S6AP412A DS405-00018-E

The following document contains information on Cypress products.
S6AP412A
ASSP
Multi-phase 3ch DCDC Converter
with I2C Interface and Internal SW FETs
Data Sheet (Full Production)
Notice to Readers: This document states the current technical specifications regarding the Spansion
product(s) described herein. Spansion. deems the products to have been in sufficient production volume
such that subsequent versions of this document are not expected to change. However, typographical or
specification corrections, or modifications to the valid combinations offered may occur.
Publication Number S6AP412A_DS405-00018
CONFIDENTIAL
Revision 1.0
Issue Date December 26, 2014
D a t a
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Notice On Data Sheet Designations
Spansion. issues data sheets with Advance Information or Preliminary designations to advise readers of
product information or intended specifications throughout the product life cycle, including development,
qualification, initial production, and full production. In all cases, however, readers are encouraged to verify
that they have the latest information before finalizing their design. The following descriptions of Spansion
data sheet designations are presented here to highlight their presence and definitions.
Advance Information
The Advance Information designation indicates that Spansion. is developing one or more specific products,
but has not committed any design to production. Information presented in a document with this designation
is likely to change, and in some cases, development on the product may discontinue. Spansion. therefore
places the following conditions upon Advance Information content:
“This document contains information on one or more products under development at Spansion. The
information is intended to help you evaluate this product. Do not design in this product without
contacting the factory. Spansion. reserves the right to change or discontinue work on this proposed
product without notice.”
Preliminary
The Preliminary designation indicates that the product development has progressed such that a commitment
to production has taken place. This designation covers several aspects of the product life cycle, including
product qualification, initial production, and the subsequent phases in the manufacturing process that occur
before full production is achieved. Changes to the technical specifications presented in a Preliminary
document should be expected while keeping these aspects of production under consideration. Spansion
places the following conditions upon Preliminary content:
“This document states the current technical specifications regarding the Spansion product(s)
described herein. The Preliminary status of this document indicates that product qualification has
been completed, and that initial production has begun. Due to the phases of the manufacturing
process that require maintaining efficiency and quality, this document may be revised by subsequent
versions or modifications due to changes in technical specifications.”
Combination
Some data sheets contain a combination of products with different designations (Advance Information,
Preliminary, or Full Production). This type of document distinguishes these products and their designations
wherever necessary, typically on the first page, the ordering information page, and pages with the DC
Characteristics table and the AC Erase and Program table (in the table notes). The disclaimer on the first
page refers the reader to the notice on this page.
Full Production (No Designation on Document)
When a product has been in production for a period of time such that no changes or only nominal changes
are expected, the Preliminary designation is removed from the data sheet. Nominal changes may include
those affecting the number of ordering part numbers available, such as the addition or deletion of a speed
option, temperature range, package type, or VIO range. Changes may also include those needed to clarify a
description or to correct a typographical error or incorrect specification. Spansion. applies the following
conditions to documents in this category:
“This document states the current technical specifications regarding the Spansion product(s)
described herein. Spansion. deems the products to have been in sufficient production volume such
that subsequent versions of this document are not expected to change. However, typographical or
specification corrections, or modifications to the valid combinations offered may occur.”
Questions regarding these document designations may be directed to your local sales office.
2
CONFIDENTIAL
S6AP412A_DS405-00018-1v0-E, December 26, 2014
S6AP412A
ASSP
Multi-phase 3ch DCDC converter
with I2C interface and internal SW FETs
Data Sheet (Full Production)
1. Description
S6AP412A contains 2ch buck DC/DC converter and 1ch buck-boost DC/DC converter. One of the buck
DC/DC converter is available for Multi-phase method. Multi-phase DC/DC converter is possible to load high
current until 4A. S6AP412A can supply the main power line in several systems by using only its chip. The
current mode control is adopted for the DC/DC converter, and it is possible to use the small chip inductor
with the high switching frequency operation which contains internal switching FETs. S6AP412A contains the
output setting resistor and the phase compensation circuit, and contributes to reduce the number of external
components and its mount area. Also it contains the CTL input pin which can control the ON/OFF for each
2
DC/DC converter, the Power Good signal output pin and I C communication interface, therefore it is easy to
2
design the power supply sequence. It is possible to tune in the output voltage exactly using the I C
communication.
2. Features
 Operating input voltage range: 2.5V to 5.5V (Maximum rating: 6.5V)
 Output voltage setting range: DD1*:0.7V to 1.32V (20 mV/step)










DD2*:1.2V to 1.95V (50 mV/step)
DD3*:2.8V to 3.5V (100 mV/step)
Maximum output current: DD1:4A, DD2:1.2A, DD3:0.6A
Internal switching FETs, output voltage setting resistor, phase compensation circuit and output discharge
resistor (all DC/DC converters)
Buck-boost DC/DC converter is seamless to change operation mode
Soft start time setting range: 1 ms to 16 ms (approximately 1 ms/step)
Switching frequency for the DC/DC converter: 3 MHz
2
Communication interface: I C (ON/OFF, Output voltage, Soft start time)
Internal PFM/PWM auto switching mode
Each DC/DC converter Power Good function (open drain)
Several protection functions: Under voltage lockout (UVLO), Over current protection (OCP), Thermal shut
down (TSD)
Small package: QFN32 (5mm × 5mm × 0.71mm, 0.5mm pitch)
*: DD1,DD2,DD3 : DC/DC converter block 1,2,3
3. Application
Network equipment, Factory automation, Security system, Surveillance camera, Electrical music instrument,
Multi-function printer, Scanner, Printer, Copy machine, Home appliances ,Data storage (HDD, SSD), Mobile
equipment for Li+ battery (1 cell)
Publication Number S6AP412A_DS405-00018
Revision 1.0
Issue Date December 26, 2014
This document states the current technical specifications regarding the Spansion product(s) described herein. Spansion. deems the products to have been in sufficient
production volume such that subsequent versions of this document are not expected to change. However, typographical or specification corrections, or modifications to the
valid combinations offered may occur.
CONFIDENTIAL
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Table of Contents
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16.
17.
18.
19.
20.
21.
22.
23.
24.
25.
26.
27.
28.
29.
30.
4
CONFIDENTIAL
Description ..................................................................................................................................... 3
Features ......................................................................................................................................... 3
Application ...................................................................................................................................... 3
Application Circuit Example ............................................................................................................ 6
Recommended Application Specification ....................................................................................... 7
Pin Configuration ............................................................................................................................ 9
Pin Descriptions............................................................................................................................ 10
Block Diagram .............................................................................................................................. 11
Absolute Maximum Ratings .......................................................................................................... 12
Recommended Operating Conditions........................................................................................... 13
Electrical Characteristics .............................................................................................................. 14
11.1 Reference Control block .................................................................................................... 14
11.2 DD1
......................................................................................................................... 15
11.3 DD2
......................................................................................................................... 16
11.4 DD3
......................................................................................................................... 17
11.5 Digital block ....................................................................................................................... 18
Operation Mode List ..................................................................................................................... 19
State Transition Diagram .............................................................................................................. 20
Turning ON and OFF Sequence (AVCC=CTLMAIN, CTL1, CTL2, CTL3).................................... 21
Turning ON and OFF Sequence (AVCC → CTLMAIN → CTL1 → CTL2 → CTL3) ............... 22
2
Turning ON and OFF Sequence (AVCC → CTLMAIN → I C)................................................... 23
CTL Pin, MODE Pin, ADDSEL Pin Threshold Voltage ................................................................. 24
Protection Operation Sequence ................................................................................................... 25
Operation Condition, Stop Circuit and Release Condition for Protection Circuit ........................... 26
DD Soft Start Operation................................................................................................................ 27
Discharge Operation..................................................................................................................... 28
PG Function ................................................................................................................................. 29
2
I C Interface.................................................................................................................................. 30
2
23.1 Structure of I C Interface ................................................................................................... 30
23.2 Definition of Signal Lines ................................................................................................... 30
23.3 Validity of Data .................................................................................................................. 31
23.4 Definition of Start and Stop Condition ............................................................................... 31
23.5 ACK Signal ........................................................................................................................ 32
2
23.6 I C Interface Input Timing .................................................................................................. 33
23.7 Slave Address ................................................................................................................... 34
2
23.8 Bit Structure of Data on I C Interface ................................................................................ 35
2
Structure of I C Interface and Data............................................................................................... 37
24.1 About DD1 Output Voltage Setting .................................................................................... 38
24.2 About DD2 Output Voltage Setting .................................................................................... 39
24.3 About DD3 Output Voltage Setting .................................................................................... 40
24.4 About Soft Start Time ........................................................................................................ 41
24.5 DC/DC Operation Mode .................................................................................................... 42
24.6 ON/OFF for DC/DC ........................................................................................................... 43
24.7 About Error Monitor ........................................................................................................... 44
24.8 About Power Good Monitor ............................................................................................... 45
I/O Pin Equivalent Circuit Diagram ............................................................................................... 46
Measurement Circuit for Characteristics of General Operation .................................................... 49
Reference Data ............................................................................................................................ 51
Ordering Information..................................................................................................................... 63
Preset Code List ........................................................................................................................... 64
Layout........................................................................................................................................... 65
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31. Package Dimensions .................................................................................................................... 66
32. Major Changes ............................................................................................................................. 67
Figures
Figure 4-1 Application Circuit ..................................................................................................................... 6
Figure 9-1 Power Dissipation vs. Operation Ambient Temperature .......................................................... 12
Figure 20-1 DD Soft Start ......................................................................................................................... 27
Figure 31-1 Layout example ..................................................................................................................... 65
Tables
Table 12-1 Operation Mode List ............................................................................................................... 19
Table 17-1 CTL(*1), MODE, ADDSEL Pin Equivalent Circuit Diagram ..................................................... 24
Table 18-1 Error Detection Sequence ...................................................................................................... 25
Table 24-1 Register map .......................................................................................................................... 37
Table 26-1 Parts list .................................................................................................................................. 50
Table 28-1 Ordering Information ............................................................................................................... 63
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4. Application Circuit Example
Figure 4-1 Application Circuit
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5. Recommended Application Specification
[Input Voltage Range]
Input voltage Vin(V)
Min
Typ
Max
2.5
3.3
5.5
VO1
±1.2%
0.711
0.720
0.729
0.731
0.740
0.749
0.751
0.760
0.769
0.771
0.780
0.789
0.790
0.800
0.810
0.810
0.820
0.830
0.830
0.840
0.850
0.850
0.860
0.870
0.869
0.880
0.891
0.889
0.900
0.911
(*1)
(*1)
(*1)
0.909
0.920
0.931
0.929
0.940
0.951
0.948
0.960
0.972
0.968
0.980
0.992
0.988
1.000
1.012
(*1)
(*1)
(*1)
1.008
1.020
1.032
1.028
1.040
1.052
1.047
1.060
1.073
1.067
1.080
1.093
1.087
1.100
1.113
(*1)
(*1)
(*1)
1.107
1.120
1.133
1.126
1.140
1.154
1.146
1.160
1.174
1.166
1.180
1.194
1.186
1.200
1.214
(*1)
(*1)
(*1)
1.205
1.220
1.235
1.225
1.240
1.255
1.245
1.260
1.275
1.265
1.280
1.295
1.284
1.300
1.316
1.304
1.320
1.336
December 26, 2014, S6AP412A_DS405-00018-1v0-E
CONFIDENTIAL
Resistance (kΩ)
Discharge
(ms)
Output
Soft-start Time
Min
Switching
Mode
Current (mA)
Limit
Current (mA)
Max
Capacitance (µF)
Max
0.708
Inductor (µH)
Typ
0.700
Frequency (MHz)
Min
0.692
Output
Accuracy
Symbol
Channel
DD1
Output Voltage (V)
Multi
1 to 16
Phase
ms
(4800)
rectification)
Multi Phase
C-mode
Built-in
time of
(synchronous
4000
Built-in
SWFET
At the
Buck
3.0
1.0
22
1.0V
setting,
the
details
are cf.
