Evaluation board description for flow NPC power modules (M40x+M80)

Reference Design
Gate driver for M40x-M80x
Power Modules
GD-M40x-80x for NPC Modules
Reference Design no.:
RD_2014-12_001-v02
Table of Contents
1
In tr o d uc t i o n ........................................................................................... 3
2
Fe at ur es of Dr i v er B o a r d ......................................................................... 8
2. 1
Ma i n Fe a tur es ........................................................................................ 8
2. 2
E lec tr ic al P ar am et er s .............................................................................. 9
2. 3
Ch a nn e l As s i gnm e nt ............................................................................. 10
2. 4
P in as s i g nm ents an d c on n ec t ors f or o per a ti o n ........................................ 11
2. 5
Mec h an ic a l D im ens io n s ......................................................................... 12
3
Des c r i pt i o n of El ec tr ic a l P arts ............................................................... 13
3. 1
P o wer M o du l e ...................................................................................... 13
3. 2
Re q ui r e d p o w er s u p pl i es ....................................................................... 13
3. 3
In p ut / o ut p ut s ig n als ............................................................................ 13
3. 4
T em per at ur e M eas ur e m ent ou t pu t .......................................................... 13
3. 5
PC B – P o wer S u pp l y ............................................................................. 14
3. 6
PC B – CT R In p ut a n d O u t pu t ................................................................ 16
3. 7
PC B – T em per at ur e .............................................................................. 18
3. 8
PC B – B oos te r ..................................................................................... 19
3. 8. 1
Ac t i v e v o lt a g e c l am p ............................................................................. 21
4
Sc hem at ic s .......................................................................................... 22
5
S hor t C ir c u i t Pr o t ec t io n ......................................................................... 25
6
BO M .................................................................................................... 30
6. 1
BO M C on tr o l Mo d ul e ............................................................................. 30
6. 2
BO M T h er m al Mo d ul e ............................................................................ 31
6. 3
BO M P o wer Su p p l y M od u l e ................................................................... 31
6. 4
BO M C ur r e n t B oos t er Mo d u le ................................................................ 32
Disclaimer: The information in this document is given as an indication for the purpose of implementation only and
shall not be regarded as any description or warranty of a certain functionality, condition or quality. The statements
contained herein, including any recommendation, suggestion or methodology, are to be verified by the user
before implementation, as operating conditions and environmental factors may vary. It shall be the sole
responsibility of the recipient of this document to verify any function described herein in the given practical
application. Vincotech GmbH hereby disclaims any and all warranties and liabilities of any kind (including without
limitation warranties of non-infringement of intellectual property rights of any third party) with respect to any and
all information given in this document.
Revision history:
Date
Dec 2014
Revision
Level
1
GD-M40x-80x for NPC Modules
Description
First release
Page
number(s)
31
Page 3 of 32
1 Introduction
This application note describes the Evaluation Driver Kit for the module family M40x-M80x or in other
words the flowNPC 4w , 2xflowNPC 4w and 3xflowNPC 4w 2400V Standard NPC generation. The
topology used in these modules is the Neutral Point Clamped which has 1200 V components in outerinner switch positions. Asymmetrical inductance for low turn off inductance utilized parasitic
inductance for reduced turn on losses > no low inductive bus bars. The board provides a plug and play
solution identifying the switching behavior and efficiency of this module family.
The M40X module family is available as a single phase 400A/2400V or three phase 3X400A/2400V
topology; in order to drive both requires one or three GD-M400-MASTER-s. The M80X module family
is a single phase 800A/2400V topology, in order to drive it requires: GD-M400-MASTER + GD-M400SLAVE connected in MASTER-SLAVE configuration.
This is the first module that carries a high power PCB with asymmetrical inductance. Asymmetrical
inductance reduces switching losses by 10% to 30%, depending on the parasitic inductance, while
extending the safe operating range at turn-off (RBSOA). Detailed information is available in
Vincotech’s webpage www.vincotech.com.
The following picture shows the MASTER configuration. This kit can be used to drive the complete
range of M40X modules.

