Press release (pdf: 131.3 KB; )

EM
MC comp
ponents
Min
niaturize
ed thin--film common-mode fiilter
for high-sp
peed interfaces
s
• Wo
orld’s highe
est common
n-mode atte
enuation in a 0403 pack
kage of 27.55 dB at 850
0 MHz
• Fo
ootprint nearly 60 perce
ent smaller than existin
ng products with same common-m
mode
atttenuation
May 14, 2015
TDK Corporation has expanded its line
eup of common-mode filters. The new TCM0
0403R
thin-ffilm commo
on-mode filte
er offers a ccommon-mo
ode attenua
ation of 27.55 dB at 850
0 MHz in an
IEC 0
0403 packa
age (0.45 mm x 0.30 m
mm), the world’s highes
st value for tthis case siz
ze. The
footp
print of the TCM0403R
T
is nearly 60
0 percent smaller than the existingg TCM0605
5R with
same
e common-mode attenuation. In a
addition, the
e new filter features
f
an extremely low
inserrtion height of only 0.23
3 mm. With a cutoff fre
equency of 5.0
5 GHz annd good com
mmonmode
e attenuatio
on characteristics in 50
00 MHz to 2.4
2 GHz range, the new
w filter supp
presses
comm
mon-mode noise witho
out distorting
g high-spee
ed differential signals. IIt is thus compatible
with various high-speed intterfaces succh as MIPI, USB 2.0, and
a USB 3.00. The typic
cal DC
resisstance is only 3.5 Ω. As
s a result, th
he new TCM
M0403R thin-film comm
mon-mode filter
f
significantly imp
proves the WLAN
W
recep
ption sensittivity in sma
artphones, cconventiona
al mobile
phon
nes and other compactt portable de
evices. Mas
ss productio
on began inn May 2015..
The miniaturizattion was rea
alized using
g TDK’s leading-edge thin-film
t
pattterning tech
hnology
deve
eloped for th
he manufacture of HDD
D magnetic heads com
mbined with compact, highpreciision coil pa
attern and te
erminal form
mation proc
cesses. Thanks to its m
much smalle
er footprint,
the n
new filter su
upports the high-density
h
y mounting of electronic componeents and contributes to
significant space
e-savings in
n electronicc devices.
----sary
Gloss
• MIPI: the Mobile Industry Processor
P
Intterface is an open standa
ard supportedd by the MIP
PI Alliance,
wh
hich consists of nearly 20
00 members companies in the mobile device indusstry.
Main application
ns
martphones, conventional mobile pho
ones, and oth
her mobile de
evices
• Sm
• Ele
ectronic devices with high
h-speed inte rfaces such as MIPI, USB 2.0, and U
USB 3.0
nd benefits
Main features an
gh 5.0 GHz cutoff
c
frequency for comp
patibility with
h high-speed interfaces
• Hig
• Wo
orld’s highesst common-m
mode attenua
ation in a 040
03 package of
o 27.5 dB att 850 MHz
• Go
ood common
n-mode attenuation chara
acteristics in 500 MHz to 2.4 GHz rannge for improved mobile
sig
gnal reception sensitivity;
• Sig
gnificant size
e reduction, combined
c
witth typical DC
C resistance of 3.5 Ω
TDK C
Corporation
1/ 2
Key d
data
Typ
pe
Dimen
nsions
[mm]
TCM
M0403R-900-2P
Common
n-mode
attenuatiion [dB] typ.
@ 850 MHz
Cutoff
frequenccy
[GHz] tyyp.
DC res
sistance
[Ω] typ
p.
27.5
2
5.0
3.5
0.45 x 0.30 x 0.23
3
----ut TDK Corp
poration
Abou
TDK Corporation is a leading electronics ccompany bas
sed in Tokyo
o, Japan. It w
was establish
hed in 1935
to com
mmercialize ferrite, a key
y material in electronic an
nd magnetic products. TD
DK's portfolio
o includes
electrronic components, modules and syste
ems* marketted under the
e product braands TDK an
nd EPCOS,
powe
er supplies, magnetic
m
app
plication prod
ducts as well as energy devices,
d
flashh memory ap
pplication
devicces, and othe
ers. TDK focu
uses on dem
manding mark
kets in the arreas of inform
mation and
comm
munication te
echnology an
nd consumerr, automotive
e and industrial electroniccs. The comp
pany has a
netwo
ork of design
n and manufa
acturing loca
ations and sa
ales offices in
n Asia, Europpe, and in No
orth and
South
h America. In
n fiscal 2015, TDK posted
d total sales of USD 9.0 billion and em
mployed abo
out 88,000
people worldwide
e.
* The product portfo
olio includes ceramic,
c
alumiinum electroly
ytic and film ca
apacitors, ferrittes, inductors, highfreque
ency compone
ents such as surface
s
acousttic wave (SAW
W) filter produc
cts and modulles, piezo and protection
compo
onents, and sensors.
----ad this text an
nd associate
ed images fro
om
You ccan downloa
www.global.tdk.co
om/news_ce
enter/press/2
20150514181
14.htm.
Furth
her informatio
on on the pro
oducts can be
e found unde
er
http:///product.tdk..com/en/cata
alog/datashee
ets/cmf_com
mmercial_signal_tcm04033r_en.pdf.
----gional media
a
Conttacts for reg
Regio
on
Contact
Japan
n
Mr. Akirra TESHIMA
ASEA
AN
Ms. Jian
ng MAN
Mr. Sho
ota KANZAKI
Greate
er
China
a
Ms. Clover XU
Europ
pe
Mr. Fran
nk TRAMPNAU
U
Ameriica
Ms. Sarra M. LAMBETH
TDK C
Corporation
TDK Corpo
oration
Tokyo, Jap
pan
TDK Singa
apore (Pte) Ltd
d.
Singapore
e
TDK China
a Co., Ltd.
Shanghai, China
pe GmbH
TDK Europ
Duesseldo
orf, Germany
TDK Corpo
oration of Ame
erica
Irving, TX, USA
Phone
Mail
+813 6852-7102
[email protected]
m
+65 6273 5022
asean.inquiry@
@sg.tdk.com
+86 21 61962307
[email protected]
m
+49 211 9077 127
[email protected]
m
+1 972-409-4519
sara.lambeth@
@us.tdk.com
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