Contents
17
Remarks
(Ta=+25°C)
[Output specification]
output
5.0
setting
resistors
Built-in
phase
compens
ation
circuit
7
DD2
DD3
VO2
VO3
±1.2%
±1.8%
(*1)
(*1)
(*1)
1.235
1.250
1.265
1.284
1.300
1.316
1.334
1.350
1.366
Remarks
Resistance (kΩ)
Discharge
(ms)
Output
Switching
Mode
(mA)
Limit Current
Min
Soft-start Time
Max
Capacitance (µF)
Max
1.214
Inductor (µH)
Typ
1.200
S h e e t
frequency (MHz)
Min
1.186
Output
Output Voltage (V)
Current (mA)
Accuracy
Symbol
Channel
D a t a
(*1)
(*1)
(*1)
1 to 16
Built-in
1.383
1.400
1.417
ms
SWFET
1.433
1.450
1.467
1.482
1.500
1.518
(*1)
(*1)
(*1)
1.531
1.550
1.569
1.581
1.600
1.619
1.630
1.650
1.670
1.680
1.700
1.729
Built-in
Buck
1200
(1500)
(synchronous
rectification)
3.0
1.0
10
At the
output
time of
setting
1.8V
5.0
setting,
C-mode
resistors
Built-in
the details
phase
1.720
are cf.
compen
Contents
sation
1.750
1.771
17
circuit
1.778
1.800
1.822
(*1)
(*1)
(*1)
1.828
1.850
1.872
1.877
1.900
1.923
1.927
1.950
1.973
2.74
2.80
2.86
(*1)
(*1)
(*1)
1 to 16
Built-in
2.84
2.90
2.96
ms
SWFET
2.94
3.00
3.06
(*1)
(*1)
(*1)
3.04
3.10
3.16
3.14
3.20
3.26
3.23
3.30
3.37
(*1)
(*1)
(*1)
3.33
3.40
3.43
(*1)
Built-in
Buck-boost
600
(750)
(synchronous
rectification)
C-mode
3.0
1.0
22
At the
output
time of
setting
3.3V
setting,
5.0
resistors
Built-in
the details
phase
are cf.
compen
3.47
Contents
sation
3.50
3.57
17
circuit
(*1)
(*1)
*1: default (It is selectable with the default output voltage)
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6. Pin Configuration
(TOP VIEW)
(WNT032)
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7. Pin Descriptions
Block
DD1
Multi-phase
DD2
Buck
DD3
Buck-boost
CTL
I2C
Pin
Pin
Name
Number
IN1
24
PullI/O
Description
Unused
Unused
Unused
Unused
DD1
DD2
DD3
I2C
-
GND
-
-
-
-
AVCC
-
-
-
down
Resistor
I
DD1 output voltage feedback
DD1 Phase1 output block power
PVCC1A
23
-
LX1A
22
O
DD1 Phase1 inductor connection
-
Open
-
-
-
PG1
28
O
DD1 Power Good output
-
GND
-
-
-
PGND1A
21
-
DD1 Phase1 output block ground
-
GND
-
-
-
PVCC1B
18
-
-
AVCC
-
-
-
LX1B
19
O
DD1 Phase2 inductor connection
-
Open
-
-
-
PGND1B
20
-
DD1 Phase2 output block ground
-
GND
-
-
-
IN2
8
I
DD2 output voltage feedback
-
-
GND
-
-
PVCC2
5
-
DD2 output block power supply
-
-
AVCC
-
-
LX2
6
O
DD2 inductor connection
-
-
Open
-
-
PG2
29
O
DD2 Power Good output
-
-
GND
-
-
PGND2
7
-
DD2 output block ground
-
-
GND
-
-
IN3
31
I
DD3 output voltage feedback
-
-
-
GND
-
PVCC3
4
-
Power supply for DD3 output block
-
-
-
AVCC
-
supply
DD1 Phase2 output block power
supply
VO3
32
O
Output voltage for DD3
-
-
-
GND
-
LX3-1
3
O
DD3 inductor connection1
-
-
-
Open
-
LX3-2
1
O
DD3 inductor connection2
-
-
-
Open
-
PG3
30
O
Output for DD3 Power Good
-
-
-
GND
-
PGND3
2
-
Ground for DD3 output block
-
-
-
GND
-
CTLMAIN
25
I
Exist
-
-
-
-
CTL1
9
I
DD1 control
Exist
Open
-
-
-
CTL2
10
I
DD2 control
Exist
-
Open
-
-
CTL3
11
I
DD3 control
Exist
-
-
Open
-
-
-
-
-
GND
Control for reference voltage
output
Power supply for I2C
DVCC
16
I
SCL
14
I
Clock for I2C communication
-
-
-
-
Open
SDA
15
I/O
Data for I2C communication
Exist
-
-
-
Open
ADDSEL
17
I
Switch for slave address
-
-
-
-
Open
AVCC
27
-
Power supply for reference voltage
-
-
-
-
-
Exist
-
-
-
-
communication
Select for DC/DC converter
Reference
MODE
12
I
CONFIDENTIAL
mode, L=PWM mode, common for
all DCDC converter )
control
10
operation mode (H: PFM/PWM
VREF18
26
O
Output reference voltage
-
-
-
-
-
GND
13
-
Ground for reference voltage
-
-
-
-
-
GND
EP
-
Ground for reference voltage
-
-
-
-
-
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8. Block Diagram
IN1
PVCC1A
<<DD1>>
VCC:2.5V to 5.5V
L Priority
A
VCC
VCC
VCC
PWM
Logic
Control
ErrAMP
ctl1
ICOMP
VREF18
A
LX1A
AST
UVLO
LV
CNV
POR
SLP
CMP
DAC
PGND1A
PG1
mode clk
PVCC1B
VCC
VCC
PWM
Logic
Control
ICOMP
LV
CNV
SLP
CMP
cs1
IN2
scp1
LX1B
AST
PGND1B
xclk
PVCC2
<<DD2>>
L Priority
B
VCC
VCC
ErrAMP
ctl2
VREF18
VCC
PWM
Logic
Control
ICOMP
B
LX2
AST
UVLO
LV
CNV
POR
SLP
CMP
DAC
PGND2
PG2
cs2
IN3
<<DD3>>
scp2
mode clk
PVCC3
L Priority
C
VCC
VCC
VCC
ErrAMP
ctl3
VREF18
PWM
Logic
Control
ICOMP
LX3-1
AST
UVLO
LV
CNV
POR
SLP
CMP
DAC
C
VO3
AST
LX3-2
PGND3
PG3
cs3
DVCC
mode xclk
scp3
VREF18
SCL
Logic Control
SDA
Output Voltage Ajuster
CTL1
AVCC
ctl1
CTL2
ctl2
CTL3
Common Block
Logic
Control
ctl3
VREF
BGR
Under
Voltage
Locked-Out
CTLMAIN
Thermal
Shut
Down
ADDSEL
VREF18
MODE
mode
scp*
(1.8V)
Short Circuit Protection
(Timer & Latch)
Soft Start Control
cs*
OSC
clk
CT
RT
xclk
GND
December 26, 2014, S6AP412A_DS405-00018-1v0-E
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11
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9. Absolute Maximum Ratings
Parameter
Symbol
Power supply voltage
Terminal voltage
LX voltage
Permission loss
Rating
Condition
Min
Max
Unit
VVCC1
AVCC,PVCC input voltage
-0.3
6.5
V
VVCC2
DVCC input voltage
-0.3
6.5
V
VCTL1
CTL1,CTL 2,CTL3 input voltage
-0.3
6.5
V
VCTL2
CTLMAIN input voltage
-0.3
6.5
V
VMODE
MODE input voltage
-0.3
6.5
V
VLOGIC
SDA,SCL input voltage
-0.3
6.5
V
VADD
ADDSEL input voltage
-0.3
6.5
V
VPG
PG1, PG2, PG3 drain voltage
-0.3
6.5
V
VOUT
IN1, IN2, IN3 input voltage
-0.3
6.5
V
VLX
LX1, LX2, LX3 voltage
-1.0
6.5
V
0
3420
mW
PD
Ta≤+25°C
Thermal resistance (θja): (29.2°C /W(*1))
Maximum junction temperature
Tjmax
-
-
+125
°C
Storage temperature
TSTG
-
-55
+125
°C
*1: When the IC is mounted on 74mm × 74mm four-layer square epoxy board. IC is mounted on a four-layer
epoxy board, which terminal bias, and the IC’s thermal pad is connected to the epoxy board.
WARNING:
1. Semiconductor devices may be permanently damaged by application of stress (including, without
limitation, voltage, current or temperature) in excess of absolute maximum ratings. Do not exceed any of
these ratings.
Figure 9-1 Power Dissipation vs. Operation Ambient Temperature
Power dissipation vs. Operation ambient temperature
4000
3500
3000
Pd [mW]
2500
2000
1500
1000
500
0
-40
-20
0
20
40
60
80
100
Temperature[˚C]
12
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10. Recommended Operating Conditions
Parameter
Symbol
Condition
Value
Min
Typ
Max
Unit
1. Reference control block
Power supply voltage
VVCC
AVCC
2.5
3.3
5.5
V
Output current for reference voltage
IREF
VREF18
-1
-
0
mA
Operating temperature
Ta
-30
+25
+85
°C
-
2. DC/DC channel
Power supply voltage
VVCC
PVCC1, PVCC2, PVCC3
2.5
3.3
5.5
V
Input voltage
VOUT
IN1,IN2
0
-
AVCC
V
Input voltage
VOUT
IN3
0
-
5.5
V
PG input voltage
VPG
PG1, PG2, PG3
0
-
5.5
V
VCTL
CTL1, CTL 2, CTL3, MODE
0
-
AVCC
V
3. Input block
Input voltage
VMODE
CTLMAIN
VVCC
DVCC
4. I2C communication block
Power supply voltage
1.70
-
3.50
V
Input voltage
VLOGIC
SDA,SCL
0
-
DVCC
V
Input voltage
VADD
ADDSEL
0
-
AVCC
V
WARNING:
1. The recommended operating conditions are required in order to ensure the normal operation of the
semiconductor device. All of the device's electrical characteristics are warranted when the device is
operated under these conditions.
