Reference Design Gate driver for M40x-M80x Power Modules GD-M40x-80x for NPC Modules Reference Design no.: RD_2014-12_001-v02 Table of Contents 1 In tr o d uc t i o n ........................................................................................... 3 2 Fe at ur es of Dr i v er B o a r d ......................................................................... 8 2. 1 Ma i n Fe a tur es ........................................................................................ 8 2. 2 E lec tr ic al P ar am et er s .............................................................................. 9 2. 3 Ch a nn e l As s i gnm e nt ............................................................................. 10 2. 4 P in as s i g nm ents an d c on n ec t ors f or o per a ti o n ........................................ 11 2. 5 Mec h an ic a l D im ens io n s ......................................................................... 12 3 Des c r i pt i o n of El ec tr ic a l P arts ............................................................... 13 3. 1 P o wer M o du l e ...................................................................................... 13 3. 2 Re q ui r e d p o w er s u p pl i es ....................................................................... 13 3. 3 In p ut / o ut p ut s ig n als ............................................................................ 13 3. 4 T em per at ur e M eas ur e m ent ou t pu t .......................................................... 13 3. 5 PC B – P o wer S u pp l y ............................................................................. 14 3. 6 PC B – CT R In p ut a n d O u t pu t ................................................................ 16 3. 7 PC B – T em per at ur e .............................................................................. 18 3. 8 PC B – B oos te r ..................................................................................... 19 3. 8. 1 Ac t i v e v o lt a g e c l am p ............................................................................. 21 4 Sc hem at ic s .......................................................................................... 22 5 S hor t C ir c u i t Pr o t ec t io n ......................................................................... 25 6 BO M .................................................................................................... 30 6. 1 BO M C on tr o l Mo d ul e ............................................................................. 30 6. 2 BO M T h er m al Mo d ul e ............................................................................ 31 6. 3 BO M P o wer Su p p l y M od u l e ................................................................... 31 6. 4 BO M C ur r e n t B oos t er Mo d u le ................................................................ 32 Disclaimer: The information in this document is given as an indication for the purpose of implementation only and shall not be regarded as any description or warranty of a certain functionality, condition or quality. The statements contained herein, including any recommendation, suggestion or methodology, are to be verified by the user before implementation, as operating conditions and environmental factors may vary. It shall be the sole responsibility of the recipient of this document to verify any function described herein in the given practical application. Vincotech GmbH hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement of intellectual property rights of any third party) with respect to any and all information given in this document. Revision history: Date Dec 2014 Revision Level 1 GD-M40x-80x for NPC Modules Description First release Page number(s) 31 Page 3 of 32 1 Introduction This application note describes the Evaluation Driver Kit for the module family M40x-M80x or in other words the flowNPC 4w , 2xflowNPC 4w and 3xflowNPC 4w 2400V Standard NPC generation. The topology used in these modules is the Neutral Point Clamped which has 1200 V components in outerinner switch positions. Asymmetrical inductance