Datasheet

UNISONIC TECHNOLOGIES CO., LTD
UFZ44
Power MOSFET
50 A, 60 V N-CHANNEL
POWER MOSFET
1

DESCRIPTION
TO-220
The UTC UFZ44 is an N-channel mode Power MOSFET,
using UTC’s advanced technology to provide customers with a
minimum on-state resistance, superior switching performance,
cost-effectiveness and ruggedizd device design.

FEATURES
1
* RDS(ON) < 28mΩ @ VGS=10V, ID=31A
* High Switching Speed
* Improved dv/dt Capability

TO-220F1
SYMBOL
2.Drain
1.Gate
3.Source

ORDERING INFORMATION
Ordering Number
Lead Free
Halogen Free
UFZ44L-TA3-T
UFZ44G-TA3-T
UFZ44L-TF1-T
UFZ44G-TF1-T
Note: Pin Assignment: G: Gate D: Drain
S: Source

Package
TO-220
TO-220F1
Pin Assignment
1
2
3
G
D
S
G
D
S
Packing
Tube
Tube
MARKING
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Copyright © 2015 Unisonic Technologies Co., Ltd
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UFZ44

Power MOSFET
ABSOLUTE MAXIMUM RATINGS (TC=25°C, unless otherwise specified)
PARAMETER
SYMBOL
VDSS
VGSS
RATINGS
UNIT
60
V
±20
V
TC=25°C (Note 2)
50
A
Continuous, VGS at 10V
ID
Drain Current
TC=100°C
36
A
200
A
Pulsed (Note 3)
IDM
Single Pulsed Avalanche Energy (Note 4)
EAS
100
mJ
Peak Diode Recovery dv/dt (Note 5)
dv/dt
4.5
V/ns
TO-220
150
W
Power Dissipation
TC=25°C
PD
TO-220F1
70
W
Linear De-rating Factor
1.0
W/°C
Junction Temperature
TJ
150
°C
Storage Temperature
TSTG
-55~+150
°C
Notes: 1. Absolute maximum ratings are those values beyond which the device could be permanently damaged.
Absolute maximum ratings are stress ratings only and functional device operation is not implied.
2. Current limited by the package, (die current = 51 A).
3. Repetitive rating; pulse width limited by maximum junction temperature.
4. VDD = 25 V, starting TJ = 25 °C, L = 44 µH, RG = 25 Ω, IAS = 51 A.
5. ISD ≤51 A, dI/dt ≤ 250 A/µs, VDD ≤ VDS, TJ ≤ 175 °C.
Drain-Source Voltage
Gate-Source Voltage

THERMAL DATA
PARAMETER
Junction to Ambient
Junction to Case
TO-220/TO-220F1
TO-220
TO-220F1
UNISONIC TECHNOLOGIES CO., LTD
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SYMBOL
θJA
θJC
RATINGS
62
1.0
1.78
UNIT
°C/W
°C/W
°C/W
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Power MOSFET
ELECTRICAL CHARACTERISTICS (TJ=25°C, unless otherwise specified)
PARAMETER
OFF CHARACTERISTICS
Drain-Source Breakdown Voltage
Breakdown Voltage Temperature
Coefficient
Drain-Source Leakage Current
Gate- Source Leakage Current
SYMBOL
BVDSS
ON CHARACTERISTICS
Gate Threshold Voltage
Static Drain-Source On-State Resistance
DYNAMIC PARAMETERS
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
SWITCHING PARAMETERS
Total Gate Charge
Gate to Source Charge
Gate to Drain Charge
Turn-ON Delay Time
Rise Time
Turn-OFF Delay Time
Fall-Time
ID=250µA, VGS=0V
MIN
IGSS
VGS(TH)
RDS(ON)
CISS
COSS
CRSS
QG
QGS
QGD
tD(ON)
tR
tD(OFF)
tF
TYP
V
0.060
VDS=60V, VGS=0V
VDS=48V, VGS=0V, TJ=125°C
VGS=+20V
VGS=-20V,
VDS=VGS, ID=250µA
VGS=10V, ID=31A (Note 2)
VGS=0V, VDS=25V, f=1.0MHz
V/°C
25
250
+100
-100
2.0
4.0
28
1900
920
170
14
110
45
92
µA
nA
nA
V
mΩ
pF
pF
pF
67
18
25
VGS=10V, VDS=48V, ID=51A
(Note 2)
VDD=30V, ID=51A, RG=9.1Ω,
RD=0.55 Ω (Note 2)
MAX UNIT
60
△BVDSS/△TJ Reference to 25°C, ID=1mA
IDSS
Forward
Reverse
TEST CONDITIONS
nC
nC
nC
ns
ns
ns
ns
D (2)
Between lead, 6
4.5
nH
mm (0.25") from
package and
G (1)
center of die
Internal Source Inductance
LS
7.5
nH
S (3)
contact
SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS
MOSFET
Maximum Body-Diode Continuous
IS
50
A
symbol showing
Current
the integral
reverse p - n
200
A
Maximum Body-Diode Pulsed Current
ISM
junction diode
Drain-Source Diode Forward Voltage
VSD
IS=51A, VGS=0V, TJ=25°C(Note 2)
2.5
V
Body Diode Reverse Recovery Time
tRR
120
180 ns
IF=51A, dI/dt=100A/µs, TJ=25°C
0.53 0.80 nC
Body Diode Reverse Recovery Charge
QRR
Intrinsic turn-on time is negligible (turn-on is dominated by
Forward Turn-On Time
tON
LS and LD)
Notes: 1. Repetitive Rating: Pulse width limited by maximum junction temperature.
2. Pulse Test: Pulse width ≤ 300µs, Duty cycle ≤ 2%.
Internal Drain Inductance
LD
UNISONIC TECHNOLOGIES CO., LTD
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Power MOSFET
TEST CIRCUITS AND WAVEFORMS