2. Any use of semiconductor devices will be under their recommended operating condition.
3. Operation under any conditions other than these conditions may adversely affect reliability of device and
could result in device failure.
4. No warranty is made with respect to any use, operating conditions or combinations not represented on
this data sheet. If you are considering application under any conditions other than listed herein, please
contact sales representatives beforehand.
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11. Electrical Characteristics
11.1 Reference Control Block
(AVCC = PVCC1A=PVCC1B=PVCC2=PVCC3 = 3.3V, supply,
PGND1A=PGND1B=PGND2=PGND3=GND=0V. Ta = +25°C, unless otherwise noted. )
Parameter
Symbol
1. Reference voltage
VVREF2
VVREF3
VREF18 pin = 0 mA
AVCC pin = 2.5V to 5.5V
VREF18 pin = 0 mA
VREF18 pin = 0 mA to -1 mA
2. Under voltage lockout
VTH
Hysteresis width
VH
AVCC rising
-
3. Over current protection
DD1, DD2, DD3
4. Thermal shut down
-
5. Input block (CTL,MODE,CTLMAIN)
Input voltage
VIH
Input voltage
VIL
ICTLH
IMODEH
ICTLL
IMODEL
Input pull-down resistor
1.773
1.800
1.827
V
1.768
1.800
1.832
V
1.768
1.800
1.832
V
2.156
2.20
2.244
V
-
0.20(*1)
-
V
0.9
1
1.1
ms
125(*2)
150
-
°C
-
AVCC
V
0
-
0.4
V
2.5
3.3
4.7
µA
-
-
1
µA
-
1(*1)
-
MΩ
-
0
1.0
µA
-
30
45
µA
-
430
630
µA
-
18
27
mA
[ TSD ]
TTSDH
Input current
Max
[ OCP ]
tOCP1
Stop temperature
Typ
[ VCC UVLO ]
Threshold voltage
Timer
Unit
Min
[ VREF18 ]
VVREF1
Output voltage
Value
Condition
RP
[ CTL,MODE,CTLMAIN ]
CTL1, CTL2, CTL3,MODE pin
AVCC
CTLMAIN pin
× 0.7
CTL1, CTL2, CTL3,MODE pin
CTLMAIN pin
CTL1, CTL2, CTL3,MODE pin = 3.3V
CTLMAIN pin = 3.3V
CTL1, CTL2, CTL3,MODE pin = 0V
CTLMAIN pin = 0V
CTL1, CTL2, CTL3,MODE pin
CTLMAIN pin
6. Consumption current (DC/DC converter block)
IVCCS1
IVCCS2
Power supply current
CTL1, CTL2, CTL3 pin = 0V
CTLMAIN pin = 0V
CTL1, CTL2, CTL3 pin = 0V
CTLMAIN pin =3.3V
DD1,DD2,DD3=ON,MODE=3.3V,
IVCC
All DD are 0 mA
(operation mode: PFM/PWM mode)
DD1,DD2,DD3=ON,MODE=0V
IVCC
All DD are 0 mA
(operation mode: Fixed PWM mode)
*1: This parameter is not be specified. This should be used as a reference to support designing the circuits.
*2: No production tested, ensure by design.
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11.2 DD1
(AVCC = PVCC1A=PVCC1B=PVCC2=PVCC3 = 3.3V, supply,
PGND1A=PGND1B=PGND2=PGND3=GND=0V. Ta = +25°C, unless otherwise noted. )
Parameter
Symbol
Condition
Max
0.988
1.000
1.012
V
-5
-
+5
mV
-10
-
+10
mV
-10
-
+15
mV
IN1 = 2.0V
-
190(*1)
-
kΩ
RPMOS
LX1A,1B = -30 mA
-
120(*1)
-
mΩ
RNMOS
LX1A,1B = 30 mA
-
80(*1)
-
mΩ
ILEAK
LX1A,1B = 0V
-3
-
-
µA
ILEAK
LX1A,1B = 3.3V
-
-
3
µA
ILIMIT
L=1.0 µH
4900(*2)
-
-
mA
IPFM
L=1.0 µH
-
100(*1)
-
mA
[ DD1 ]
Output voltage
VOUT
Input stability
VLINE
Load stability
VLOAD
Load stability
VLOAD
SW PMOS-Tr
on resistance
SW NMOS-Tr
on resistance
SW PMOS-Tr
leakage current
SW NMOS-Tr
Leakage current
Over current
protection value
PFM/PWM mode
changeover current
Unit
Typ
1. DC/DC converter block
IN1 input impedance
Value
Min
RIN
Discharge resistor
RDIS
Soft start time
Tss
Switching frequency
fOSC
IOUT = -10 mA,
Output voltage setting: 1.0V
IOUT = -10 mA,
PVCC1 = 2.5V to 5.5V
IOUT = -1 mA to -4000 mA
(Fixed PWM mode)
IOUT = -1 mA to -4000 mA
(PFM/PWM mode)
Soft start time setting: 1 ms
-
-
5(*1)
-
kΩ
0.9
1
1.1
ms
2.7
3.0
3.3
MHz
*1: This parameter is not be specified. This should be used as a reference to support designing the circuits.
*2: No production tested, ensure by design.
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11.3 DD2
(AVCC = PVCC1A=PVCC1B=PVCC2=PVCC3 = 3.3V, supply,
PGND1A=PGND1B=PGND2=PGND3=GND=0V. Ta = +25°C, unless otherwise noted. )
Parameter
Symbol
Condition
Max
1.778
1.800
1.822
V
-5
-
+5
mV
-10
-
+10
mV
-10
-
+20
mV
IN2 = 2.0V
-
150(*1)
-
kΩ
RPMOS
LX2 = -30 mA
-
190(*1)
-
mΩ
RNMOS
LX2 = 30 mA
-
135(*1)
-
mΩ
ILEAK
LX2 = 0V
-3
-
-
µA
ILEAK
LX2 = 3.3V
-
-
3
μA
ILIMIT
L=1.0 µH
1500(*2)
-
-
mA
IPFM
L=1.0 µH
-
65(*1)
-
mA
-
5
-
kΩ
0.9
1
1.1
ms
2.7
3.0
3.3
MHz
[ DD2 ]
Output voltage
VOUT
Input stability
VLINE
Load stability
VLOAD
Load stability
VLOAD
SW PMOS-Tr
on resistance
SW NMOS-Tr
on resistance
SW PMOS-Tr
leakage current
SW NMOS-Tr
leakage current
Over current
protection value
PFM/PWM mode
changeover current
Discharge resistor
Unit
Typ
2. DC/DC converter block
IN2 input impedance
Value
Min
RIN
RDIS
Soft start time
Tss
Switching frequency
fOSC
IOUT = -10 mA,
Output voltage setting:1.8V
IOUT = -10 mA
PVCC2 = 2.5V to 5.5V
IOUT = -1mA to -1200 mA
(Fixed PWM mode)
IOUT = -1 mA to -1200 mA
(PFM/PWM mode)
Soft start time setting: 1 ms
-
*1: This parameter is not be specified. This should be used as a reference to support designing the circuits.
*2: No production tested, ensure by design.
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11.4 DD3
(AVCC = PVCC1A=PVCC1B=PVCC2=PVCC3 = 3.3V, supply,
PGND1A=PGND1B=PGND2=PGND3=GND=0V. Ta = +25°C, unless otherwise noted. )
Parameter
Symbol
Condition
Max
3.241
3.300
3.359
V
-5
-
+5
mV
-10
-
+10
mV
-10
-
+15
mV
IN3 = 2.0V
-
550(*1)
-
kΩ
RPMOS
LX3-1 = -30 mA
-
115(*1)
-
mΩ
RNMOS
LX3-1 = 30 mA
-
140(*1)
-
mΩ
RPMOS
LX3-2 = -30 mA
-
155(*1)
-
mΩ
RNMOS
LX3-2 = 30 mA
-
220(*1)
-
mΩ
ILEAK
LX3-1 = 0V
-3
-
-
μA
ILEAK
LX3-1 = 3.3V
-
-
1
μA
ILEAK
LX3-2 = 0V
-3
-
-
μA
ILEAK
LX3-2 = 3.3V
-
-
1
μA
ILIMIT
L=1.0 µH
1000(*2)
-
-
mA
IPFM
L=1.0 µH
-
200(*1)
-
mA
[ DD3 ]
Output voltage
VOUT
Input stability
VLINE
Load stability
VLOAD
Load stability
VLOAD
SW PMOS-Tr
on resistance
SW NMOS-Tr
on resistance
SW PMOS-Tr
on resistance
SW NMOS-Tr
on resistance
SW PMOS-Tr
leakage current
SW NMOS-Tr
leakage current
SW PMOS-Tr
leakage current
SW NMOS-Tr
leakage current
Over current
protection value
PFM/PWM mode
changeover current
RIN
Discharge resistor
RDIS
Soft start time
Tss
Switching frequency
Unit
Typ
3. DC/DC converter block
IN2 input impedance
Value
Min
IOUT = -10 mA,
Output voltage setting: 3.3V
IOUT = -10 mA,
PVCC3 = 2.5V to 5.5V
IOUT = -1 mA to -600 mA
(Fixed PWM mode)
IOUT = -1 mA to -600 mA
(PFM/PWM mode)
Soft start time setting:1 ms
fOSC
-
-
5(*1)
-
kΩ
0.9
1
1.1
ms
2.7
3.0
3.3
MHz
*1: This parameter is not be specified. This should be used as a reference to support designing the circuits.
*2: No production tested, ensure by design.
