Pressure Freescale Semiconductor + MPX2100 Rev 10, 10/2008 100 kPa On-Chip Temperature Compensated and Calibrated Silicon Pressure Sensors MPX2100 Series 0 to 100 kPa (0 to 14.5 psi) 40 mV Full Scale Span (Typical) The MPX2100 series devices silicon piezoresistive pressure sensors providing a highly accurate and linear voltage output directly proportional to the applied pressure. The sensor is a single, monolithic silicon diaphragm with the strain gauge and a thin-film resistor network integrated on-chip. The chip is laser trimmed for precise span and offset calibration an temperature compensation. Application Examples • • • • • • Features • • • • • Temperature Compensated Over 0°C to +85°C Available in Absolute, Differential and Gauge Configurations Easy to Use Chip Carrier Package Options Ratiometric to Supply Voltage ±0.25% Linearity (MPX2100D Series) Pump/Motor Controllers Robotics Level Indicators Medical Diagnostics Pressure Switching Barometers ORDERING INFORMATION Package Case Device Name Options No. Unibody Package (MPX2100 Series) MPX2100A Tray 344 MPX2100D Tray 344 MPX2100AP Tray 344B MPX2100GP Tray 344B MPX2100DP Tray 344C MPX2100GVP Tray 344D MPX2100ASX Tray 344F None # of Ports Single Dual Gauge • • Pressure Type Differential Absolute • • • • • • • MPX2100A MPX2100D • • Device Marking MPX2100AP MPX2100GP • MPX2100DP • MPX2100GVP • MPX2100A PACKAGES MPX2100A/D CASE 344-15 MPX2100AP/GP CASE 344B-01 MPX2100DP CASE 344C-01 © Freescale Semiconductor, Inc., 2002, 2008. All rights reserved. MPX2100GVP CASE 344D-01 MPX2100ASX CASE 344F-01 Pressure Figure 1 shows a block diagram of the internal circuitry on the stand-alone pressure sensor chip. VS 3 Thin Film Temperature Compensation and Calibration Circuitry Sensing Element 2 +VOUT 4 -V OUT 1 GND Figure 1. Temperature Compensated Pressure Sensor Schematic Voltage Output versus Applied Differential Pressure The differential voltage output of the sensor is directly proportional to the differential pressure applied. The absolute sensor has a built-in reference vacuum. The output voltage will decrease as vacuum, relative to ambient, is drawn on the pressure (P1) side. The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure side (P1) relative to the vacuum side (P2). Similarly, output voltage increases as increasing vacuum is applied to the vacuum side (P2) relative to the pressure side (P1). MPX2100 2 Sensors Freescale Semiconductor Pressure Operating Characteristics Table 1. Operating Characteristics (VS = 10 Vdc, TA = 25°C unless otherwise noted, P1 > P2) Characteristics Symbol Min Typ Max Unit Pressure Range(1) POP 0 — 100 kPa Supply Voltage(2) VS — 10 16 Vdc Supply Current Io — 6.0 — mAdc VFSS 38.5 40 41.5 mV Voff -1.0 -2.0 — — 1.0 2.0 mV ΔV/ΔP — 0.4 — mV/kPa — — -0.25 -1.0 — — 0.25 1.0 %VFSS Pressure Hysteresis(5) (0 to 100 kPa) — — ±0.1 — %VFSS Temperature Hysteresis(5) (-40°C to +125°C) — — ±0.5 — %VFSS TCVFSS -1.0 — 1.0 %VFSS TCVoff -1.0 — 1.0 mV Input Impedance Zin 1000 — 2500 Ω Output Impedance Zout 1400 — 3000 Ω Response Time(6) (10% to 90%) tR — 1.0 — ms Warm-Up — — 20 — ms Offset Stability(7) — — ±0.5 — %VFSS Full Scale Span(3) Offset(4) MPX2100D Series MPX2100A Series Sensitivity Linearity(5) MPX2100D Series MPX2100A Series Temperature Effect on Full Scale Span(5) Temperature Effect on Offset(5) 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self-heating. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following: Linearity: Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range. Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C. TcSpan: Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C. TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Offset stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MPX2100 Sensors Freescale Semiconductor 3 Pressure Maximum Ratings Table 2. Maximum Ratings(1) Rating Symbol Value Unit Maximum Pressure (P1 > P2) Pmax 400 kPa Storage Temperature Tstg -40 to +125 °C Operating Temperature TA -40 to +125 °C 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Least Squares Fit Relative Voltage Output LINEARITY Linearity refers to how well a transducer's output follows the equation: Vout = Voff + sensitivity x P over the operating pressure range. There are two basic methods for calculating nonlinearity: (1) end point straight line fit (see Figure 2) or (2) a least squares best line fit. While a least squares fit gives the “best case” linearity error (lower numerical value), the calculations required are burdensome. Conversely, an end point fit will give the “worst case” error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. Motorola's specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. Exaggerated Performance Curve Least Square Deviation Straight Line Deviation End Point Straight Line Fit Offset 0 50 100 Pressure (% Fullscale) Figure 2. Linearity Specification Comparison MPX2100 4 Sensors Freescale Semiconductor Pressure On-Chip Temperature Compensation and Calibration Figure 3 shows the output characteristics of the MPX2100 series at 25°C. The output is directly proportional to the differential pressure and is essentially a straight line. VS = 10 Vdc TA = 25°C P1 > P2 40 Output (mVdc) 35 30 25 20 The effects of temperature on Full-Scale Span and Offset are very small and are shown under Operating Characteristics. TYP Span Range (Typ) MAX 15 10 MIN 5 0 -5 kPa 0 PSI 25 3.62 50 7.25 75 10.87 Offset (Typ) 100 14.5 Figure 3. Output versus Pressure Differential Silicone Gel Die Coat Differential/Gauge Die P1 Epoxy Case Wire Bond Lead Frame Silicone Gel Die Coat Stainless Steel Metal Cover Differential/Gauge Element P2 Bond Die Absolute Die P1 Wire Bond Lead Frame Absolute Element P2 Stainless Steel Metal Cover Epoxy Case Die Bond Figure 4. Cross-Sectional Diagram (not to scale) Figure 4 illustrates the absolute sensing configuration (right) and the differential or gauge configuration in the basic chip carrier (Case 344). A silicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPX2100 series pressure sensor operating characteristics and internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application. MPX2100 Sensors Freescale Semiconductor 5 Pressure PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing the silicone gel which isolates the die. The differential or gauge sensor is designed to operate with positive differential pressure Part Number MPX2100A, MPX2100D Case Type 344 applied, P1 > P2. The absolute sensor is designed for vacuum applied to P1 side. The Pressure (P1) side may be identified by using the table below: Pressure (P1) Side Identifier Stainless Steel Cap MPX2100DP 344C Side with Part Marking MPX2100AP, MPX2100GP 344B Side with Port Attached MPX2100ASX 344F Side with Port Attached MPX2100GVP 344D Stainless Steel Cap MPX2100 6 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS C R M 1 B -A- 2 Z 4 3 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). DIM A B C D F G J L M N R Y Z N L 1 2 3 4 PIN 1 -TSEATING PLANE J F G F Y D 4 PL 0.136 (0.005) STYLE 1: PIN 1. 2. 3. 4. M T A DAMBAR TRIM ZONE: THIS IS INCLUDED WITHIN DIM. "F" 8 PL M STYLE 2: PIN 1. 2. 3. 4. GROUND + OUTPUT + SUPPLY - OUTPUT STYLE 3: PIN 1. 2. 3. 