Gate Charge Test Circuit
Gate Charge Waveforms
VGS
Same Type
as DUT
12V
QG
10V
200nF
50kΩ
VDS
300nF
QGS
QGD
VGS
DUT
3mA
Charge
Unclamped Inductive Switching Waveforms
Unclamped Inductive Switching Test Circuit
VDS
RG
2
EAS= 1
2 LIAS
BVDSS
BVDSS-VDD
BVDSS
ID
L
IAS
10V
ID(t)
DUT
tP
VDD
VDD
VDS(t)
tP
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Time
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
Power MOSFET
TEST CIRCUITS AND WAVEFORMS(Cont.)
Peak Diode Recovery dv/dt Test Circuit & Waveforms
+
DUT
VDS
RG
L
ISD
VGS
VDD
Driver
Same Type
as DUT
dv/dt controlled by RG
ISD controlled by pulse period
VGS
(Driver
)
D=
Gate Pulse Width
Gate Pulse Period
10V
IFM, Body Diode Forward Current
ISD
(DUT)
di/dt
IRM
Body Diode Reverse Current
VDS
(DUT)
Body Diode Recovery dv/dt
VSD
VDD
Body Diode Forward
Voltage Drop
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Power MOSFET
TYPICAL CHARACTERISTICS

Drain Current vs. Drain-Source
Breakdown Voltage
Drain Current vs. Gate Threshold Voltage
300
250
250
Drain Current, ID (µA)
Drain Current, ID (µA)
300
200
150
100
200
150
100
50
0
50
0
20
40
60
80
0
0
100
Drain Current, ID (A)
16
14
12
10
VGS=10V, ID=20A
8
6
4
2
0
0
0.1 0.2
0.3
0.4 0.5 0.6
Drain to Source Voltage, VDS (V)
Body-Diode Continuous Current, IS (A)
Drain-Source On-State Resistance
Characteristics
18
1
1.5
2
2.5
3
3.5
Gate Threshold Voltage, VTH (V)
Drain-Source Breakdown Voltage, BVDSS (V)
20
0.5
56
Body-Diode Continuous Current vs.
Source to Drain Voltage
48
40
32
24
16
8
0
0
0.4
0.8
1.2
1.6
2.0
Source to Drain Voltage, VSD (V)
UTC assumes no responsibility for equipment failures that result from using products at values that
exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or
other parameters) listed in products specifications of any and all UTC products described or contained
herein. UTC products are not designed for use in life support appliances, devices or systems where
malfunction of these products can be reasonably expected to result in personal injury. Reproduction in
whole or in part is prohibited without the prior written consent of the copyright owner. The information
presented in this document does not form part of any quotation or contract, is believed to be accurate
and reliable and may be changed without notice.
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