Datasheet

Photomicrosensor (Transmissive)
EE-SX4134
Be sure to read Precautions on page 24.
■ Dimensions
■ Features
Note: All units are in millimeters unless otherwise indicated.
• Ultra-compact model.
• Photo IC output model.
• Operates at a VCC of 2.2 to 7 V.
• PCB surface mounting type.
■ Absolute Maximum Ratings (Ta = 25°C)
Item
IF
25 mA (see note 1)
Reverse voltage
VR
5V
Detector
Supply voltage
VCC
9V
Output voltage
VOUT
17 V
Output current
IOUT
8 mA
Permissible output POUT
dissipation
Ambient
Operating
temperature Storage
Internal Circuit
V
O
K
G
Terminal No.
A
Name
Anode
K
Cathode
V
Supply voltage
(Vcc)
O
G
Output (OUT)
Ground (GND)
Unless otherwise specified, the
tolerances are ±0.15 mm.
Rated value
Forward current
Optical axis
A
Symbol
Emitter
80 mW (see note 1)
Topr
–25°C to 85°C
Tstg
–40°C to 90°C
Reflow soldering
Tsol
255°C (see note 2)
Manual soldering
Tsol
350°C (see note 2)
Note: 1. Refer to the temperature rating chart if the ambient temperature exceeds 25°C.
2. Complete soldering within 10 seconds for reflow soldering
and within 3 seconds for manual soldering.
■ Electrical and Optical Characteristics (Ta = 25°C)
Item
Emitter
Detector
Symbol
Value
Condition
Forward voltage
VF
1.2 V typ., 1.4 V max.
IF = 20 mA
Reverse current
IR
0.01 μA typ., 10 μA max.
VR = 5 V
Peak emission wavelength
λP
940 nm typ.
IF = 20 mA
Power supply voltage
VCC
2.2 V min., 7 V max.
---
Low-level output voltage VOL
0.12 V typ., 0.4 V max.
Vcc = 2.2 to 7 V, IOL = 8 mA, IF = 7 mA
High-level output current IOH
10 μA max.
Vcc = 2.2 to 7 V, IF = 0 mA, VOUT = 17 V
Current consumption
2.8 mA typ., 4 mA max.
Vcc = 7 V
870 mm typ.
Vcc = 2.2 to 7 V
2.0 mA typ., 3.5 mA max.
VCC = 2.2 to 7 V
ICC
Peak spectral sensitivity λP
wavelength
LED current when output is ON
IFT
Hysteresis
ΔH
21% typ.
VCC = 2.2 to 7 V (see note 1)
Response frequency
f
3 kHz min.
VCC = 2.2 to 7 V, IF = 5 mA, IOL = 8 mA (see note 2)
Response delay time
tPHL
7 μs typ.
VCC = 2.2 to 7 V, IF = 5 mA, IOL = 8 mA (see note 3)
Response delay time
tPLH
18 μs typ.
VCC = 2.2 to 7 V, IF = 5 mA, IOL = 8 mA (see note 3)
40
EE-SX4134 Photomicrosensor (Transmissive)
3. The following illustrations show the definition of response
delay time.
Note: 1. Hysteresis denotes the difference in forward LED
current value, expressed in percentage, calculated
from the respective forward LED currents when the
photo IC in turned from ON to OFF and when the
photo IC in turned from OFF to ON.
Input
2. The value of the response frequency is measured by
rotating the disk as shown below.
Output
Disk
2.1 mm
0.5 mm
0.5 mm
■ Engineering Data
Supply voltage VCC (V)
Low-level Output Voltage vs.
Ambient Temperature Characteristics (Typical)
Low-level Output Voltage vs.
