NXQ1TXH5
One-chip 5 V Qi wireless transmitter
Rev. 1.1 — 4 March 2016
Product short data sheet
1. General description
The NXQ1TXH5 is a controller and driver IC for a 5 V Qi-certified/compliant low-power
wireless charger. It offers a fully integrated solution that includes a 5 V full-bridge power
stage, as defined in Wireless Power Consortium (WPC) 5 V Qi standards A5, A11, A12
and A16.
The NXQ1TXH5 uses a dedicated analog ping circuitry to detect devices. With the analog
pin circuitry, an extremely low standby (wait state) power consumption is achieved. When
a Qi-compliant receiver is placed, the NXQ1TXH5 starts to communicate with it. After the
receiver is recognized, it safely initiates wireless power transfer from the transmitter to the
receiver, while monitoring for fault conditions such as overheating or interference from
metal objects. The device is optimized to operate from a 5 V USB power supply and uses
Smart Power Limiting (SPL) to adjust the output power automatically to compensate for
power-limited supplies. The device supports Foreign Object Detection (FOD).
LED outputs and a buzzer output are available for the user interface. The LED outputs
feature a number of blinking modes. Static Power Reduction (SPR) allows multiple
NXQ1TXH5-based transmitters to operate from a single USB power supply by limiting
power consumption per device.
The NXQ1TXH5 is available in a 5 mm 5 mm, 32-pin HVQFN package.
2. Features and benefits
Single-chip WPC 1.2 transmitter
Operates from 5 V supply
Low EMI radiation meeting EN55022 radiated and conducted emission limits
Very few external components needed, minimizing cost and board space
Extremely low-power receiver detection circuitry by integrating an analog ping circuit;
standby (wait state) power 10 mW (typical)
Power stage protected against overcurrents and overtemperature
Dual-channel Amplitude Shift Keying (ASK) demodulation
Demodulates communication packets from Qi-compliant receivers
PID regulation for power drive and control
Internal 1.8 V digital supply generation
LED (2) and buzzer outputs
NTC input for external temperature check and protection
On-chip thermal protection
Small HVQFN 32-pin package (5 mm 5 mm) with 0.5 mm pitch
NXQ1TXH5
NXP Semiconductors
One-chip 5 V Qi wireless transmitter
FOD with WPC receiver versions 1.2 and 1.1 and for legacy receiver support
(Qi version 1.0)
Peak efficiency > 75 %
Excellent low power (< 2 W) transfer efficiency. Ideal for charging wearables
3. Applications
Wireless Power Consortium (WPC) Qi certified/compliant wireless power transmitters
Wireless charger for (smart)phones, toys, shavers, pads, and other handheld devices
High-efficiency low-power wireless charger for smartwatches and other wearables
4. Quick reference data
Table 1.
Quick reference data
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VDDP
IDDP
power supply voltage
on pins VDDP1 and VDDP2
3.4
-
5.25
V
power supply current
on pins VDDP1 and VDDP2
wait state (average current)
-
2
-
mA
power transfer state (no load)
-
15
-
mA
1.5
5[1]
A
power transfer state (with load)
[1]
-
The maximum average current is 2 A. However, when removing the receiver, the power stage current protection limits the peak current
at 5 A.
5. Ordering information
Table 2.
Ordering information
Type number
NXQ1TXH5
Package
Name
Description
Version
HVQFN32
plastic thermal enhanced very thin quad flat package; no leads;
32 terminals; body 5 5 0.85 mm
SOT617-3
5.1 Ordering options
Table 3.
Ordering options
Type number
Orderable part
number
Package
Packing method
Minimum
Temperature
ordering quantity
NXQ1TXH5
NXQ1TXH5/101J
HVQFN32
reel 13" Q1/T1,
*standard mark SMD
non-dry-pack
6000
NXQ1TXH5
Product short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1.1 — 4 March 2016
Tamb = 20 C to +85 C
© NXP Semiconductors N.V. 2016. All rights reserved.
