Datasheet

AOD468/AOI468
300V,11.5A N-Channel MOSFET
General Description
Product Summary
The AOD468 & AOI468 have been fabricated using an
advanced high voltage MOSFET process that is designed
to deliver high levels of performance and robustness in
popular AC-DC applications.By providing low RDS(on), Ciss
and Crss along with guaranteed avalanche capability these
parts can be adopted quickly into new and existing offline
power supply designs.These parts are ideal for boost
converters and synchronous rectifiers for consumer,
telecom, industrial power supplies and LED backlighting.
VDS
ID (at VGS=10V)
350V@150℃
RDS(ON) (at VGS=10V)
<0.42Ω
11.5A
100% UIS Tested!
100% Rg Tested!
TO252
DPAK
Top View
TO251A
IPAK
Bottom View
Top View
D
Bottom View
D
D
G
S
S
G
G
S
D
S
Absolute Maximum Ratings TA=25°C unless otherwise noted
Symbol
Parameter
VDS
Drain-Source Voltage
VGS
Gate-Source Voltage
TC=25°C
Continuous Drain
B
Current
TC=100°C
Pulsed Drain Current
C
D
G
G
S
Maximum
300
Units
V
±30
V
11.5
ID
8.3
A
IDM
29
IAR
3.8
EAR
216
mJ
Single pulsed avalanche energy
Peak diode recovery dv/dt
TC=25°C
B
o
Power Dissipation
Derate above 25 C
EAS
dv/dt
430
5
150
mJ
V/ns
W
Junction and Storage Temperature Range
Maximum lead temperature for soldering
purpose, 1/8" from case for 5 seconds
TJ, TSTG
1
-50 to 175
W/ oC
°C
300
°C
Avalanche Current
C
Repetitive avalanche energy
C
H
Thermal Characteristics
Parameter
Maximum Junction-to-Ambient
A
Maximum Case-to-sink
Maximum Junction-to-Case D,F
Rev0: Dec 2010
A,G
PD
TL
Symbol
RθJA
RθCS
RθJC
A
Typical
45
Maximum
55
Units
°C/W
0.7
0.5
1
°C/W
°C/W
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Page 1 of 6
AOD468/AOI468
Electrical Characteristics (TJ=25°C unless otherwise noted)
Symbol
Parameter
Conditions
Min
ID=250µA, VGS=0V, TJ=25°C
300
Typ
Max
Units
STATIC PARAMETERS
BVDSS
Drain-Source Breakdown Voltage
BVDSS
/∆TJ
Zero Gate Voltage Drain Current
IDSS
Zero Gate Voltage Drain Current
IGSS
Gate-Body leakage current
VDS=0V, VGS=±30V
VGS(th)
RDS(ON)
Gate Threshold Voltage
Static Drain-Source On-Resistance
VDS=5V ID=250µA
gFS
Forward Transconductance
VSD
Diode Forward Voltage
IS=1A,VGS=0V
IS
Maximum Body-Diode Continuous Current
Maximum Body-Diode Pulsed Current
ISM
ID=250µA, VGS=0V, TJ=150°C
350
V
ID=250µA, VGS=0V
0.29
o
V/ C
VDS=300V, VGS=0V
1
VDS=240V, TJ=125°C
10
Output Capacitance
Crss
Reverse Transfer Capacitance
Rg
Gate resistance
SWITCHING PARAMETERS
Qg
Total Gate Charge
Qgs
Gate Source Charge
±100
4
4.5
nΑ
V
VGS=10V, ID=6A
0.31
0.42
Ω
VDS=40V, ID=6A
11
1
V
12
A
29
A
DYNAMIC PARAMETERS
Ciss
Input Capacitance
Coss
µA
VGS=0V, VDS=25V, f=1MHz
VGS=0V, VDS=0V, f=1MHz
3.4
0.74
S
500
632
790
pF
55
90
125
pF
3
7
11
pF
1.3
2.7
4.1
Ω
10
12.8
16
nC
VGS=10V, VDS=240V, ID=12A
4.4
nC
Qgd
Gate Drain Charge
4.3
nC
tD(on)
Turn-On DelayTime
18
ns
tr
Turn-On Rise Time
31
ns
tD(off)
Turn-Off DelayTime
36
ns
tf
Turn-Off Fall Time
VGS=10V, VDS=150V, ID=12A,
RG=25Ω
20
IF=12A,dI/dt=100A/µs,VDS=100V
trr
Body Diode Reverse Recovery Time
Qrr
Body Diode Reverse Recovery Charge IF=12A,dI/dt=100A/µs,VDS=100V
ns
130
170
205
1
1.3
1.6
ns
µC
A. The value of R θJA is measured with the device in a still air environment with T A =25°C.
B. The power dissipation P D is based on T J(MAX)=175°C in a TO252 package, using junction-to-case thermal resistance, and is more useful in setting
the upper dissipation limit for cases where additional heatsinking is used.
C. Repetitive rating, pulse width limited by junction temperature T J(MAX)=175°C.
D. The R θJA is the sum of the thermal impedence from junction to case R θJC and case to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300 µs pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-case thermal impedence which is measured with the device mounted to a large heatsink, assuming a
maximum junction temperature of T J(MAX)=175°C.
