. TC1782 Scalable Pads Timing and Electromagnetic Emission AP32146 A pplication Note V1.0 2010-01 Microcontrollers Edition 2010-01 Published by Infineon Technologies AG 81726 Munich, Germany © 2010 Infineon Technologies AG All Rights Reserved. LEGAL DISCLAIMER THE INFORMATION GIVEN IN THIS APPLICATION NOTE IS GIVEN AS A HINT FOR THE IMPLEMENTATION OF THE INFINEON TECHNOLOGIES COMPONENT ONLY AND SHALL NOT BE REGARDED AS ANY DESCRIPTION OR WARRANTY OF A CERTAIN FUNCTIONALITY, CONDITION OR QUALITY OF THE INFINEON TECHNOLOGIES COMPONENT. THE RECIPIENT OF THIS APPLICATION NOTE MUST VERIFY ANY FUNCTION DESCRIBED HEREIN IN THE REAL APPLICATION. INFINEON TECHNOLOGIES HEREBY DISCLAIMS ANY AND ALL WARRANTIES AND LIABILITIES OF ANY KIND (INCLUDING WITHOUT LIMITATION WARRANTIES OF NON-INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS OF ANY THIRD PARTY) WITH RESPECT TO ANY AND ALL INFORMATION GIVEN IN THIS APPLICATION NOTE. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Revision History: V1.0, 2010-01 Previous Version: none Page Subjects (major changes since last revision) We Listen to Your Comments Is there any information in this document that you feel is wrong, unclear or missing? Your feedback will help us to continuously improve the quality of this document. Please send your proposal (including a reference to this document) to: [email protected] Application Note 3 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Table of Contents 1 Preface ................................................................................................................................................5 2 2.1 2.2 2.2.1 2.2.2 2.2.3 Introduction ........................................................................................................................................6 Pad driver scaling in detail ...................................................................................................................6 Physical basics.....................................................................................................................................7 Load charging.......................................................................................................................................7 Signal integrity......................................................................................................................................8 Power integrity / Electromagnetic emission .......................................................................................12 3 TC1782 test configuration ...............................................................................................................14 4 Specified timings .............................................................................................................................16 5 5.1 5.2 5.3 5.4 5.5 5.6 5.7 5.8 Measured timings.............................................................................................................................17 Measurement conditions and naming conventions............................................................................17 Measured rise/fall times for Class A1 drivers.....................................................................................20 Measured rise/fall times for Class A1+ drivers...................................................................................21 Measured rise/fall times for Class A2 drivers.....................................................................................23 Rise/fall time diagrams for Class A1 drivers ......................................................................................26 Rise/fall time diagrams for Class A1+ drivers ....................................................................................27 Rise/fall time diagrams for Class A2 drivers ......................................................................................29 Rise/fall time diagrams for increased capacitive loads ......................................................................33 6 6.1 6.2 6.2.1 6.2.2 6.2.3 6.3 Measured electromagnetic emission .............................................................................................37 Microcontroller operation mode..........................................................................................................37 Description of test equipment.............................................................................................................41 Conducted emission test configuration ..............................................................................................41 Radiated emission test configuration .................................................................................................41 Measurement settings........................................................................................................................42 Emission test result discussion ..........................................................................................................43 7 7.1 7.2 7.2.1 7.2.2 7.2.3 7.2.4 7.2.5 7.2.6 7.2.7 7.2.8 Recommended pad driver settings ................................................................................................51 Signal categories................................................................................................................................51 Decision tables and diagrams ............................................................................................................52 Decision table for pad class A2..........................................................................................................55 Decision table for pad class A1+........................................................................................................57 Decision table for pad class A1..........................................................................................................59 Decision diagrams for pad class A2...................................................................................................60 Decision diagrams for pad class A1+.................................................................................................65 Decision diagrams for pad class A1...................................................................................................70 Decision diagrams for weak driver at high capacitive load ................................................................75 Decision diagrams for medium driver at high capacitive load............................................................80 8 8.1 8.2 8.3 Pad Scaling Calculator (PASTOR)..................................................................................................85 Scope