ISL80101 Features The ISL80101 ia a low-voltage, high-current, single output LDO specified for 1A output current. This part operates from input voltages of 2.2V to 6V and is capable of providing output voltages of 0.8V to 5V on the adjustable VOUT versions. Fixed output voltage options available in 0.8V, 1.2V, 1.5V, 1.8V, 2.5V, 3.3V and 5V. Other custom voltage options available upon request. • 0.2% initial VOUT Accuracy For applications that demand in-rush current less than current limit or a longer delay for a valid VOUT, an external capacitor on the soft-start pin provides adjustment. A supply independent ENABLE signal allows the part to be placed into a low quiescent current shutdown mode. Sub-micron CMOS process is utilized for this product family to deliver best in class analog performance and overall value. This CMOS LDO will consume significantly lower quiescent current as a function of load over bipolar LDOs, which translates into higher efficiency and the ability to consider packages with smaller footprints. Quiescent current is modestly compromised to enable leading class fast load transient response and hence total AC regulation band for an LDO in this category. Applications*(see page 14) • Designed for 2.2V to 6V Input Supply • Dropout Typically 130mV at 1A • Fast Load Transient Response • Rated Output Current Options of 1A • Adjustable In-Rush Current Limiting • Fixed and Adjustable VOUT Options Available • 58dB Typical PSRR • Output Noise of 100µVRMS between 300Hz to 300kHz • PG Feature • 1V Enable Input Threshold • Short-Circuit Current Protection • 1A Peak Reverse Current • Over-Temperature Shutdown • Any Cap Stable with Minimum 10µF Ceramic • ±1.8% Guaranteed VOUT Accuracy for Junction Temperature Range from -40°C to +125°C • Available in a 10 Ld DFN Package and soon to follow TO220-5, TO263-5 and SOT223-5 • Pb-Free (RoHS Compliant) • DSP, FPGA and µP Core Power Supplies • Noise-Sensitive Instrumentation Systems • Post Regulation of Switched Mode Power Supplies • Industrial Systems • Medical Equipment • Telecommunications and Networking Equipment • Servers • Hard Disk Drives (HD/HDD) Pin Configuration ISL80101 (10 LD 3X3 DFN) TOP VIEW December 21, 2009 FN6931.0 1 VOUT 1 10 VIN VOUT 2 9 VIN SENSE/ADJ 3 8 NC PG 4 7 ENABLE GND 5 6 SS CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright © Intersil Americas Inc. 2009. All Rights Reserved. All other trademarks mentioned are the property of their respective owners. ISL80101 High Performance 1A LDO ISL80101 Pin Descriptions PIN NUMBER PIN NAME 1, 2 VOUT 3 SENSE/ADJ 4 PG 5 GND 6 SS 7 ENABLE 8 DNC Do not connect this pin to ground or supply. Leave floating. 9, 10 VIN Input supply pin. DESCRIPTION Output voltage pin. Remote voltage sense for internally fixed VOUT options. ADJ pin for externally set VOUT. VOUT in regulation signal. Logic low defines when VOUT is not in regulation. Pin should be grounded if not used. GND pin. External cap controls the rate of the VOUT ramp. VIN independent chip enable. TTL and CMOS compatible. Ordering Information PART NUMBER (Notes 4, 5) PART MARKING VOUT VOLTAGE (Note 3) TEMP RANGE (°C) PACKAGE (Pb-Free) PKG DWG. # ISL80101IRAJZ (Note 1) DZAB ADJ -40 to +125 10 Ld 3x3 DFN L10.3x3 ISL80101IR08Z DZBB 0.8V -40 to +125 10 Ld 3x3 DFN L10.3x3 ISL80101IR08Z-T (Note 2) DZBB 0.8V -40 to +125 10 Ld 3x3 DFN L10.3x3 ISL80101IR12Z DZCB 1.2V -40 to +125 10 Ld 3x3 DFN L10.3x3 ISL80101IR12Z-T (Note 2) DZCB 1.2V -40 to +125 10 Ld 3x3 DFN L10.3x3 ISL80101IR15Z DZDB 1.5V -40 to +125 10 Ld 3x3 DFN L10.3x3 ISL80101IR15Z-T (Note 2) DZDB 1.5V -40 to +125 10 Ld 3x3 DFN L10.3x3 ISL80101IR18Z (Note 1) DZEB 1.8V -40 to +125 10 Ld 3x3 DFN L10.3x3 ISL80101IR25Z (Note 1) DZFB 2.5V -40 to +125 10 Ld 3x3 DFN L10.3x3 ISL80101IR33Z DZGB 3.3V -40 to +125 10 Ld 3x3 DFN L10.3x3 ISL80101IR33Z-T (Note 2) DZGB 3.3V -40 to +125 10 Ld 3x3 DFN L10.3x3 ISL80101IR50Z DZHB 5.0V -40 to +125 10 Ld 3x3 DFN L10.3x3 ISL80101IR50Z-T (Note 2) DZHB 5.0V -40 to +125 10 Ld 3x3 DFN L10.3x3 NOTES: 1. Add “-T” or “TK” for Tape and Reel. Please refer to TB347 for details on reel specifications. 2. Please refer to TB347 for details on reel specifications. 3. For other output voltages, contact Intersil Marketing. 4. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 5. For Moisture Sensitivity Level (MSL), please see device information page for ISL80101. For more information on MSL please see techbrief TB363. 2 FN6931.0 December 21, 2009 ISL80101 Absolute Maximum Ratings Thermal Information VIN relative to GND (Note 6) . . . . . . . . . . . . -0.3V to +6.5V VOUT relative to GND (Note 6) . . . . . . . . . . -0.3V to +6.5V PG, ENABLE, SENSE/ADJ, SS Relative to GND (Note 6) . . . . . . . . . . . . . -0.3V to +6.5V Thermal Resistance . . . . . . . . . . . . . . . . . . .θJA (°C/W)θJC (°C/W) 10 Ld DFN Package (Notes 7, 8) . . 45 4 Storage Temperature Range . . . . . . . . . . . -65°C to +150°C Junction Temperature . . . . . . . . . . . . . . . . . . . . . . +150°C Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . .see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp Recommended Operating Conditions (Notes 9, 10) Junction Temperature Range (TJ) (Note 9) . -40°C to +125°C VIN relative to GND . . . . . . . . . . . . . . . . . . . . . 2.2V to 6V VOUT range . . . . . . . . . . . . . . . . . . . . . . . . . . 800mV to 5V PG, ENABLE, SENSE/ADJ, SS relative to GND . . . . 0V to +6V PG Sink Current . . . . . . . . . . . . . . . . . . . . . . . . . . . <10mA CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTES: 6. ABS max voltage rating is defined as the voltage applied for a lifetime average duty cycle above 6V of 1%. 7. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech Brief TB379. 8. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside. 9. Extended operation at these conditions may compromise reliability. Exceeding these limits will result in damage. Recommended operating conditions define limits where specifications are guaranteed. 10. Electromigration specification defined as lifetime average junction temperature of +110°C where max rated DC current = lifetime average current. Electrical Specifications PARAMETER Unless otherwise noted, VIN = VOUT + 0.4V, VOUT = 1.8V, CIN = COUT = 10µF, TJ = +25°C. Applications must follow thermal guidelines of the package to determine worst case junction temperature. Please refer to Applications section of the datasheet and Tech Brief TB379. Boldface limits apply over the operating temperature range, -40°C to +125°C. SYMBOL TEST CONDITIONS MIN MAX (Note 11) TYP (Note 11) UNITS DC CHARACTERISTICS DC Ouput Voltage Accuracy VOUT VOUT Options: 