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11.5 Digital Block
(AVCC = PVCC1A=PVCC1B=PVCC2=PVCC3 = 3.3V, supply,
PGND1A=PGND1B=PGND2=PGND3=GND=0V. Ta = +25°C, unless otherwise noted. )
Parameter
Symbol
Condition
1. Power Good block
Value
Min
Typ
Max
Unit
[ Power Good ]
Output voltage
VOL
PG1, PG2, PG3 IOL = 1 mA
-
-
0.4
V
Output current
IOL
PG1, PG2, PG3
1
-
-
mA
Low voltage detection
VTH
IN1, IN2, IN3 = falling
-
-
V
Power on detection
VTH
IN1, IN2, IN3 = rising
-
-
V
DVCC
V
2. I2C block
Vo
×0.90(*1)
Vo
×0.93(*1)
[ I2C ]
VIH
SCL,SDA
VIL
SCL,SDA
DVCC
×0.7
Input voltage
IIH
Input current
IIL
SCL,SDA
DVCC = 3.3V
SCL,SDA
DVCC = 3.3V
-
DVCC
0
-
-
-
10
µA
-10
-
-
µA
×0.3
V
Output voltage
VOL
SDA IOL = 3 mA
-
-
0.4
V
Output current
IOL
SDA
3
-
-
mA
-
AVCC
V
0
-
0.4
V
2.5
3.3
4.7
µA
3. ADDSEL block
[ ADDSEL ]
Input voltage
Input voltage
Input current
Input pull-down resistor
VIH
ADDSEL
AVCC
×0.7
VIL
ADDSEL
IADD
ADDSEL = 3.3V
IADD
ADDSEL = 0V
-
-
1
µA
RP
ADDSEL
-
1(*1)
-
MΩ
*1: This parameter is not be specified. This should be used as a reference to support designing the circuits.
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12. Operation Mode List
Table 12-1 Operation Mode List
Mode
Stand-by
Stand-by2
Normal
Error Detection
L
H
H
H
L
L
H/L(*1)
X
X
CTLMAIN (external)
CTL signal
Operation Block
(external/I2C)
CTL1
2
CTL2
(external/I C)
L
L
H/L(*1)
CTL3
(external/I2C)
L
L
H/L(*1)
X
Reference
OFF
ON
ON
ON
Digital
OFF
ON
ON
ON
DD1
OFF
OFF
ON/OFF
OFF
DD2
OFF
OFF
ON/OFF
OFF
DD3
OFF
OFF
ON/OFF
OFF
disable
enable
enable
enable
I2C communication
I2C communication
Protection
Thermal shut down (TSD)
Not available
Not available
available
(*2)
operating
Over current protection (OCP)
Not available
Not available
available
(*2)
*1: normal mode means that CTLMAIN pin is "H" level and each DD CTL pin is "H" level
*2: This state is after each err detection. Error state will release, when the power supply voltage or CTLMAIN
pin will turn off and on.
2
Priority of the External CTL pin and I C Communication
CTLMAIN
CTL1, CTL2, CTL3
30h Resistor
Relevant
(External)
(External)
(I2C)
Channel
H
H
1
ON
H
H
0
ON
H
L
1
ON
H
L
0
OFF
L
X
disable
OFF
2
Priority of the External MODE pin and I C Communication
MODE
20h Resistor
(External)
(I2C)
H
1
PFM/PWM
H
0
PFM/PWM
L
1
PFM/PWM
L
0
Fixed PWM
Operation Mode
Notes:
−
The I C communication is valid after the reference control block and digital block activation setting
the external CTLMAIN pin to "H" level.
−
Please attention below note about ON/OFF control of DD1, DD2, DD3 by I C communication.
2
When each DD control is turned off by I C communication and external CTL pin remains "H" level,
DCDC converter keep operating.
2
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13. State Transition Diagram
Stand-by
(1)
(2)
Stand-by 2
(3)
(2)
(4)
General
(6)
(5)
Error
detection
(1)
External CTLMAIN pin is "H" level.
(2)
External CTLMAIN pin is "L" level.
(3)
External CTL pin or I2C communication "relevant CH_ON"
(4)
External CTL pin or I2C communication "relevant CH_OFF"
(5)
Error detection (TSD, OCP 1 ms continuation)
(6)
Turning on the power supply again (equal to or less than uvlo_vcc rest voltage) or setting CTLMAIN to "L" level
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14. Turning ON and OFF Sequence (AVCC=CTLMAIN, CTL1, CTL2, CTL3)
2.0V
2.2V
AVCC
CTLMAIN
CTL*(*1)
1.8V
VREF18
osc
(IC internal signal)


uvlo_vcc
(IC internal signal)
DD1
93%
Discharge
93%
Discharge
93%
Discharge
PG1
DD2
PG2
DD3
PG3
UVLO release
release to DD*
activation
UVLO
DD(*2)
activation
Soft-start time
Time till start (*3)
(*1)
Typ : (820)µs
Max : TBD µs
*1: CTL1, CTL2, CTL3
*2: DD1, DD2, DD3
*3: VREF18 activations depend on the VREF18 pin capacitance.
Time in the sequence figure above is applied for the following condition.
VREF18 pin capacitance: 1.0µF
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15. Turning ON and OFF Sequence (AVCC → CTLMAIN → CTL1 → CTL2 →
CTL3)
AVCC 3.3V
CTLMAIN
1.8V
VREF18
osc
(IC internal signal)


uvlo_vcc
(IC internal signal)
CTL1
93%
DD1
Discharge
PG1=CTL2
93%
Discharge
DD2
PG2=CTL3
93%
DD3
Discharge
PG3
UVLO
release
to DD*activation
activation
UVLO release
to DD(*1)
Time till start (*2)
(*1)
Typ : (820)µs
Max : TBD µs
*1: DD1, DD2, DD3
*2: VREF18 activations depend on the VREF18 pin capacitance.
Time in the sequence figure above is applied for the following condition.
VREF18 pin capacitance: 1.0µF
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16. Turning ON and OFF Sequence (AVCC → CTLMAIN → I2C)
AVCC 3.3V
CTLMAIN
1.8V
VREF18
osc
(IC internal signal)


uvlo_vcc
(IC internal signal)
I2C(DD ON/OFF)
OFF
ON
OFF
ctl*(*1)
DD1
93%
Discharge
93%
Discharge
93%
Discharge
PG1
DD2
PG2
DD3
PG3
UVLOrelease
releaseto
to DD(*2)
DD* activation
UVLO
activation
Soft-start time
Time till start (*3)
(*1)
Typ : (820)µs
Max : TBD µs
*1: CTL1, CTL2, CTL3
*2: DD1, DD2, DD3
*3: VREF18 activations depend on the VREF18 pin capacitance.
Time in the sequence figure above is applied for the following condition.
VREF18 pin capacitance: 1.0µF
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17. CTL Pin, MODE Pin, ADDSEL Pin Threshold Voltage
The input circuit structure for the CTL(*1) pin is the schmitt trigger style, and the threshold voltage shows the
hysteresis characteristics when CTL(*1) OFF to ON and ON to OFF.
(See "CTL(*1) pin equivalent circuit diagram" below.)
Also, the threshold voltage level depends on the VCC pin voltage.
Moreover, make sure to input either the "H" level (>"VCC×0.7"V) or "L" level (<0.4V) to the CTL(*1) and
MODE and ADDSEL pin when in use.
Table 17-1 CTL(*1), MODE, ADDSEL Pin Equivalent Circuit Diagram
AVCC
The CTL threshold voltage
shows the hysteresis
characteristics.
ESD protection
element
CTL*(*1)
MODE
ADDSEL
ESD protection
element
GND
*1: CTLMAIN, CTL1, CTL2, CTL3
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18. Protection Operation Sequence
Over Current Protection (DD channel)
The DD channel monitors the peak current of FET at any time during the operation. When the DD output
becomes the over current state, the output voltage is decreased. Afterward, the timer operation is performed
and the output stops after about 1 ms progress.
When one of each DD channel stops operation by over current protection, all DD channels stop operation.
Thermal Shut Down
If the temperature at the junction part reaches +150°C, the thermal shutdown protection circuit turns all
channels off.
Error Detection Sequence
Table 18-1 Error Detection Sequence
DD1,DD2,DD3
The whole IC
Normal
operation
Normal
operation
Over current
detection
Thermal
shutdown
protection
Voltage drop
No
1ms
Continue for 1ms?
Yes
Error detection mode
Error signal output (I2C address 40h)
Error Detection Mode Release
It is necessary to turn the power supply turning on again, or to turn CTLMAIN turning on again to release the
error detection mode.
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19. Operation Condition, Stop Circuit and Release Condition for Protection
Circuit
Operation
Channel
Whilst Under
Over Current Protection
(OCP)
Protection
Under Voltage
Lockout Protection
Thermal Shutdown Protection
(TSD)
(UVLO)
Operating condition:
Operating condition: Input
Operating condition:
voltage drop
Process during protection
After about 1 ms progress in the
over current condition
Process during protection
operation:
Process during protection
DD1,DD2,DD3
Discharge
DD1, DD2, DD3 stop
operation:
DD1, DD2, DD3 stop
Recovery condition:
operation:
DD1, DD2, DD3 stop
Chip temperature increment
(1) Power supply reasserted
Recovery condition:
(2) CTLMAIN reasserted
Input voltage rise
Recovery condition:
(1) Power supply reasserted
UVLO operates only when
(2) CTLMAIN reasserted
CTLMAIN is "H" (at VREF18
output).
Only when CTLMAIN is in the
"H" state and CTL(*1) is in the
"H" state, or when DD(*2) in
operating condition by I2C, will
operate.
Error output
-
(address 40h)
Write "1" when detecting OCP
No change
Write "1" when detecting TSD
Thermal shutdown protection (TSD) operation during over current protection timer operation
When the thermal shutdown protection (TSD) operated during the over current protection (OCP) timer
operation, the thermal shutdown protection has priority.
Operation when releasing under voltage lockout protection (UVLO)
− DD1,DD2,DD3 : Activation following the condition for CTL(*1) pin or I2C
Note:
−
2
When VREF18 decreases at the time of UVLO operation, I C register is reset, and all DD does OFF.
It is necessary to let you do ON by CTL(*1) pin and communication again to let DD have ON.
*1: CTL1, CTL2, CTL3
*2: DD1, DD2, DD3
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20. DD Soft Start Operation
The soft-start operation for DD1, DD2 and DD3 is enabled in order to prevent the rush current during the DD
2
activation. The soft-start time can be controlled by I C.
About output voltage changing option, soft start time is showed by follow equation.
Tss=Tslp × Vset/Vdef (ms)
Tss : soft start time
Tslp : slope coefficient of soft start
Vset : output voltage setting
Vdef : DD1=1.0, DD2=1.8, DD3=3.3
Figure 20-1 DD Soft Start
Output voltage2 setting value
Output voltage1 setting value
Output voltage3 setting value
Soft-start time
Channel ON/OFF signal (internal signal)
t
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21. Discharge Operation
DD Channel
When executing the DD OFF operation at the channel ON/OFF signal, the DC/DC smooth capacitance
charged for each output voltage is discharged using resistor for discharge which is set in the IC and the
output voltage is decreased gradually. However, the discharge time changes depending on the DC/DC
converter load current.
The discharge time is calculated by the following equation.
Discharge time (time till the output becomes 10% without load)
toff(s) ≈ 2.3 × R_DIS × COUT (F)
Note:
−
See the table in Electrical Characteristics for the discharge resistor value.