1. current boost PCB

2. controller PCBs for input and output signals

3. power supply PCB

4.Temperature PCB for thermistor signal conditioning
GD-M40x-80x for NPC Modules
Page 4 of 32
4
2
.
3
1
Figure 1: Evaluation driver board in MASTER configuration
GD-M40x-80x for NPC Modules
Page 5 of 32
Ordering numbers for M40X (one module – one MASTER gate driver)
Ordering numbers for M80X (one module – one MASTER+one SLAVE+one CONNECTION CABLE
kit)
Module
M40X
M80X
Table 1: Ordering numbers
GATE DRIVER
Connection cables
GD-M400-MASTER
GD-M800-MS
included
N.A.
The following picture shows the SLAVE configuration. This kit can be used only in MASTER-SLAVE
configuration to drive the M80X

1. current boost PCB

3. power supply PCB

4.PCB for thermistor signal conditioning
4
3
1
Figure 2: Evaluation driver board in SLAVE configuration
GD-M40x-80x for NPC Modules
Page 6 of 32
The MASTER-SLAVE configuration is shown on figure 3
The MASTER-SLAVE configuration is intended to drive the M80X

1. GD-M400-MASTER

2. GD-M400-SLAVE

3. GD-M800-MS-CONN
1
2
.
3
Figure 3: Evaluation driver board in MASTER-SLAVE configuration
GD-M40x-80x for NPC Modules
Page 7 of 32
2 Features of Driver Board
The next chapter describes the main features, basic electrical parameters as well as pin assignments
and mechanical dimensions.
2.1
Main Features

