EM MC comp ponents Min niaturize ed thin--film common-mode fiilter for high-sp peed interfaces s • Wo orld’s highe est common n-mode atte enuation in a 0403 pack kage of 27.55 dB at 850 0 MHz • Fo ootprint nearly 60 perce ent smaller than existin ng products with same common-m mode atttenuation May 14, 2015 TDK Corporation has expanded its line eup of common-mode filters. The new TCM0 0403R thin-ffilm commo on-mode filte er offers a ccommon-mo ode attenua ation of 27.55 dB at 850 0 MHz in an IEC 0 0403 packa age (0.45 mm x 0.30 m mm), the world’s highes st value for tthis case siz ze. The footp print of the TCM0403R T is nearly 60 0 percent smaller than the existingg TCM0605 5R with same e common-mode attenuation. In a addition, the e new filter features f an extremely low inserrtion height of only 0.23 3 mm. With a cutoff fre equency of 5.0 5 GHz annd good com mmonmode e attenuatio on characteristics in 50 00 MHz to 2.4 2 GHz range, the new w filter supp presses comm mon-mode noise witho out distorting g high-spee ed differential signals. IIt is thus compatible with various high-speed intterfaces succh as MIPI, USB 2.0, and a USB 3.00. The typic cal DC resisstance is only 3.5 Ω. As s a result, th he new TCM M0403R thin-film comm mon-mode filter f significantly imp proves the WLAN W recep ption sensittivity in sma artphones, cconventiona al mobile phon nes and other compactt portable de evices. Mas ss productio on began inn May 2015.. The miniaturizattion was rea alized using g TDK’s leading-edge thin-film t pattterning tech hnology deve eloped for th he manufacture of HDD D magnetic heads com mbined with compact, highpreciision coil pa attern and te erminal form mation proc cesses. Thanks to its m much smalle er footprint, the n new filter su upports the high-density h y mounting of electronic componeents and contributes to significant space e-savings in n electronicc devices. ----sary Gloss • MIPI: the Mobile Industry Processor P Intterface is an open standa ard supportedd by the MIP PI Alliance, wh hich consists of nearly 20 00 members companies in the mobile device indusstry. Main application ns martphones, conventional mobile pho ones, and oth her mobile de evices • Sm • Ele ectronic devices with high h-speed inte rfaces such as MIPI, USB 2.0, and U USB 3.0 nd benefits Main features an gh 5.0 GHz cutoff c frequency for comp patibility with h high-speed interfaces • Hig • Wo orld’s highesst common-m mode attenua ation in a 040 03 package of o 27.5 dB att 850 MHz • Go ood common n-mode attenuation chara acteristics in 500 MHz to 2.4 GHz rannge for improved mobile sig gnal reception sensitivity; • Sig gnificant size e reduction, combined c witth typical DC C resistance of 3.5 Ω TDK C Corporation 1/ 2 Key d data Typ pe Dimen nsions [mm] TCM M0403R-900-2P Common n-mode attenuatiion [dB] typ. @ 850 MHz Cutoff frequenccy [GHz] tyyp. DC res sistance [Ω] typ p. 27.5 2 5.0 3.5 0.45 x 0.30 x 0.23 3 ----ut TDK Corp poration Abou TDK Corporation is a leading electronics ccompany bas sed in Tokyo o, Japan. It w was establish hed in 1935 to com mmercialize ferrite, a key y material in electronic an nd magnetic products. TD DK's portfolio o includes electrronic components, modules and syste ems* marketted under the e product braands TDK an nd EPCOS, powe er supplies, magnetic m app plication prod ducts as well as energy devices, d flashh memory ap pplication devicces, and othe ers. TDK focu uses on dem manding mark kets in the arreas of inform mation and comm munication te echnology an nd consumerr, automotive e and industrial electroniccs. The comp pany has a netwo ork of design n and manufa acturing loca ations and sa ales offices in n Asia, Europpe, and in No orth and South h America. In n fiscal 2015, TDK posted d total sales of USD 9.0 billion and em mployed abo out 88,000 people worldwide e. * The product portfo olio includes ceramic, c alumiinum electroly ytic and film ca apacitors, ferrittes, inductors, highfreque ency compone ents such as surface s acousttic wave (SAW W) filter produc cts and modulles, piezo and protection compo onents, and sensors. ----ad this text an nd associate ed images fro om You ccan downloa www.global.tdk.co om/news_ce enter/press/2 20150514181 14.htm. Furth her informatio on on the pro oducts can be e found unde er http:///product.tdk..com/en/cata alog/datashee ets/cmf_com mmercial_signal_tcm04033r_en.pdf. ----gional media a Conttacts for reg Regio on Contact Japan n Mr. Akirra TESHIMA ASEA AN Ms. Jian ng MAN Mr. Sho ota KANZAKI Greate er China a Ms. Clover XU Europ pe Mr. Fran nk TRAMPNAU U Ameriica Ms. Sarra M. LAMBETH TDK C Corporation TDK Corpo oration Tokyo, Jap pan TDK Singa apore (Pte) Ltd d. Singapore e TDK China a Co., Ltd. Shanghai, China pe GmbH TDK Europ Duesseldo orf, Germany TDK Corpo oration of Ame erica Irving, TX, USA Phone Mail +813 6852-7102 [email protected] m +65 6273 5022 asean.inquiry@ @sg.tdk.com +86 21 61962307 [email protected] m +49 211 9077 127 [email protected] m +1 972-409-4519 sara.lambeth@ @us.tdk.com 2/ 2