of the software ........................................................................................................................85 How to use PASTOR .........................................................................................................................85 PASTOR screenshots ........................................................................................................................86 Annex A: Measured rise/fall waveforms............................................................................................................90 Annex B: Glossary.............................................................................................................................................150 Application Note 4 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission 1 Preface Output driver scaling, also referred to as „slew rate control“, is an effective technique to reduce the electromagnetic emission and improve the signal integrity of an integrated circuit by reducing the driver strength and/or smoothing the rising and falling edges of one or more pad output drivers. Output driver scaling makes sense only when a certain margin regarding signal frequency and/or capacitive output load is available. Any driver scaling must maintain proper signal integrity. This application note presents a huge set of output driver characterization data plus a special software, which shall enable the system designers to select proper driver settings to reduce the electromagnetic emission caused by the driver switching, while maintaining the desired signal integrity. Parameters under consideration are switching frequency, capacitive output load, pad supply voltage and ambient temperature. Chapter 2 introduces physical basics behind the scaling. Chapter 3 describes the TC1782 software initialization for timing and emission measurements. Chapter 4 lists all specified timings which have been validated by measurements as documented in this application note. Chapter 5 provides values and comparison diagrams of measured rise/fall times under various conditions. Chapter 6 compares several measured electromagnetic emissions under various conditions. Chapter 7 recommends useful settings for the drivers by introducing signal categories and giving lots of decision tables and graphs. Chapter 8 introduces the new Microsoft Excel ™ based software PASTOR, which calculates pad driver timings under various environmental conditions and proposes the best driver scaling under timing, EMC, load, voltage and temperature constraints. Annex A shows the waveforms of all measured rise/fall times. Annex B explains all abbreviations used in this application note in a glossary. Guideline to use this application note: In most cases an appropriate driver setting is searched for, based on a given signal data rate, a given capacitive load connected to this signal, and a given maximal ambient temperature. As a solution, the diagrams given in Chapter 7 provide the required pad driver settings. These suitable pad driver settings lead to minimum electromagnetic emission under the given constraints for data rate, capacitive load, and operating temperature. In addition, the measured values of rise and fall times for all driver settings listed in the decision diagrams can be referred in Chapter 5. The impact of driver settings on electromagnetic emission can be estimated from the diagrams in Chapter 5. Annex A and B serve as data pool for detailled timing and electromagnetic emission behaviour for all pad driver settings under various temperature and capacitve load conditions. Note that emissions are always measured at room temperature (25°C). Figure 1: 32-bit microcontroller TC1782 Important notes: The information given in this application note is valid for Infineon microcontrollers of the AudoMax family, fabricated in 90 nm CMOS technology. Please note that all numbers given in this application note are not guaranteed in the microcontroller data sheets. They are verified by design without being monitored during the IC fabrication process. The numbers are based on timing measurements performed on center lot devices. Fabrication process windows may lead to deviations of below 10%. Application Note 5 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission 2 Introduction The output driver scaling principle of the TC1782 microcontroller is shown in Figure 2. The driver configuration is possible by setting corresponding control bits in the port-related output control registers. 2.1 Pad driver scaling in detail Basically, we distinguish between driver control and edge control. Driver control bits set the general DC driving capability of the respective driver. Reducing the driver strength increases the output’s internal resistance which attenuates noise that is imported/exported via the output line. For a given external load, charging and discharging time varies with the driver strength, thus the rise/fall times will change accordingly. For the sake of low electromagnetic emission, low-speed signals should be driven by weak output drivers. However, high DC-current sinks like LEDs or power transistors may require a stable high output current (strong driver) although the toggle rate is very low. The controllable output drivers of the TC1782 pins feature three differently sized transistors (strong, medium, and weak) for each direction (push and pull). The time of activating/deactivating these transistors determines the output characteristics of the respective port driver. The strength of the driver can be selected to adapt the driver characteristics to the application’s requirements: In Strong Driver Mode, the medium and strong transistors are activated. In this mode the driver provides maximum output current even after the target signal level is reached. In Medium Driver Mode, only the medium transistor is activated while the other transistors remain off. In Weak Driver Mode, only the weak transistor is activated while the other transistors remain off. This results in smooth transitions with low current peaks (and reduced susceptibility for noise) on the cost of increased transition times, i.e. slower edges, depending on the capacitive load, and low static current. Figure 2: Pad output driver schematic Signal slopes or edges define the rise/fall time for the respective output, i.e. the output transition time. Soft edges reduce the peak currents that are drawn when changing the voltage level of an external capacitive load. For a bus interface, however, sharp edges may still be required. Edge characteristics are controlled by the pad pre-driver which controls the final output driver stage. Application Note 6 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission 2.2 Physical basics Two main constraints have to be met when deciding for a certain clock driver setting: signal integrity and power integrity. Signal integrity must be maintained for all signals driven by the microcontroller. Conditions for good signal integrity are: - Maximal desired signal frequency is reached. - Stable-Level-to-Slope ratio is high (at least 2:1, depending on protocol timing). - High and low signal levels are reached. - No overshoot or undershoot occurs. Power integrity must be maintained to ensure proper operation and fulfil EMC requirements. Condititions for good power integrity are: - Low RF noise on all power supply domains. - This is equivalent to low switching noise and low electromagnetic emission. Both issues will be discussed after a general introduction to capacitive load charging. 