IN(*1)
A
Resistor for discharge
R1
PVCC(*2)
A
Error
Amp
R2
LX(*3)
Cout
Reference
voltage
DAC
PGND(*4)
Channel ON/OFF Cont.
*1: IN1, IN2, IN3
*2: PVCC1, PVCC2, PVCC3
*3: LX1, LX2, LX3
*4: PGND1, PGND2, PGND3
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22. PG Function
The following pins for each channel Power Good output are prepared.
PG1
It is the pin for DD1 Power Good output.
When the output voltage exceeds 93% of the setting value at the DD1 ON mode, "H" is output.
Also, when the output voltage becomes equal or lower than 90% of the setting value after the "H" output, "L"
is output. "L" is output at the DD1 OFF mode.
PG2
It is the pin for DD2 Power Good output.
When the output voltage exceeds 93% of the setting value at the DD2 ON mode, "H" is output.
Also, when the output voltage becomes equal or lower than 90% of the setting value after the "H" output, "L"
is output. "L" is output at the DD2 OFF mode.
PG3
It is the pin for DD3 Power Good output.
When the output voltage exceeds 93% of the setting value at the DD3 ON mode, "H" is output.
Also, when the output voltage becomes equal or lower than 90% of the setting value after the "H" output, "L"
is output. "L" is output at the DD3 OFF mode.
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29
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23. I2C Interface
23.1 Structure of I2C Interface
2
The I C interface executes the data communication in 1 byte (8-bit) units using two signal lines (bus), a SCL
(serial clock line) and a SDA (serial data line).
This bus is connected to multiple devices;
master: device to generate the clock signal and to control the data transfer (CPU and so on)
slave: device that an address is specified by a master.
This IC is set as the slave and has no function to be the master.
Each device is defined due to the communication direction as described below.
transmitter: device to send data to bus
receiver: device to receive data from bus
The IC has the function both transmitter and receiver.
SCL
SDA
transmitter
receiver
receiver
maser
slave1
transmitter
slave2
The IC defines the followings;
Write : data is transmitted from master and the IC receives data
Read : The IC transmits data and master receives data.
23.2 Definition of Signal Lines
SCL and SDA are connected to the power supply by the pull-up resistor.
The output circuit is the open Drain output.
When a bus is not used (waiting state), the open "H" is set changing the open Drain to the OFF state.
Note:
−
2
SCL and SDA pins adopt a different ESD protection system from standard I C specification because
of ESD enhancement (see 25. I/O Pin Equivalent Circuit Diagram). When the power supply is in the
bus line, do not shut off the power supply for an IC (DVCC).
I2C bus line power supply
R
R
Pull Up
SCL
SDA
input
Inside of IC
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input
output
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23.3 Validity of Data
Data has the following characteristics;
− change when SCL is the "L" level
− valid if the state is kept while SCL is the "H" level.
SCL
SDA
data
state
data
change
data
state
The SDA signal change means the start or stop condition when SCL is the "H" level.
23.4 Definition of Start and Stop Condition
The start and stop conditions are output from the master and shows start and stop of communications to the
slave.
− Start : SDA changes from "H" to "L" when SCL is "H".
− Stop : SDA changes from "L" to "H" when SCL is "H".
SCL
SDA
S
start
condition
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P
stop
condition
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23.5 ACK Signal
This is a signal to confirm the data reception during communication.
The receiver replies the ACK signal to show the data reception to a transmitter every time
1 byte (8-bit) of data is received. The ACK signal is sent in 9clk after sending data 8-bit matching to the SCL
signal that the master generates.
− A transmitter keeps SDA output "open H" in SCL9clk.
− A receiver informs the data reception situation to a transmitter outputting the followings in SCL
9 clk;
when data was received : SDA output "L" (ACK)
when no data was received : SDA output "open H" (NACK)
However, if the master is changed to the receiver, ACK is not replied after the last data reception because
the bus keeps open stopping the data transmission to the slave transmitter. In this case, the slave
transmitter opens the bus (open H) and is set to the stop condition reception waiting state from the master.
SCL
from master
SDA
by transmitter
SDA
by receiver
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1
8
bit0
bit7
9
H hold
10
bit0
NACK
ACK
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23.6 I2C Interface Input Timing
(within recommended operating conditions)
Value
Parameter
Symbol
SCL=100 kHz
SCL=400 kHz
Unit
Min
Max
Min
Max
SCL clock frequency
fSCL
-
100
-
400
kHz
Start condition hold time
tHD:start
4.0
-
0.6
-
µs
Restart condition setup time
tSU:start
4.7
-
0.6
-
µs
Stop condition setup time
tSU:stop
4.0
-
0.6
-
µs
tbuf
4.7
-
1.3
-
µs
SCL "L" time
tLow
4.7
-
1.3
-
µs
SCL "H" time
tHigh
4.0
-
0.6
-
µs
SCL/SDA rising time
tr
-
1.0
-
0.3
µs
SCL/SDA falling time
tf
-
0.3
-
0.3
µs
Data hold time
tHD:data
0.0
-
0.0
-
µs
Data setup time
tSU:data
0.25
-
0.10
-
µs
Cb
-
400
-
400
pF
Stop to Start bus open time
SCL/SDA capacitor load
VIH/VIL level reference
2
Conform to I C bus specifications
S
tr
tf
tHigh tLow
Sr
SCL
P
tbuf
SDA
tHD:start
tSU:data
tHD:data
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tSU:start
tSU:stop
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23.7 Slave Address
2
This is a slave address when communicating with the I C interface.
The slave address of this IC is set by the first seven bits as shown below.
The seventh bit follows the ADDSEL pin and "0"/"1" are variable.
The eighth bit is called the least significant bit (LSB) and determines the message direction. The bit "0"
shows that information will be written from the master to the slave.
The bit "1" shows that the master reads information from the slave.
This does not support the general call address.
When the ADDSEL pin is in "H"
S
T
A
R
T
slave address
0
1
0
1
1
0
1
MSB
R/W
LSB
A
C
K
S
T
O
P
A
C
K
S
T
O
P
When the ADDSEL pin is in "L"
S
T
A
R
T
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slave address
0
MSB
1
0
1
1
0
0
R/W
LSB
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23.8 Bit Structure of Data on I2C Interface
(1) Writing Data to Register and Reading Data
The data line is sent/received in the order from the most significant bit (MSB) to the least significant bit
(LSB).
S
T
A
R
T
No.
A
C
K
slave address
1
2
3
4
5
6
7
register address
8
1
S 0 1 0 1 1 0 0 W
A
C
K
2
3
4
5
6
7
8
0 0 0 0 0 0 1 0
S
A T
C O
K P
data
1
2
3
4
5
6
7
8
a b c d e f g h
P
register
data
address
00H
01H
02H
03H
04H
:
:
D07
D06
D05
D04
D03
D02
D01
D00
a
b
c
d
e
f
g
h
Output the "stop" condition after sending the Write data.
: Signal which a master sends,
December 26, 2014, S6AP412A_DS405-00018-1v0-E
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: Signal which this IC sends
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2
(2) I C Interface Data Format
2
About I C Communication
1. When a different slave address comes, non-matching ID is informed by not replying ACK after receiving
the slave address.
2. All registers write to internal registers in the ACK signal after receiving the 8-bit data of each setting.
3. If a non-existing register address is specified, data is not written to a register.
4. Output the "stop" condition after sending the write data.
<Write (W)>
S
T
A
R
T
A
C
K
slave address
A
C
K
register address
data
S
A T
C O
K P
S 0 1 0 1 1 0 0 W
P
When the ADDSEL pin is in "L"
Write is allowed per one address. (Sequential writing is not allowed.)
Send register address and data as one unit.
: Signal which a master sends,
: Signal which this IC sends
<Read (R)>
S
T
A
R
T
slave address
A
C
K
S 0 1 0 1 1 0 0 W
When the ADDSEL pin is in "L"
register address
S
T
A A
C R
K T
slave address
A
C
K
data
S 0 1 0 1 1 0 0 R
S
A T
C O
K P
P
When the ADDSEL pin is in "L"
Read is allowed per one address. Be sure to perform read by specifying the register addresses.
(Sequential reading is not allowed.)
: Signal which a master sends,
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: Signal which this IC sends
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24. Structure of I2C Interface and Data
Table 24-1 Register Map
Data
Address
Writing
Remarks
d07
d06
d05
d04
d03
d02
d01
d00
Default
Timing
00H
0
0
0
D04
D03
D02
D01
D00
0FH
ACK
DD1 output voltage setting
Output
01H
0
0
0
0
D03
D02
D01
D00
0CH
ACK
DD2 output voltage setting
voltage
02H
0
0
0
0
0
D02
D01
D00
05H
ACK
DD3 output voltage setting
03H
0
0
0
(*1)
(*1)
(*1)
(*1)
(*1)
0FH
ACK
Unused
10H
0
0
0
0
D03
D02
D01
D00
00H
ACK
DD1 soft-start time setting
11H
0
0
0
0
D03
D02
D01
D00
00H
ACK
DD2 soft-start time setting
12H
0
0
0
0
D03
D02
D01
D00
00H
ACK
DD3 soft-start time setting
13H
0
0
0
0
(*1)
(*1)
(*1)
(*1)
00H
ACK
Unused
Soft start
DD
DD operation mode setting
operation
20H
0
0
0
0
(*1)
D02
D01
D00
00H
ACK
mode
"0": Fixed PWM mode,
"1":PFM/PWM mode
ON/OFF
30H
0
0
0
0
(*1)
D02
D01
D00
00H
ACK
Error
40H
0
0
0
D04
(*1)
D02
D01
D00
00H
-
DD output ON/OFF setting
"0":Output OFF / "1": Output ON
DD error state monitoring
register (read only)
"0":Normal / "1": Error detection
DD PG state monitoring register
PG
50H
0
0
0
0
(*1)
D02
D01
D00
00H
-
(read only)
"0": Non-output / "1": output
For test
EXH
-
-
-
-
-
-
-
-
-
-
Disabled
For test
FXH
-
-
-
-
-
-
-
-
-
-
Disabled
*1: Unused register. Write/read is possible, but does not influence IC movement.
Note:
−
Address FXH and address EXH are for test.
Do not write/read FXH and EXH.
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24.1 About DD1 Output Voltage Setting
 Address 00H DD1 is allocated as resisters for the DC/DC output voltage setting.
 The DC/DC output voltage setting of DD1 is controlled by writing data to address 00 H.
