AOS Semiconductor Product Reliability Report AOK60N30, rev A Plastic Encapsulated Device ALPHA & OMEGA Semiconductor, Inc www.aosmd.com This AOS product reliability report summarizes the qualification result for AOK60N30. Accelerated environmental tests are performed on a specific sample size, and then followed by electrical test at end point. Review of final electrical test result confirms that AOK60N30 passes AOS quality and reliability requirements. Table of Contents: I. II. III. IV. Product Description Package and Die information Environmental Stress Test Summary and Result Reliability Evaluation I. Product Description: The AOK60N30 is fabricated using an advanced high voltage MOSFET process that is designed to deliver high levels of performance and robustness in popular AC-DC applications. By providing low RDS(on), Ciss and Crss along with guaranteed avalanche capability this part can be adopted quickly into new and existing offline power supply designs. -RoHS Compliant -Halogen-Free Detailed information refers to datasheet. II. Die / Package Information: AOK60N30 Standard sub-micron 300V N channel MOSFET Package Type TO247 Lead Frame Bare Cu Die Attach Soft Solder Bonding Al wire Mold Material Epoxy resin with silica filler MSL (moisture sensitive level) Level 1 based on J-STD-020 Process Note * based on information provided by assembler and mold compound supplier III. Result of Reliability Stress for AOK60N30 Test Item Test Condition Time Point Lot Attribution Total Sample size Number of Failures MSL Precondition 168hr 85°c /85%RH +3 cycle reflow@260°c HTGB - 15 lots 3234pcs 0 JESD22A113 Temp = 150 c, Vgs=100% of Vgsmax 168hrs 500 hrs 1000 hrs 462pcs 0 3 lots 3 lots JESD22A108 Temp = 150 c, Vds=80% of Vdsmax 168hrs 500 hrs 1000 hrs 77pcs / lot 462pcs 0 3 lots 3 lots JESD22A108 HAST 130 c, 85%RH, 33.3 psi, Vgs = 100% of Vgs max 96 hrs 12 lots 77pcs / lot 924pcs 0 JESD22A110 Pressure Pot 121c, 29.7psi, RH=100% 96 hrs (Note A*) 15 lots 77 pcs / lot 1155pcs 0 JESD22A102 Temperature Cycle -65c to 150c, air to air 250 / 500 cycles (Note A*) 15 lots 77 pcs / lot 1155pcs 0 JESD22A104 (Note A*) 77 pcs / lot HTRB Standard Note A: The reliability data presents total of available generic data up to the published date. IV. Reliability Evaluation FIT rate (per billion): 5.09 MTTF = 22440 years The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in sample size of the selected product (AOK60N30). Failure Rate Determination is based on JEDEC Standard JESD 85. FIT means one failure per billion hours. 2 9 Failure Rate = Chi x 10 / [2 (N) (H) (Af)] 9 = 1.83 x 10 / [2x (6x77x500 +6x77x1000) x259] = 5.09 9 8 MTTF = 10 / FIT = 1.97 x 10 hrs = 22440 years Chi²= Chi Squared Distribution, determined by the number of failures and confidence interval N = Total Number of units from HTRB and HTGB tests H = Duration of HTRB/HTGB testing Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C) Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)] Acceleration Factor ratio list: 55 deg C 70 deg C 85 deg C 100 deg C 115 deg C Af 259 88 32 13 5.64 Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16 Tj u = The use junction temperature in degree (Kelvin), K = C+273.16 -5 K = Boltzmann’s constant, 8.617164 X 10 eV / K 130 deg C 150 deg C 2.59 1