0.8V, 1.2V, 1.5V and 1.8V 2.2V ≤ VIN < 3.6V; 0A < ILOAD ≤ 1A -1.8 0.2 1.8 % -1.8 0.2 1.8 % 491 500 509 mV 1 % VOUT Options: 2.5V, 3.3V and 5.0V VOUT + 0.4V ≤ VIN ≤ 6V; 0A < ILOAD < 1A Feedback Pin (ADJ Option Only) VADJ 2.2V ≤VIN ≤ 6V, 0A < ILOAD < 1A DC Input Line Regulation ΔVOUT/ ΔVIN VOUT + 0.5V < VIN < 5V DC Output Load Regulation ΔVOUT/ ΔIOUT 0A < ILOAD < 1A, All voltage options Feedback Input Current VADJ = 0.5V Ground Pin Current IQ Ground Pin Current in Shutdown ISHDN -1 % 0.01 1 µA ILOAD = 0A, 2.2V < VIN < 6V 3 5 mA ILOAD = 1A, 2.2V < VIN < 6V 5 7 mA ENABLE Pin = 0.2V, VIN = 6V 0.2 12 µA 212 mV Dropout Voltage (Note 12) VDO ILOAD = 1A, VOUT = 2.5V 130 Output Short Circuit Current (1A Version) OCP VOUT = 0V, 2.2V < VIN < 6V 1.75 A Thermal Shutdown Temperature TSD 2.2V < VIN < 6V 160 °C 3 FN6931.0 December 21, 2009 ISL80101 Electrical Specifications Unless otherwise noted, VIN = VOUT + 0.4V, VOUT = 1.8V, CIN = COUT = 10µF, TJ = +25°C. Applications must follow thermal guidelines of the package to determine worst case junction temperature. Please refer to Applications section of the datasheet and Tech Brief TB379. Boldface limits apply over the operating temperature range, -40°C to +125°C. (Continued) TEST CONDITIONS MIN MAX (Note 11) TYP (Note 11) UNITS PARAMETER SYMBOL Thermal Shutdown Hysteresis (Rising Threshold) TSDn 2.2V < VIN < 6V 30 °C PSRR f = 1kHz, ILOAD = 1A; VIN = 2.2V 58 dB AC CHARACTERISTICS Input Supply Ripple Rejection f = 120Hz, ILOAD = 1A; VIN = 2.2V ILOAD = 10mA, BW = 300Hz < f < 300kHz Output Noise Voltage 72 dB 100 µVRMS ENABLE PIN CHARACTERISTICS Turn-on Threshold 2.2V < VIN < 6V 0.3 0.8 1 V Hysteresis (Rising Threshold) 2.2V < VOUT + 0.4V < 6V 10 80 200 mV Enable Pin Turn-on Delay COUT = 10µF, ILOAD = 1A Enable Pin Leakage Current VIN = 6V, EN = 3V 100 µs 1 µA ADJUSTABLE INRUSH CURRENT LIMIT CHARACTERISTICS Current limit adjust IPD VIN = 3.5V, EN = 0V, SS = 1V ICHG 0.5 1 1.3 mA -3.3 -2 -0.8 µA 75 85 92 %VOUT PG PIN CHARACTERISTICS VOUT PG Flag Threshold VOUT PG Flag Hysteresis 4 PG Flag Low Voltage VIN = 2.5V, ISINK = 500µA PG Flag Leakage Current VIN = 6V, PG = 6V % 100 mV 1 µA NOTES: 11. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization and are not production tested. 12. Dropout is defined by the difference in supply VIN and VOUT when the supply produces a 2% drop in VOUT from its nominal value. 4 FN6931.0 December 21, 2009 ISL80101 Typical Application Diagrams 9 2.5V ± 10% 10µF 10 V OUT VIN V OUT VIN SENSE/ADJ 1 2 3 1.8V ± 1.8% 10µF 100k 10k ISL80101 7 6 ENABLE PG 4 SS (*NOTE 13) GND 5 FIXED FIGURE 1. FIXED TYPICAL APPLICATION DIAGRAM 9 2.5V ± 10% 10µF 10 VIN VOUT VIN ISL80101 VOUT 1 2 1.8V ± 1.8% 10µF 2.6k 10k 100k SE NSE/ADJ 1k 7 6 (*NOTE 13) ENABLE PG 4 SS GND 5 ADJUSTABLE FIGURE 2. ADJUSTABLE TYPICAL APPLICATION DIAGRAM NOTE: 13. Used when large bulk capacitance required on VOUT for application. 