G.These tests are performed with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with T A=25°C.
H. L=60mH, IAS=3.8A, VDD=150V, RG=10Ω, Starting T J=25°C
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
Rev0: Dec 2010
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Page 2 of 6
AOD468/AOI468
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
20
100
VDS=40V
10V
-55°C
15
10
ID(A)
ID (A)
6.5V
10
6V
125°C
1
5
VGS=5.5V
25°C
0.1
0
0
5
10
15
20
25
2
30
4
1.5
3
1.2
2.5
Normalized On-Resistance
RDS(ON) (Ω)
VDS (Volts)
Fig 1: On-Region Characteristics
VGS=10V
0.9
6
8
10
VGS(Volts)
Figure 2: Transfer Characteristics
0.6
0.3
VGS=10V
ID=6A
2
1.5
1
0.5
0.0
0
5
10
15
20
0
-100
25
ID (A)
Figure 3: On-Resistance vs. Drain Current and Gate
Voltage
-50
0
50
100
150
200
Temperature (°C)
Figure 4: On-Resistance vs. Junction Temperature
1.2
1.0E+02
ID=30A
40
1.0E+00
1
IS (A)
BVDSS (Normalized)
1.0E+01
1.1
125°C
125°C
25°C
1.0E-01
1.0E-02
0.9
25°C
0.8
-100
1.0E-03
1.0E-04
50
100
150
200
TJ (oC)
Figure 5: Break Down vs. Junction Temperature
Rev0: Dec 2010
-50
0
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0.2
0.4
0.6
0.8
1.0
VSD (Volts)
Figure 6: Body-Diode Characteristics
Page 3 of 6
AOD468/AOI468
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
15
10000
Capacitance (pF)
VGS (Volts)
Ciss
VDS=240V
ID=12A
12
9
6
1000
Coss
100
Crss
10
3
0
1
0
4
8
12
16
20
0.1
Qg (nC)
Figure 7: Gate-Charge Characteristics
100
1
10
VDS (Volts)
Figure 8: Capacitance Characteristics
100
800
10µs
RDS(ON)
limited
1ms
1
10ms
DC
0.1
1
10
100
400
200
TJ(Max)=175°C
TC=25°C
0.01
TJ(Max)=175°C
TC=25°C
600
100µs
Power (W)
ID (Amps)
10
1000
0
0.0001
VDS (Volts)
ZθJC Normalized Transient
Thermal Resistance
1
0.01
0.1
1
10
Pulse Width (s)
Figure 10: Single Pulse Power Rating Junction-toCase (Note F)
Figure 9: Maximum Forward Biased Safe
Operating Area (Note F)
10
0.001
D=Ton/T
TJ,PK=TC+PDM.ZθJC.RθJC
RθJC=1°C/W
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
0.1
PD
0.01
0.001
0.000001
Single Pulse
0.00001
0.0001
Ton
0.001
0.01
T
0.1
1
10
Pulse Width (s)
Figure 11: Normalized Maximum Transient Thermal Impedance (Note F)
Rev0: Dec 2010
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Page 4 of 6
AOD468/AOI468
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
12
150
Current rating ID(A)
Power Dissipation (W)
180
120
90
60
9
6
3
30
0
0
0
25
50
75
100
125
150
175
0
TCASE (°C)
Figure 12: Power De-rating (Note B)
25
50
75
100
125
150
175
TCASE (°C)
Figure 13: Current De-rating (Note B)
400
TA=25°C
Power (W)
300
200
100
0
0.01
0.1
1
10
100
Pulse Width (s)
Figure 14: Single Pulse Power Rating Junction-to-Ambient (Note G)
1000
ZθJA Normalized Transient
Thermal Resistance
10
1
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
D=Ton/T
TJ,PK=TA+PDM.ZθJA.RθJA
RθJA=55°C/W
0.1
0.01
PD
0.001
Ton
Single Pulse
0.0001
0.0001
0.001
0.01
0.1
1
10
T
100
1000
10000
Pulse Width (s)
Figure 15: Normalized Maximum Transient Thermal Impedance (Note G)
Rev0: Dec 2010
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Page 5 of 6
AOD468/AOI468
Gate Charge Test Circuit & Waveform
Vgs
Qg
10V
+
+ Vds
VDC
-
VDC
DUT
Qgs
Qgd
-
Vgs
Ig
Charge
Res istive Switching Test Circuit & Waveforms
RL
Vds
Vds
DUT
Vgs
Rg
+
VDC
90%
Vdd
-
10%
Vgs
Vgs
t d(on)
tr
t d(off)
t on
tf
t off
Unclamped Inductive Switching (UIS) Test Circuit & Waveforms
L
EAR= 1/2 LI
Vds
2
AR
BVDSS
Vds
Id
+
Vgs
Vgs
VDC
Rg
-
Vdd
I AR
Id
DUT
Vgs
Vgs
Diode Recovery Tes t Circuit & Waveforms
Qrr = - Idt
Vds +
DUT
Vds -
Isd
Vgs
Ig
Rev0: Dec 2010
Vgs
Isd
L
+ Vdd
VDC
-
IF
trr
dI/dt
IRM
Vds
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Vdd
Page 6 of 6