Data
S
T
A
R
T
0
0
0
D04
D03
D02
MSB
D01
D00
LSB
A
C
K
S
T
O
P
address00H: For DD1 output voltage setting
D04 to D00: Set the output voltage
DD1 Output Voltage Setting Table
Data
Output Voltage (V)
Data
Output Voltage (V)
00H
0.700
10H
1.020
01H
0.720
11H
1.040
02H
0.740
12H
1.060
03H
0.760
13H
1.080
04H
0.780
14H
1.100 (*1)
05H
0.800
15H
1.120
06H
0.820
16H
1.140
07H
0.840
17H
1.160
08H
0.860
18H
1.180
09H
0.880
19H
1.200 (*1)
0AH
0.900 (*1)
1AH
1.220
0BH
0.920
1BH
1.240
0CH
0.940
1CH
1.260
0DH
0.960
1DH
1.280
0EH
0.980
1EH
1.300
0FH
1.000 (*1)
1FH
1.320
*1: Preset value
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24.2 About DD2 Output Voltage Setting
 Address 01H DD2 is allocated as resisters for the DC/DC output voltage setting.
 The DC/DC output voltage setting of DD2 is controlled by writing data to address 01 H.
Data
S
T
A
R
T
0
0
0
MSB
0
D03
D02
D01
D00
LSB
A
C
K
S
T
O
P
address01H: For DD2 output voltage setting
D03 to D00: Set the output voltage
DD2 Output Voltage Setting Table
Data
Output Voltage (V)
00H
1.200 (*1)
01H
1.250
02H
1.300
03H
1.350 (*1)
04H
1.400
05H
1.450
06H
1.500 (*1)
07H
1.550
08H
1.600
09H
1.650
0AH
1.700
0BH
1.750
0CH
1.800 (*1)
0DH
1.850
0EH
1.900
0FH
1.950
*1: Preset value
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24.3 About DD3 Output Voltage Setting
 Address 02H DD3 is allocated as resisters for the DC/DC output voltage setting.
 The DC/DC output voltage setting of DD3 is controlled by writing data to address 02 H.
Data
S
T
A
R
T
0
0
0
MSB
0
0
D02
D01
D00
LSB
A
C
K
S
T
O
P
address02H: For DD3 output voltage setting
D02 to D00: Set the output voltage
DD3 Output Voltage Setting Table
Data
Output Voltage (V)
00H
2.80 (*1)
01H
2.90
02H
3.00 (*1)
03H
3.10
04H
3.20
05H
3.30 (*1)
06H
3.40
07H
3.50 (*1)
*1: Preset value
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24.4 About Soft Start Time
 Address 10H to 12H are allocated as registers for the soft start time control.
 The soft start time control is controlled by writing data to addresses 10 H to 12H.
Data
S
T
A
R
T
0
0
0
0
D03
D02
MSB
D01
D00
LSB
A
C
K
S
T
O
P
address10H: For DD1 soft start time setting
address11H: For DD2 soft start time setting
address12H: For DD3 soft start time setting
D03 to D00: Set the soft start time
Tss=Tslp × Vset/Vdef (ms)
Tss : soft start time
Tslp : slope coefficient of soft start : refer to follow table
Vset : output voltage setting
Vdef : DD1=1.0, DD2=1.8, DD3=3.3
Soft Start Time Setting
Data
Tslp
Remarks
00H
1.0
DD1,DD2,DD3 (*1)
01H
2.0
02H
3.0
03H
4.0
04H
5.0
05H
6.0
06H
7.0
07H
8.0
08H
9.0
09H
10.0
0AH
11.0
0BH
12.0
0CH
13.0
0DH
14.0
0EH
15.0
0FH
16.0
*1: Preset value
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24.5 DC/DC Operation Mode
 Address 20H is allocated as a register for the DC/DC operation mode control.
 The DC/DC operation mode is controlled by writing data to address 20 H.
Data
S
T
A
R
T
0
0
0
0
D03
D02
D01
MSB
D00
LSB
A
C
K
S
T
O
P
address20H: For DC/DC operation mode setting
D01 to D00: Set the DC/DC operation mode
Address
Bit
20H
D00
20H
D01
20H
D02
20H
D03
Description
0: DD1 Fixed PWM (*1)
1: DD1 PFM/PWM
0: DD2 Fixed PWM (*1)
1: DD2 PFM/PWM
0: DD3 Fixed PWM (*1)
1: DD3 PFM/PWM
Out of use
*1: Preset value
42
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24.6 ON/OFF for DC/DC
 Address 30H is allocated as a register for the DC/DC ON/OFF.
 The DC/DC ON/OFF is controlled by writing data to address 30H.
Data
S
T
A
R
T
0
0
0
0
D03
D02
D01
MSB
D00
LSB
A
C
K
S
T
O
P
address30H: For DC/DC ON/OFF
D02 to D00: Set ON/OFF for DC/DC
Address
Bit
30H
D00
30H
D01
30H
D02
30H
D03
Description
0: DD1 output OFF (*1)
1: DD1 output ON
0: DD2 output OFF (*1)
1: DD2 output ON
0: DD3 output OFF (*1)
1: DD3 output ON
Out of use
*1: Preset value
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24.7 About Error Monitor
 Address 40H is allocated as error status monitor of each DC/DC output and thermal shut down.
 Address 40H is read only resistor.
Data
S
T
A
R
T
0
0
0
D04
D03
D02
D01
MSB
D00
LSB
A
C
K
S
T
O
P
address40H: For error monitor of each DC/DC output and thermal shut down
D04 to D00: read only resistor. (Not allowed write resistor)
Address
Bit
40H
D00
40H
D01
40H
D02
40H
D03
40H
D04
Description
0: DD1 OCP non detection (*1)
1: DD1 OCP detection
0: DD2 OCP non detection (*1)
1: DD2 OCP detection
0: DD3 OCP non detection (*1)
1: DD3 OCP detection
Out of use
0: TSD non detection (*1)
1: TSD detection
*1: Preset value
44
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24.8 About Power Good Monitor
 Address 50H is allocated as output monitor of each DC/DC output.
 Address 50H is read only resistor.
Data
S
T
A
R
T
0
0
0
0
D03
D02
D01
MSB
D00
LSB
A
C
K
S
T
O
P
address50H: For output monitor of each DC/DC output.
Detection level is over 93% of DCDC output voltage setting.
D04 to D00: read only resistor. (Not allowed write resistor)
Address
Bit
50H
D00
50H
D01
50H
D02
50H
D03
Description
0: DD1 non output (*1)
1: DD1 output
0: DD2 non output (*1)
1: DD2 output
0: DD3 non output (*1)
1: DD3 output
Out of use
*1: Preset value
December 26, 2014, S6AP412A_DS405-00018-1v0-E
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25. I/O Pin Equivalent Circuit Diagram
<<AVCC>>
AVCC
ESD
protection
element
GND
<<VREF18>>
AVCC
VREF18
GND
<<IN1,IN2, LX1,LX2, PGND1<PGND2>>
AVCC
IN*
GND
IN*: IN1, IN2
LX*: LX1, LX2
PGND*: PGND1, PGND2
46
CONFIDENTIAL
LX*
PGND*
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<<PVCC1,PVCC2>
AVCC
PVCC*: PVCC1, PVCC2
LX*: LX1, LX2
PGND*: PGND1, PGND2
PVCC*
LX*
PGND*
GND
<<IN3,PGND3 >
IN3
GND
PGND3
<<PVCC3,LX3-1,LX3-2,VO3>>
AVCC
PVCC3
LX3-1
VO3
LX3-2
PGND3
GND
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<<CTL*, ADDSEL, MODE>>
<<PG*>>
AVCC
AVCC
PG*: PG1, PG2, PG3
PG*
CTL*
ADDSEL
MODE
GND
GND
CTL*: CTLMAIN, CTL1,
CTL2, CTL3
<<SCL>>
DVCC
DVCC
SCL
SDA
GND
48
CONFIDENTIAL
<<SDA>>
GND
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26. Measurement Circuit for Characteristics of General Operation
S6AP412A
Input Voltage:
2.5V to 5.5V
C1
0.1mF
C2
4.7mF
IN1
AVCC
PVCC1A
LX1A
L1
C7
C8
22mF 22mF
1.0mH
DD1:1.0V
Io(max):4000mA
PGND1A
C3
4.7mF
PVCC1B
LX1B
CTL1
L2
1.0mH
PGND1B
R1
100kW
PG1
PG1
C4
4.7mF
IN2
PVCC2
LX2
CTL2
L3
C9
22mF
1.0mH
DD2:1.80V
Io(max):1200mA
PGND2
R2
100kW
C5
4.7mF
PVCC3
PG2
LX3-1
CTL3
L4
1.0mH
CTLMAIN
3.3V
SCL
SDA
PG2
LX3-2
DVCC
SCL
SDA
IN3
VO3
MODE
ADDSEL
VREF18
C10
33mF
DD3:3.30V
Io(max):600mA
PGND3
R3
100kW
PG3
PG3
GND
C6
1.0mF
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Table 26-1 Parts list
Symbol
Parts
Part number
Specifications
Vendor
L1
Inductor
1276AS-H-1R0M
1.0 µH
TOKO
L2
Inductor
1276AS-H-1R0M
1.0 µH
TOKO
L3
Inductor
1276AS-H-1R0M
1.0 µH
TOKO
L4
Inductor
1276AS-H-1R0M
1.0 µH
TOKO
C1
Ceramic Capacitor
C1608X5R1H104K
0.1 µF
TDK
C2
Ceramic Capacitor
C1608X5R1V475K
4.7 µF
TDK
C3
Ceramic Capacitor
C1608X5R1V475K
4.7 µF
TDK
C4
Ceramic Capacitor
C1608X5R1V475K
4.7 µF
TDK
C5
Ceramic Capacitor
C1608X5R1V475K
4.7 µF
TDK
C6
Ceramic Capacitor
C2012X5R1A336M
1.0 µF
TDK
C7
Ceramic Capacitor
C1608X5R1H105K
22 µF
TDK
C8
Ceramic Capacitor
C1608X5R1H105K
22 µF
TDK
C9
Ceramic Capacitor
C1608X5R1H105K
22 µF
TDK
C10
Ceramic Capacitor
C2012X5R1A336M
33 µF
TDK
R1
Resistor
RR0816P-104-D
100 kΩ
SSM
R2
Resistor
RR0816P-104-D
100 kΩ
SSM
Resistor
RR0816P-104-D
100 kΩ
SSM
R3
TOKO
TDK
SSM
50
CONFIDENTIAL
: TOKO, INC.
: TDK Corporation
: SUSUMU CO., LTD.
S6AP412A_DS405-00018-1v0-E, December 26, 2014
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27. Reference Data
Inductor and capacitor value refer to section 26.