5 FN6931.0 December 21, 2009 ISL80101 ISL80101 Schematic Block Diagram VIN SS THERMAL SHUTDOWN SS REFERENCE BIAS OCL - POWER PMOS + VOUT SENSE ENABLE LEVEL SHIFT ADJ PGOOD + GND Application Section Input Voltage Requirements Despite other output voltages offered, this family of LDOs is optimized for a true 2.5V to 1.8V conversion where the input supply can have a tolerance of as much as ±10% for conditions noted in the “Electrical Specifications” table on page 3. Minimum guaranteed input voltage is 2.2V. However, due to the nature of an LDO, VIN must be some margin higher than the output voltage plus dropout at the maximum rated current of the application if active filtering (PSRR) is expected from VIN to VOUT. The Dropout spec of this family of LDOs has been generously specified in order to allow applications to design for a level of efficiency that can accommodate the smaller outline package for those applications that cannot accommodate the profile of the TO220/263. External Capacitor Requirements GENERAL GUIDELINE External capacitors are required for proper operation. Careful attention must be paid to layout guidelines and selection of capacitor type and value to ensure optimal performance. OUTPUT CAPACITOR The required minimum output capacitor is 10µF X5R/X7R to ensure stable operation. Additional capacitors of any value in Ceramic, POSCAP or Alum/Tantalum Electrolytic types may be placed in parallel to improve PSRR at higher frequencies and/or load transient AC output voltage tolerances. This minimum capacitor must be connected to VOUT and Ground pins of the LDO with PCB traces no longer than 0.5cm. 6 INPUT CAPACITOR The minimum input capacitor required for proper operation is 10µF having a ceramic dielectric. This minimum capacitor must be connected to VOUT and Ground pins of the LDO with PCB traces no longer than 0.5cm. Thermal Fault Protection In the event the die temperature exceeds typically +160°C, then the output of the LDO will shut down until the die temperature can cool down to typically +130°C. The level of power combined with the thermal resistance of the package (+45°C/W for DFN) will determine if the junction temperature exceeds the thermal shutdown temperature specified in the “Electrical Specifications” table on page 3 (see thermal packaging guidelines). Current Limit Protection The ISL80101 LDO incorporates protection against overcurrent due to any short or overload condition applied to the output pin. The current limit circuit performs as a constant current source when the output current exceeds the current limit threshold noted in the “Electrical Specifications” table on page 3. If the short or overload condition is removed from VOUT, then the output returns to normal voltage mode regulation. In the event of an overload condition on the DFN package the LDO will begin to cycle on and off due to the die temperature exceeding thermal fault condition. The TO220/263 package will tolerate higher levels of power dissipation on the die which may never thermal cycle if the heatsink of this larger package can keep the die temperature below the specified typical thermal shutdown temperature. FN6931.0 December 21, 2009 ISL80101 Functional Description Enable Operation The Enable turn-on threshold is typically 0.8V with a hysteresis of 80mV. The Enable pin doesn't have an internal pull-up or pull-down resistor. As a result, this pin must not be left floating. This pin must be tied to VIN if it is not used. A pull-up resistor (typically 1kΩ to 10kΩ) will be required for applications that use open collector or open drain outputs to control the Enable pin. The Enable pin may be connected directly to VIN for applications that are always on. Soft-Start Operation The soft-start circuit