NX3008CBKS 30 / 30 V, 350 / 200 mA N/P-channel Trench MOSFET Rev. 1 — 29 July 2011 Product data sheet 1. Product profile 1.1 General description Complementary N/P-channel enhancement mode Field-Effect Transistor (FET) in very small SOT363 (SC-88) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology. 1.2 Features and benefits Low threshold voltage ESD protection up to 2 kV Very fast switching AEC-Q101 qualified Trench MOSFET technology 1.3 Applications Level shifter Load switch Power supply converter Switching circuits 1.4 Quick reference data Table 1. Symbol Quick reference data Parameter Conditions Min Typ Max Unit Tj = 25 °C - - -30 V -8 - 8 V - - -200 mA - - 30 V -8 - 8 V - - 350 mA - 1 1.4 Ω - 2.8 4.1 Ω TR2 (P-channel) VDS drain-source voltage VGS gate-source voltage drain current ID VGS = -4.5 V; Tamb = 25 °C [1] TR1 (N-channel) VDS drain-source voltage VGS gate-source voltage drain current ID Tj = 25 °C VGS = 4.5 V; Tamb = 25 °C [1] TR1 (N-channel), Static characteristics RDSon drain-source on-state resistance VGS = 4.5 V; ID = 350 mA; Tj = 25 °C TR2 (P-channel), Static characteristics RDSon [1] drain-source on-state resistance VGS = -4.5 V; ID = -200 mA; Tj = 25 °C Device mounted on an FR4 PCB, single-sided copper, tin-plated and mounting pad for drain 1 cm2. NX3008CBKS NXP Semiconductors 30 / 30 V, 350 / 200 mA N/P-channel Trench MOSFET 2. Pinning information Table 2. Pinning information Pin Symbol Description 1 S1 source TR1 2 G1 gate TR1 3 D2 drain TR2 4 S2 source TR2 5 G2 gate TR2 6 D1 drain TR1 Simplified outline Graphic symbol 6 5 4 1 2 3 D1 D2 G1 G2 SOT363 (SC-88) S1 S2 017aaa262 3. Ordering information Table 3. Ordering information Type number Package Name Description Version NX3008CBKS SC-88 plastic surface-mounted package; 6 leads SOT363 4. Marking Table 4. Marking codes Type number Marking code[1] NX3008CBKS LD% [1] % = placeholder for manufacturing site code. NX3008CBKS Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 29 July 2011 © NXP B.V. 2011. All rights reserved. 2 of 21 NX3008CBKS NXP Semiconductors 30 / 30 V, 350 / 200 mA N/P-channel Trench MOSFET 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit Tj = 25 °C - -30 V TR2 (P-channel) VDS drain-source voltage VGS gate-source voltage ID drain current total power dissipation Ptot 8 V [1] - -200 mA VGS = -4.5 V; Tamb = 100 °C [1] - -125 mA Tamb = 25 °C; single pulse; tp ≤ 10 µs peak drain current IDM -8 VGS = -4.5 V; Tamb = 25 °C - -0.8 A [2] - 280 mW [1] - 320 mW Tsp = 25 °C - 990 mW Tj = 25 °C - 30 V -8 8 V Tamb = 25 °C TR1 (N-channel) VDS drain-source voltage VGS gate-source voltage ID drain current VGS = 4.5 V; Tamb = 25 °C [1] - 350 mA VGS = 4.5 V; Tamb = 100 °C [1] - 230 mA - 1.4 A [2] - 280 mW [1] - 320 mW - 990 mW - 445 mW IDM peak drain current Tamb = 25 °C; single pulse; tp ≤ 10 µs Ptot total power dissipation Tamb = 25 °C Tsp = 25 °C Per device Tamb = 25 °C [2] Ptot total power dissipation Tj junction temperature -55 150 °C Tamb ambient temperature -55 150 °C Tstg storage temperature -65 150 °C TR1 (N-channel), Source-drain diode source current IS Tamb = 25 °C [1] - 