2.2.1 Load charging Generally, a switching transistor output stage delivers charge to its corresponding load capacitance during rising edge and draws charge from its load capacitance during falling edge. The load capacitance is built by the signal net (traces) on the PCB and all connected receiver input stages (ASIC input pins). Timing diagrams normally show the signal’s voltage over time characteristics. However, the resulting timing is a result of the electrical charge transfer to and from the load capacitance described above. Charge is transferred by flowing current. A bigger pad driver means a smaller resistance in the loading path of the external load. Figure 3 shows the load current and voltage of two examples of pad drivers connected to a load of C=40pF. The strong driver has an output resistance of 25Ω, the weak driver 50Ω. For times t<0, the output voltage is 0V. At t=0, the load capacitor C is connected to the target output voltage U=5V via the respective driver pullup transistor. As a reaction, the load current steps immediately to the value I=U/R. I is bigger for smaller values of R. This means that the strong driver generates a bigger current jump and charges the load capacitor in a Charging Voltage and Current at 40pF Load shorter time. In frequency domain, the current peak which is resulting from the charging of the load capacitor and from the over- or undershoots, causes significant RF energy and thus electromagnetic emission on the pad power supply. These Application Note 0.2 4.5 0.18 4 0.16 3.5 0.14 3 0.12 2.5 0.1 2 0.08 1.5 0.06 1 0.04 0.5 0.02 0 -2.0E-09 0.0E+00 2.0E-09 4.0E-09 6.0E-09 8.0E-09 Current [A] 5 Voltage [V] In time domain this leads to bigger reflections for not adapted driver impedances. Since typical trace impedances range from 60 to 120Ω, a strong driver with Z=10Ω is poorly adapted and may cause big voltage overand undershoots. A weak driver with Z=100Ω may fit perfectly and generate a clean voltage switching signal without over- or undershoots. These effects are discussed in chapter 2.2.2. 0 1.0E-08 Time [s] Voltage R=50Ohm Voltage R=25Ohm Current R=50Ohm Current R=25Ohm Figure 3: Current-/voltage charging curves for different driver strengths 7 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission effects are discussed in chapter 2.2.3. Not only the pad driver impedance, but also the connected capacitive load determines the electromagnetic emission amplitudes. Figure 4 illustrates the differences in charging current and voltage between a capacitive load of 40pF and one of 20pF. In both cases, the driver impedance is set to 50Ω. This disadvantage can be compensated by chosing a smaller pad driver, i.e. a weaker driver setting, causing bigger driver impedance and thus smaller di/dt for the charging current. The selection of a weaker driver setting slows down the pad switching time, so care must be taken to maintain the required signal integrity. 2.2.2 Charging Voltage and Current at 50Ohm Driver Impedance 0.2 4.5 0.18 4 0.16 3.5 0.14 3 0.12 2.5 0.1 2 0.08 1.5 0.06 1 0.04 0.5 0.02 0 -2.0E-09 0.0E+00 2.0E-09 4.0E-09 6.0E-09 8.0E-09 Current [A] 5 Voltage [V] As expected, the charging voltage increases faster for a smaller load. However, the starting value of the charging current is only determined by the driver impedance and is thus loadindependent. The load affects only the speed of load current decrease. It decreases faster if the load is smaller. This means on the other hand a bigger di/dt for smaller loads, resulting in higer emission for smaller loads. 0 1.0E-08 Time [s] Voltage Cload=40pF Voltage Cload=20pF Current Cload=40pF Current Cload=20pF Figure 4: Current-/voltage charging curves for different capacitive loads Signal integrity Maintaining signal integrity means to select the rise/fall times such that all signal handshaking and data communication timings and levels are ensured for proper system operation. This means the data interchange between the microcontroller and external ICs (e.g. Flash memory, line drivers, receivers) runs properly. Therefore, it has to be taken into account that CMOS transistors become slower with rising temperature. Thus the timing of a critical signal has to be matched for proper operation at highest ambient temperature. Depending on the application, common ambient temperature ranges are up to 85°C or up to 125°C. Several automotive control units specify an ambient temperature range from -40°C up to 140°C. The die temperature may reach values above 150°C during operation. Rules: • Choose driver characteristics to meet the DC driving requirements. Make sure that the DC current provided by the microcontroller’s pad drivers is sufficient to drive e.g. actuators or LEDs into the desired logic state. • Choose slope settings to meet system timing constraints at the highest system temperature. Make sure that no too strong driver settings are selected. This would lead to unnecessarily fast signal edges, causing two disadvantages regarding electromagnetic emission: (1) The slopes are too fast and cause undesired high emission energy at higher frequencies; (2) Over- and undershoot appears with the danger of latchup, spikes leading to wrong logic states or increased data delays and undesired high frequency emission. • If system timing requires strong drivers, consider series termination to avoid over-/undershoot at signal transitions. The value of the termination resistor has to be chosen according the signal line impedance. Application Note 8 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission The following examples describe the signal integrity issues mentioned above. Let us assume a CMOS push/pull output driver with scalable driver impedance connected to a scalable microstrip trace on the PCB terminated by a reveiver input pin. The driver is controlled by a periodically toggling clock with 2ns slopes at different