for low turn off inductance utilized parasitic inductance for reduced turn on losses > no low inductive bus bars. The board provides a plug and play solution identifying the switching behavior and efficiency of this module family. The M40X module family is available as a single phase 400A/2400V or three phase 3X400A/2400V topology; in order to drive both requires one or three GD-M400-MASTER-s. The M80X module family is a single phase 800A/2400V topology, in order to drive it requires: GD-M400-MASTER + GD-M400SLAVE connected in MASTER-SLAVE configuration. This is the first module that carries a high power PCB with asymmetrical inductance. Asymmetrical inductance reduces switching losses by 10% to 30%, depending on the parasitic inductance, while extending the safe operating range at turn-off (RBSOA). Detailed information is available in Vincotech’s webpage www.vincotech.com. The following picture shows the MASTER configuration. This kit can be used to drive the complete range of M40X modules. 1. current boost PCB 2. controller PCBs for input and output signals 3. power supply PCB 4.Temperature PCB for thermistor signal conditioning GD-M40x-80x for NPC Modules Page 4 of 32 4 2 . 3 1 Figure 1: Evaluation driver board in MASTER configuration GD-M40x-80x for NPC Modules Page 5 of 32 Ordering numbers for M40X (one module – one MASTER gate driver) Ordering numbers for M80X (one module – one MASTER+one SLAVE+one CONNECTION CABLE kit) Module M40X M80X Table 1: Ordering numbers GATE DRIVER Connection cables GD-M400-MASTER GD-M800-MS included N.A. The following picture shows the SLAVE configuration. This kit can be used only in MASTER-SLAVE configuration to drive the M80X 1. current boost PCB 3. power supply PCB 4.PCB for thermistor signal conditioning 4 3 1 Figure 2: Evaluation driver board in SLAVE configuration GD-M40x-80x for NPC Modules Page 6 of 32 The MASTER-SLAVE configuration is shown on figure 3 The MASTER-SLAVE configuration is intended to drive the M80X 1. GD-M400-MASTER 2. GD-M400-SLAVE 3. GD-M800-MS-CONN 1 2 . 3 Figure 3: Evaluation driver board in MASTER-SLAVE configuration GD-M40x-80x for NPC Modules Page 7 of 32 2 Features of Driver Board The next chapter describes the main features, basic electrical parameters as well as pin assignments and mechanical dimensions. 2.1 Main Features Four drivers for each switch Single 15 V power supply input with 3000VAC isolation Gate voltage of -8 V / +16 V Voltage for each switch is generated by a DC/DC converter Non-inverting PWM inputs Optical Fiber Input and Output signals Desaturation protection Two level turn-off with 10 V intermediate level Active miller clamp Under voltage lockout Fault output signal (active high) for each switch Isolated PWM coded heatsink temperature sense with thermistor on each 400A unit Gate drive current of ±20 A peak Active voltage clamp PCB designed to fulfill the requirements of IEC61800-5-1, pollution degree 2, over voltage category III GD-M40x-80x for NPC Modules Page 8 of 32 2.2 Electrical Parameters The electrical characteristics involve the guaranteed value spread for the supply voltage, load and processes. Unless otherwise noted all voltages are given with respect to ground (GND). Positive currents are assumed to be flowing into pins. min. typ. max. Unit Remarks UCE – max for IGBT/FWD 1200 V Pmax – max output power supply 2 W See note 1 US – supply voltage for drivers 14,5 15 15,5 V For 1 dc/dc converter IS – Input current no load / full load 30/250 mA 14,5V<Vin(DC/DC)<15,5V Gate drive supply voltage positive 16,5 17 18 V 14,5V<Vin(DC/DC)<15,5V Gate drive supply voltage negative -7 -8,7 -10 V UVLO top threshold Under voltage lockout 14 14,5 15 V UVLO bottom threshold Under voltage lockout 13 14 14,5 V Desaturation protection 7 V See note 2 fsw – switching frequency 8 16 kHz Ta – Ambient temperature -25 70 °C TST – Storage temperature -40 85 °C Peak Wavelength of fiber optics R/T 660 nm Photosensitivity Spectral Range 600 780 nm (S = 80% Smax) 1 minutes See note 3 Gate drive supply isolation voltage 3000 VAC For additional information refer to the datasheet of