DCDC Convertor Efficiency Data
 DD1
Input voltage = 3.3V, Vo=1.2V setting
100
100
90
90
80
80
70
70
Efficiency[%]
Efficiency[%]
Input voltage = 3.3V, Vo = 1.0V setting
60
50
40
30
20
0
0.00001
30
0
0.00001
10
Input voltage = 5.5V, Vo = 1.0V setting
100
100
90
90
80
80
70
70
60
50
40
30
20
0
0.00001
PFM/PWM
0.001
0.1
Load current[A]
10
50
40
30
Fixed PWM
PFM/PWM
10
PFM/PWM
0.001
0.1
Load current[A]
60
20
Fixed PWM
10
Fixed PWM
Input voltage = 5.5V, Vo = 1.2V setting
Efficiency[%]
Efficiency[%]
40
10
PFM/PWM
0.001
0.1
Load current[A]
50
20
Fixed PWM
10
60
0
0.00001
10
0.001
0.1
Load current[A]
10
 DD2
100
100
90
90
80
80
70
70
60
50
40
30
20
0
0.00001
December 26, 2014, S6AP412A_DS405-00018-1v0-E
50
40
30
10
PFM/PWM
0.001
0.1
Load current[A]
60
20
Fixed PWM
10
CONFIDENTIAL
Input voltage = 3.3V, Vo = 1.8V setting
Efficiency[%]
Efficiency[%]
Input Voltage = 3.3V, Vo = 1.5V setting
10
0
0.00001
Fixed PWM
PFM/PWM
0.001
0.1
Load current[A]
10
51
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 DD2
Input Voltage = 5.5V, Vo = 1.8V setting
100
100
90
90
80
80
70
70
Efficiency[%]
Efficiency[%]
Input voltage = 5.5V, Vo = 1.5V setting
60
50
40
30
20
0
0.00001
40
30
10
PFM/PWM
0.001
0.1
Load current[A]
50
20
Fixed PWM
10
60
0
0.00001
10
Fixed PWM
PFM/PWM
0.001
0.1
Load current[A]
10
 DD3
100
90
90
80
80
70
70
60
50
40
30
20
10
0
0.00001
52
CONFIDENTIAL
Input Voltage = 5.5V, Vo = 3.3V setting
100
Efficiency[%]
Efficiency[%]
Input voltage = 3.3V, Vo = 3.3V setting
50
40
30
20
Fixed PWM
Fixed PWM
10
PFM/PWM
0.001
0.1
Load current[A]
60
10
0
0.00001
PFM/PWM
0.001
0.1
Load current[A]
10
S6AP412A_DS405-00018-1v0-E, December 26, 2014
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DCDC Convertor Regulation Data
 DD1
Input voltage = 3.3V, Vo = 1.0V setting
Input voltage = 3.3V, Vo=1.2V setting
1.015
1.215
1.010
1.210
Output voltage[V]
1.220
Output voltage[V]
1.020
1.005
1.205
1.000
1.200
0.995
1.195
0.990
Fixed PWM
0.985
PFM/PWM
0.980
0.0
1.0
2.0
3.0
Load current[A]
4.0
Input voltage = 5.5V, Vo = 1.0V setting
1.190
Fixed PWM
1.185
PFM/PWM
1.180
1.215
1.010
1.210
Output voltage[V]
1.220
1.015
Output voltage[V]
1.0
2.0
3.0
Load current[A]
4.0
Input voltage = 5.5V, Vo = 1.2V setting
1.020
1.005
1.205
1.000
1.200
0.995
1.195
0.990
Fixed PWM
0.985
PFM/PWM
0.980
0.0
0.0
1.0
2.0
3.0
Load current[A]
4.0
1.190
Fixed PWM
1.185
PFM/PWM
1.180
0.0
1.0
2.0
3.0
Load current[A]
4.0
 DD2
Input Voltage = 3.3V, Vo = 1.5V setting
Input voltage = 3.3V, Vo = 1.8V setting
1.815
1.510
1.810
Output voltage[V]
1.820
1.515
Output voltage[V]
1.520
1.505
1.805
1.800
1.500
1.795
1.495
1.490
Fixed PWM
1.485
PFM/PWM
1.480
0.0
0.4
0.8
Load current[A]
December 26, 2014, S6AP412A_DS405-00018-1v0-E
CONFIDENTIAL
1.2
1.790
Fixed PWM
1.785
PFM/PWM
1.780
0.0
0.4
0.8
Load current[A]
1.2
53
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 DD2
Input voltage = 5.5V, Vo = 1.5V setting
Input Voltage = 5.5V, Vo = 1.8V setting
1.815
1.510
1.810
Output voltage[V]
1.820
1.515
Output voltage[V]
1.520
1.805
1.505
1.800
1.500
1.795
1.495
1.490
Fixed PWM
1.485
PFM/PWM
1.480
0.0
0.4
0.8
Load current[A]
1.2
1.790
Fixed PWM
1.785
PFM/PWM
1.780
0.0
0.4
0.8
Load current[A]
1.2
 DD3
3.320
3.320
3.315
3.315
3.310
3.310
3.305
3.305
3.300
3.300
3.295
3.295
3.290
Fixed PWM
3.285
PFM/PWM
3.280
0.0
0.2
0.4
Load current[A]
54
CONFIDENTIAL
Input Voltage = 5.5V, Vo = 3.3V setting
Output voltage[V]
Output voltage[V]
Input voltage = 3.3V, Vo = 3.3V setting
0.6
3.290
Fixed PWM
3.285
PFM/PWM
3.280
0.0
0.2
0.4
0.6
Load current[A]
S6AP412A_DS405-00018-1v0-E, December 26, 2014
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DCDC Convertor Output Ripple Voltage
 DD1
Input voltage = 3.3V, Vo = 1.0V setting
Input voltage = 3.3V, Vo=1.0V setting
Load current = 0mA , Fixed PWM
Load current = 4000mA, Fixed PWM
10mV/div, 0.5μs/div
Input voltage = 5.5V, Vo = 1.0V setting
Input voltage = 5.5V, Vo = 1.0V setting
Load current = 0mA , Fixed PWM
Load current = 4000mA, Fixed PWM
10mV/div, 0.5μs/div
10mV/div, 0.5μs/div
Input voltage = 3.3V, Vo = 1.0V setting
Input voltage = 3.3V, Vo=1.0V setting
Load current = 0mA , PFM/PWM
Load current = 4000mA,PFM/PWM
10mV/div, 2ms/div
Input voltage = 5.5V, Vo = 1.0V setting
Load current = 0mA , PFM/PWM
10mV/div, 2ms/div
December 26, 2014, S6AP412A_DS405-00018-1v0-E
CONFIDENTIAL
10mV/div, 0.5μs/div
10mV/div, 0.5μs/div
Input voltage = 5.5V, Vo = 1.0V setting
Load current = 4000mA,PFM/PWM
10mV/div, 0.5μs/div
55
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 DD2
Input voltage = 3.3V, Vo = 1.8V setting
Input voltage = 3.3V, Vo=1.8V setting
Load current = 0mA , Fixed PWM
Load current = 1200mA, Fixed PWM
10mV/div, 0.5μs/div
Input voltage = 5.5V, Vo = 1.8V setting
Input voltage = 5.5V, Vo = 1.8V setting
Load current = 0mA , Fixed PWM
Load current =1200mA, Fixed PWM
10mV/div, 0.5μs/div
Input voltage = 3.3V, Vo=1.8V setting
Load current = 0mA , PFM/PWM
Load current =1200mA,PFM/PWM
10mV/div, 0.5μs/div
Input voltage = 5.5V, Vo = 1.8V setting
Input voltage = 5.5V, Vo = 1.8V setting
Load current = 0mA , PFM/PWM
Load current = 1200mA,PFM/PWM
10mV/div, 2ms/div
CONFIDENTIAL
10mV/div, 0.5μs/div
Input voltage = 3.3V, Vo = 1.8V setting
10mV/div, 2ms/div
56
10mV/div, 0.5μs/div
10mV/div, 0.5μs/div
S6AP412A_DS405-00018-1v0-E, December 26, 2014
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 DD3
Input voltage = 3.3V, Vo = 3.3V setting
Input voltage = 3.3V, Vo=3.3V setting
Load current = 0mA , Fixed PWM
Load current = 600mA, Fixed PWM
10mV/div, 0.5μs/div
Input voltage = 5.5V, Vo = 3.3V setting
Input voltage = 5.5V, Vo = 3.3V setting
Load current = 0mA , Fixed PWM
Load current =600mA, Fixed PWM
10mV/div, 0.5μs/div
10mV/div, 0.5μs/div
Input voltage = 3.3V, Vo = 3.3V setting
Input voltage = 3.3V, Vo=3.3V setting
Load current = 0mA , PFM/PWM
Load current = 600mA,PFM/PWM
10mV/div, 2ms/div
10mV/div, 0.5μs/div
Input voltage = 5.5V, Vo = 1.0V setting
Input voltage = 3.3V, Vo =3.3V setting
Load current = 0mA , PFM/PWM
Load current = 600mA,PFM/PWM
10mV/div, 2ms/div
December 26, 2014, S6AP412A_DS405-00018-1v0-E
CONFIDENTIAL
10mV/div, 0.5μs/div
10mV/div, 0.5μs/div
57
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DCDC Convertor Enable/Disable
 DD1(Fixed PWM)
Input voltage = 3.3V, Vo = 1.0V setting
Input voltage = 3.3V, Vo=1.0V setting
Load current = 4000mA, Tss = 1ms setting
Load current = 0mA, Tss = 1ms setting
SCL(3V/div)
SCL(3V/div)
PG1(6V/div)
PG1(6V/div)
1.01ms
Vo(0.5V/div)
Vo(0.5V/div)
200us/div
510ms
200ms/div
IIN(1.0A/div)
IIN(40mA/div)
 DD1(PFM/PWM)
Input voltage = 3.3V, Vo = 1.0V setting
Input voltage = 3.3V, Vo=1.0V setting
Load current = 4000mA, Tss = 1ms setting
Load current = 0mA, Tss = 1ms setting
SCL(3V/div)
SCL(3V/div)
PG1(6V/div)
PG1(6V/div)
1.01ms
Vo(0.5V/div)
Vo(0.5V/div)
200us/div
515ms
200ms/div
IIN(1.0A/div)
IIN(40mA/div)
 DD2(Fixed PWM)
Input voltage = 3.3V, Vo = 1.8V setting
Input voltage = 3.3V, Vo=1.8V setting
Load current = 1200mA, Tss = 1ms setting
Load current = 0mA, Tss = 1ms setting
SCL(3V/div)
SCL(3V/div)
PG2(6V/div)
PG2(6V/div)
1.02ms
Vo(1V/div)
Vo(1V/div)
200us/div
200ms
50ms/div
IIN(500mA/div)
IIN(40mA/div)
58
CONFIDENTIAL
S6AP412A_DS405-00018-1v0-E, December 26, 2014
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 DD2(PFM/ PWM)
Input voltage = 3.3V, Vo = 1.8V setting
Input voltage = 3.3V, Vo=1.8V setting
Load current = 1200mA, Tss = 1ms setting
Load current = 0mA, Tss = 1ms setting
SCL(3V/div)
SCL(3V/div)
PG2(6V/div)
PG2(6V/div)
1.03ms
Vo(1V/div)
Vo(1V/div)
200us/div
204ms
50ms/div
IIN(500mA/div)
IIN(40mA/div)
 DD3 (Fixed PWM)
Input voltage = 3.3V, Vo = 3.3V setting
Input voltage = 3.3V, Vo=3.3 V setting
Load current = 600mA, Tss = 1ms setting
Load current = 0mA, Tss = 1ms setting
SCL(3V/div)
SCL(3V/div)
PG3(6V/div)
PG3(6V/div)
0.99ms
Vo(2V/div)
200us/div
Vo(2V/div)
270ms
100ms/div
IIN(500mA/div)
IIN(40mA/div)
 DD3 (Fixed PWM)
Input voltage = 3.3V, Vo = 3.3V setting
Input voltage = 3.3V, Vo=3.3 V setting
Load current = 600mA, Tss = 1ms setting
Load current = 0mA, Tss = 1ms setting
SCL(3V/div)
SCL(3V/div)
PG3(6V/div)
PG3(6V/div)
1.0ms
Vo(2V/div)
200us/div
Vo(2V/div)
270ms
100ms/div
IIN(500mA/div)
IIN(40mA/div)
December 26, 2014, S6AP412A_DS405-00018-1v0-E
CONFIDENTIAL
59
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DCDC Convertor Load Transient
 DD1(Fixed PWM)
Input voltage = 3.3V, Vo = 1.0V setting
Input voltage = 3.3V, Vo=1.0V setting
Load current = from 0mA to 4000mA per 10us
Load current = from 4000mA to 0mA per 10us
82.5mV