frequencies. This simple circuit is shown in Figure 5. Figure 5: Signal over- and undershoots Let us further assume the following system settings: Driver scaling Microstrip scaling Clock rate scaling 20Ω 2cm long 1MHz Strong-medium 50Ω 5cm long 10MHz Strong-soft 100Ω 10cm long 100MHz Medium 200Ω 20cm long - Weak 1000Ω - - Driver name Impedance Zdr Strong-sharp Please note that the “driver names” for these examples have been selected according the driver settings implemented in the TC1782. Nevertheless, the signal shapes and timings shown in Figures 6 to 11 are based on the simple model of Figure 5 and thus not identical to the physical realization of these drivers. For signal shapes and signal integrity discussion of the real physical TC1782 drivers please refer to chapters 5 and 7 and Annex A. Figures 6, 7, 8 show the driver scaling impact on signal integrity. Stronger drivers may cause signal over- and undershoot. Figures 9, 10, 11 show the PCB trace length impact. Driver strength should be selected to be as weak as possible to avoid over/undershoot. Of course any timings required by communication protocols must be maintained. Typically, weak driver settings can be used for signals up to 1MHz. Medium settings are valid for signals in the low MHz range, whereas faster signals need strong drivers. Infineon microcontrollers refine their strong drivers by slew-rate control like sharp/medium/soft edge, thus providing a fine tuning capability in the high signal performance class which is especially critical for electromagnetic emission. Figure 6: A 1MHz clock can be driven by a weak or medium driver. Any strong driver should be avoided due to unnecessary over- and undershoots and higher electromagnetic emission. Figure 7: A 10MHz signal cannot anymore be driven by a weak driver since the final high and low levels are hardly reached in time. The medium driver may be possible in the shown case of a 10cm long PCB trace. Depending on the communication protocol’s timing requirements, the strong-soft driver may be preferred due to its slightly faster slopes. Strong-medium and strong-sharp drivers are not recommended due to resulting overand undershoot. Figure 8: Depending on the protocol’s timing constraints, either strong-medium or strong-sharp drivers must be used. Strong-sharp still has significant over- and undershoots, thus offers worse signal integrity, but has steeper slopes. Application Note 9 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 6: Signal integrity for various driver settings at 1MHz clock signal Figure 7: Signal integrity for various driver settings at 10MHz clock signal Figure 8: Signal integrity for various driver settings at 100MHz clock signal Application Note 10 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 9: The PCB trace length determines the signal integrity significantly. Longer traces lead to increased over- and undershoot due to the larger inductive and capacitive components of the trace according the transmission line theory. This ringing effect caused by the trace length is superimposed to the ringing effect caused by strong drivers with steep slope which was discussed in Figures 6 to 8. The strong-sharp driver shown in Figure 9 causes significant ringing on traces longer than 5cm. Figure 10: For strong-medium driver, the ringing is significantly reduced and the timing even for 100MHz clocks is good up to 10cm long traces. Figure 11: The strong-soft driver is the preferred choice for signals up to 10MHz. It cannot be used for 100MHz clocks because due to the long slopes the target signal levels are never reached. Figure 9: Signal integrity for strong-sharp driver at various microstrip line lengths Figure 10: Signal integrity for strong-medium driver at various microstrip line lengths Application Note 11 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 11: Signal integrity for strong-soft driver at various microstrip line lengths 2.2.3 Power integrity / Electromagnetic emission Any switching between low and high voltage levels generates RF noise. Responsible for this electromagnetic energy is the dynamic current which is required to charge and discharge a lot of on-chip and off-chip nodes. In the logic core power supply domain of a microcontroller, the millions of transistors switching nearly simultaneously – triggered by the synchronous clock – draw lots of dynamic current from on-chip capacitors, decoupling capacitors on the PCB and finally the voltage regulator or battery “somewhere” in the system. Preferrably, most of this dynamic switching current should be provided by the onchip capacitors because in that case, only a small part of high frequency energy is propagated over the PCB, where it is efficiently radiated. If a good RF decoupling concept has been implemented on the PCB (i.e. decoupling capacitors place close to the microcontroller’s Figure 12: Spectrum envelope for different clocks and edges power supply pins), most of the RF current is kept within small loops on the PCB. For the I/O domain, the switching currents are drawn by the pad drivers. In contrast to the logic core domain, no on-chip capacitors can be implemented on the microcontroller due to very limited area of the pad frame. For the I/O domain, a very good external decoupling concept must be implemented on the PCB. Nevertheless, the electromagnetic emission caused by pad drivers can in most application cases significantly reduced by using weaker drivers. This driver selection is done by software as explained in section 2.1. From theory, the Application Note 12 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission electromagnetic emission (EME) of trapezoidal pulses (as are typical clock waveforms) is determined by the signal frequency and the signal slopes. In the emission spectrum, the limit curve is determined by two kneepoints which separate the limit curve in damping sections of 0dB/decade, -20dB/decade and -40dB/decade. Figure 12 shows the kneepoint frequencies for several cases of clock frequency and clock edges (i.e. rise/fall times). Good signal integrity is assumed when the rise and fall time takes 10% of one clock period. Any faster edge will not improve signal integrity significantly, but leads to heavily shited damping kneepoints towards higher frequency – see the 1ns egde examples in Figure 12. The steeper a switching pulse is, the higher frequencies (harmonics) are required to form the rising and falling edges. A rise time of 1ns leads to a spectrum composed from harmonics up to at least 500 MHz. Assuming a 100MHz (10ns period) clock signal consisting of 10% rise time, 40% high level, 10% fall time and 40% low level, this clock signal already generates at least harmonics up to 