2 of 17
NXQ1TXH5
NXP Semiconductors
One-chip 5 V Qi wireless transmitter
6. Block diagram
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Fig 1.
NXQ1TXH5
Product short data sheet
NXQ1TXH5 functional block diagram
All information provided in this document is subject to legal disclaimers.
Rev. 1.1 — 4 March 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
3 of 17
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NXP Semiconductors
One-chip 5 V Qi wireless transmitter
7. Pinning information
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For enhanced thermal and electrical performance the exposed die-pad (33), the GNDP and GNDD
pins must be directly connected to the top layer board ground (GNDD). The exposed die-pad must
also be connected to bottom layer board ground with plated-through vias (see Section 12.4).
Fig 2.
Pin configuration
7.2 Pin description
Table 4.
NXQ1TXH5
Product short data sheet
Pin description
Symbol
Pin
Type Description
CNF2
1
I
configuration output 2 for FOD_E
CNF3
2
I
configuration output 3 for FOD_threshold
SDA
3
I/O
I2C-bus data input/output; connect to test pad (see Figure 4)
SCL
4
I
I2C-bus clock input; connect to test pad (see Figure 4)
BUZZER
5
O
buzzer output
CNF4
6
I
configuration output 4 for LED_mode
LED_G
7
O
green LED output
LED_R
8
O
red LED output
CNF_IN
9
I
configuration input
ASEN1
10
I
analog sense input 1
VSEN
11
I
coil voltage sense
NTC
12
I
temperature measurement using NTC
ASEN2
13
I
analog sense input 2
STBY
14
I
VDDP2
15, 16 P
standby function; connect to ground when not used
power supply pin 2
All information provided in this document is subject to legal disclaimers.
Rev. 1.1 — 4 March 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
4 of 17
NXQ1TXH5
NXP Semiconductors
One-chip 5 V Qi wireless transmitter
Table 4.
NXQ1TXH5
Product short data sheet
Pin description …continued
Symbol
Pin
OUT2
17, 18 O
Type Description
transmitter output 2
GNDP
19, 20, P
21, 22
power ground
OUT1
23, 24 O
transmitter output 1
VDDP1
25, 26 P
power supply pin 1
GNDD
27
P
digital ground
CDEC
28
P
decoupling connection for internal LDO
XTAL_IN
29
I
crystal input
XTAL_OUT 30
O
crystal output
TEST
31
I/O
test pin; connect to ground
CNF1
32
O
configuration output 1 for SPR
All information provided in this document is subject to legal disclaimers.
Rev. 1.1 — 4 March 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
5 of 17
NXQ1TXH5
NXP Semiconductors
One-chip 5 V Qi wireless transmitter
8. Functional description
The NXQ1TXH5 is a fully integrated 5 V wireless charger with an internal full-bridge
power stage. It efficiently integrates all the functions required to control the power transfer
with a Qi-compliant receiver. It can deliver up to 8 W continuous power into the
Qi-compliant type A5, A11, A12 or A16 transmitter coil.
Figure 1 shows a block diagram of the NXQ1TXH5. It is operational when a 5 V supply is
connected and pin STBY is LOW. The NXQ1TXH5 starts checking for a device on the
transmitter base station. When a receiver is detected, power transfer is initiated for the
detected receiver.
The power transfer can be monitored via the LEDs and BUZZER outputs.
Additional inputs are provided for configuring the NXQ1TXH5:
•
•
•
•
LED mode selection
Configuring FOD according to the application design and coil/capacitor selection
Setting the SPR level
Enabling/disabling SPL
8.1 NXQ1TXH5 operating states
The NXQ1TXH5 supports a number of operating states:
• Power-on state:
The NXQ1TXH5 generates a power-on LED blinking sequence after which it is
operational (standby = low).