300 mA Tamb = 25 °C [1] - -200 mA HBM [3] - 2000 V HBM [3] - 2000 V TR2 (P-channel), Source-drain diode source current IS TR1 N-channel), ESD maximum rating VESD electrostatic discharge voltage TR2 (P-channel), ESD maximum rating VESD electrostatic discharge voltage [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and mounting pad for drain 1 cm2. [2] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper; tin-plated and standard footprint. [3] Measured between all pins. NX3008CBKS Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 29 July 2011 © NXP B.V. 2011. All rights reserved. 3 of 21 NX3008CBKS NXP Semiconductors 30 / 30 V, 350 / 200 mA N/P-channel Trench MOSFET 001aao121 120 Pder (%) Ider (%) 80 80 40 40 0 -75 Fig 1. 001aao122 120 -25 25 75 125 Tj (°C) 0 -75 175 Normalized total power dissipation as a function of junction temperature Fig 2. -25 25 75 125 Tj (°C) 175 Normalized continuous drain current as a function of junction temperature 001aao251 10 lD (A) 1 (1) 10-1 (2) (3) (4) 10-2 10-1 (5) 1 10 VDS (V) 102 IDM is a single pulse (1) tp = 1 ms (2) tp = 10 ms (3) DC; Tsp = 25 °C (4) tp = 100 ms (5) DC; Tamb = 25 °C; 1 cm2 drain mounting pad Fig 3. Safe operating area TR1 (N-channel); junction to ambient; continuous and peak drain currents as a function of drain-source voltage NX3008CBKS Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 29 July 2011 © NXP B.V. 2011. All rights reserved. 4 of 21 NX3008CBKS NXP Semiconductors 30 / 30 V, 350 / 200 mA N/P-channel Trench MOSFET 001aao253 -10 lD (A) -1 (1) -10-1 (2) (3) (4) (5) -10-2 -10-1 -1 -10 -102 VDS (V) IDM is a single pulse (1) tp = 1 ms (2) tp = 10 ms (3) DC; Tsp = 25 °C (4) tp = 100 ms (5) DC; Tamb = 25 °C; 1 cm2 drain mounting pad Fig 4. Safe operating area TR2 (P-channel); junction to ambient; continuous and peak drain currents as a function of drain-source 6. Thermal characteristics Table 6. Symbol Thermal characteristics Parameter Conditions thermal resistance from junction to ambient in free air in free air Min Typ Max Unit [1] - - 300 K/W [1] - 390 445 K/W [2] - 340 390 K/W - - 130 K/W [1] - 390 445 K/W [2] - 340 390 K/W - - 130 K/W Per device Rth(j-a) TR1 (N-channel) Rth(j-a) Rth(j-sp) thermal resistance from junction to ambient thermal resistance from junction to solder point TR2 (P-channel) Rth(j-a) Rth(j-sp) thermal resistance from junction to ambient in free air thermal resistance from junction to solder point [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper; tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and mounting pad for drain 1 cm2. NX3008CBKS Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 29 July 2011 © NXP B.V. 2011. All rights reserved. 5 of 21 NX3008CBKS NXP Semiconductors 30 / 30 V, 350 / 200 mA N/P-channel Trench MOSFET 017aaa034 103 duty cycle = 1 Zth(j-a) (K/W) 0.75 0.5 0.33 102 0.25 0.2 0.1 0.05 0 0.02 0.01 10 1 10−3 10−2 10−1 1 10 102 103 tp (s) FR4 PCB, standard footprint Fig 5. TR1: Transient thermal impedance from junction to ambient as a function of pulse duration; typical values 017aaa035 103 Zth(j-a) (K/W) duty cycle = 1 0.75 0.5 102 0.25 0.33 0.2 0.1 0.05 0 0.02 0.01 10 1 10−3 10−2 10−1 1 10 102 103 tp (s) FR4 PCB, mounting pad for drain 1 cm2. Fig 6. TR1: Transient thermal impedance from junction to ambient as a function of pulse duration; typical values NX3008CBKS Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 29 July 2011 © NXP B.V. 2011. All rights reserved. 