500MHz. Figure 12 indicates that not the clock frequency, but the rise/fall times determine the resulting RF spectrum. Even if a clock driver operates at a relatively low toggle rate, it may generate the same RF spectrum as if it would operate at a significantly higher toggle rate – as long as its rise/fall times are not adjusted to the lower toggle rate by slowing down the transitions. For example, if the mentioned 100MHz clock driver operates at only 10 MHz, its rise/fall times should be extended from 1 ns to 10 ns, still maintaining the 10% ratio relatively to the clock period time. This setting will reduce the emission by 10dB at 50MHz and by more than 30dB above 300MHz. • General Rule: Choose driver and edge characteristics to result in lowest electromagnetic emission while meeting all system timing requirements (i.e. good signal integrity) at given signal load and highest system temperature. Figure 13 refers to our pad driver and transmission line simulation model of Figure 5. It shows the simulated electromagnetic emission at the probing point “MEAS” which is an AC-coupled test point with resistive divider to match typical emission scales of up to 80dBµV. Important is the interpretation of relative emission reduction potential when using weaker pad drivers. For a 1MHz signal, Figure 6 shows that even the weakest driver delivers acceptable signal integrity. Moreover, Figure 13 confirms that the weakest driver reduces electromagnetic emission significantly, compared to the strong and medium settings. At 200MHz, the 1MHz harmonics are reduced by 34dB. At 100MHz, the reduction is ca. 20dB; above ca. 450MHz, the emission stays below 10dBµV (i.e. is uncritical) for all driver settings. Figure 13: Electromagnetic emission for various driver settings at 1MHz clock signal Application Note 13 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission 3 TC1782 test configuration Timing measurements were performed at 3 pins, representing the 3 pad driver classes: - Port pin P1.13 = Class A1 pin (low speed 3.3 V LVTTL output) - Port pin P5.1 = Class A1+ pin (medium speed 3.3 V LVTTL output) - Port pin P2.0 = Class A2 pin (high speed 3.3 V LVTTL output) Electromagnetic emission measurements were performed on the I/O supply net VDDP. Roughly, these settings can be linked to driven data rates, as documented in Chapter 7. Note that the actual data rate which can be driven by the selected driver depends on additional parameters like external capacitive load, pad supply voltage and ambient temperature. The driver settings for the respective port pins are configured by bit fields PDx in the Port Driver Mode Register, see Table 1. Px_PDR Port x Pad Driver Mode Register (F000 0C40H+x*100H) Reset Value: 0000 0000H 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 0 PD7 0 PD6 0 PD5 0 PD4 r rw r rw r rw r rw 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 PD3 0 PD2 0 PD1 0 PD0 r rw r rw r rw r rw Field PD0 Bits [2:0] Type rw PD1 [6:4] rw PD2 [10:8] rw PD3 [14:12] rw PD4 [18:16] rw PD5 [22:20] rw PD6 [26:24] rw PD7 [30:28] rw 0 3, 7, 11, 15, 19, 23, 27, 31 r 16 0 Description Pad Driver Mode for Px.[3:0] (Class A1 or A2 pads; coding see Table 2) Pad Driver Mode for Px.[7:4] (Class A1 or A2 pads; coding see Table 2) Pad Driver Mode for Px.[11:8] (Class A1 or A2 pads; coding see Table 2) Pad Driver Mode for Px.[15:12] (Class A1 or A2 pads; coding see Table 2) Pad Driver Mode for Px.[19:16] (not used for 16-bit ports) Pad Driver Mode for Px.[23:20] (not used for 16-bit ports) Pad Driver Mode for Px.[27:24] (not used for 16-bit ports) Pad Driver Mode for Px.[31:28] (not used for 16-bit ports) Reserved Read as 0; should be written with 0. Table 1: Pad driver mode register specification Application Note 14 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Driver strength and slew rate are controlled by the bit fields in the pad driver mode register Px_PDR, independently of input/output and pull-up/pulldown control functionality as programmed in the Pn_IOCRx register. One Px_PDR register is assigned to each port. Depending on the assigned pad class, the 3-bit wide pad driver mode selection bit fields PDx in the pad driver mode registers Px_PDR make it possible to select the port line functionality as shown in Table 2: - Class A1 pins make it possible to select between medium and weak output drivers. - Class A1+ and A2 pins make it possible to select between strong/medium/weak output drivers. In case of strong driver type, the signal transition edge can be additionally selected as soft/slow (Class A1+) or sharp/sharp-minus/medium/medium-minus/soft (Class A2). For details on the register structure and bit configurations please refer to the TC1782 specification. Pad Class A1 PDx.2 X PDx.1 X A1+ 0 0 1 1 0 0 0 0 1 1 1 1 X X X X 0 0 1 1 0 0 1 1 A2 PDx.0 0 1 0 1 0 1 0 1 0 1 X Driver Strength Medium driver Weak driver Strong driver soft edge Strong driver slow edge Medium driver Weak driver Strong driver, sharp edge Strong driver, medium edge Strong driver, soft edge Strong driver, sharp-minus edge Medium driver selected 0 1 Strong driver, medium-minus edge Weak driver selected Table 2: Pad Driver Mode Selection Please note that sometimes Class A1+ and A2 drivers share the same configuration bits, thus the driver and slew rate settings are not anymory fully individual. For these cases Table 3 lists the resulting combinations of settings. For details on the driver class distribution per bit please refer to the TC1782 specification. PDx.2 PDx.1 PDx.0 A2 Driver Strength A1+ Driver Strength 0 0 0 0 1 1 1 1 0 0 1 1 0 0 1 1 0 1 0 1 0 1 0 1 Strong sharp Strong medium Strong soft Strong sharp-minus Medium Medium Strong medium-minus Weak Strong soft Strong slow Strong soft Strong slow Medium Weak Medium Weak Table 3: Possible Driver Strength Combinations in a Mixed Pad Group (A1+ and A2) Application Note 15 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission 4 Specified timings Rise/fall times are specified for the TC1782 operating conditions: TJ < 150°C and VDDP = 3.3 V ± 5%. A junction temperature TJ of 150°C corresponds to an ambient temperature of TA < 140°C. The rise/fall times documented in chapter 5 have been characterized for ambient temperatures up to 140°C, thus fully covering the specified operating range. In addition, worst and best case results including ± 5% variation of VDDP are provided. For details please refer to the TC1782 product specification. Class Pad driver Load condition Max. specified value A1 Weak 20 pF 90 ns A1 Weak 150 pF 350 ns A1 Weak 20000 pF 50000 ns A1 Medium 50 pF 40 ns A1 Medium 150 pF 110 ns A1 Medium 20000 pF 15000 ns A1+ Weak 20 pF 90 ns A1+ Weak 150 pF 350 ns A1+ Weak 20000 pF 50000 ns A1+ Medium 50 pF 