Output Current (Typical)
Ta = 25°C
VCC = 5 V
IOL = 8 mA
IF = 7 mA
Output current IC (mA)
Response Delay Time vs. Forward
Current (Typical)
Response delay time tPHL, tPLH (μs)
Current consumption Icc (mA)
Ta = 25°C
IF = 0 mA
Supply voltage VCC (V)
Forward voltage VF (V)
Ambient temperature Ta (°C)
Current Consumption vs. Supply
Voltage (Typical)
Ta = 25°C
RL = 4.7 kΩ
LED current IFT (mA)
Forward current IF (mA)
Ta = 70°C
Low level output voltage VOL (V)
VCC = 5 V
RL = 4.7 kΩ
LED Current vs. Supply Voltage
(Typical)
VCC = 5 V
IF = 7 mA
IOL = 8 mA
IOL = 0.5 mA
Ambient temperature Ta (°C)
Repeat Sensing Position
Characteristics (Typical)
40
IF
Ta = 25°C
VCC = 5 V
RL = 4.7 kΩ
ICC
VCC
RL
35
OUT
VOUT
GND
30
25
20
tPLH
15
INPUT IF
t
10
OUTPUT
Ta = 25°C
IF = 5 mA
VCC = 5 V
RL = 4.7 kΩ
n = repeat 20 times
Output transistor
LED current IFT (mA)
LED Current vs. Ambient Temperature Characteristics (Typical)
Ta = −30°C
Ta = 25°C
Low level output voltage VOL (V)
Ambient temperature Ta (°C)
Forward Current vs. Forward
Voltage Characteristics (Typical)
Output allowable dissipation PC (mW)
Forward current IF (mA)
Forward Current vs. Collector
Dissipation Temperature Rating
0.01
t
tPHL
tPLH
5
tPHL
0
0
5
10
15
20
25
Forward current IF (mA)
30
-0.1
0
0.1
0.2
0.3
Distance d (mm)
EE-SX4134 Photomicrosensor (Transmissive)
41
Unit: mm (inch)
■ Tape and Reel
Reel
21±0.8 dia.
2±0.5
13±
0.5 dia.
330±2 dia.
80±1 dia.
Product name
Quantity
Lot number
12.4 +2
0
18.4 max.
Tape
1.5 dia.
Tape configuration
Parts mounted
Terminating part
(40 mm min.)
Pull-out direction
Leading part
(400 mm min.)
Empty
(40 mm min.)
Tape quantity
2,000 pcs./reel
42
EE-SX4134 Photomicrosensor (Transmissive)
Precautions
■ Soldering Information
Reflow soldering
• The following soldering paste is recommended:
Melting temperature: 216 to 220°C
Composition: Sn 3.5 Ag 0.75 Cu
• The recommended thickness of the metal mask for screen printing
is between 0.2 and 0.25 mm.
• Set the reflow oven so that the temperature profile shown in the following chart is obtained for the upper surface of the product being
soldered.
Temperature
1 to 5°C/s
260°C max.
255°C max.
230°C max.
1 to 5°C/s
150 to 180°C
120 sec
10 sec max.
40 sec max.
Time
Manual soldering
• Use”Sn 60” (60% tin and 40% lead) or solder with silver content.
• Use a soldering iron of less than 25 W, and keep the temperature
of the iron tip at 300°C or below.
• Solder each point for a maximum of three seconds.
• After soldering, allow the product to return to room temperature
before handling it.
Storage
To protect the product from the effects of humidity until the package
is opened, dry-box storage is recommended. If this is not possible,
store the product under the following conditions:
Temperature: 10 to 30°C
Humidity: 60% max.
The product is packed in a humidity-proof envelope. Reflow
soldering must be done within 48 hours after opening the envelope,
during which time the product must be stored under 30°C at 80%
maximum humidity.
If it is necessary to store the product after opening the envelope, use
dry-box storage or reseal the envelope.
Baking
If a product has remained packed in a humidity-proof envelope for six
months or more, or if more than 48 hours have lapsed since the
envelope was opened, bake the product under the following
conditions before use:
Reel: 60°C for 24 hours or more
Bulk: 80°C for 4 hours or more
EE-SX4134 Photomicrosensor (Transmissive)
43