TD350 from ST Note 1: The secondary voltage for the gate drive will change with the same ratio. Note 2: Limitation by IGBT losses Note 3: For conformance with IEC 62109-1 the input supply of the DC-DC converter (15V) should be connected to the inverter neutral potential Table 2: Electric parameters The following table shows different modules available in the M40x-M80x series. Here information about the maximum/recommended switching frequency and the assembled passive components are mentioned. Module M400F M800F Nominal chip current [A] 400 800 1 Maximum frequency [kHz] 43 43 Recommended frequency [kHz] 20 20 Gate resistors RG_ext on [Ω] 1,25 1,25 Gate resistors RG_ext off [Ω] 1,25 1,25 Gate resistors RG_int [Ω] buck IGBT 0,5 0,5 Gate resistors RG_int [Ω] boost IGBT 1,875 1,875 Gate emitter resistor RGE [Ω] 15K 15K 2 Gate emitter capacitor CGE [µF] n.a. n.a. 1 : Limit given by the output power of power supply 2 : not assembled Table 3: Members of M40x-80X family GD-M40x-80x for NPC Modules Page 9 of 32 2.3 Channel Assignment The evaluation driver kit consists of four channels for the IGBTs and an additional channel for the temperature (NTC). HB H HB H NP H NP H NP L NP L HB L HB L NTC fault output U2 HB H HB L PWM input U1 NP H NP L Figure 4: Assignment for channels GD-M40x-80x for NPC Modules Page 10 of 32 Pin assignments and connectors for operation The driver board has connectors to provide the power to the PCB and to support signals to e.g. the driver circuit. 1 2 P17 – Power Supply +15 V GND -for each channel U1 – Input PWM signal -SFH551/1-1V digital receiver for optical data transmission with polymer optical fiber 2.2mm polymer 650nm -for each channel U2 – Fault Output signal -SFH756V transmitter for optical data transmission with polymer optical fiber 2,2 mm 650nm -one per gate driver U5 – Output temperature -SFH756V transmitter for optical data transmission with polymer optical fiber 2,2 mm 650nm Table 4: Pin assignment for connectors GD-M40x-80x for NPC Modules Page 11 of 32 2.4 Mechanical Dimensions Mechanical dimensions for width, length and height (without module): 97.9 mm x 98.1 mm x 46 mm Figure 5: PCB of boost stage GD-M40x-80x for NPC Modules Page 12 of 32 3 Description of Electrical Parts This chapter describes the different electrical parts like the input signals, output signals and driver circuit for a better understanding how the board works. 3.1 Power Module This power module family is suitable for PV applications and for UPS applications. M40xP(F) modules are available in single phase and in three phase configuration based on a neutral point clamped topology which is also known as NPC topology. Two 1200V fast IGBTs with freewheeling diodes are implemented for the outer switch (BUCK STAGE) and for the inner switch another two 1200V IGBTs with freewheeling diodes are placed (BOOST STAGE). The IGBTs and the freewheeling diodes have the same current rating. Two diodes Dtran+, Dtran- will implement the regeneration of the energy stored in the parasitic inductance, and the asymmetrical inductance at work. For temperature measurement a NTC is equipped. Note that this NTC has only a functional isolation. 3.2 Required power supplies To ensure a correct operation of the evaluation kit one single +15 V power supply for all gate drivers. The +15 V has to be supported through the connector P17. In parallel MASTER-SLAVE operation the +15V at P17 has to be supplied at MASTER and SLAVE as well. The PWM input, FAULT and temperature measurement output are implemented via optical fiber, no addition power supply is required for the CTR cards. 