Vo1(100mV/div)
offset:1.000V
Vo1(100mV/div)
offset:1.000V
82.5mV
10us
10us
Io(2.0A/div)
Io(2.0A/div)
 DD1(PFM/PWM)
Input voltage = 3.3V, Vo = 1.0V setting
Input voltage = 3.3V, Vo=1.0V setting
Load current = from 0mA to 4000mA per 10us
Load current = from 4000mA to 0mA per 10us
Vo1(100mV/div)
offset:1.000V
84.1mV
Vo1(100mV/div)
offset:1.000V
82.5mV
50ms
10us
Io(2.0A/div)
Io(2.0A/div)
 DD2(Fixed PWM)
Input voltage = 3.3V, Vo = 1.8V setting
Input voltage = 3.3V, Vo=1.8V setting
Load current = from 0mA to 1200mA per 10us
Vo2(50mV/div)
offset:1.8V
Load current = from 1200mA to 0mA per 10us
54.1mV
Vo1(50mV/div)
offset:1.8V
54.8mV
10us
10us
Io(1.0A/div)
60
CONFIDENTIAL
Io(1.0A/div)
S6AP412A_DS405-00018-1v0-E, December 26, 2014
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 DD2(PFM/ PWM)
Input voltage = 3.3V, Vo = 1.8V setting
Input voltage = 3.3V, Vo=1.8V setting
Load current = from 0mA to 1200mA per 10us
Load current = from 1200mA to 0mA per 10us
Vo2(50mV/div)
offset:1.8V
57.1mV
Vo1(50mV/div)
offset:1.8V
54.0mV
10ms
10us
Io(1.0A/div)
Io(1.0A/div)
 DD3 (Fixed PWM)
Input voltage = 3.3V, Vo = 3.3V setting
Input voltage = 3.3V, Vo=3.3 V setting
Load current = 600mA, Tss = 1ms setting
Load current = 0mA, Tss = 1ms setting
Vo3(50mV/div)
offset:3.3V
54.7mV
Vo3(50mV/div)
offset:3.3V
59.5mV
10us
10us
Io(500mA/div)
Io(500mA/div)
 DD3 (Fixed PWM)
Input voltage = 3.3V, Vo = 3.3V setting
Input voltage = 3.3V, Vo=3.3 V setting
Load current = 600mA, Tss = 1ms setting
Load current = 0mA, Tss = 1ms setting
Vo3(50mV/div)
offset:3.3V
84mV
Vo3(50mV/div)
offset:3.3V
83mV
20ms
10us
Io(500mA/div)
Io(500mA/div)
December 26, 2014, S6AP412A_DS405-00018-1v0-E
CONFIDENTIAL
61
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DCDC Convertor DVFS Function
 DD1 (Fixed PWM)
Input voltage = 3.3V,
Input voltage = 3.3V
Vo =from 0.7V to 1.32V setting by I2C
Vo =from 1.32V to 0.7V setting by I2C
SCL
(2V/div)
SCL
(2V/div)
PG
(5V/div)
PG
(5V/div)
Vo1
(200mV/div)
offset0.7V
62
CONFIDENTIAL
100us
Vo1
(200mV/div)
offset0.7V
100us
S6AP412A_DS405-00018-1v0-E, December 26, 2014
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28. Ordering Information
Table 28-1 Ordering Information
Part Number
Package
Remarks
S6AP412A18GN1C000
S6AP412A28GN1C000
S6AP412A38GN1C000
S6AP412A58GN1C000
S6AP412A68GN1C000
S6AP412A78GN1C000
32-pin plastic QFN
S6AP412A98GN1C000
(WNT032)
S6AP412AA8GN1C000
S6AP412AB8GN1C000
S6AP412AD8GN1C000
S6AP412AE8GN1C000
S6AP412AF8GN1C000
December 26, 2014, S6AP412A_DS405-00018-1v0-E
CONFIDENTIAL
63
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29. Preset Code List
DD1 Output Voltage
DD2 Output Voltage
DD3 Output Voltage
Preset Code Value
Preset Code Value
Preset Code Value
18
0.90V
1.35V
3.30V
28
0.90V
1.50V
3.30V
38
0.90V
1.80V
3.30V
58
1.00V
1.35V
3.30V
68
1.00V
1.50V
3.30V
78
1.00V
1.80V
3.30V
98
1.10V
1.35V
3.30V
A8
1.10V
1.50V
3.30V
Preset Code
64
CONFIDENTIAL
B8
1.10V
1.80V
3.30V
D8
1.20V
1.35V
3.30V
E8
1.20V
1.50V
3.30V
F8
1.20V
1.80V
3.30V
S6AP412A_DS405-00018-1v0-E, December 26, 2014
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30. Layout
Consider the points listed below and do the layout design.
− Provide the ground plane as much as possible on the IC mounted face. GND and PGNDx provide the
through hole proximal to GND and PGNDx pins of IC, and connect it with GND of internal layer.
− Provide the power plane as much as possible to lower impedance of VCC.
− Play the most attention to the loop composed of input capacitor (CPVCCx) and SWFET. Input
capacitor (CPVCCx) connected with PVCCx should be placed close to the pin as much as possible to
make the current loop as small as possible. Also connect the GND pin of the input capacitor with
PGNDx.
− Output capacitor (CVO3) connected with VO3 should be placed close to the pin as much as possible.
Also connect the GND pin of the output capacitor with PGND3.
− GND pins of the switching system parts provide the through hole at the proximal place, and connect it
with GND of internal layer.
− By-pass capacitor (CVREF, CAVCC) connected with VREF and AVCC should be placed close to the
pin as much as possible. Also connect the GND pin of the by-pass capacitor with GND of internal layer
in the proximal through-hole.
− Pull the feedback line to be connected to the INx pin of the IC separately from near the output
capacitor pin, whenever possible. Consider the line connected with INx pins to keep away from a
switching system parts as much as possible because it is sensitive to the noise.
− There is leaked magnetic flux around the inductor or backside of place equipped with inductor.
Line and parts sensitive to noise should be considered to be placed away from the inductor (or backside of
place equipped with inductor).
Switching system parts: Input capacitor(CPVCCx), Inductor(L), Output capacitor(CVOx)
Note:
−
x: Each channel number
Figure 30-1 Layout Example
Layout example of switching components 1
Layout example of IC
CPVCC1A
GND
PGNDx
CPVCCx
PVCC1B
PGND1B
PVCC1A
PGND1A
CPVCC1B
CVREF
VREF
L
Through Hole
AVCC
CAVCC
CVOx
GND
PVCCx
To the LXx pin
Output voltage
VOx feedback
(Top View)
Layout example of switching components 2
EP(Exposed Pad)
1pin
Surface
Layer
CPVCC3
PGND2
PVCC2
PVCC3
PGND3
CVO3
Output voltage
VO3 feedback
VO3
CPVCC2
Inner
Layer
December 26, 2014, S6AP412A_DS405-00018-1v0-E
CONFIDENTIAL
CVO3
To the LX3-2 pin
GND
L
To the LX3-1 pin
PGND3
PVCC3
CPVCC3
GND
65
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31. Package Dimensions
66
CONFIDENTIAL
S6AP412A_DS405-00018-1v0-E, December 26, 2014
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32. Major Changes
Page
Section
Change Results
Revision 0.1
-
-
Initial release
-
Preliminary → Full production
Revision 1.0
50
26. Measurement Circuit for Characteristics of General Operation
63
28. Ordering Information
December 26, 2014, S6AP412A_DS405-00018-1v0-E
CONFIDENTIAL
Revised the Parts number of Component list
1278AS-H-1R0M → 1276AS-H-1R0M
Revised the Part number of Ordering Information
67
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Colophon
The products described in this document are designed, developed and manufactured as contemplated for general use,
including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not
designed, developed and manufactured as contemplated (1) for any use that includes fatal risks or dangers that, unless
extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal injury,
severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control,
mass transport control, medical life support system, missile launch control in weapon system), or (2) for any use where
chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion will not be liable
to you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products.
Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such
failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and
prevention of over-current levels and other abnormal operating conditions. If any products described in this document
represent goods or technologies subject to certain restrictions on export under the Foreign Exchange and Foreign Trade Law
of Japan, the US Export Administration Regulations or the applicable laws of any other country, the prior authorization by the
respective government entity will be required for export of those products.
Trademarks and Notice
The contents of this document are subject to change without notice. This document may contain information on a Spansion
product under development by Spansion. Spansion reserves the right to change or discontinue work on any product without
notice. The information in this document is provided as is without warranty or guarantee of any kind as to its accuracy,
completeness, operability, fitness for particular purpose, merchantability, non-infringement of third-party rights, or any other
warranty, express, implied, or statutory. Spansion assumes no liability for any damages of any kind arising out of the use of
the information in this document.
®
®
®
TM
Copyright © 2014 Spansion
All rights reserved. Spansion , the Spansion logo, MirrorBit , MirrorBit Eclipse ,
TM
ORNAND and combinations thereof, are trademarks and registered trademarks of Spansion LLC in the United States and
other countries. Other names used are for informational purposes only and may be trademarks of their respective owners.
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CONFIDENTIAL
S6AP412A_DS405-00018-1v0-E, December 26, 2014