40 ns A1+ Medium 150 pF 110 ns A1+ Medium 20000 pF 15000 ns A1+ Strong slow 50 pF 28 ns A1+ Strong soft 50 pF 16 ns A2 Weak 20 pF 90 ns A2 Weak 150 pF 350 ns A2 Weak 20000 pF 50000 ns A2 Medium 50 pF 40 ns A2 Medium 150 pF 110 ns A2 Medium 20000 pF 15000 ns A2 Strong soft 50 pF 16 ns A2 Strong medium minus 50 pF 10 ns A2 Strong medium 50 pF 5.5 ns A2 Strong sharp minus 50 pF 4.4 ns A2 Strong sharp 50 pF 3.3 ns B Strong sharp 35 pF 2.5 ns * B Strong sharp 50 pF 3.3 ns * B Strong sharp 100 pF 6 ns * * for I/O supply voltage VDDP ≥ 3.13V Application Note 16 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission 5 Measured timings 5.1 Measurement conditions and naming conventions The test configuration listed in chapter 3 applies. Accordingly, all timings are measured at pins P1.13 (Class A2), P5.1 (Class A1+) and P2.0 (Class A2). The following parameters are varied for timing measurements to reflect the PVT (process, voltage, temperature) variations anticipated during fabrication and operation: • Pad supply voltage VDDP in 3 steps: 3.30V (nominal), 3.13V (-5%), 3.47V (+5%). • Capacitive load according TC1782 specification in 8 steps for weak and medium drivers: 10pF, 15pF, 22pF, 33pF, 47pF, 150pF, 1500pF, 20000pF • Capacitive load according TC1782 specification in 6 steps for strong-sharp drivers: 10pF, 15pF, 22pF, 33pF, 47pF, 100pF • Capacitive load according TC1782 specification in 5 steps for all strong driver settings except strongsharp: 10pF, 15pF, 22pF, 33pF, 47pF • Ambient • For rise/fall time values at other temperatures, a linear interpolation is performed. • Electromagnetic emission is always measured at TA=25°C. emperature in 6 steps: -40°C, 0°C, +25°C, +40°C, +80°C, +125°C The pad driver is loaded with the respective capacitance by connecting a lumped SMD 0805 X7R capacitor to the port pin. The port pin is driven by either a Class A1, Class A1+ or Class A2 pad driver. Please note that the measurement probe capacitance of 3pF must be added to the nominal load capacitors. Therefore, total capacitance values of 13pF up to 50pF are reached. Table 4 shows the reference between real loads and numbers given in the result diagrams. For easy reading, in all result tables and diagrams, the load capacitances are referring to the SMD capacitor values as 10, 15, 22, 33, 47pF. SMD load 10 pF 15 pF 22 pF 33 pF 47 pF >50 pF Probe capacitance 3 pF 3 pF 3 pF 3 pF 3 pF 3 pF Resulting physical capacitance 13 pF 18 pF 25 pF 36 pF 50 pF Respective load value +3 pF (may be neglected for large values) Table 4: Overview of capacitive loads used for timing measurements Application Note 17 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 14: Voltage level references for timing measurement at VDDP=3.3V The results given in Tables 6-8 and in the diagrams of sections 4.5 to 4.8 show the measured rising and falling edge timings. The reference points are 10% and 90% as indicated in Figure 14. Table 5 lists all parameter variations and test names for reference. These test names are used to indicate the driver settings and load configurations used in sections 4.5 to 4.8 4. All measurements have been performed for VDDP=3.30V at ambient temperatures TA=-40°C, 0°C, 25°C, 40°C, 80°C and 125°C. Rise and fall time values for other temperatures are calculated by interpolation (70°C, 85°C, 110°C) and extrapolation (140°C). Application Note 18 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Test Name WEA-10pF WEA-15pF WEA-22pF WEA-33pF WEA-47pF WEA-150pF WEA-1500pF WEA-20nF MED-10pF MED-15pF MED-22pF MED-33pF MED-47pF MED-150pF MED-1500pF MED-20nF SSL-10pF SSL-15pF SSL-22pF SSL-33pF SSL-47pF SSO-10pF SSO-15pF SSO-22pF SSO-33pF SSO-47pF SMM-10pF SMM-15pF SMM-22pF SMM-33pF SMM-47pF SME-10pF SME-15pF SME-22pF SME-33pF SME-47pF SSM-10pF SSM-15pF SSM-22pF SSM-33pF SSM-47pF SSH-10pF SSH-15pF SSH-22pF SSH-33pF SSH-47pF SSH-100pF Driver strength Weak Weak Weak Weak Weak Weak Weak Weak Medium Medium Medium Medium Medium Medium Medium Medium Strong-slow Strong-slow Strong-slow Strong-slow Strong-slow Strong-soft Strong-soft Strong-soft Strong-soft Strong-soft Strong-medium-minus Strong-medium-minus Strong-medium-minus Strong-medium-minus Strong-medium-minus Strong-medium Strong-medium Strong-medium Strong-medium Strong-medium Strong-sharp-minus Strong-sharp-minus Strong-sharp-minus Strong-sharp-minus Strong-sharp-minus Strong-sharp Strong-sharp Strong-sharp Strong-sharp Strong-sharp Strong-sharp Lumped load capacitance 10pF 15 pF 22 pF 33 pF 47 pF 150 pF 1500 pF 20000 pF 10pF 15 pF 22 pF 33 pF 47 pF 150 pF 1500 pF 20000 pF 10pF 15 pF 22 pF 33 pF 47 pF 10pF 15 pF 22 pF 33 pF 47 pF 10pF 15 pF 22 pF 33 pF 47 pF 10pF 15 pF 22 pF 33 pF 47 pF 10pF 15 pF 22 pF 33 pF 47 pF 10pF 15 pF 22 pF 33 pF 47 pF 100 pF Class A1 X X X X X X X X X X X X X X X X Class A1+ X X X X X X X X X X X X X X X X X X X X X X X X X X Class A2 X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X Table 5: Abbreviations used in the timing result diagrams Application Note 19 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Sections 5.2 to 5.4 list the measured 10% / 90% rise and fall times of all driver, load and ambient temperature conditions, while the I/O supply is kept at nominal value VDDP=3.30V. The last row in every table (section 5.2) lists the slowest measured rise/fall times under worst case conditions (VDDP = 3.30V-5% = 3.13V; TA=140°C). The related waveforms are presented in Annex A. Sections 5.5 to 5.8 show the measured rise/fall times for different combinations of ambient temperature and capacitive load. 5.2 Measured rise/fall times for Class A1 drivers A1 WEAK TA (°C) -40 0 +25 +40 +80 +125 +140 WORST CASE SPEC CL=10pF tR (ns) tF (ns) 30,93 38,55 34,41 42,60 36,96 45,07 38,21 47,44 42,00 52,15 46,82 55,23 48,43 56,26 49,63 62,09 CL=15pF tR (ns) tF (ns) 39,85 46,46 44,46 51,10 47,38 54,03 49,25 56,27 53,62 62,25 59,41 67,77 61,34 69,61 62,09 71,87 CL=22pF tR (ns) tF (ns) 41,53 48,01 45,94 52,67 48,60 55,76 50,47 57,84 55,52 63,72 61,54 70,31 63,55 72,51 64,26 73,99 150 A1 WEAK TA (°C) -40 0 +25 +40 +80 +125 +140 WORST CASE SPEC CL=150pF tR (ns) tF (ns) 156 129 170 138 176 143 182 149 195 161 207 174 211 178 221 185 550 CL=1500pF tR (ns) tF (ns) 1290 845 1390 911 1420 939 1460 962 1560 1030 1670 1110 1707 1137 1763 1170 CL=20000pF tR (ns) tF (ns) 17800 11310 18990 12030 19120 12380 19760 12840 20990 13680 22260 14890 22680 15290 23310 15487 65000 A1 MEDIUM TA (°C) -40 0 +25 +40 +80 +125 +140 CL=10pF tR (ns) tF (ns) 10,50 11,80 11,21 12,81 12,01 13,57 12,49 14,30 13,89 15,68 15,29 17,29 15,76 17,83 CL=15pF tR (ns) tF (ns) 13,53 14,11 14,51 15,42 15,31 16,12 15,87 16,87 17,69 18,48 19,53 20,41 20,14 21,05 16,72 20,51 WORST CASE SPEC 18,57 21,64 CL=33pF tR (ns) tF (ns) 51,34 55,26 56,36 60,70 59,37 64,06 61,30 66,55 68,19 73,41 75,29 79,50 77,66 81,53 79,27 86,19 CL=47pF tR (ns) tF (ns) 67,00 66,70 73,23 72,86 76,02 76,59 78,74 79,08 84,99 86,71 94,29 95,64 97,39 98,62 99,90 100,95 CL=22pF tR (ns) tF (ns) 13,39 14,51 14,83 16,01 15,53 16,50 16,32 17,25 17,81 18,97 19,37 20,79 19,89 21,40 CL=33pF tR (ns) tF (ns) 16,37 16,73 18,11 18,43 19,05 19,54 19,47 19,91 21,27 21,78 23,58 24,12 24,35 24,90 CL=47pF tR (ns) tF (ns) 21,61 20,17 23,41 21,91 24,33 22,75 25,05 23,68 27,12 25,83 29,44 28,26 30,21 29,07 20,64 25,67 31,02 29,98 50 22,11 25,96 Table 6: Pad driver class A1 – measured rise and fall times (first part) Application Note 20 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission A1 MEDIUM TA (°C) -40 0 +25 +40 +80 +125 +140 WORST CASE SPEC CL=150pF tR (ns) tF (ns) 46,9 37,5 49,9 40,6 51,7 42,0 53,2 43,6 57,7 47,2 61,5 50,4 62,8 51,5 65,9 54,5 140 CL=1500pF tR (ns) tF (ns) 408 256 438 272 458 283 465 291 492 311 513 329 520 335 530 350 CL=20000pF tR (ns) tF (ns) 5190 3280 5520 3540 5700 3670 5810 3770 6180 4070 6510 4310 6620 4390 6760 4547 18000 Table 6: Pad driver class A1 – measured rise and fall times (second part) 5.3 Measured rise/fall times for Class A1+ drivers A1+ WEAK TA (°C) -40 0 +25 +40 +80 +125 +140 WORST CASE SPEC CL=10pF tR (ns) tF (ns) 32,89 39,05 35,64 43,06 39,26 45,62 39,97 47,50 44,27 53,08 46,89 55,95 47,76 56,91 52,40 61,14 CL=15pF tR (ns) tF (ns) 39,78 44,15 43,68 49,10 46,57 51,98 47,71 53,87 54,18 60,03 59,16 66,51 60,82 68,67 61,79 69,85 CL=22pF tR (ns) tF (ns) 42,61 47,68 47,63 52,56 50,53 55,60 53,55 58,80 59,21 64,71 66,80 72,78 69,33 75,47 72,10 77,12 150 A1+ WEAK TA (°C) -40 0 +25 +40 +80 +125 +140 WORST CASE SPEC CL=150pF tR (ns) tF (ns) 163 131 175 141 181 147 190 152 200 165 214 176 219 180 231 191 550 CL=1500pF tR (ns) tF (ns) 1410 893 1500 952 1530 987 1570 1010 1690 1080 1780 1170 1810 1200 1863 1227 CL=20000pF tR (ns) tF (ns) 17210 11290 18260 11920 18810 12320 19410 12650 20380 13690 21370 14670 21700 15000 22903 15370 65000 CL=33pF tR (ns) tF (ns) 52,51 54,41 57,76 60,53 60,61 64,07 62,63 66,16 69,46 72,63 75,43 79,07 77,42 81,22 79,34 84,04 CL=47pF tR (ns) tF (ns) 67,17 64,99 73,73 71,74 78,04 75,67 80,64 78,87 85,87 84,03 97,12 95,39 100,87 99,18 101,78 101,24 Table 7: Pad driver class A1+ – measured rise and fall times (first part) Application Note 21 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission A1+ MEDIUM TA (°C) -40 0 +25 +40 +80 +125 +140 WORST CASE SPEC CL=10pF tR (ns) tF (ns) 10,73 12,12 11,83 13,05 12,84 14,14 13,09 14,53 14,88 16,11 15,87 17,12 16,20 17,46 17,20 18,93 CL=15pF tR (ns) tF (ns) 13,84 13,62 14,31 14,97 15,13 15,76 15,85 16,50 17,62 18,15 19,61 20,10 20,27 20,75 20,89 21,01 CL=22pF tR (ns) tF (ns) 13,69 14,62 15,11 16,19 15,97 16,91 17,00 17,84 18,97 19,62 21,06 20,60 21,76 20,93 21,29 21,89 A1+ MEDIUM TA (°C) -40 0 +25 +40 +80 +125 +140 CL=150pF tR (ns) tF (ns) 48,3 38,6 52,6 41,3 52,8 43,4 55,3 44,5 58,9 48,5 63,6 52,2 65,2 53,5 67,6 54,6 140 CL=1500pF tR (ns) tF (ns) 426 267 457 283 468 294 476 301 509 323 528 343 534 350 572 365 CL=20000pF tR (ns) tF (ns) 5370 3430 5720 3580 5740 3720 5860 3830 6340 4110 6670 4480 6780 4600 6997 4613 18000 A1+ STRONGSLOW -40 0 +25 +40 +80 +125 +140 WORST CASE SPEC CL=10pF 7,66 8,70 8,34 9,43 8,86 10,01 9,19 10,26 10,19 11,49 11,43 12,33 11,84 12,61 12,00 13,42 CL=15pF 9,22 9,83 10,13 10,77 10,44 11,17 11,03 11,79 12,18 12,95 13,48 14,31 13,91 14,76 14,84 14,93 A1+ STRONGSOFT -40 0 +25 +40 +80 +125 +140 WORST CASE SPEC CL=10pF 4,02 3,09 4,28 3,31 4,44 3,44 4,71 3,65 4,99 4,00 5,26 4,35 5,35 4,47 5,80 4,62 CL=15pF 5,53 3,78 5,99 4,09 6,05 4,26 6,53 4,40 6,83 4,83 7,50 5,36 7,72 5,54 7,81 5,62 WORST CASE SPEC CL=33pF tR (ns) tF (ns) 16,19 16,66 18,16 18,36 19,04 19,29 19,73 20,18 21,80 22,07 23,04 23,77 23,45 24,34 24,46 25,37 CL=47pF tR (ns) tF (ns) 20,92 19,45 23,23 21,96 24,55 23,10 25,26 23,91 27,33 26,20 30,73 29,09 31,86 30,05 32,66 30,68 50 CL=22pF 9,79 10,50 10,70 11,44 11,13 12,00 12,08 12,79 13,02 14,12 14,92 15,59 15,55 16,08 15,81 16,92 CL=33pF 11,55 11,96 12,64 13,13 13,08 13,75 13,95 14,34 15,27 15,60 16,83 17,21 17,35 17,75 17,66 17,97 CL=47pF 15,13 14,06 16,45 15,60 17,34 16,51 17,89 17,16 18,94 18,64 21,01 20,64 21,70 21,31 22,07 21,81 28 CL=22pF 6,18 4,35 6,61 4,71 6,74 4,87 7,26 5,13 7,67 5,58 8,03 6,02 8,15 6,17 8,74 6,36 CL=33pF 8,14 5,60 8,92 6,08 9,09 6,25 9,30 6,37 10,05 7,10 10,43 7,77 10,56 7,99 10,95 8,37 CL=47pF 12,11 7,53 12,75 8,27 13,24 8,66 13,42 8,93 14,21 9,85 15,15 10,77 15,46 11,08 15,60 11,05 16 Table 7: Pad driver class A1+ – measured rise and fall times (second part) Application Note 22 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission 5.4 Measured rise/fall times for Class A2 drivers A2 WEAK TA (°C) -40 0 +25 +40 +80 +125 +140 WORST CASE SPEC CL=10pF tR (ns) tF (ns) 31,49 37,86 34,97 42,55 38,13 45,44 39,89 47,41 44,25 52,84 49,07 58,66 50,68 60,60 51,57 61,75 CL=15pF tR (ns) tF (ns) 39,13 44,44 43,71 49,20 45,94 52,15 48,22 54,90 53,95 60,06 58,31 67,12 59,76 69,47 60,62 70,45 CL=22pF tR (ns) tF (ns) 44,86 49,72 49,52 54,50 53,18 58,53 53,91 59,50 59,49 65,60 63,41 71,47 64,72 73,43 69,66 77,57 150 A2 WEAK TA (°C) -40 0 +25 +40 +80 +125 +140 WORST CASE SPEC CL=150pF tR (ns) tF (ns) 149 124 162 135 168 140 171 145 184 159 200 175 205 180 220 188 550 CL=1500pF tR (ns) tF (ns) 1260 836 1370 905 1400 942 1420 963 1530 1050 1620 1110 1650 1130 1713 1183 CL=20000pF tR (ns) tF (ns) 16570 10720 17290 11510 17890 11830 18150 12210 19360 13250 20820 14140 21300 14440 22290 14870 65000 A2 MEDIUM TA (°C) -40 0 +25 +40 +80 +125 +140 WORST CASE SPEC CL=10pF tR (ns) tF (ns) 10,27 11,56 11,54 13,03 12,52 13,67 13,02 14,43 14,86 16,10 15,85 17,42 16,18 17,86 17,05 18,65 CL=15pF tR (ns) tF (ns) 12,33 13,35 13,80 14,93 14,82 15,75 15,53 16,23 17,09 17,92 19,17 19,97 19,86 20,65 20,55 21,61 CL=22pF tR (ns) tF (ns) 13,74 14,85 15,46 16,25 16,65 17,53 16,75 17,52 18,80 19,59 19,87 21,23 20,23 21,78 22,09 23,23 CL=33pF tR (ns) tF (ns) 51,25 54,04 56,58 60,76 60,36 63,76 63,27 66,31 69,60 74,06 75,57 81,63 77,56 84,15 79,12 84,82 CL=47pF tR (ns) tF (ns) 66,01 64,93 71,39 70,94 75,71 75,19 78,01 77,96 84,86 86,14 92,10 94,93 94,51 97,86 97,67 101,02 CL=33pF tR (ns) tF (ns) 15,40 15,92 17,02 17,74 18,33 18,78 18,89 19,53 21,24 21,60 23,16 23,99 23,80 24,79 24,49 25,11 CL=47pF tR (ns) tF (ns) 19,51 19,04 21,54 21,03 22,84 22,08 23,29 22,68 25,71 25,02 28,53 27,65 29,47 28,53 30,05 29,37 50 Table 8: Pad driver class A2 – measured rise and fall times (first part) Application Note 23 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission A2 MEDIUM TA (°C) -40 0 +25 +40 +80 +125 +140 WORST CASE SPEC CL=150pF tR (ns) tF (ns) 40,6 34,4 