controls the rate at which the output voltage comes up to regulation at power-up or coming out of a chip disable. A constant current charges an external soft-start capacitor. The external capacitor always gets discharged to 0V at start-up of after coming out of a chip disable. The discharge rate is the RC time constant of an internal resistance and CSS. The soft-start function effectively limits the amount of in-rush current below the programmed current limit during start-up or an enable sequence to avoid an overcurrent fault condition. This can be an issue for applications that require large, external bulk capacitances on VOUT where high levels of charging current can be seen for a significant period of time. High in-rush currents can cause VIN to drop below minimum which could cause VOUT to shutdown. Equation 3 can be used to calculate CSS for a desired in-rush current. Where VOUT is the output voltage, COUT is the total capacitance on the output and IINRUSH is the desired in-rush current. ( V OUT xC OUT x2μA ) ) C SS = ----------------------------------------------------------I INRUSH x0.5V (EQ. 1) The following scope in Figure 3 captures the response for the soft-start function.The output voltage is set to 1.8V. FIGURE 4. IN-RUSH CURRENT WITH CSS = 15nF, COUT = 1000µF, IN-RUSH CURRENT = 0.5A FIGURE 5. IN-RUSH CURRENT WITH CSS = 33nF, COUT = 1000µF, IN-RUSH CURRENT = 0.2A The rise time of the regulator output voltage for a given CSS value can be calculated using Equation 2. Also C SS x0.5V t RAMP = ---------------------------2μA (EQ. 2) Power-Good Operation The PGOOD circuit monitors VOUT and signals a fault condition when VOUT is below 85% of the nominal output voltage. The PGOOD flag is an open-drain NMOS that can sink 10mA during a fault condition. The PGOOD pin requires an external pull up resistor which is typically connected to the VOUT pin. The PGOOD pin should not be pulled up to a voltage source greater than VIN. During a fault condition, the PGOOD output is pulled low. The PGOOD fault can be caused by the current limit fault or low input voltage. The PGOOD does not function during thermal shutdown and when the part is disabled. FIGURE 3. IN-RUSH CURRENT WITH NO CSS, COUT = 1000µF, IN-RUSH CURRENT = 1.8A 7 FN6931.0 December 21, 2009 ISL80101 Output Voltage Selection An external resistor divider is used to scale the output voltage relative to the internal reference voltage. This voltage is then fed back to the error amplifier. The output voltage can be programmed to any level between 0.8V and 5V. An external resistor divider, R1 and R2, is used to set the output voltage as shown in Equation 3. The recommended value for R2 is 500Ω to 1kΩ. R1 is then chosen according to Equation 4: ⎛ R1 ⎞ V OUT = 0.5V × ⎜ ------- + 1⎟ R ⎝ 2 ⎠ (EQ. 3) V OUT R 1 = R 2 × ⎛ ---------------- – 1⎞ ⎝ 0.5V ⎠ (EQ. 4) Power Dissipation The junction temperature must not exceed the range specified in the Recommended Operating Conditions. The power dissipation can be calculated by using Equation 5: To calculate the maximum ambient operating temperature, use the junction-to-ambient thermal resistance (θJA) for the DFN package with Equation 5: P D ( MAX ) = ( T J ( MAX ) – T A ) ⁄ θ JA (EQ. 7) Substitute PD for PD(MAX) and the maximum ambient operating temperature can be found by solving for TA using Equation 8: T A = T JMAX – P D ( MAX ) × θ JA (EQ. 8) Heatsinking The DFN Package The DFN package uses the copper area on the PCB as a heat-sink. The EPAD of this package must be soldered to the copper plane (GND plane) for heat sinking. Figure 6 shows a curve for the θJA of the DFN package for different copper area sizes. 