6 of 21 NX3008CBKS NXP Semiconductors 30 / 30 V, 350 / 200 mA N/P-channel Trench MOSFET 017aaa034 103 duty cycle = 1 Zth(j-a) (K/W) 0.75 0.5 0.33 102 0.25 0.2 0.1 0.05 0 0.02 0.01 10 1 10−3 10−2 10−1 1 10 102 103 tp (s) FR4 PCB, standard footprint Fig 7. TR2, Transient thermal impedance from junction to ambient as a function of pulse duration; typical values 017aaa035 103 Zth(j-a) (K/W) duty cycle = 1 0.75 0.5 102 0.25 0.33 0.2 0.1 0.05 0 0.02 0.01 10 1 10−3 10−2 10−1 1 10 102 103 tp (s) FR4 PCB, mounting pad for drain 1 cm2 Fig 8. TR2, Transient thermal impedance from junction to ambient as a function of pulse duration; typical values NX3008CBKS Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 29 July 2011 © NXP B.V. 2011. All rights reserved. 7 of 21 NX3008CBKS NXP Semiconductors 30 / 30 V, 350 / 200 mA N/P-channel Trench MOSFET 7. Characteristics Table 7. Characteristics Symbol Parameter Conditions Min Typ Max Unit TR2 (P-channel), Static characteristics V(BR)DSS drain-source breakdown voltage ID = -250 µA; VGS = 0 V; Tj = 25 °C -30 - - V VGSth gate-source threshold voltage ID = -250 µA; VDS = VGS; Tj = 25 °C -0.6 -0.9 -1.1 V IDSS drain leakage current VDS = -30 V; VGS = 0 V; Tj = 25 °C - - -1 µA VDS = -30 V; VGS = 0 V; Tj = 150 °C - - -10 µA IGSS gate leakage current VGS = 8 V; VDS = 0 V; Tj = 25 °C - -0.2 -1 µA VGS = -8 V; VDS = 0 V; Tj = 25 °C - -0.2 -1 µA VGS = 4.5 V; VDS = 0 V; Tj = 25 °C - -10 - nA RDSon gfs drain-source on-state resistance transfer conductance VGS = -4.5 V; VDS = 0 V; Tj = 25 °C - -10 - nA VGS = 2.5 V; VDS = 0 V; Tj = 25 °C - -1 - nA VGS = -2.5 V; VDS = 0 V; Tj = 25 °C - -1 - nA VGS = -4.5 V; ID = -200 mA; Tj = 25 °C - 2.8 4.1 Ω VGS = -2.5 V; ID = -10 mA; Tj = 25 °C - 5.3 6.5 Ω VGS = -4.5 V; ID = -200 mA; Tj = 150 °C - 5.3 7.8 Ω VDS = -10 V; ID = -200 mA; Tj = 25 °C - 160 - mS TR1 (N-channel), Static characteristics V(BR)DSS drain-source breakdown voltage ID = 250 µA; VGS = 0 V; Tj = 25 °C 30 - - V VGSth gate-source threshold voltage ID = 250 µA; VDS = VGS; Tj = 25 °C 0.6 0.9 1.1 V IDSS drain leakage current VDS = 30 V; VGS = 0 V; Tj = 25 °C - - 1 µA VDS = 30 V; VGS = 0 V; Tj = 150 °C - - 10 µA VGS = 8 V; VDS = 0 V; Tj = 25 °C - 0.2 1 µA VGS = -8 V; VDS = 0 V; Tj = 25 °C - 0.2 1 µA VGS = 4.5 V; VDS = 0 V; Tj = 25 °C - 10 - nA VGS = -4.5 V; VDS = 0 V; Tj = 25 °C - 10 - nA VGS = 2.5 V; VDS = 0 V; Tj = 25 °C - 1 - nA VGS = -2.5 V; VDS = 0 V; Tj = 25 °C - 1 - nA IGSS RDSon gfs gate leakage current drain-source on-state resistance transfer conductance VGS = 4.5 V; ID = 350 mA; Tj = 25 °C - 1 1.4 Ω VGS = 4.5 V; ID = 350 mA; Tj = 150 °C - 1.8 2.5 Ω VGS = 2.5 V; ID = 200 mA; Tj = 25 °C - 1.4 2.1 Ω VGS = 1.8 V; ID = 10 mA; Tj = 25 °C - 2 2.8 Ω VDS = 10 V; ID = 350 mA; Tj = 25 °C - 310 - mS - 0.52 0.68 nC - 0.17 - nC - 0.08 - nC TR1 (N-channel), Dynamic characteristics QG(tot) total gate charge QGS gate-source charge QGD gate-drain charge NX3008CBKS Product data sheet VDS = 15 V; ID = 350 mA; VGS = 4.5 V; Tj = 25 °C All information provided in this document is subject to legal disclaimers. Rev. 1 — 29 July 2011 © NXP B.V. 2011. All rights reserved. 