3.3 Input / output signals The switching of the IGBT inverter needs to be controlled by 4 channels for each phase. The dedicated input signals is the U1 (PWM IN) located on its own CTR card. Each switch has its own fault output activated by under voltage lockout or by desaturation supported through U2 (FAULT OUT) The output of the temperature is a PWM signal available on U5 TH card. 3.4 Temperature output The temperature output is generated with a voltage-controlled pulse width modulator. It is supported to the fiber optic connector U5.The attached diagram gives the duty cycle as a function of the NTC temperature which is build in the power module. GD-M40x-80x for NPC Modules Page 13 of 32 Duty Cycle & V mod vs. Temperature 1,10 1,05 1,00 0,95 0,90 0,85 0,80 0,75 0,70 0,65 0,60 0,55 0,50 0,45 0,40 0,35 0,30 0,25 0,20 0,15 0,10 0,05 0,00 80 70 60 50 40 30 20 10 0 25 30 35 40 45 50 55 60 65 Vmod 70 75 80 85 90 95 100 105 110 115 120 125 Measured Duty Cycle Figure 6: Duty cycle of temperature output 3.5 PCB – Power Supply The power supply board supports all four channels of the M40x evaluation kit. A 15 V power supply has to be used to support the 2-pin connector in the middle of the PCB (P17). Four independent DC/DC converters are used on this board to generate +16 V / -8 V for each IGBT. T4 NTC Figure 7: PCB of power supply GD-M40x-80x for NPC Modules Page 14 of 32 The asymmetric bipolar voltage for the IGBTs is generated by a DC/DC converter IG136-15 Figure 8: Bipolar voltage supply for e.g. T3 – neutral point low side The DC /DC converter (IG136-15) is a 2 W, 15V input, +17V/-8,7V output with 3000VACrms I/O isolation. Different connectors are used on the bottom side of the power supply PCB to supply the signals from the input, output and temperature PCB to the boost PCB. Additional connectors on the bottom side of the power supply PCB are used for Master-Slave operation. Male connectors for parallel operation Female connectors for current boost PCB Figure 9: Connector for boost PCB and parallel operation GD-M40x-80x for NPC Modules Page 15 of 32 The pin assignment for the bottom connectors is like the following: Connectors for boost PCB Connectors for parallel operation Pin Signal Comment Pin Signal Comment 1 desat np H Desaturation protection 1 desat np H Desaturation protection 2 +16V np 1-2 Positive supply voltage 2 +16V np 1-2 Positive supply voltage 3 out H np H Output for PWM signal 3 out H np H Output for PWM signal 4 V clamp npH In Active Voltage clamp 4 V clamp npH In Active Voltage clamp 5 -8V np 1-2 Negative supply voltage 5 -8V np 1-2 Negative supply voltage 6 clamp np H Clamp 6 clamp np H Clamp 7 npGND 1-2 Ground 7 npGND 1-2 Ground 8 nc/NTC* not connected/NTC 8 npGND 1-2 Ground 9 npGND 1-2 Ground 10 npGND 1-2 Ground * only for the HB L section Table 5: Pin assignment for connectors, e.g. T2 – neutral point high side 3.6 PCB – CTR Input and Output Four additional vertical mounted PCBs provide the PWM input signals for the IGBTs as well as fault signals coming from the IGBTs Receiver PWM in Transmitter Fault out Figure 10: CTR- PCB with TD350E GD-M40x-80x for NPC Modules Page 16 of 32 Figure 11: Schematic of CTR- PCB with TD350E For each channel the isolation is provides between the user side and the power side with optical fiber. The green LED indicates that a voltage is applied on the secondary side. In this case the supply voltage comes from the power supply PCB. The red LED starts lightning when a fault is detected A voltage regulator generates the 5 V secondary supply voltage for the receiver fiber out of the 16 V coming from the power supply PCB. The IGBT driver IC is the TD350E Features of the IGBT gate driver IC Active Miller clamp feature Two-level turn-off with adjustable level and delay Desaturation detection Fault status output Negative gate drive capability UVLO protection 2 kV ESD protection (HBM) Activ Miller clamp: During turn-off, the gate voltage is monitored and the clamp output is activated when gate voltage goes below 2 V (relative to GND). The clamp voltage is VL+3 V max. for a Miller current up to 500 mA. The clamp is disabled when the IN input is triggered again.The current capability of the clamp output is increased by an external PNP bipolar transistor placed on the current booster PCB ( bottom PCB). Two-level turn-off: The two-level turn-off is used to increase the reliability of the application. During turn-off, gate voltage can be reduced to a programmable level (set by D201 to a 10 V) in order to reduce the IGBT current (in the event of overcurrent). This action prevents both dangerous overvoltage