Four drivers for each switch

Single 15 V power supply input with 3000VAC isolation

Gate voltage of -8 V / +16 V

Voltage for each switch is generated by a DC/DC converter

Non-inverting PWM inputs

Optical Fiber Input and Output signals

Desaturation protection

Two level turn-off with 10 V intermediate level

Active miller clamp

Under voltage lockout

Fault output signal (active high) for each switch

Isolated PWM coded heatsink temperature sense with thermistor on each 400A unit

Gate drive current of ±20 A peak

Active voltage clamp

PCB designed to fulfill the requirements of IEC61800-5-1, pollution degree 2, over voltage
category III
GD-M40x-80x for NPC Modules
Page 8 of 32
2.2
Electrical Parameters
The electrical characteristics involve the guaranteed value spread for the supply voltage, load and
processes. Unless otherwise noted all voltages are given with respect to ground (GND).
Positive currents are assumed to be flowing into pins.
min.
typ.
max.
Unit
Remarks
UCE – max for IGBT/FWD
1200
V
Pmax – max output power supply
2
W
See note 1
US – supply voltage for drivers
14,5
15
15,5
V
For 1 dc/dc converter
IS – Input current no load / full load
30/250
mA
14,5V<Vin(DC/DC)<15,5V
Gate drive supply voltage positive
16,5
17
18
V
14,5V<Vin(DC/DC)<15,5V
Gate drive supply voltage negative
-7
-8,7
-10
V
UVLO top threshold
Under voltage lockout
14
14,5
15
V
UVLO bottom threshold
Under voltage lockout
13
14
14,5
V
Desaturation protection
7
V
See note 2
fsw – switching frequency
8
16
kHz
Ta – Ambient temperature
-25
70
°C
TST – Storage temperature
-40
85
°C
Peak Wavelength of fiber optics R/T
660
nm
Photosensitivity Spectral Range
600
780
nm
(S = 80% Smax)
1 minutes See note 3
Gate drive supply isolation voltage
3000
VAC
For additional information refer to the datasheet of TD350 from ST
Note 1: The secondary voltage for the gate drive will change with the same ratio.
Note 2: Limitation by IGBT losses
Note 3: For conformance with IEC 62109-1 the input supply of the DC-DC converter (15V) should be
connected to the inverter neutral potential
Table 2: Electric parameters
The following table shows different modules available in the M40x-M80x series. Here information
about the maximum/recommended switching frequency and the assembled passive components are
mentioned.
Module
M400F M800F
Nominal chip current [A]
400
800
1
Maximum frequency [kHz]
43
43
Recommended frequency [kHz]
20
20
Gate resistors RG_ext on [Ω]
1,25
1,25
Gate resistors RG_ext off [Ω]
1,25
1,25
Gate resistors RG_int [Ω] buck IGBT
0,5
0,5
Gate resistors RG_int [Ω] boost IGBT
1,875
1,875
Gate emitter resistor RGE [Ω]
15K
15K
2
Gate emitter capacitor CGE [µF]
n.a.
n.a.
1
: Limit given by the output power of power supply
2
: not assembled
Table 3: Members of M40x-80X family
GD-M40x-80x for NPC Modules
Page 9 of 32
2.3
Channel Assignment
The evaluation driver kit consists of four channels for the IGBTs and an additional channel for the
temperature (NTC).
HB H
HB H
NP H
NP H
NP L
NP L
HB L
HB L
NTC
fault output U2
HB H
HB L
PWM input U1
NP H
NP L
Figure 4: Assignment for channels
GD-M40x-80x for NPC Modules
Page 10 of 32
Pin assignments and connectors for operation
The driver board has connectors to provide the power to the PCB and to support signals to e.g. the
driver circuit.
1
2
P17 – Power Supply
+15 V
GND
-for each channel
U1 – Input PWM signal
-SFH551/1-1V digital receiver for optical data transmission
with polymer optical fiber 2.2mm polymer 650nm
-for each channel
U2 – Fault Output signal
-SFH756V transmitter for optical data transmission with polymer
optical fiber 2,2 mm 650nm
-one per gate driver
U5 – Output temperature
-SFH756V transmitter for optical data transmission with polymer
optical fiber 2,2 mm 650nm