8 of 21 NX3008CBKS NXP Semiconductors 30 / 30 V, 350 / 200 mA N/P-channel Trench MOSFET Table 7. Characteristics …continued Symbol Parameter Conditions Min Typ Max Unit Ciss input capacitance - 34 50 pF Coss output capacitance VDS = 15 V; f = 1 MHz; VGS = 0 V; Tj = 25 °C - 6.5 - pF Crss reverse transfer capacitance - 2.2 - pF td(on) turn-on delay time - 15 30 ns tr rise time - 11 - ns td(off) turn-off delay time - 69 138 ns tf fall time - 19 - ns - 0.55 0.72 nC - 0.23 - nC - 0.09 - nC - 31 46 pF - 6.5 - pF - 2.3 - pF - 19 38 ns - 30 - ns VDS = 20 V; RL = 250 Ω; VGS = 4.5 V; RG(ext) = 6 Ω; Tj = 25 °C TR2 (P-channel), Dynamic characteristics QG(tot) total gate charge VDS = -15 V; ID = -200 mA; VGS = -4.5 V; Tj = 25 °C QGS gate-source charge QGD gate-drain charge Ciss input capacitance Coss output capacitance Crss reverse transfer capacitance td(on) turn-on delay time tr rise time td(off) turn-off delay time - 65 130 ns tf fall time - 38 - ns -0.47 -0.88 -1.2 V 0.47 0.85 1.2 V VDS = -15 V; f = 1 MHz; VGS = 0 V; Tj = 25 °C VDS = -20 V; RL = 250 Ω; VGS = -4.5 V; RG(ext) = 6 Ω; Tj = 25 °C TR2 (P-channel), Source-drain diode characteristics VSD source-drain voltage IS = -200 mA; VGS = 0 V; Tj = 25 °C TR1 (N-channel), Source-drain diode characteristics VSD source-drain voltage NX3008CBKS Product data sheet IS = 350 mA; VGS = 0 V; Tj = 25 °C All information provided in this document is subject to legal disclaimers. Rev. 1 — 29 July 2011 © NXP B.V. 2011. All rights reserved. 9 of 21 NX3008CBKS NXP Semiconductors 30 / 30 V, 350 / 200 mA N/P-channel Trench MOSFET 001aao267 0.4 ID (A) 2.5 V 001aao268 10-3 4.5 V ID (A) 2V 0.3 (2) (1) (3) 10-4 1.75 V 0.2 10-5 1.5 V 0.1 VGS = 1.25 V 0.0 0 1 2 3 VDS (V) 10-6 0.0 4 Tj = 25 °C 0.5 1.0 VGS (V) 1.5 Tj = 25 °C; VDS = 5 V (1) minimum values (2) typical values (3) maximum values Fig 9. TR1: Output characteristics: drain current as a function of drain-source voltage; typical values 001aao269 6 Fig 10. TR1: Sub-threshold drain current as a function of gate-source voltage 001aao270 6 RDS (on) (Ω) RDS (on) (Ω) (1) (2) (3) 4 4 (4) 2 2 (1) (5) (2) (6) 0 0.0 0.1 0.2 0.3 ID (A) 0.4 0 0 1 Tj = 25 °C ID = 350 mA (1) VGS = 1.5 V (1) Tj = 150 °C (2) VGS = 1.75 V (2) Tj = 25 °C 2 3 4 VGS (V) 5 (3) VGS = 2.0 V (4) VGS = 2.25 V (5) VGS = 2.5 V (6) VGS = 4.5 V Fig 11. TR1: Drain-source on-state resistance as a function of drain current; typical values NX3008CBKS Product data sheet Fig 12. TR1: Drain-source on-state resistance as a function of gate-source voltage; typical values All information provided in this document is subject to legal disclaimers. Rev. 1 — 29 July 2011 © NXP B.V. 2011. All rights reserved. 