIV
ILX
200mA/DIV
ILX
200mA/DIV
5µs/DIV
28
CONFIDENTIAL
10µs/DIV
MB39C811_DS405-00013-3v0-E, December 05, 2014
v1.2
D a t a S h e e t
14. Layout for Printed Circuit Board
Note the points listed below in layout design
− Place the switching parts(*1) on top layer, and avoid connecting each other through through-holes.
− Make the through-holes connecting the ground plane close to the GND pins of the switching parts(*1).
− Be very careful about the current loop consisting of the input capacitor CVIN, the VIN pin of IC, and the
PGND pin. Place and connect these parts as close as possible to make the current loop small.
− The output capacitor CVOUT and the inductor L are placed adjacent to each other.
− Place the bypass capacitor CVB close to VB pin, and make the through-holes connecting the ground
plane close to the GND pin of the bypass capacitor CVB.
− Draw the feedback wiring pattern from the VOUT pin to the output capacitor CVOUT pin. The wiring
connected to the VOUT pin is very sensitive to noise so that the wiring should keep away from the
switching parts(*1). Especially, be very careful about the leaked magnetic flux from the inductor L,
even the back side of the inductor L.
*1: Switching parts: IC (MB39C811), Input capacitor (CVIN), Inductor (L), Output capacitor (CVOUT). Refer
to Figure 6-1.
Figure 14-1 Example of a layout design
CVOUT
feedback wiring pattern
L
CVIN
VB
VOUT
Top Layer
through-holes
VIN
LX
PGND
Back Layer
December 05, 2014, MB39C811_DS405-00013-3v0-E
CONFIDENTIAL
CVB
29
v1.2
D a t a S h e e t
15. Usage Precaution
Do not configure the IC over the maximum ratings
If the IC is used over the maximum ratings, the LSI may be permanently damaged.
It is preferable for the device to be normally operated within the recommended usage conditions. Usage
outside of these conditions can have a bad effect on the reliability of the LSI.
Use the devices within recommended operating conditions
The recommended operating conditions are the recommended values that guarantee the normal operations
of LSI.
The electrical ratings are guaranteed when the device is used within the recommended operating conditions
and under the conditions stated for each item.
Printed circuit board ground lines should be set up with consideration for common
impedance
Take appropriate measures against static electricity
− Containers for semiconductor materials should have anti-static protection or be made of conductive
material.
− After mounting, printed circuit boards should be stored and shipped in conductive bags or containers.
− Work platforms, tools, and instruments should be properly grounded.
− Working personnel should be grounded with resistance of 250 kΩ to 1MΩ in series between body and
ground.
Do not apply negative voltages
The use of negative voltages below -0.3V may cause the parasitic transistor to be activated on LSI lines,
which can cause malfunctions.
30
CONFIDENTIAL
MB39C811_DS405-00013-3v0-E, December 05, 2014
v1.2
D a t a S h e e t
16. Ordering Information
Table 16-1 Ordering information
Part number
Package
40-pin plastic QFN
MB39C811QN
(LCC-40P-M63)
17. Marking
Figure 17-1 Marking
MB 3 9 C 8 1 1
E2
INDEX
December 05, 2014, MB39C811_DS405-00013-3v0-E
CONFIDENTIAL
Lead free mark
31
v1.2
D a t a S h e e t
18. Product Labels
Figure 18-1 Inner box label [Q-Pack label (4 × 8.5inch)]
Ordering Part Number
(P)+Part No.
Quantity
Mark lot information
Label spec
: Conformable JEDEC
Barcode form : Code 39
32
CONFIDENTIAL
MB39C811_DS405-00013-3v0-E, December 05, 2014
v1.2
D a t a S h e e t
Figure 18-2 Al(Aluminum) bag label [2-in-1 label (4 × 8.5inch)]
Ordering Part Number
(P)+Part No.
Mark lot information
Quantity
Caution
JEDEC MSL, if available.
December 05, 2014, MB39C811_DS405-00013-3v0-E
CONFIDENTIAL
33
v1.2
D a t a S h e e t
Figure 18-3 Reel label [Reel label (4 × 2.5inch)]
Ordering Part Number
(P)+Part No.
Mark lot information
Quantity
Figure 18-4 Reel label [Dry pack & Reel label (4 × 2.5inch)]
Figure 18-5 Outer box label [Shopping label (4 × 8.5inch)]
Quantity
34
CONFIDENTIAL
Ordering Part Number : (1P)+Part No.