• Standby state:
The device is inactive in standby state. The NXQ1TXH5 is in standby state when pin
STBY is HIGH. STBY must be connected to ground in standalone applications.
• Wait state (analog and digital ping):
The NXQ1TXH5 performs extremely low-power device detection using analog
circuitry in analog ping mode. The NXQ1TXH5 performs standard device detection
using the DSP in digital ping mode.
• ID and config state:
The NXQ1TXH5 communicates with and begins to supply power to a Qi-compliant
receiver.
• Power transfer state:
The NXQ1TXH5 charges the Qi-compliant receiver in power transfer state.
• Charged state:
The NXQ1TXH5 switches to charged state when it receives a ‘charge complete’
message from the receiver.
• Fault state:
The NXQ1TXH5 switches to a fault state when:
–
A receiver error is reported
– A foreign object is detected between receiver and the transmitter
– A receiver/transmitter overtemperature condition occurs
NXQ1TXH5
Product short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1.1 — 4 March 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
6 of 17
NXQ1TXH5
NXP Semiconductors
%<
One-chip 5 V Qi wireless transmitter
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Fig 3.
NXQ1TXH5 state diagram
8.2 Protections
The NXQ1TXH5 incorporates three built-in protections.
• Temperature reduction and temperature protection mechanism
• OverCurrent Protection (OCP)
• NTC, which monitors the voltage level on an external NTC network
NXQ1TXH5
Product short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1.1 — 4 March 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
7 of 17
NXQ1TXH5
NXP Semiconductors
One-chip 5 V Qi wireless transmitter
9. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to ground. See Limiting
Values disclaimer in Section 15.3.
Symbol
Parameter
Conditions
Min
Max
Unit
on pin VDDP1 and VDDP2
VDDP
power supply voltage
0.3
+6.0
V
Tj
junction temperature
-
+150
C
Tstg
storage temperature
55
+150
C
Tamb
ambient temperature
20
+85
C
VESD
electrostatic discharge voltage
according to the Human Body Model (HBM)
2
+2
kV
according to the Charge Device Model (CDM)
500
+500
V
10. Thermal characteristics
Table 6.
Thermal characteristics
Symbol
Parameter
Conditions
Typ
Unit
Rth(j-a)
thermal resistance from
junction to ambient
2-layer application board positioned
horizontally in free air; dimensions
45 mm 45 mm 0.8 mm; natural
convection; copper coverage on each layer
> 95 %; copper thickness each layer 70 m
30
K/W
11. Characteristics
Table 7.
DC characteristics
Tamb = 25 C, default settings unless otherwise specified
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
[1]
3.5
-
5.25
V
wait state (peak current)
[2]
-
1
-
A
wait state (average current)
[2]
-
2
-
mA
VDDP
power supply voltage
on pin VDDP1 and VDDP2
IDDP
power supply current
on pins VDDP1 and VDDP2:
standby state (STBY HIGH)
-
15
50
A
power transfer state (no-load)
-
15
-
mA
-
-
2
A
-
-
5
A
power transfer state
(average current with load)
power transfer state
(absolute peak current with load)
[2]
[1]
The maximum DC VDDP input voltage is 5.25 V. However, at the maximum load, spikes can occur due to high dI/dt. With the proper
decoupling circuitry and snubbers at the outputs, these spikes must never exceed 7 V (see Section 12.2 and Section 12.3).
[2]
The current consumption depends on the load impedance of the LC tank connected to the output stage at 175 kHz.
Assumed typical value: L = 6.3 F, 60 m and C = 384 nF.
NXQ1TXH5
Product short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1.1 — 4 March 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
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NXP Semiconductors
One-chip 5 V Qi wireless transmitter
Table 8.