46 (EQ. 5) The maximum allowed junction temperature, TJ(MAX) and the maximum expected ambient temperature, TA(MAX) will determine the maximum allowed junction temperature rise (ΔTJ) as shown in Equation 6: (EQ. 6) ΔT J = T J ( MAX ) – T A ( MAX ) 8 44 θJA, C/W P D = ( V IN – V OUT ) × I OUT + V IN × I GND 42 40 38 36 34 2 4 6 8 10 12 14 16 18 20 22 2 EPAD-MOUNT COPPER LAND AREA ON PCB, mm 24 FIGURE 6. 3mmx3mm-10 PIN DFN ON 4-LAYER PCB WITH THERMAL VIAS θJA vs EPAD-MOUNT COPPER LAND AREA ON PCB FN6931.0 December 21, 2009 ISL80101 Typical Operating Performance Unless otherwise noted: VIN = 2.2V, VOUT = 1.8V, CIN = COUT = 10µF, TJ = +25°C, IL = 0A. 2.0 1.8 1.8 OUTPUT VOLTAGE (V) ΔVOUT (%) 1.2 0.6 0 -0.6 -1.2 1.6 1.4 1.2 +125°C 1.0 0.8 -40°C +25°C 0.6 0.4 0.2 -1.8 -50 -25 0 25 50 75 100 125 0 150 0 1 3 2 4 SUPPLY VOLTAGE (V) JUNCTION TEMPERATURE (°C) FIGURE 7. OUTPUT VOLTAGE vs TEMPERATURE 5 0.6 GROUND CURRENT (mA) DVOUT (%) 1.2 +25°C 0 -0.6 -40°C +125°C -1.2 0 0.25 0.50 0.75 4 3 2 1 0 1.00 2 FIGURE 9. OUTPUT VOLTAGE vs OUTPUT CURRENT 6 5.0 4.5 GROUND CURRENT (µA) +125°C 3.00 2.75 -40°C +25°C 2.50 2.25 2.00 1.75 1.50 0 5 FIGURE 10. GROUND CURRENT vs SUPPLY VOLTAGE 3.50 3.25 4 3 INPUT VOLTAGE (V) OUTPUT CURRENT (mA) GROUND CURRENT (mA) 6 FIGURE 8. OUTPUT VOLTAGE vs SUPPLY VOLTAGE 1.8 -1.8 5 4.0 3.5 3.0 VIN = 6V 2.5 2.0 1.5 1.0 0.5 0.25 0.50 0.75 1.00 OUTPUT CURRENT (A) FIGURE 11. GROUND CURRENT vs OUTPUT CURRENT 9 0 -40 -25 -10 5 20 35 50 65 80 TEMPERATURE (°C) 95 110 125 FIGURE 12. SHUTDOWN CURRENT vs TEMPERATURE FN6931.0 December 21, 2009 ISL80101 Typical Operating Performance 200 190 180 170 160 150 140 130 120 110 100 90 80 70 60 50 40 30 20 10 0 -40 -25 -10 DROPOUT VOLTAGE (mV) DROPOUT VOLTAGE (mV) Unless otherwise noted: VIN = 2.2V, VOUT = 1.8V, CIN = COUT = 10µF, TJ = +25°C, IL = 0A. (Continued) VOUT = 2.5 5 20 35 50 65 80 95 110 125 TEMPERATURE (°C) 200 190 180 170 160 150 140 130 120 110 100 90 80 70 60 50 40 30 20 10 0 0 VOUT = 2.5 0.2 0.4 0.6 0.8 1.0 OUTPUT CURRENT (A) FIGURE 13. DROPOUT VOLTAGE vs TEMPERATURE FIGURE 14. DROPOUT VOLTAGE vs OUTPUT CURRENT 0.90 0.85 0.80 VOLTAGE (V) 0.75 0.70 0.65 0.60 0.55 0.50 0.45 0.40 0.35 0.30 -40 -25 -10 5 20 35 50 65 80 95 110 125 JUNCTION TEMPERATURE (°C) FIGURE 15. ENABLE THRESHOLD VOLTAGE vs TEMPERATURE FIGURE 17. POWER-DOWN (VIN = 2.2V) 10 FIGURE 16. POWER-UP (VIN = 2.2V) FIGURE 18. ENABLE START-UP FN6931.0 December 21, 2009 ISL80101 Typical Operating Performance Unless otherwise noted: VIN = 2.2V, VOUT = 1.8V, CIN = COUT = 10µF, TJ = +25°C, IL = 0A. (Continued) 300 START-UP TIME (µs) 250 200 150 100 50 0 2.0 3.0 3.5 4.0 4.5 5.0 INPUT VOLTAGE (V) 5.5 6.0 FIGURE 20. START-UP TIME vs SUPPLY VOLTAGE 300 3.5 250 2.5 CURRENT (A) START-UP (µs) FIGURE 19. ENABLE SHUTDOWN 2.5 200 150 100 2.0 6V 2.2V 1.5 1.0 0.5 50 0 -40 -25 -10 5 20 35 50 65 80 95 110 125 JUNCTION TEMPERATURE (°C) 0 -40 -25 -10 5 20 35 50 65 80 95 110 125 JUNCTION TEMPERATURE (°C) FIGURE 21. START-UP TIME vs TEMPERATURE FIGURE 