across the IGBT and RBSOA problems, especially at short-circuit turn-off. The two-level turn-off (Ta) delay is programmable through an external resistor (R205) and capacitor (C208) for accurate timing use the following equation : Ta [μs] = 0.7 • R48 [kΩ] • C51 [nF] Ta is set to 1,5 μs Turn-off delay (Ta) is also used to delay the input signal to prevent distortion of input pulse width. Desaturation detection: When the desat voltage goes higher than 7 V, the output is driven low (with 2-level turn-off). The FAULT output is activated. The FAULT state is exited at the next falling edge of IN input. A programmable blanking time is used to allow enough time for IGBT saturation. The blanking time is made of an internal 250μA current source and an external capacitor (C39).The high voltage diode blocks the high voltage during IGBT off state (a standard 1kV ); the 1kΩ resistor filters parasitic spikes and also protects the DESAT input. GD-M40x-80x for NPC Modules Page 17 of 32 During operation, the DESAT capacitor is discharged when TD350 output is low (IGBT off). When the IGBT is turned on, the DESAT capacitor starts charging and desaturation protection is effective after the blanking time (tB) tB =7.2VC39 / 250μA When a desaturation event occurs, the fault output is pulled down and TD350 outputs are low (IGBT off) until the IN input signal is released (high level), then activated again (low level). C39=100pF In case of a short circuit the HB IGBT must be first turned off, in order to insure this sequence the desaturation capacitances for the NP IGBT-s are increased. Additional capacintances are placed on the power board (C45;C46) Fault status output: the dedicated output pin of the IC is used to signal a fault event (desaturation, UVLO) to a controller. The fault pin drives direct the U2 fiber transmitter via a red colored LED. When a fault event is detected the red LED will ligt up. Minimum ON time:In order to ensure the proper operation of the 2-level turn-off function, the input ON time(Twin) must be greater than the Twinmin value: Twinmin = Ta + 2 • Rdel • C51 = 1,5 +2*0,5*0,47=2μs Rdel is the internal discharge resistor of TD350E 0,5 kΩ (from the datasheet of TD350E) Input signals smaller than Ta are ignored. Input signals larger than T winmin are transmitted to the output stage after the Ta delay with minimum width distortion ( ΔTw = Twout - Twin). For an input signal width Twin between Ta and Twinmin, the output width Twout is reduced below Twin (pulse distortion) and the IGBT could be partially turned on. These input signals should be avoided during normal operation. For more details see : http://www.st.com/web/en/resource/technical/document/datasheet/DM00023850.pdf 3.7 PCB – Temperature One vertical mounted PCB measures the module temperature using the internal NTC and provides optical information about the module temperature. Transmitter Figure 12: TH-PCB with LTC6992-1 (Voltage-Controlled Pulse Width Modulator) GD-M40x-80x for NPC Modules Page 18 of 32 Figure 13: Schematic of the TH-PCB The duty cycle of the PWM signal generated by the LTC6992-1 is direct proportional to the measured temperature of the module. (Fig 6) An internal +5 V supply is required to power the LTC6992-1.The input of the +5 V is the +16 V hb L coming from the power supply PCB. PCB – Booster 3.8 The boost PCB provides the needed gate current to drive the IGBTs. Four independent driver channels are assembled. It is supplied by the power supply PCB with +16 V and -8 V. HB H HB H NP H NP H HB L NP L HB L 9 NP L 9 9 Figure 14: Current Booster PCB The pin assignment for the connectors is like the following: Connector: HB H ; HB L ; NP H ; NP L Pin Signal HB H Signal NP H Signal NP L Signal HB L 1 desat desat desat desat 2 +16 V +16 V +16 V +16 V 3 out high out high out high out high GD-M40x-80x for NPC Modules Comment Desaturation protection Positive supply Signal for turn on/off Page 19 of 32 4 V clamp V clamp V clamp 5 -8 V -8 V -8 V 6 clamp clamp clamp 7 GND GND GND 8 n.c. n.c. n.c. Table 6: Pin assignment for connectors V clamp -8 V clamp GND NTC Active voltage