4. VCC - SUPPLY + SUPPLY GROUND INCHES MILLIMETERS MIN MAX MIN MAX 0.595 0.630 15.11 16.00 0.514 0.534 13.06 13.56 0.200 0.220 5.08 5.59 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.014 0.016 0.36 0.40 0.695 0.725 17.65 18.42 30˚ NOM 30˚ NOM 0.475 0.495 12.07 12.57 0.430 0.450 10.92 11.43 0.048 0.052 1.22 1.32 0.106 0.118 2.68 3.00 GND -VOUT VS +VOUT CASE 344-15 ISSUE AA UNIBODY PACKAGE SEATING PLANE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. -A- -T- U L R H N PORT #1 POSITIVE PRESSURE (P1) -Q- B 1 2 3 4 PIN 1 K -P0.25 (0.010) J M T Q S S F C G D 4 PL 0.13 (0.005) M T S S Q S DIM A B C D F G H J K L N P Q R S U INCHES MILLIMETERS MIN MAX MIN MAX 1.145 1.175 29.08 29.85 0.685 0.715 17.40 18.16 0.305 0.325 7.75 8.26 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.182 0.194 4.62 4.93 0.014 0.016 0.36 0.41 0.695 0.725 17.65 18.42 0.290 0.300 7.37 7.62 0.420 0.440 10.67 11.18 0.153 0.159 3.89 4.04 0.153 0.159 3.89 4.04 0.230 0.250 5.84 6.35 0.220 0.240 5.59 6.10 0.910 BSC 23.11 BSC STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPLY 4. - OUTPUT CASE 344B-01 ISSUE B UNIBODY PACKAGE MPX2100 Sensors Freescale Semiconductor 7 Pressure PACKAGE DIMENSIONS NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. -AU V PORT #1 R W L H PORT #2 PORT #1 POSITIVE PRESSURE (P1) PORT #2 VACUUM (P2) N -QB SEATING PLANE SEATING PLANE 1 2 3 4 PIN 1 K -P-T- 0.25 (0.010) -T- M T Q S S F J G D 4 PL C 0.13 (0.005) M T S Q S S -TA E -Q- U N V B R PORT #1 POSITIVE PRESSURE (P1) PIN 1 -P0.25 (0.010) M T Q M 4 3 2 1 S K J F INCHES MILLIMETERS MIN MAX MIN MAX 1.145 1.175 29.08 29.85 0.685 0.715 17.40 18.16 0.405 0.435 10.29 11.05 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.182 0.194 4.62 4.93 0.014 0.016 0.36 0.41 0.695 0.725 17.65 18.42 0.290 0.300 7.37 7.62 0.420 0.440 10.67 11.18 0.153 0.159 3.89 4.04 0.153 0.159 3.89 4.04 0.063 0.083 1.60 2.11 0.220 0.240 5.59 6.10 0.910 BSC 23.11 BSC 0.248 0.278 6.30 7.06 0.310 0.330 7.87 8.38 STYLE 1: PIN 1. 2. 3. 4. CASE 344C-01 ISSUE B UNIBODY PACKAGE C DIM A B C D F G H J K L N P Q R S U V W GROUND + OUTPUT + SUPPLY - OUTPUT NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D E F G J K N P Q R S U V INCHES MILLIMETERS MIN MAX MIN MAX 1.080 1.120 27.43 28.45 0.740 0.760 18.80 19.30 0.630 0.650 16.00 16.51 0.016 0.020 0.41 0.51 0.160 0.180 4.06 4.57 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.014 0.016 0.36 0.41 0.220 0.240 5.59 6.10 0.070 0.080 1.78 2.03 0.150 0.160 3.81 4.06 0.150 0.160 3.81 4.06 0.440 0.460 11.18 11.68 0.695 0.725 17.65 18.42 0.840 0.860 21.34 21.84 0.182 0.194 4.62 4.92 G D 4 PL 0.13 (0.005) M T P S Q S STYLE 1: PIN 1. 2. 3. 4. GROUND V (+) OUT V SUPPLY V (-) OUT CASE 344F-01 ISSUE B UNIBODY PACKAGE MPX2100 8 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. -AU SEATING PLANE -T- L R DIM A B C D F G H J K L N P Q R S U H PORT #2 VACUUM (P2) POSITIVE PRESSURE (P1) N -Q- B 1 2 3 4 K PIN 1 S C F -P- J 0.25 (0.010) M T Q S G D 4 PL 0.13 (0.005) M T S S Q S STYLE 1: PIN 1. 2. 3. 4. INCHES MILLIMETERS MIN MAX MIN MAX 1.145 1.175 29.08 29.85 0.685 0.715 17.40 18.16 0.305 0.325 7.75 8.26 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.182 0.194 4.62 4.93 0.014 0.016 0.36 0.41 0.695 0.725 17.65 18.42 0.290 0.300 7.37 7.62 0.420 0.440 10.67 11.18 0.153 0.159 3.89 4.04 0.153 0.158 3.89 4.04 0.230 0.250 5.84 6.35 0.220 0.240 5.59 6.10 0.910 BSC 23.11 BSC GROUND + OUTPUT + SUPPLY - OUTPUT CASE 344D-01 ISSUE B UNIBODY PACKAGE MPX2100 Sensors Freescale Semiconductor 9 How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. 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