Table 4: Pin assignment for connectors
GD-M40x-80x for NPC Modules
Page 11 of 32
2.4
Mechanical Dimensions
Mechanical dimensions for width, length and height (without module): 97.9 mm x 98.1 mm x 46 mm
Figure 5: PCB of boost stage
GD-M40x-80x for NPC Modules
Page 12 of 32
3 Description of Electrical Parts
This chapter describes the different electrical parts like the input signals, output signals and driver
circuit for a better understanding how the board works.
3.1
Power Module
This power module family is suitable for PV applications and for UPS applications. M40xP(F) modules
are available in single phase and in three phase configuration based on a neutral point clamped
topology which is also known as NPC topology. Two 1200V fast IGBTs with freewheeling diodes are
implemented for the outer switch (BUCK STAGE) and for the inner switch another two 1200V IGBTs
with freewheeling diodes are placed (BOOST STAGE). The IGBTs and the freewheeling diodes have
the same current rating. Two diodes Dtran+, Dtran- will implement the regeneration of the energy stored in
the parasitic inductance, and the asymmetrical inductance at work.
For temperature measurement a NTC is equipped. Note that this NTC has only a functional isolation.
3.2
Required power supplies
To ensure a correct operation of the evaluation kit one single +15 V power supply for all gate drivers.
The +15 V has to be supported through the connector P17. In parallel MASTER-SLAVE operation the
+15V at P17 has to be supplied at MASTER and SLAVE as well. The PWM input, FAULT and
temperature measurement output are implemented via optical fiber, no addition power supply is
required for the CTR cards.
3.3
Input / output signals
The switching of the IGBT inverter needs to be controlled by 4 channels for each phase. The
dedicated input signals is the U1 (PWM IN) located on its own CTR card. Each switch has its own fault
output activated by under voltage lockout or by desaturation supported through U2 (FAULT OUT)
The output of the temperature is a PWM signal available on U5 TH card.
3.4
Temperature output
The temperature output is generated with a voltage-controlled pulse width modulator. It is supported to
the fiber optic connector U5.The attached diagram gives the duty cycle as a function of the NTC
temperature which is build in the power module.
GD-M40x-80x for NPC Modules
Page 13 of 32
Duty Cycle & V mod vs. Temperature
1,10
1,05
1,00
0,95
0,90
0,85
0,80
0,75
0,70
0,65
0,60
0,55
0,50
0,45
0,40
0,35
0,30
0,25
0,20
0,15
0,10
0,05
0,00
80
70
60
50
40
30
20
10
0
25
30
35
40
45
50
55
60
65
Vmod
70
75
80
85
90
95
100
105
110
115
120
125
Measured Duty Cycle
Figure 6: Duty cycle of temperature output
3.5
PCB – Power Supply
The power supply board supports all four channels of the M40x evaluation kit. A 15 V power supply
has to be used to support the 2-pin connector in the middle of the PCB (P17). Four independent
DC/DC converters are used on this board to generate +16 V / -8 V for each IGBT.
T4
NTC
Figure 7: PCB of power supply
GD-M40x-80x for NPC Modules
Page 14 of 32
The asymmetric bipolar voltage for the IGBTs is generated by a DC/DC converter IG136-15
Figure 8: Bipolar voltage supply for e.g. T3 – neutral point low side
The DC /DC converter (IG136-15) is a 2 W, 15V input, +17V/-8,7V output with 3000VACrms I/O
isolation.
Different connectors are used on the bottom side of the power supply PCB to supply the signals from
the input, output and temperature PCB to the boost PCB.
Additional connectors on the bottom side of the power supply PCB are used for Master-Slave
operation.
Male connectors for
parallel operation
Female connectors for
current boost PCB
Figure 9: Connector for boost PCB and parallel operation