MB39C811_DS405-00013-3v0-E, December 05, 2014
v1.2
D a t a S h e e t
19. Recommended Mounting Conditions
Table 19-1 Recommended mounting conditions
Items
Contents
Method
IR(Infrared Reflow) / Convection
Times
3 times in succession
Before unpacking
Floor life
Please use within 2 years after production.
From unpacking to reflow
Within 7 days
In case over period of floor
Baking with 125°C+/-3°C for 24hrs+2hrs/-0hrs is required. Then
life(*1)
please use within 7 days. (Please remember baking is up to 2 times)
Floor life
Between 5°C and 30°C and also below 70%RH required.
condition
(It is preferred lower humidity in the required temp range.)
*1: Concerning the Tape & Reel product, please transfer product to heatproof tray and so on when you
perform baking. Also please prevent lead deforming and ESD damage during baking process.
Figure 19-1 Recommended mounting conditions
Supplier Tp ≥ Tc
User Tp ≤ Tc
Tc
Tc -5°C
Supplier tp
User tp
Te m p e r a t u r e
Tp
tp
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
TL
Tsmax
Tc -5°C
tL
Preheat Area
Tsmin
ts
25
Time 25°C to Peak
Time
Table 19-2 Recommended mounting conditions (J-STD-020D)
(Temperature on the top of the package body is measured.)
260°C Max.
TL to TP: Ramp Up Rate
3°C/s Max.
TS: Preheat & Soak
150 to 200°C, 60 to 120s
TP - tP: Peak Temperature
260°C Down, within 30s
TL – tL: Liquidous Temperature
217°C, 60 to 150s
TP to TL: Ramp Down Rate
6°C /s Max.
Time 25°C to Peak
8min Max.
December 05, 2014, MB39C811_DS405-00013-3v0-E
CONFIDENTIAL
35
v1.2
D a t a S h e e t
20. Package Dimensions
40-pin plastic QFN
Lead pitch
0.50 mm
Package width ×
package length
6.00 mm × 6.00 mm
Sealing method
Plastic mold
Mounting height
0.90 mm MAX
Weight
0.10 g
(LCC-40P-M63)
40-pin plastic QFN
(LCC-40P-M63)
4.50±0.10
(.177±.004)
6.00±0.10
(.236±.004)
INDEX AREA
6.00±0.10
(.236±.004)
0.25±0.05
(.010±.002)
4.50±0.10
(.177±.004)
0.45
(.017)
1PIN INDEX
R0.20(R.008)
0.50(.020)
(TYP)
0.40±0.05
(.016±.002)
+.0006
0.035 +0.015
-0.035 (.0014 -.0014 )
(0.20(.008))
0.85±0.05
(.033±.002)
C
2013 FUJITSU SEMICONDUCTOR LIMITED HMbC40-63Sc-1-1
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
36
CONFIDENTIAL
MB39C811_DS405-00013-3v0-E, December 05, 2014
v1.2
D a t a S h e e t
21. Major Changes
Page
Section
Change Results
Preliminary 0.1 [June 14, 2013]
-
-
Initial release
Revision 1.0 [November 18, 2013]
6
4.Pin Assignments
Changed Pin8 PGND to N.C.
7
5.Pin Descriptions
Changed Pin8 PGND to N.C.
Added Max in Power dissipation
Added Figure [Power dissipation]
9
7.Absolute Maximum Rating
Changed VIN pin input slew rate
Added VIN pin , Input current
Added AC pin input current
10
8.Recommended Operating Conditions
Deleted Added VIN pin , Input current
Deleted AC pin input current
Changed values in "Input voltage range"
Deleted Input slew rate
Added "IOUT=1mA" in "Preset output voltage" and changed values
11
9.1.DC Characteristics
Changed "over current protection" to "peak switching current" and values
Changed "Output current" to "Maximum output current" and values
Changed values in "UVLO release voltage"
Changed values in "UVLO detection voltage"
18
11.Example
Added new
22
14.Ordering Information
Added "Table 14-2 EVB Ordering Information"
23
15.Marking
Added new
24
16.Product Label
Added new
25
17.Recommended Mounting Conditions
Added new
Revision 2.0 [August 29, 2014]
11
9. Electrical Characteristics
Table 9-1 DC characteristics
Deleted Input voltage range
11. Typical Application Circuits
18
Figure 11-3 Voltage doubler rectification circuit
Added the explanation of the voltage doubler rectification circuit
for vibration harvester
19 to 21
12. Application Notes
Added the “12. Application Notes”
22 to 26
13. Typical Characteristics
Updated the “13. Typical Characteristics”
14. Layout for Printed Circuit Board
Added the “14. Layout for Printed Circuit Board”
18. Product Label
Changed the “18. Product Label”
27
30 to 32
Revision 3.0
7
5. Pin Descriptions
Added descriptions for all N.C. pins in “Table 5-1 Pin descriptions”
“Non connection pin” → “Non connection pin (Leave this pin open)”
Wiring correction in “Figure 6-1 Block diagram”
8
6. Block Diagram
Deleted the wire connections between DCGND1, DCGND2 pins and each
bridge rectifier, then added the internal GNDs.