AC characteristics
Tamb = 25 C, default settings unless otherwise specified
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
start-up and power transfer states
110
-
205
kHz
Full-bridge power stage
fsw
switching frequency
fsw(step)
switching frequency step size start-up and power transfer states
-
500
-
Hz
duty cycle
start-up and power transfer states
10
-
50
%
step
duty cycle step size
start-up and power transfer states
-
0.1
-
%
VIH
HIGH-level input voltage
standby state
1.2
-
VDDP
V
VIL
LOW-level input voltage
operating state
-
-
0.6
V
0
-
1.5
V
400
-
VDDP
mV
-
-
20
mA
400
-
VDDP
mV
-
-
20
mA
pin STBY
pins CNF_IN, ASEN1, ASEN2, VSEN, and NTC
input voltage
VI
operating range
[1]
LED_G, LED_R and CNF1, CNF2, CNF3, and CNF4 outputs
output voltage
VO
set externally
load current
Iload
open-drain output
[2]
BUZZER output
VO
output voltage
set externally
Iload
load current
open-drain output
[2]
I2C pins: SCL and SDA
VIH
HIGH-level input voltage
1
-
3.6
V
VIL
LOW-level input voltage
-
-
0.6
V
-
-
1.8
V
oscillator: pins XTAL_IN and XTAL_OUT
input voltage
VI
external crystal requirements
fnom
nominal frequency
32
32.768
33.5
kHz
DL
drive level
-
-
1
W
8
12
14
pF
load capacitance
CL
[1]
[3]
The nominal operating range is from 0 V to 1.5 V. However, any level between 1.5 V and VDDP has the same effect (as 1.5 V).
[2]
The output voltage at maximum load current is guaranteed not to exceed 400 mV.
[3]
The load capacitors are embedded in the NXQ1TXH5.
NXQ1TXH5
Product short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1.1 — 4 March 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
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NXQ1TXH5
NXP Semiconductors
One-chip 5 V Qi wireless transmitter
12. Application information
12.1 Crystal oscillator
The NXQ1TXH5 uses an external low-cost 32.768 kHz crystal, with a 1 % accuracy. The
crystal should support a load capacitance of 12 pF (the load capacitance is embedded in
the NXQ1TXH5). Do not connect the crystal to the NXQ1TXH5 using vias, but directly on
the top layer of the PCB. If possible, shield the crystal by connecting the casing to ground.
The crystal is connected to the oscillator input pin (XTAL_IN) via a 2.2 pF series capacitor.
12.2 Supply decoupling
Effective supply decoupling is required. The decoupling capacitors must to be chosen
such that the effective capacitance is at least 10 F at a DC bias voltage of 5.5 V. The
frequency must be 205 kHz for each supply pin. X5R capacitors of 22 F normally fulfill
this requirement. To prevent spikes that are too high on the VDDP pins and to improve HF
behavior and reduce EMI, use smaller (10 nF) high-quality capacitors. These capacitors
must be mounted as close as possible to the VDDP pins of the NXQ1TXH5 in parallel with
the 22 F capacitors (see Figure 4).
12.3 Snubber network
Snubber RC networks are connected to outputs OUT1 and OUT2. Each snubber network
consists of a 6.8 nF capacitor in series with a 1 resistor to ground (see Figure 4). The
snubber network must be connected as close as possible to the NXQ1TXH5 OUT1 and
OUT2 pins.
12.4 Exposed die-pad ground and thermal connection
For optimal thermal and electrical performance, the device bottom exposed VSS pin
(pin 33) MUST be soldered to a PCB solder land under the exposed die-pad. To have
good electrical contact and thermal flow from the device to the bottom copper layer, the
PCB solder pad under the device MUST be connected with plated-through vias to the
copper bottom layer of the PCB. In this way, the PCB bottom copper layer can provide
heat sinking for the device dissipation.
In the NXQ1TXH5 application note examples are provided for recommended layouts with
good thermal and electrical performance.