GD-M40x-80x for NPC Modules
Page 15 of 32
The pin assignment for the bottom connectors is like the following:
Connectors for boost PCB
Connectors for parallel operation
Pin
Signal
Comment
Pin
Signal
Comment
1
desat np H
Desaturation protection
1
desat np H
Desaturation protection
2
+16V np 1-2 Positive supply voltage
2
+16V np 1-2 Positive supply voltage
3
out H np H
Output for PWM signal
3
out H np H
Output for PWM signal
4
V clamp npH In Active Voltage clamp
4
V clamp npH In Active Voltage clamp
5
-8V np 1-2
Negative supply voltage
5
-8V np 1-2
Negative supply voltage
6
clamp np H
Clamp
6
clamp np H
Clamp
7
npGND 1-2
Ground
7
npGND 1-2
Ground
8
nc/NTC*
not connected/NTC
8
npGND 1-2
Ground
9
npGND 1-2
Ground
10
npGND 1-2
Ground
* only for the HB L section
Table 5: Pin assignment for connectors, e.g. T2 – neutral point high side
3.6
PCB – CTR Input and Output
Four additional vertical mounted PCBs provide the PWM input signals for the IGBTs as well as fault
signals coming from the IGBTs
Receiver
PWM in
Transmitter
Fault out
Figure 10: CTR- PCB with TD350E
GD-M40x-80x for NPC Modules
Page 16 of 32
Figure 11: Schematic of CTR- PCB with TD350E
For each channel the isolation is provides between the user side and the power side with optical fiber.
The green LED indicates that a voltage is applied on the secondary side. In this case the supply
voltage comes from the power supply PCB. The red LED starts lightning when a fault is detected
A voltage regulator generates the 5 V secondary supply voltage for the receiver fiber out of the 16 V
coming from the power supply PCB.
The IGBT driver IC is the TD350E
Features of the IGBT gate driver IC
Active Miller clamp feature
Two-level turn-off with adjustable level and delay
Desaturation detection
Fault status output
Negative gate drive capability
UVLO protection
2 kV ESD protection (HBM)
Activ Miller clamp: During turn-off, the gate voltage is monitored and the clamp output is activated
when gate voltage goes below 2 V (relative to GND). The clamp voltage is VL+3 V max. for a Miller
current up to 500 mA. The clamp is disabled when the IN input is triggered again.The current
capability of the clamp output is increased by an external PNP bipolar transistor placed on the current
booster PCB ( bottom PCB).
Two-level turn-off: The two-level turn-off is used to increase the reliability of the application.
During turn-off, gate voltage can be reduced to a programmable level (set by D201 to a 10 V) in order
to reduce the IGBT current (in the event of overcurrent). This action prevents both dangerous
overvoltage across the IGBT and RBSOA problems, especially at short-circuit turn-off.
The two-level turn-off (Ta) delay is programmable through an external resistor (R205) and capacitor
(C208) for accurate timing use the following equation :
Ta [μs] = 0.7 • R48 [kΩ] • C51 [nF]
Ta is set to 1,5 μs
Turn-off delay (Ta) is also used to delay the input signal to prevent distortion of input pulse width.
Desaturation detection: When the desat voltage goes higher than 7 V, the output is driven low (with
2-level turn-off). The FAULT output is activated. The FAULT state is exited at the next falling
edge of IN input. A programmable blanking time is used to allow enough time for IGBT saturation.
The blanking time is made of an internal 250μA current source and an external capacitor (C39).The
high voltage diode blocks the high voltage during IGBT off state (a standard 1kV ); the 1kΩ resistor
filters parasitic spikes and also protects the DESAT input.
GD-M40x-80x for NPC Modules
Page 17 of 32
During operation, the DESAT capacitor is discharged when TD350 output is low (IGBT off).
When the IGBT is turned on, the DESAT capacitor starts charging and desaturation
