Photomicrosensor (Transmissive) EE-SX4134 Be sure to read Precautions on page 24. ■ Dimensions ■ Features Note: All units are in millimeters unless otherwise indicated. • Ultra-compact model. • Photo IC output model. • Operates at a VCC of 2.2 to 7 V. • PCB surface mounting type. ■ Absolute Maximum Ratings (Ta = 25°C) Item IF 25 mA (see note 1) Reverse voltage VR 5V Detector Supply voltage VCC 9V Output voltage VOUT 17 V Output current IOUT 8 mA Permissible output POUT dissipation Ambient Operating temperature Storage Internal Circuit V O K G Terminal No. A Name Anode K Cathode V Supply voltage (Vcc) O G Output (OUT) Ground (GND) Unless otherwise specified, the tolerances are ±0.15 mm. Rated value Forward current Optical axis A Symbol Emitter 80 mW (see note 1) Topr –25°C to 85°C Tstg –40°C to 90°C Reflow soldering Tsol 255°C (see note 2) Manual soldering Tsol 350°C (see note 2) Note: 1. Refer to the temperature rating chart if the ambient temperature exceeds 25°C. 2. Complete soldering within 10 seconds for reflow soldering and within 3 seconds for manual soldering. ■ Electrical and Optical Characteristics (Ta = 25°C) Item Emitter Detector Symbol Value Condition Forward voltage VF 1.2 V typ., 1.4 V max. IF = 20 mA Reverse current IR 0.01 μA typ., 10 μA max. VR = 5 V Peak emission wavelength λP 940 nm typ. IF = 20 mA Power supply voltage VCC 2.2 V min., 7 V max. --- Low-level output voltage VOL 0.12 V typ., 0.4 V max. Vcc = 2.2 to 7 V, IOL = 8 mA, IF = 7 mA High-level output current IOH 10 μA max. Vcc = 2.2 to 7 V, IF = 0 mA, VOUT = 17 V Current consumption 2.8 mA typ., 4 mA max. Vcc = 7 V 870 mm typ. Vcc = 2.2 to 7 V 2.0 mA typ., 3.5 mA max. VCC = 2.2 to 7 V ICC Peak spectral sensitivity λP wavelength LED current when output is ON IFT Hysteresis ΔH 21% typ. VCC = 2.2 to 7 V (see note 1) Response frequency f 3 kHz min. VCC = 2.2 to 7 V, IF = 5 mA, IOL = 8 mA (see note 2) Response delay time tPHL 7 μs typ. VCC = 2.2 to 7 V, IF = 5 mA, IOL = 8 mA (see note 3) Response delay time tPLH 18 μs typ. VCC = 2.2 to 7 V, IF = 5 mA, IOL = 8 mA (see note 3) 40 EE-SX4134 Photomicrosensor (Transmissive) 3. The following illustrations show the definition of response delay time. Note: 1. Hysteresis denotes the difference in forward LED current value, expressed in percentage, calculated from the respective forward LED currents when the photo IC in turned from ON to OFF and when the photo IC in turned from OFF to ON. Input 2. The value of the response frequency is measured by rotating the disk as shown below. Output Disk 2.1 mm 0.5 mm 0.5 mm ■ Engineering Data Supply voltage VCC (V) Low-level Output Voltage vs. Ambient Temperature Characteristics (Typical) Low-level Output Voltage vs. Output Current (Typical) Ta = 25°C VCC = 5 V IOL = 8 mA IF = 7 mA Output current IC (mA) Response Delay Time vs. Forward Current (Typical) Response delay time tPHL, tPLH (μs) Current consumption Icc (mA) Ta = 25°C IF = 0 mA Supply voltage VCC (V) Forward voltage VF (V) Ambient temperature Ta (°C) Current Consumption vs. Supply Voltage (Typical) Ta = 25°C RL = 4.7 kΩ LED current IFT (mA) Forward current IF (mA) Ta = 70°C Low level output voltage VOL (V) VCC = 5 V RL = 4.7 kΩ LED Current vs. Supply Voltage (Typical) VCC = 5 V IF = 7 mA IOL = 8 mA IOL = 0.5 mA Ambient temperature Ta (°C) Repeat Sensing Position Characteristics (Typical) 40 IF Ta = 25°C VCC = 5 V RL = 4.7 kΩ ICC VCC RL 35 OUT VOUT GND 30 25 20 tPLH 15 INPUT IF t 10 OUTPUT Ta = 25°C IF = 5 mA VCC = 5 V RL = 4.7 kΩ n = repeat 20 times Output transistor LED current IFT (mA) LED Current vs. Ambient Temperature Characteristics (Typical) Ta = −30°C Ta = 25°C Low level output voltage VOL (V) Ambient temperature Ta (°C) Forward Current vs. Forward Voltage Characteristics (Typical) Output allowable dissipation PC (mW) Forward current IF (mA) Forward Current vs. Collector Dissipation Temperature Rating 0.01 t tPHL tPLH 5 tPHL 0 0 5 10 15 20 25 Forward current IF (mA) 30 -0.1 0 0.1 0.2 0.3 Distance d (mm) EE-SX4134 Photomicrosensor (Transmissive) 41 Unit: mm (inch) ■ Tape and Reel Reel 21±0.8 dia. 2±0.5 13± 0.5 dia. 330±2 dia. 80±1 dia. Product name Quantity Lot number 12.4 +2 0 18.4 max. Tape 1.5 dia. Tape configuration Parts mounted Terminating part (40 mm min.) Pull-out direction Leading part (400 mm min.) Empty (40 mm min.) Tape quantity 2,000 pcs./reel 42 EE-SX4134 Photomicrosensor (Transmissive) Precautions ■ Soldering Information Reflow soldering • The following soldering paste is recommended: Melting temperature: 216 to 220°C Composition: Sn 3.5 Ag 0.75 Cu • The recommended thickness of the metal mask for screen printing is between 0.2 and 0.25 mm. • Set the reflow oven so that the temperature profile shown in the following chart is obtained for the upper surface of the product being soldered. Temperature 1 to 5°C/s 260°C max. 255°C max. 230°C max. 1 to 5°C/s 150 to 180°C 120 sec 10 sec max. 40 sec max. Time Manual soldering • Use”Sn 60” (60% tin and 40% lead) or solder with silver content. • Use a soldering iron of less than 25 W, and keep the temperature of the iron tip at 300°C or below. • Solder each point for a maximum of three seconds. • After soldering, allow the product to return to room temperature before handling it. Storage To protect the product from the effects of humidity until the package is opened, dry-box storage is recommended. If this is not possible, store the product under the following conditions: Temperature: 10 to 30°C Humidity: 60% max. The product is packed in a humidity-proof envelope. Reflow soldering must be done within 48 hours after opening the envelope, during which time the product must be stored under 30°C at 80% maximum humidity. If it is necessary to store the product after opening the envelope, use dry-box storage or reseal the envelope. Baking If a product has remained packed in a humidity-proof envelope for six months or more, or if more than 48 hours have lapsed since the envelope was opened, bake the product under the following conditions before use: Reel: 60°C for 24 hours or more Bulk: 80°C for 4 hours or more EE-SX4134 Photomicrosensor (Transmissive) 43