clamp Negative supply Miller clamping Ground not connected / NTC The PCB has two current boost stages that are connected in parallel to provide a high gate current when necessary. The module has two gate pins. Each for half of the nominal module current. A common gate resistor as well as separated gate resistors are used for the gates and the common emitter. The schematic to drive the IGBT is shown in the next figure as an example for HB L IGBT. The schematics for the other IGBT-s are the same. GD-M40x-80x for NPC Modules Page 20 of 32 3.8.1 Active voltage clamp The rated blocking voltage of the semiconductor switch may never be exceeded. This requirment must be fulfiled under all working conditions including of course turn-off transients from over-current or short –circuit conditions. Due to the unavoidable stray inductances in the layout of the power stage and high values of the current change dI/dt the over voltages in the range of few hundreds volts can be produced. In extrem cases these voltage spikes can take the values higher than the maximal permissible level of the collector-emitter voltage VCE(max) . The zener diodes D23,D18 between colector and gate causes the gate to become turned on when the collector voltage reaches 1200 V Figure15: Boost stage of HB L GD-M40x-80x for NPC Modules Page 21 of 32 4 Schematics Figure16: Boost stage schematic GD-M40x-80x for NPC Modules Page 22 of 32 Figure17: Power stage schematic GD-M40x-80x for NPC Modules Page 23 of 32 Figure18:Temperature card schematic GD-M40x-80x for NPC Modules Page 24 of 32 Figure19:Control card schematic Short Circuit Protection The short circuit protection has been tested by using critical inductance for the short (Sc). Critical inductance means that the inductance is so small that dI/dt is high enough not to be able to be detected by the current sensing of the inverter. On the other hand the inductance is so big that the IGBT can temporary saturate due to the high dI/dt and so the IGBT has to withstand du/dt after the short circuit protection is activated by the desaturation sensing. The interpretation of the curves is the following. At „0“ time the T2 IGBT is getting a positive gate voltage and it saturates. The emitter voltage, „magenta“ rises to the collector voltage, „green“. The current, „blue“ on the short circuit impedance starts to increase rapidly. Current range is 1000A / DIV. At about 4000A collector current the IGBT desaturation sensing is activated and the soft turn off is initiated, At „1“ time the gate drive circuit switches to the first turn off level of 10Vs. At time „2“ the IGBT desaturates in a soft manner due to the reduced gate drive voltage and the gate drive settles to 10V. As the IGBT is not turned off, there is no dangerous du/dt to cause RBSOA infringement and the overvoltage spike on the IGBT is also small. The short circuit current at a value of about 5000A partly commutes into the freewheeling diode (inverse diode of T4). The IGBT is conducting a current limited by its transfer current characteristics at 10V gate voltage. At time „3“ the IGBT gate voltage is totally switched off to -8V and the IGBT releases the rest of current. As the majority of the short circuit current is already flowing through the freewheeling diode and as there is no voltage change on the IGBT (du/dt) at this moment there will be no dangerous voltage overshoot and turn off safe operating area for the IGBT will be fulfilled. GD-M40x-80x for NPC Modules Page 25 of 32 Figure 13: Schematic and waveforms of T2 NP high IGBT short circuit measurement The short circuit protection is checked for all 4 IGBTs. GD-M40x-80x for NPC Modules Page 26 of 32 Figure 14: Schematic and waveforms of T3 NP low IGBT short circuit measurement GD-M40x-80x for NPC Modules Page 27 of 32 Ucc T1 15V Uce Sc 700V D2 D3 T2 T3 15V 15V Uge V 1mH T4 Scope GND V Ic 0.000003 0.00001 Q Q Q Q Q Q 0.000003 Figure 15: Schematic and waveforms of T4 HB low IGBT short circuit measurement GD-M40x-80x for NPC Modules Page 28 of 32 Figure 16: Schematic and waveforms of T1 HB high IGBT short circuit measurement