protection is effective after the blanking time (tB)
tB =7.2VC39 / 250μA
When a desaturation event occurs, the fault output is pulled down and TD350 outputs are
low (IGBT off) until the IN input signal is released (high level), then activated again (low
level).
C39=100pF
In case of a short circuit the HB IGBT must be first turned off, in order to insure this sequence the
desaturation capacitances for the NP IGBT-s are increased. Additional capacintances are placed on
the power board (C45;C46)
Fault status output: the dedicated output pin of the IC is used to signal a fault event (desaturation,
UVLO) to a controller. The fault pin drives direct the U2 fiber transmitter via a red colored LED. When
a fault event is detected the red LED will ligt up.
Minimum ON time:In order to ensure the proper operation of the 2-level turn-off function, the input
ON time(Twin) must be greater than the Twinmin value:
Twinmin = Ta + 2 • Rdel • C51 = 1,5 +2*0,5*0,47=2μs
Rdel is the internal discharge resistor of TD350E 0,5 kΩ (from the datasheet of TD350E)
Input signals smaller than Ta are ignored. Input signals larger than T winmin are transmitted to
the output stage after the Ta delay with minimum width distortion ( ΔTw = Twout - Twin).
For an input signal width Twin between Ta and Twinmin, the output width Twout is reduced
below Twin (pulse distortion) and the IGBT could be partially turned on. These input signals
should be avoided during normal operation.
For more details see :
http://www.st.com/web/en/resource/technical/document/datasheet/DM00023850.pdf
3.7
PCB – Temperature
One vertical mounted PCB measures the module temperature using the internal NTC and provides
optical information about the module temperature.
Transmitter
Figure 12: TH-PCB with LTC6992-1 (Voltage-Controlled Pulse Width Modulator)
GD-M40x-80x for NPC Modules
Page 18 of 32
Figure 13: Schematic of the TH-PCB
The duty cycle of the PWM signal generated by the LTC6992-1 is direct proportional to the measured
temperature of the module. (Fig 6)
An internal +5 V supply is required to power the LTC6992-1.The input of the +5 V is the +16 V hb L
coming from the power supply PCB.
PCB – Booster
3.8
The boost PCB provides the needed gate current to drive the IGBTs. Four independent driver
channels are assembled.
It is supplied by the power supply PCB with +16 V and -8 V.
HB H
HB H
NP H
NP H
HB L
NP L
HB L
9
NP L
9
9
Figure 14: Current Booster PCB
The pin assignment for the connectors is like the following:
Connector: HB H ; HB L ; NP H ; NP L
Pin Signal HB H
Signal NP H
Signal NP L
Signal HB L
1
desat
desat
desat
desat
2
+16 V
+16 V
+16 V
+16 V
3
out high
out high
out high
out high
GD-M40x-80x for NPC Modules
Comment
Desaturation protection
Positive supply
Signal for turn on/off
Page 19 of 32
4
V clamp
V clamp
V clamp
5
-8 V
-8 V
-8 V
6
clamp
clamp
clamp
7
GND
GND
GND
8
n.c.
n.c.
n.c.
Table 6: Pin assignment for connectors
V clamp
-8 V
clamp
GND
NTC
Active voltage clamp
Negative supply
Miller clamping
Ground
not connected / NTC
The PCB has two current boost stages that are connected in parallel to provide a high gate current
when necessary. The module has two gate pins. Each for half of the nominal module current. A
common gate resistor as well as separated gate resistors are used for the gates and the common
emitter.
The schematic to drive the IGBT is shown in the next figure as an example for HB L IGBT. The
schematics for the other IGBT-s are the same.
GD-M40x-80x for NPC Modules
Page 20 of 32
3.8.1
Active voltage clamp
The rated blocking voltage of the semiconductor switch may never be exceeded. This requirment must
be fulfiled under all working conditions including of course turn-off transients from over-current or short
