AOS Semiconductor Product Reliability Report AOT480L, rev B Plastic Encapsulated Device ALPHA & OMEGA Semiconductor, Inc www.aosmd.com 1 This AOS product reliability report summarizes the qualification result for AOT480L. Accelerated environmental tests are performed on a specific sample size, and then followed by electrical test at end point. Review of final electrical test result confirms that AOT480L passes AOS quality and reliability requirements. The released product will be categorized by the process family and be monitored on a quarterly basis for continuously improving the product quality. Table of Contents: I. II. III. IV. Product Description Package and Die information Environmental Stress Test Summary and Result Reliability Evaluation I. Product Description: TM The AOT480L is fabricated with SDMOS trench technology that combines excellent RDS(ON) with low gate charge & low Qrr. The result is outstanding efficiency with controlled switching behavior. This universal technology is well suited for PWM, load switching and general purpose applications. -RoHS Compliant -Halogen Free Details refer to the datasheet. II. Die / Package Information: Process Package Type Lead Frame Die Attach Bond wire Mold Material Moisture Level AOT480L Standard sub-micron 80V N channel MOSFET TO220 Bare Cu Soft solder Al wire Epoxy resin with silica filler Up to Level 1 2 III. Result of Reliability Stress for AOT480L Test Item Test Condition Time Point MSL Precondition 168hr 85°c /85%RH +3 cycle reflow@260°c Temp = 150°c , Vgs=100% of Vgsmax - 15 lots 3234pcs 0 JESD22A113 168hrs 500 hrs 1000 hrs 2 lots 3 lots 4 lots 693pcs 0 JESD22A108 HTRB Temp = 150°c , Vds=80% of Vdsmax 168hrs 500 hrs 1000 hrs (Note A*) 2 lots 3 lots 4 lots 77 pcs / lot 693pcs 0 JESD22A108 HAST 130°c , 85%RH, 33.3 psi, Vgs = 100% of Vgsmax 96 hrs (Note A*) 12 lots 77 pcs / lot 924pcs 0 JESD22A110 Pressure Pot 121°c , 29.7psi, RH=100% 96 hrs (Note A*) 15 lots 77 pcs / lot 1155pcs 0 JESD22A102 (Note A*) 77 pcs / lot 0 JESD22A104 HTGB Temperature Cycle -65°c to 150°c , air to air, 250 / 500 cycles Lot Attribution 15 lots (Note A*) Total Sample size Number of Failures 1155pcs Reference Standard 77 pcs / lot Note A: The reliability data presents total of available generic data up to the published date. IV. Reliability Evaluation FIT rate (per billion): 3.92 MTTF = 29102 years The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in sample size of the selected product (AOT480L). Failure Rate Determination is based on JEDEC Standard JESD 85. FIT means one failure per billion hours. 2 9 Failure Rate = Chi x 10 / [2 (N) (H) (Af)] 9 = 1.83 x 10 / [2x (4x77x168 +6x77x500 +8x77x1000) x259] = 3.92 9 8 MTTF = 10 / FIT = 2.55 x 10 hrs = 29102 years Chi²= Chi Squared Distribution, determined by the number of failures and confidence interval N = Total Number of units from HTRB and HTGB tests H = Duration of HTRB/HTGB testing Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C) Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)] Acceleration Factor ratio list: Af 55 deg C 70 deg C 85 deg C 100 deg C 115 deg C 130 deg C 150 deg C 259 87 32 13 5.64 2.59 1 Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16 Tj u =The use junction temperature in degree (Kelvin), K = C+273.16 k = Boltzmann’s constant, 8.617164 X 10-5eV / K 3