GD-M40x-80x for NPC Modules Page 29 of 32 5 BOM 5.1 BOM Control Module Part Number Description 312060 CGD-M400-PCB_CTR(Rev02); SAMPLE 300737 C-1uF-25V-10%-X7R-0805-PM 303142 C-10uF-25V-10%-X7R-1206-PM C-47pF-100V-NPO-0805-PM; SAMPLE Material group Quantity Un Layout position PCB Capacitors below 500V Capacitors below 500V Capacitors below 500V Capacitors below 500V Capacitors below 500V Capacitors below 500V 1 PC PCB 4 PC C5; C34; C77; C78 2 PC C6; C17 1 PC C22 2 PC C33; C52 1 PC C39 1 PC C51 LEDs 1 PC D13 Diode zener 1 PC D14 311008 DI-BZX84C10-SOT23 CONNECTOR-8PIN-1.27mmMT-PM; SAMPLE Connectors 2 PC P1, P2 300748 R-470R-1%-TK100-0805-CM(I) Resistors 1 PC R39 300749 R-1K-1%-TK100-0805-CM(I) Resistors 1 PC R41 303237 R-4K7-1%-0805-PM Resistors 1 PC R48 300818 R-4R7-1%-TK100-0805-CM(I) Resistors 1 PC R44 311031 Resistors 2 PC R46, R47 Resistors 1 PC R42 Resistors 1 PC R49 311323 R-10R-1%-TK100-0805;Sample R-15K-1%-TK100-0805-PM; SAMPLE 300758 R-10K-1%-TK100-0805CM(I) R-100R-1%-TK100-0805; Sample Resistors 1 PC R50 310408 MC78L05ACDR2G; Sample IC 1 PC REF1 311004 SFH551/1-1V-PM; SAMPLE IC 1 PC U1 311005 SFH756V-PM; SAMPLE IC 1 PC U2 311006 IC-TD350ID-SO14-PM;Sample IC 1 PC U4 310998 310840 311040 300774 310999 303928 310982 300758 C-22uF-25V-10%-X7R-1210-PM C-100pF-50V-10%-X7R-0805PM; SAMPLE C-470pF-50V-5%-COG-0805CM(I) LED-HSMF-C155-(Red/Green)SMD-PM; SAMPLE GD-M40x-80x for NPC Modules Page 30 of 32 5.2 BOM Thermal Module Part Number Description 312057 CGD-M400-PCB_TH(Rev02); SAMPLE 303142 C-10uF-25V-10%-X7R-1206-PM 300737 C-1uF-25V-10%-X7R-0805-PM C-10nF-50V-10%-X7R-0805CM(I) CONNECTOR-8PIN-1.27mmMT-PM; SAMPLE R-8K2-0.1%-TK25-0805-PM; SAMPLE R-2K2-0.1%-TK25-0805-PM; SAMPLE Material group Quantity Un Layout position PCB Capacitors below 500V Capacitors below 500V Capacitors below 500V 1 PC PCB 2 PC C1, C2 1 PC C13 1 PC C14 Connector 1 PC P1 Resistors 1 PC R1 Resistors 1 PC R2 Resistors 1 PC R6 311029 R-470R-1%-TK100-0805-CM(I) R-499K-1%-TK100-0805 PM; SAMPLE Resistors 1 PC R7 310408 MC78L05ACDR2G; Sample IC 1 PC REF1 311005 SFH756V-PM; SAMPLE IC-LTC6992CS6-1-SOT363-6LPM; SAMPLE IC 1 PC U5 IC 1 PC U6 300780 311008 311043 311044 300748 311030 5.3 BOM Power Supply Module Part Number Description Material group 312202 CGD-M400-PCB_IN(REV03) PCB 1 PC 310998 C-47pF-100V-NPO-0805-PM Capacitor 2 PC 310840 C-22uF-25V-10%-X7R-1210-PM CONNECTOR-10PIN-1.27mmFTSH10-PM CONNECTOR-8PIN-1.27mmFLE8-PM IC-IGC13615W_DC/DC_CONVERTER CONNECTOR-2PIN-2.5mmHDR1X2-PM Capacitor 48 Connector 4 Connector 4 C45,C46 C0-C33,C35PC C44,C100,C111,C112,C133 HB_H_1,HB_L_1,NP_H_1,NP_ PC L_1 HB_H_2,HB_L_2,NP_H_2,NP_ PC L_2 IC 4 PC IG126_15-IG126_18 Connector 1 PC P17 311013 311010 311879 311014 GD-M40x-80x for NPC Modules Quantity Un Layout position Page 31 of 32 5.4 BOM Current Booster Module Part Number Description Material group Quantity Un Layout position 312203 CGD-M400-PCB_OUT(REV03) PCB 1 PC PCB 310840 C-22uF-25V-10%-X7R-1210-PM Capacitor 24 PC C1-C8,C13-C24,C29-C32 300737 Capacitor 4 PC C25,C34,C36,C37 Capacitor 4 PC C33,C35,C38,C39 Diode 4 PC D1,D2,D9,D10 Diode 8 PC D3-D6,D11-D14 Diode 4 PC D7,D8,D15,D16 Diode 8 PC D17,D18,D23,D24,D33-D36 Diode 12 PC D19-D22,D25-D32 Connector 4 PC HB_H,HB_L,NP_H,NP_L 312069 C-1uF-25V-10%-X7R-0805-PM C-100nF-50V-10%-X7R-0805CM(I) DI-EGF1T-E3/67A-DO214BAPM; SAMPLE DI-P6SMB18CA-18V-600WSMB; Sample DI-VS-10BQ100PBF-SMB-PM; SAMPLE DI-P6SMB480A-480V-600W-5%SMB; Sample BAS385 30V,200mA MICROMELF; Sample CONNECTOR-8PIN-1.27mmSMD-FTSH8; SAMPLE TR-ZXTP25040DFH-PNPSOT23; Sample Transistor 4 PC Q1-Q4 300749 R-1K-1%-TK100-0805-CM(I) Resistor 4 PC 312070 R-8R2-1%-TK100-0603; Sample R-R510-1%-TK100-1210-PM; SAMPLE R-15K-1%-TK100-0805-PM; SAMPLE Resistor 12 PC Resistor 20 PC R2,R23,R24,R47 R3,R4,R13-R16,R25,R26,R35R38 R5-R12,R21,R22,R27R34,R43,R44 Resistor 8 PC R17-R20,R39-R42 R-1R-1%-TK100-0805-CM R-10R-1%-TK100-0805-PM; SAMPLE TR-ZXGD3006E6-SOT23-6-PM; SAMPLE Resistor 4 PC R45,R48,R51,R52 Resistor 4 PC R1,R46,R49,R50 IC 8 PC T1-T8 300781 311039 312067 311038 312068 310866 311041 311033 310982 300672 311031 311036 GD-M40x-80x for NPC Modules Page 32 of 32