–circuit conditions. Due to the unavoidable stray inductances in the layout of the power stage and high
values of the current change dI/dt the over voltages in the range of few hundreds volts can be
produced. In extrem cases these voltage spikes can take the values higher than the maximal
permissible level of the collector-emitter voltage VCE(max) . The zener diodes D23,D18 between colector
and gate causes the gate to become turned on when the collector voltage reaches 1200 V
Figure15: Boost stage of HB L
GD-M40x-80x for NPC Modules
Page 21 of 32
4 Schematics
Figure16: Boost stage schematic
GD-M40x-80x for NPC Modules
Page 22 of 32
Figure17: Power stage schematic
GD-M40x-80x for NPC Modules
Page 23 of 32
Figure18:Temperature card schematic
GD-M40x-80x for NPC Modules
Page 24 of 32
Figure19:Control card schematic
Short Circuit Protection
The short circuit protection has been tested by using critical inductance for the short (Sc).
Critical inductance means that the inductance is so small that dI/dt is high enough not to be able to be
detected by the current sensing of the inverter. On the other hand the inductance is so big that the
IGBT can temporary saturate due to the high dI/dt and so the IGBT has to withstand du/dt after the
short circuit protection is activated by the desaturation sensing.
The interpretation of the curves is the following.
At „0“ time the T2 IGBT is getting a positive gate voltage and it saturates. The emitter voltage,
„magenta“ rises to the collector voltage, „green“. The current, „blue“ on the short circuit impedance
starts to increase rapidly. Current range is 1000A / DIV. At about 4000A collector current the IGBT
desaturation sensing is activated and the soft turn off is initiated, At „1“ time the gate drive circuit
switches to the first turn off level of 10Vs. At time „2“ the IGBT desaturates in a soft manner due to the
reduced gate drive voltage and the gate drive settles to 10V. As the IGBT is not turned off, there is no
dangerous du/dt to cause RBSOA infringement and the overvoltage spike on the IGBT is also small.
The short circuit current at a value of about 5000A partly commutes into the freewheeling diode
(inverse diode of T4). The IGBT is conducting a current limited by its transfer current characteristics at
10V gate voltage. At time „3“ the IGBT gate voltage is totally switched off to -8V and the IGBT
releases the rest of current. As the majority of the short circuit current is already flowing through the
freewheeling diode and as there is no voltage change on the IGBT (du/dt) at this moment there will be
no dangerous voltage overshoot and turn off safe operating area for the IGBT will be fulfilled.
GD-M40x-80x for NPC Modules
Page 25 of 32
Figure 13: Schematic and waveforms of T2 NP high IGBT short circuit measurement
The short circuit protection is checked for all 4 IGBTs.
GD-M40x-80x for NPC Modules
Page 26 of 32
Figure 14: Schematic and waveforms of T3 NP low IGBT short circuit measurement
GD-M40x-80x for NPC Modules
Page 27 of 32
Ucc
T1
15V
Uce
Sc
700V
D2
D3
T2
T3
15V
15V
Uge
V
1mH
T4
Scope GND
V
Ic
0.000003
0.00001
Q
Q
Q
Q
Q
Q
0.000003
Figure 15: Schematic and waveforms of T4 HB low IGBT short circuit measurement
GD-M40x-80x for NPC Modules
Page 28 of 32
Figure 16: Schematic and waveforms of T1 HB high IGBT short circuit measurement
GD-M40x-80x for NPC Modules
Page 29 of 32
5 BOM
5.1
BOM Control Module
Part
Number
Description
312060
CGD-M400-PCB_CTR(Rev02);
SAMPLE
300737
C-1uF-25V-10%-X7R-0805-PM
303142
C-10uF-25V-10%-X7R-1206-PM
C-47pF-100V-NPO-0805-PM;
SAMPLE
Material group
Quantity Un
Layout position
PCB
Capacitors below
500V
Capacitors below
500V
Capacitors below
500V
Capacitors below
500V
Capacitors below
500V