10 of 21 NX3008CBKS NXP Semiconductors 30 / 30 V, 350 / 200 mA N/P-channel Trench MOSFET 001aao272 2.0 a 001aao271 0.4 1.5 ID (A) (1) (2) 0.3 1.0 0.2 0.5 0.1 0.0 -60 0.0 0 1 2 VGS (V) 0 60 120 Tj (˚C) 180 3 VDS > ID x RDSon (1) Tj = 25 °C (2) Tj = 150 °C Fig 13. TR1: Transfer characteristics: drain current as a function of gate-source voltage; typical values 001aao273 1.5 Fig 14. TR1: Normalized drain-source on-state resistance as a function of junction temperature; typical values 001aao274 102 VGS(th) (V) (1) C (pF) (1) 1.0 (2) 10 0.5 (2) (3) (3) 0.0 -60 0 60 120 Tj (˚C) 180 1 10-1 1 ID = 0.25 mA; VDS = VGS f = 1 MHz; VGS = 0 V (1) maximum values (1)Ciss (2) typical values (2)Coss (3) minimum values (3)Crss Fig 15. TR1: Gate-source threshold voltage as a function of junction temperature NX3008CBKS Product data sheet 10 VDS (V) 102 Fig 16. TR1: Input, output and reverse transfer capacitances as a function of drain-source voltage; typical values All information provided in this document is subject to legal disclaimers. Rev. 1 — 29 July 2011 © NXP B.V. 2011. All rights reserved. 11 of 21 NX3008CBKS NXP Semiconductors 30 / 30 V, 350 / 200 mA N/P-channel Trench MOSFET 001aao275 5 VDS VGS (V) ID 4 VGS(pl) 3 VGS(th) VGS 2 QGS1 QGS2 QGS 1 QGD QG(tot) 003aaa508 0 0.0 0.2 0.4 QG (nC) 0.6 ID = 350 mA; VDS = 15 V; Tamb = 25 °C Fig 17. TR1: Gate-source voltage as a function of gate charge; typical values 001aao276 0.4 Fig 18. Gate charge waveform definitions 001aao256 -0.25 -4.5 V ID (A) IS (A) -3 V -0.20 -2.5 V 0.3 (1) -0.15 (2) 0.2 -0.10 -2 V 0.1 -0.05 VGS = -1.5 V 0.0 0.0 0.4 0.6 VSD (V) VGS = 0 V 1.2 0.00 0 -1 -2 -3 VDS (V) -4 Tj = 25 °C (1) Tj = 150 °C (2) Tj = 25 °C Fig 19. TR1: Source current as a function of source-drain voltage; typical values NX3008CBKS Product data sheet Fig 20. TR2: Output characteristics: drain current as a function of drain-source voltage; typical values All information provided in this document is subject to legal disclaimers. Rev. 1 — 29 July 2011 © NXP B.V. 2011. All rights reserved. 12 of 21 NX3008CBKS NXP Semiconductors 30 / 30 V, 350 / 200 mA N/P-channel Trench MOSFET 001aao257 -10-3 001aao258 14 RDS (on) (Ω) 12 ID (A) (1) (1) (2) (3) (2) (3) (4) 10 -10-4 8 6 (5) -10-5 4 (6) 2 -10-6 0.0 -0.5 -1.0 VGS (V) 0 -1.5 0 -0.05 -0.10 Tj = 25 °C; VDS = -5 V Tj = 25 °C (1) minimum values (1) VGS = -1.75 V (2) typical values (2) VGS = -2.0 V (3) maximum values (3) VGS = -2.25 V -0.15 -0.20 -0.25 ID (A) (4) VGS = -2.5 V (5) VGS = -3.0 V (6) VGS = -4.5 V Fig 21. TR2: Sub-threshold drain current as a function of gate-source voltage 001aao259 14 RDS (on) (Ω) 12 Fig 22. TR2: Drain-source on-state resistance as a function of drain current; typical values 001aao260 -0.25 ID (A) -0.20 10 (1) (2) -0.15 8 6 -0.10 (1) 4 (2) -0.05 2 0 0 -1 -2 -3 -4 VGS (A) -5 0.00 0 -1 ID = -200 mA VDS > ID x RDSon (1) Tj = 150 °C (1) Tj = 25 °C (2) Tj = 25 °C (2) Tj = 150 °C Fig 23. TR2: Drain-source on-state resistance as a function of gate-source voltage; typical values NX3008CBKS Product data sheet -2 VGS (V) -3 Fig 24. TR2: Transfer characteristics: drain current as a function of gate-source voltage; typical values All information provided in this document is subject to legal disclaimers. Rev. 1 — 29 July 2011 © NXP B.V. 2011. All rights reserved. 