11
15
9. Electrical Characteristics
9.1 DC characteristics
10. Function
10.3 Function descriptions
December 05, 2014, MB39C811_DS405-00013-3v0-E
CONFIDENTIAL
Added conditions and notes for output power-good detection voltage in
“Table 9-1 DC characteristics”
“To preset voltage ratio” → “To preset voltage ratio VVOUT ≥ 3.3V (*2)”
Added conditions and notes in “Table 10-3 Output power-good signal output
(OPGOOD)”
“ ≥ VOPGH ” → “ ≥ VOPGH (VVOUT ≥ 3.3V) (*1) ”
37
v1.2
D a t a S h e e t
Page
Section
Change Results
Wiring correction in “Figure 11-1 Application circuit for photovoltaic energy
17
11. Typical Application Circuits
harvester”
Deleted the wire connections between DCGND1 pin and the bridge rectifier,
then added the internal GND.
Wiring correction in “Figure 11-2 Application circuit for vibration energy
17
11. Typical Application Circuits
harvester”
Deleted the wire connections between DCGND2 pin and the bridge rectifier,
then added the internal GND.
Wiring correction in “Figure 11-3 Voltage doubler rectification circuit for
18
11. Typical Application Circuits
vibration harvester”
Deleted the wire connections between DCGND1 pin and the bridge rectifier,
then added the internal GND.
Added the “Table 12-1 Manufactures of recommended inductors”
19, 20
12. Application Notes
Added the “Table 12-2 Manufactures of photovoltaic harvesters”
Added the “Table 12-3 Manufactures of vibration harvesters”
Added the “Table 12-4 Manufactures of capacitors”
Inserted the data of 22μH and 10μH together into “Figure 13-1 Typical
23 to 28
13. Typical Characteristics
characteristics of DC/DC conveter”.
Inserted the data of 22μH and 10μH together into “Figure 13-4 Switching
waveforms of DC/DC converter”.
Replaced the line regulation datas of 22μH in “Figure 13-1 Typical
23, 24
13. Typical Characteristics
characteristics of DC/DC conveter”
Replaced the load regulation datas of 22μH in “Figure 13-1”
Added the line and load regulation data of 10μH in “Figure 13-1”.
31
16. Ordering Information
38
CONFIDENTIAL
Deleted “Table 16-2 EVB Ordering information”
MB39C811_DS405-00013-3v0-E, December 05, 2014
v1.2
D a t a S h e e t
December 05, 2014, MB39C811_DS405-00013-3v0-E
CONFIDENTIAL
39
v1.2
D a t a S h e e t
Colophon
The products described in this document are designed, developed and manufactured as contemplated for general use,
including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not
designed, developed and manufactured as contemplated (1) for any use that includes fatal risks or dangers that, unless
extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal injury,
severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control,
mass transport control, medical life support system, missile launch control in weapon system), or (2) for any use where
chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion will not be liable
to you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products.
Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such
failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and
prevention of over-current levels and other abnormal operating conditions. If any products described in this document
represent goods or technologies subject to certain restrictions on export under the Foreign Exchange and Foreign Trade Law
of Japan, the US Export Administration Regulations or the applicable laws of any other country, the prior authorization by the
respective government entity will be required for export of those products.
Trademarks and Notice
The contents of this document are subject to change without notice. This document may contain information on a Spansion
product under development by Spansion. Spansion reserves the right to change or discontinue work on any product without
notice. The information in this document is provided as is without warranty or guarantee of any kind as to its accuracy,
completeness, operability, fitness for particular purpose, merchantability, non-infringement of third-party rights, or any other
warranty, express, implied, or statutory. Spansion assumes no liability for any damages of any kind arising out of the use of
the information in this document.
®
®
®
TM
Copyright © 2013 - 2014 Spansion
All rights reserved. Spansion , the Spansion logo, MirrorBit , MirrorBit Eclipse ,
TM
TM
TM
ORNAND , Easy DesignSim , Traveo and combinations thereof, are trademarks and registered trademarks of Spansion
LLC in the United States and other countries. Other names used are for informational purposes only and may be trademarks
of their respective owners.
40
CONFIDENTIAL
MB39C811_DS405-00013-3v0-E, December 05, 2014
v1.2