Capacitors below
500V
1
PC
PCB
4
PC
C5; C34; C77; C78
2
PC
C6; C17
1
PC
C22
2
PC
C33; C52
1
PC
C39
1
PC
C51
LEDs
1
PC
D13
Diode zener
1
PC
D14
311008
DI-BZX84C10-SOT23
CONNECTOR-8PIN-1.27mmMT-PM; SAMPLE
Connectors
2
PC
P1, P2
300748
R-470R-1%-TK100-0805-CM(I)
Resistors
1
PC
R39
300749
R-1K-1%-TK100-0805-CM(I)
Resistors
1
PC
R41
303237
R-4K7-1%-0805-PM
Resistors
1
PC
R48
300818
R-4R7-1%-TK100-0805-CM(I)
Resistors
1
PC
R44
311031
Resistors
2
PC
R46, R47
Resistors
1
PC
R42
Resistors
1
PC
R49
311323
R-10R-1%-TK100-0805;Sample
R-15K-1%-TK100-0805-PM;
SAMPLE
300758 R-10K-1%-TK100-0805CM(I)
R-100R-1%-TK100-0805;
Sample
Resistors
1
PC
R50
310408
MC78L05ACDR2G; Sample
IC
1
PC
REF1
311004
SFH551/1-1V-PM; SAMPLE
IC
1
PC
U1
311005
SFH756V-PM; SAMPLE
IC
1
PC
U2
311006
IC-TD350ID-SO14-PM;Sample
IC
1
PC
U4
310998
310840
311040
300774
310999
303928
310982
300758
C-22uF-25V-10%-X7R-1210-PM
C-100pF-50V-10%-X7R-0805PM; SAMPLE
C-470pF-50V-5%-COG-0805CM(I)
LED-HSMF-C155-(Red/Green)SMD-PM; SAMPLE
GD-M40x-80x for NPC Modules
Page 30 of 32
5.2
BOM Thermal Module
Part
Number
Description
312057
CGD-M400-PCB_TH(Rev02);
SAMPLE
303142
C-10uF-25V-10%-X7R-1206-PM
300737
C-1uF-25V-10%-X7R-0805-PM
C-10nF-50V-10%-X7R-0805CM(I)
CONNECTOR-8PIN-1.27mmMT-PM; SAMPLE
R-8K2-0.1%-TK25-0805-PM;
SAMPLE
R-2K2-0.1%-TK25-0805-PM;
SAMPLE
Material group
Quantity Un
Layout position
PCB
Capacitors below
500V
Capacitors below
500V
Capacitors below
500V
1
PC
PCB
2
PC
C1, C2
1
PC
C13
1
PC
C14
Connector
1
PC
P1
Resistors
1
PC
R1
Resistors
1
PC
R2
Resistors
1
PC
R6
311029
R-470R-1%-TK100-0805-CM(I)
R-499K-1%-TK100-0805 PM;
SAMPLE
Resistors
1
PC
R7
310408
MC78L05ACDR2G; Sample
IC
1
PC
REF1
311005
SFH756V-PM; SAMPLE
IC-LTC6992CS6-1-SOT363-6LPM; SAMPLE
IC
1
PC
U5
IC
1
PC
U6
300780
311008
311043
311044
300748
311030
5.3
BOM Power Supply Module
Part
Number
Description
Material group
312202
CGD-M400-PCB_IN(REV03)
PCB
1
PC
310998
C-47pF-100V-NPO-0805-PM
Capacitor
2
PC
310840
C-22uF-25V-10%-X7R-1210-PM
CONNECTOR-10PIN-1.27mmFTSH10-PM
CONNECTOR-8PIN-1.27mmFLE8-PM
IC-IGC13615W_DC/DC_CONVERTER
CONNECTOR-2PIN-2.5mmHDR1X2-PM
Capacitor
48
Connector
4
Connector
4
C45,C46
C0-C33,C35PC
C44,C100,C111,C112,C133
HB_H_1,HB_L_1,NP_H_1,NP_
PC
L_1
HB_H_2,HB_L_2,NP_H_2,NP_
PC
L_2
IC
4
PC
IG126_15-IG126_18
Connector
1
PC
P17
311013
311010
311879
311014
GD-M40x-80x for NPC Modules
Quantity Un
Layout position
Page 31 of 32
5.4
BOM Current Booster Module
Part
Number
Description
Material group
Quantity Un
Layout position
312203
CGD-M400-PCB_OUT(REV03)
PCB
1
PC
PCB
310840
C-22uF-25V-10%-X7R-1210-PM
Capacitor
24
PC
C1-C8,C13-C24,C29-C32
300737
Capacitor
4
PC
C25,C34,C36,C37
Capacitor
4
PC
C33,C35,C38,C39
Diode
4
PC
D1,D2,D9,D10
Diode
8
PC
D3-D6,D11-D14
Diode
4
PC
D7,D8,D15,D16
Diode
8
PC
D17,D18,D23,D24,D33-D36
Diode
12
PC
D19-D22,D25-D32
Connector
4
PC
HB_H,HB_L,NP_H,NP_L
312069
C-1uF-25V-10%-X7R-0805-PM
C-100nF-50V-10%-X7R-0805CM(I)
DI-EGF1T-E3/67A-DO214BAPM; SAMPLE
DI-P6SMB18CA-18V-600WSMB; Sample
DI-VS-10BQ100PBF-SMB-PM;
SAMPLE
DI-P6SMB480A-480V-600W-5%SMB; Sample
BAS385 30V,200mA
MICROMELF; Sample
CONNECTOR-8PIN-1.27mmSMD-FTSH8; SAMPLE
TR-ZXTP25040DFH-PNPSOT23; Sample
Transistor
4
PC
Q1-Q4
300749
R-1K-1%-TK100-0805-CM(I)
Resistor
4
PC
312070
R-8R2-1%-TK100-0603; Sample
R-R510-1%-TK100-1210-PM;
SAMPLE
R-15K-1%-TK100-0805-PM;
SAMPLE
Resistor
12
PC
Resistor
20
PC
R2,R23,R24,R47
R3,R4,R13-R16,R25,R26,R35R38
R5-R12,R21,R22,R27R34,R43,R44
Resistor
8
PC
R17-R20,R39-R42
R-1R-1%-TK100-0805-CM
R-10R-1%-TK100-0805-PM;
SAMPLE
TR-ZXGD3006E6-SOT23-6-PM;
SAMPLE
Resistor
4
PC
R45,R48,R51,R52
Resistor
4
PC
R1,R46,R49,R50
IC
8
PC
T1-T8
300781
311039
312067
311038
312068
310866
311041
311033
310982
300672
311031
311036
GD-M40x-80x for NPC Modules
Page 32 of 32