13 of 21 NX3008CBKS NXP Semiconductors 30 / 30 V, 350 / 200 mA N/P-channel Trench MOSFET 001aao261 2.0 001aao262 -1.5 a VGS(th) (V) (1) 1.5 -1.0 (2) 1.0 (3) -0.5 0.5 0.0 -60 0 60 120 Tj (˚C) 180 0.0 -60 0 60 120 Tj (˚C) 180 ID = -0.25 mA; VDS = VGS (1) maximum values (2) typical values (3) minimum values Fig 25. TR2: Normalized drain-source on-state resistance as a function of junction temperature; typical values Fig 26. TR2: Gate-source threshold voltage as a function of junction temperature 001aao263 102 001aao264 -5 VGS (V) C (pF) -4 (1) -3 10 (2) -2 (3) 1 -10-1 -1 -10 -1 VDS (V) -102 f = 1 MHz; VGS = 0 V 0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 QG (nC) ID = -200 mA; VDS = -15 V; Tamb = 25 °C (1)Ciss (2)Coss (3)Crss Fig 27. TR2: Input, output and reverse transfer capacitances as a function of drain-source voltage; typical values NX3008CBKS Product data sheet Fig 28. Gate-source voltage as a function of gate charge; typical values All information provided in this document is subject to legal disclaimers. Rev. 1 — 29 July 2011 © NXP B.V. 2011. All rights reserved. 14 of 21 NX3008CBKS NXP Semiconductors 30 / 30 V, 350 / 200 mA N/P-channel Trench MOSFET 001aao265 -0.25 VDS IS (A) ID -0.20 VGS(pl) -0.15 (1) VGS(th) VGS (2) -0.10 QGS1 QGS2 QGS QGD QG(tot) -0.05 003aaa508 0.00 0.0 -0.4 -0.8 VSD (V) -1.2 VGS = 0 V (1) Tj = 150 °C (2) Tj = 25 °C Fig 29. Gate charge waveform definitions Fig 30. TR2: Source current as a function of source-drain voltage; typical values 8. Test information P t2 duty cycle δ = t1 t2 t1 t 006aaa812 Fig 31. Duty cycle definition 8.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications. NX3008CBKS Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 29 July 2011 © NXP B.V. 2011. All rights reserved. 15 of 21 NX3008CBKS NXP Semiconductors 30 / 30 V, 350 / 200 mA N/P-channel Trench MOSFET 9. Package outline Plastic surface-mounted package; 6 leads SOT363 D E B y X A HE 6 5 v M A 4 Q pin 1 index A A1 1 2 e1 3 bp c Lp w M B e detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 max bp c D E e e1 HE Lp Q v w y mm 1.1 0.8 0.1 0.30 0.20 0.25 0.10 2.2 1.8 1.35 1.15 1.3 0.65 2.2 2.0 0.45 0.15 0.25 0.15 0.2 0.2 0.1 OUTLINE VERSION REFERENCES IEC JEDEC SOT363 JEITA SC-88 EUROPEAN PROJECTION ISSUE DATE 04-11-08 06-03-16 Fig 32. Package outline SOT363 (SC-88) NX3008CBKS Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 29 July 2011 © NXP B.V. 2011. All rights reserved. 16 of 21 NX3008CBKS NXP Semiconductors 30 / 30 V, 350 / 200 mA N/P-channel Trench MOSFET 10. Soldering 2.65 solder lands 2.35 1.5 0.4 (2×) 0.6 0.5 (4×) (4×) solder resist solder paste 0.5 (4×) 0.6 (2×) occupied area 0.6 (4×) Dimensions in mm 1.8 sot363_fr Fig 33. Reflow soldering footprint for SOT363 (SC-88) 1.5 solder lands 0.3 2.5 4.5 solder resist occupied area 1.5 Dimensions in mm 1.3 preferred transport direction during soldering 1.3 2.45 5.3 sot363_fw Fig 34. Wave soldering footprint for SOT363 (SC-88) NX3008CBKS Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 29 July 2011 © NXP B.V. 2011. All rights reserved. 