12.5 Support interface
For NXP Semiconductors support purposes, connecting interface wires must be made
possible to tune the FOD resistors and to check DSP operation. To connect the interface
wires, the NXQ1TXH5 I2C interface pins (pins 3 and 4) must be made available on the
PCB layout as exposed test-pads with minimum 2 mm2 solder area. A test pad for ground
connection must also be placed close to the I2C test-pad connections. Do not connect
pull-up resistors to VDDP for the I2C interface pins. For more advanced debug options for
NXP Semiconductors, pins 1, 2, and 32 require the same test options.
NXQ1TXH5
Product short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1.1 — 4 March 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
10 of 17
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NXP Semiconductors
One-chip 5 V Qi wireless transmitter
12.6 Application diagram
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Application diagram
NXQ1TXH5
Product short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1.1 — 4 March 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
11 of 17
NXQ1TXH5
NXP Semiconductors
One-chip 5 V Qi wireless transmitter
12.7 Efficiency
DDD
7[VXSSOLHGSRZHU
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Fig 5.
5[RXWSXWSRZHUP:
Graph of system efficiency as a function of output power at VDDP = 5 V
DDD
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Fig 6.
5[RXWSXWSRZHUP:
Graph of power transfer efficiency as a function of output power at VDDP = 5 V
Remark: The curves in Figure 5 and Figure 6 are measured on the NXP Semiconductors
DB1340 boards with:
• Coil: Elec&Eltek (E&E); Y31-60055F
• Capacitors:
– 82 nF; 5 %; 50 V; C0G; 1206; Murata; GRM31C5C1H823JA01L
– 100 nF; 5 %; 50 V; C0G; 1206; TDK; CGA5L2C0G1H104J160AA
NXQ1TXH5
Product short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1.1 — 4 March 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
12 of 17
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NXP Semiconductors
One-chip 5 V Qi wireless transmitter
13. Package outline
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NXQ1TXH5
Product short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1.1 — 4 March 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
13 of 17
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NXP Semiconductors
One-chip 5 V Qi wireless transmitter
14. Revision history
Table 9.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
NXQ1TXH5 v.1.1
20160304
Product short data sheet
-
NXQ1TXH5 v.1
Modifications:
NXQ1TXH5 v.1
NXQ1TXH5
Product short data sheet
•
Table 7 “DC characteristics” has been updated.
20160211
Product short data sheet
-
All information provided in this document is subject to legal disclaimers.
Rev. 1.1 — 4 March 2016
-
© NXP Semiconductors N.V. 2016. All rights reserved.
14 of 17
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NXP Semiconductors
One-chip 5 V Qi wireless transmitter
15. Legal information
15.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
15.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
15.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
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Product short data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 1.1 — 4 March 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
15 of 17
NXQ1TXH5
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Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
15.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
GreenChip — is a trademark of NXP B.V.
16. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
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Product short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1.1 — 4 March 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
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17. Contents
1
2
3
4
5
5.1
6
7
7.1
7.2
8
8.1
8.2
9
10
11
12
12.1
12.2
12.3
12.4
12.5
12.6
12.7
13
14
15
15.1
15.2
15.3
15.4
16
17
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 6
NXQ1TXH5 operating states . . . . . . . . . . . . . . 6
Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 8
Thermal characteristics . . . . . . . . . . . . . . . . . . 8
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Application information. . . . . . . . . . . . . . . . . . 10
Crystal oscillator . . . . . . . . . . . . . . . . . . . . . . . 10
Supply decoupling . . . . . . . . . . . . . . . . . . . . . 10
Snubber network . . . . . . . . . . . . . . . . . . . . . . 10
Exposed die-pad ground and thermal
connection . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Support interface . . . . . . . . . . . . . . . . . . . . . . 10
Application diagram . . . . . . . . . . . . . . . . . . . . 11
Efficiency . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14
Legal information. . . . . . . . . . . . . . . . . . . . . . . 15
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Contact information. . . . . . . . . . . . . . . . . . . . . 16
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2016.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 4 March 2016
Document identifier: NXQ1TXH5