22. CURRENT LIMIT vs TEMPERATURE 3.0 CURRENT LIMIT (A) 2.5 2.0 1.5 1.0 0.5 0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 INPUT VOLTAGE (V) 5.5 6.0 FIGURE 23. CURRENT LIMIT vs SUPPLY VOLTAGE 11 FIGURE 24. CURRENT LIMIT RESPONSE FN6931.0 December 21, 2009 ISL80101 Typical Operating Performance Unless otherwise noted: VIN = 2.2V, VOUT = 1.8V, CIN = COUT = 10µF, TJ = +25°C, IL = 0A. (Continued) FIGURE 25. LOAD TRANSIENT 0A TO 1A, COUT = 10µF CERAMIC FIGURE 26. LOAD TRANSIENT 0A TO 1A, COUT = 100µF CERAMIC FIGURE 27. LOAD TRANSIENT 10mA TO 1A, COUT = 10µF CERAMIC FIGURE 28. LOAD TRANSIENT 10mA TO 1A, COUT = 100µF CERAMIC 90 80 70 dB 60 2.2V 50 2V 40 2.5V 30 20 10 0 FIGURE 29. ILINE TRANSIENT 12 IOUT = 1A 10 100 1k 10k FREQUENCY (Hz) 100k 1M FIGURE 30. PSRR vs VIN FN6931.0 December 21, 2009 ISL80101 Typical Operating Performance Unless otherwise noted: VIN = 2.2V, VOUT = 1.8V, CIN = COUT = 10µF, TJ = +25°C, IL = 0A. (Continued) 90 90 80 80 70 70 60 100µF 50 dB 47µF 40 50 40 30 30 20 20 10µF 10 0 10 100 1k 10k 100k 100mA 10 IOUT = 1A 1M 0 10 100 1k 10k 100k 1M FREQUENCY (Hz) FREQUENCY (Hz) FIGURE 32. PSRR vs LOAD FIGURE 31. PSRR vs COUT 10 1 NOISE µV/⎟Hz dB 60 1A 0.1 0.01 ILOAD 0.001 10 100 1k 10k 100k FREQUENCY (Hz) 1M 10M FIGURE 33. SPECTRAL NOISE DENSITY vs FREQUENCY 13 FN6931.0 December 21, 2009 ISL80101 Revision History The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to web to make sure you have the latest Rev. DATE REVISION 12/21/09 FN6931.0 CHANGE Initial Release to web Products Intersil Corporation is a leader in the design and manufacture of high-performance analog semiconductors. The Company's products address some of the industry's fastest growing markets, such as, flat panel displays, cell phones, handheld products, and notebooks. Intersil's product families address power management and analog signal processing functions. Go to www.intersil.com/products for a complete list of Intersil product families. *For a complete listing of Applications, Related Documentation and Related Parts, please see the respective device information page on intersil.com: ISL80101 To report errors or suggestions for this datasheet, please go to www.intersil.com/askourstaff FITs are available from our website at http://rel.intersil.com/reports/search.php For additional products, see www.intersil.com/product_tree Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted in the quality certifications found at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 14 FN6931.0 December 21, 2009 ISL80101 Package Outline Drawing L10.3x3 10 LEAD DUAL FLAT PACKAGE (DFN) Rev 6, 09/09 3.00 6 PIN #1 INDEX AREA A B 1 6 PIN 1 INDEX AREA (4X) 3.00 2.00 8x 0.50 2 10 x 0.23 4 0.10 1.60 TOP VIEW 10x 0.35 BOTTOM VIEW 4 (4X) 0.10 M C A B 0.415 PACKAGE OUTLINE 0.200 0.23 0.35 (10 x 0.55) SEE DETAIL "X" (10x 0.23) 1.00 MAX 0.10 C BASE PLANE 2.00 0.20 C SEATING PLANE 0.08 C SIDE VIEW (8x 0.50) C 0.20 REF 5 1.60 0.05 TYPICAL RECOMMENDED LAND PATTERN DETAIL "X" NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal ± 0.05 4. Lead width applies to the metallized terminal and is measured between 0.18mm and 0.30mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature. 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 indentifier may be either a mold or mark feature. 15 FN6931.0 December 21, 2009