17 of 21 NX3008CBKS NXP Semiconductors 30 / 30 V, 350 / 200 mA N/P-channel Trench MOSFET 11. Revision history Table 8. Revision history Document ID Release date Data sheet status Change notice Supersedes NX3008CBKS v.1 20110729 Product data sheet - - NX3008CBKS Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 29 July 2011 © NXP B.V. 2011. All rights reserved. 18 of 21 NX3008CBKS NXP Semiconductors 30 / 30 V, 350 / 200 mA N/P-channel Trench MOSFET 12. 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However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. NX3008CBKS Product data sheet Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. All information provided in this document is subject to legal disclaimers. Rev. 1 — 29 July 2011 © NXP B.V. 2011. All rights reserved. 19 of 21 NX3008CBKS NXP Semiconductors 30 / 30 V, 350 / 200 mA N/P-channel Trench MOSFET Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 12.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV, FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE, ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse, QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET, TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V. HD Radio and HD Radio logo — are trademarks of iBiquity Digital Corporation. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 13. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] NX3008CBKS Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 29 July 2011 © NXP B.V. 2011. All rights reserved. 20 of 21 NX3008CBKS NXP Semiconductors 30 / 30 V, 350 / 200 mA N/P-channel Trench MOSFET 14. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 8.1 9 10 11 12 12.1 12.2 12.3 12.4 13 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1 General description . . . . . . . . . . . . . . . . . . . . . .1 Features and benefits . . . . . . . . . . . . . . . . . . . . .1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Quick reference data . . . . . . . . . . . . . . . . . . . . .1 Pinning information . . . . . . . . . . . . . . . . . . . . . . .2 Ordering information . . . . . . . . . . . . . . . . . . . . . .2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .3 Thermal characteristics . . . . . . . . . . . . . . . . . . .5 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .8 Test information . . . . . . . . . . . . . . . . . . . . . . . . .15 Quality information . . . . . . . . . . . . . . . . . . . . . .15 Package outline . . . . . . . . . . . . . . . . . . . . . . . . .16 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17 Revision history . . . . . . . . . . . . . . . . . . . . . . . . .18 Legal information. . . . . . . . . . . . . . . . . . . . . . . .19 Data sheet status . . . . . . . . . . . . . . . . . . . . . . .19 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . .19 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .20 Contact information. . . . . . . . . . . . . . . . . . . . . .20 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 29 July 2011 Document identifier: NX3008CBKS