45,6 37,6 46,5 39,0 48,1 40,5 52,1 43,7 57,0 47,5 58,7 48,8 60,3 51,2 140 A2 STRONG-SOFT -40 0 +25 +40 +80 +125 +140 WORST CASE SPEC CL=1500pF tR (ns) tF (ns) 341 219 369 237 380 243 388 253 407 273 438 291 448 297 466 310 CL=10pF 4,55 6,10 4,98 6,52 5,38 6,79 5,69 7,15 6,48 7,86 7,18 8,54 7,41 8,77 7,60 9,12 CL=20000pF tR (ns) tF (ns) 5140 2810 5330 3020 5430 3110 5600 3210 5970 3480 6210 3830 6290 3950 6723 4047 18000 CL=15pF 5,08 6,78 5,55 7,43 5,98 7,53 6,30 7,87 7,14 8,53 7,80 9,29 8,02 9,54 8,15 9,80 CL=22pF 5,35 7,11 5,96 7,93 6,33 8,10 6,67 8,13 7,57 8,99 8,23 9,68 8,45 9,91 8,94 10,81 CL=33pF 5,69 7,33 6,41 7,94 6,84 8,34 7,29 8,65 8,21 9,57 9,08 10,48 9,37 10,78 9,73 11,17 CL=47pF 6,60 8,07 7,39 8,77 7,81 9,16 8,13 9,45 9,10 10,32 9,82 11,18 10,06 11,47 10,81 12,06 16 A2 STRONGCL=10pF MEDIUM-MINUS TA (°C) tR (ns) tF (ns) -40 2,34 3,16 0 2,57 3,50 +25 2,76 3,70 +40 2,91 3,90 +80 3,28 4,31 +125 3,45 4,58 +140 3,51 4,67 WORST CASE 3,91 5,06 SPEC CL=15pF tR (ns) tF (ns) 2,65 3,63 2,90 3,96 3,11 4,19 3,27 4,36 3,65 4,72 3,82 5,07 3,88 5,19 4,22 5,42 CL=22pF tR (ns) TA (°C) 2,87 3,92 3,22 4,35 3,42 4,57 3,56 4,64 3,98 5,09 4,32 5,53 4,43 5,68 4,79 6,17 CL=33pF tR (ns) tF (ns) 3,23 4,21 3,58 4,64 3,81 4,89 4,01 5,10 4,50 5,65 4,95 6,17 5,10 6,34 5,24 6,47 CL=47pF tR (ns) tF (ns) 3,85 4,89 4,24 5,32 4,51 5,58 4,69 5,74 5,19 6,32 5,69 6,80 5,86 6,96 5,95 7,27 10 tbd A2 STRONGMEDIUM TA (°C) -40 0 +25 +40 +80 +125 +140 WORST CASE SPEC CL=15pF tR (ns) tF (ns) 1,63 2,10 1,78 2,29 1,86 2,40 1,94 2,52 2,11 2,74 2,37 3,05 2,46 3,15 2,49 3,19 CL=22pF tR (ns) TA (°C) 1,81 2,33 1,97 2,57 2,07 2,69 2,17 2,80 2,37 3,06 2,56 3,32 2,62 3,41 2,88 3,64 CL=33pF tR (ns) tF (ns) 2,07 2,59 2,29 2,88 2,39 3,02 2,53 3,16 2,79 3,43 3,04 3,79 3,12 3,91 3,24 3,95 CL=47pF tR (ns) tF (ns) 2,55 3,12 2,81 3,39 2,92 3,54 3,02 3,64 3,29 3,92 3,53 4,18 3,61 4,27 3,84 4,56 7 Application Note CL=10pF tR (ns) tF (ns) 1,41 1,82 1,55 1,99 1,63 2,10 1,70 2,20 1,88 2,42 2,07 2,69 2,13 2,78 2,17 2,86 24 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Table 8: Pad driver class A2 – measured rise and fall times (second part) A2 STRONGSHARPMINUS TA (°C) -40 0 +25 +40 +80 +125 +140 WORST CASE SPEC CL=10pF tR (ns) tF (ns) 0,93 1,35 1,01 1,48 1,07 1,55 1,15 1,63 1,29 1,78 1,39 1,85 1,42 1,87 1,52 2,07 CL=15pF tR (ns) tF (ns) 1,14 1,59 1,24 1,73 1,31 1,81 1,39 1,88 1,51 2,01 1,70 2,22 1,76 2,29 1,78 2,33 CL=22pF tR (ns) TA (°C) 1,31 1,78 1,46 1,94 1,52 2,02 1,62 2,15 1,78 2,24 1,95 2,45 2,01 2,52 2,13 2,66 CL=33pF tR (ns) tF (ns) 1,60 1,98 1,75 2,18 1,81 2,25 1,94 2,38 2,14 2,60 2,28 2,84 2,33 2,92 2,44 2,96 CL=47pF tR (ns) tF (ns) 2,06 2,42 2,24 2,62 2,31 2,71 2,43 2,80 2,63 3,07 2,94 3,37 3,04 3,47 3,13 3,59 5 tbd A2 STRONGSHARP TA (°C) -40 0 +25 +40 +80 +125 +140 WORST CASE SPEC CL=10pF tR (ns) tF (ns) 0,59 0,62 0,63 0,66 0,64 0,69 0,68 0,72 0,73 0,77 0,79 0,85 0,81 0,87 0,83 0,91 CL=15pF tR (ns) tF (ns) 0,84 0,81 0,85 0,84 0,86 0,87 0,89 0,84 0,91 0,94 0,96 1,01 0,97 1,03 1,01 1,07 CL=22pF tR (ns) TA (°C) 1,00 1,02 1,04 1,03 1,05 1,05 1,10 1,08 1,15 1,13 1,20 1,22 1,22 1,25 1,31 1,33 CL=33pF tR (ns) tF (ns) 1,26 1,14 1,34 1,23 1,35 1,27 1,40 1,30 1,50 1,44 1,61 1,56 1,65 1,60 1,67 1,62 2.5 tbd CL=47pF tR (ns) tF (ns) 1,71 1,48 1,82 1,59 1,83 1,60 1,89 1,66 2,01 1,78 2,18 1,95 2,24 2,01 2,38 2,11 3.7 A2 STRONGSHARP TA (°C) -40 0 +25 +40 +80 +125 +140 WORST CASE SPEC CL=100pF tR (ns) tF (ns) 3,20 2,51 3,41 2,69 3,47 2,81 3,57 2,86 3,89 3,30 4,23 3,92 4,34 4,13 4,58 4,39 7.5 Table 8: Pad driver class A2 – measured rise and fall times (third part) Application Note 25 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission 5.5 Rise/fall time diagrams for Class A1 drivers Weak Driver Rise/Fall Times over Temperature 3.3V Pad Supply; Pad Class A1 100,00 90,00 Rise/Fall Time [ns] 80,00 WEA 10 pF Rise Time WEA 10 pF Fall Time WEA WEA WEA WEA WEA WEA 70,00 60,00 15 pF Rise Time 15 pF Fall Time 22 pF Rise Time 22 pF Fall Time 33 pF Rise Time 33 pF Fall Time WEA 47 pF Rise Time WEA 47 pF Fall Time 50,00 40,00 30,00 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 Ambient Temperature [°C] Figure 15: Rise/fall times for Class A1 weak driver setting at VDDP=3.30V Medium Driver Rise/Fall Times over Temperature 3.3V Pad Supply; Pad Class A1 32,00 30,00 28,00 Rise/Fall Time [ns] 26,00 24,00 22,00 20,00 18,00 16,00 MED MED MED MED MED MED 10 pF Rise Time 10 pF Fall Time 15 pF Rise Time 15 pF Fall Time 22 pF Rise Time 22 pF Fall Time MED MED MED MED 33 pF Rise Time 33 pF Fall Time 47 pF Rise Time 47 pF Fall Time 14,00 12,00 10,00 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 Ambient Temperature [°C] Figure 16: Rise/fall times for Class A1 medium driver setting at VDDP=3.30V Application Note 26 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission 5.6 Rise/fall time diagrams for Class A1+ drivers Weak Driver Rise/Fall Times over Temperature 3.3V Pad Supply; Pad Class A1+ 110,00 100,00 90,00 Rise/Fall Time [ns] WEA 10 pF Rise Time WEA 10 pF Fall Time 80,00 WEA WEA WEA WEA WEA WEA 70,00 60,00 15 pF Rise Time 15 pF Fall Time 22 pF Rise Time 22 pF Fall Time 33 pF Rise Time 33 pF Fall Time WEA 47 pF Rise Time WEA 47 pF Fall Time 50,00 40,00 30,00 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 Ambient Temperature [°C] Figure 17: Rise/fall times for Class A1+ weak driver setting at VDDP=3.30V Medium Driver Rise/Fall Times over Temperature 3.3V Pad Supply; Pad Class A1+ 32,00 30,00 28,00 26,00 MED 10 pF Rise Time MED 10 pF Fall Time Rise/Fall Time [ns] 24,00 MED MED MED MED MED MED 22,00 20,00 18,00 15 pF Rise Time 15 pF Fall Time 22 pF Rise Time 22 pF Fall Time 33 pF Rise Time 33 pF Fall Time MED 47 pF Rise Time MED 47 pF Fall Time 16,00 14,00 12,00 10,00 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 Ambient Temperature [°C] Figure 18: Rise/fall times for Class A1+ medium driver setting at VDDP=3.30V Application Note 27 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Strong Driver Slow-Edge Rise/Fall Times over Temperaure 3.3V Pad Supply; Pad Class A1+ 22,00 21,00 20,00 19,00 18,00 SSL 10 pF Rise Time Rise/Fall Time [ns] 17,00 SSL 10 pF SSL 15 pF SSL 15 pF SSL 22 pF SSL 22 pF SSL 33 pF 16,00 15,00 14,00 Fall Time Rise Time Fall Time Rise Time Fall Time Rise Time SSL 33 pF Fall Time SSL 47 pF Rise Time SSL 47 pF Fall Time 13,00 12,00 11,00 10,00 9,00 8,00 7,00 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 Ambient Temperature [°C] Figure 19: Rise/fall times for Class A1+ strong-slow driver setting at VDDP=3.30V Strong Driver Soft-Edge Rise/Fall Times over Temperature 3.3V Pad Supply; Pad Class A1+ 16,00 15,00 14,00 13,00 12,00 SSO 10 pF Rise Time SSO 10 pF Fall Time Rise/Fall Time [ns] 11,00 SSO 15 pF Rise Time SSO 15 pF Fall Time SSO 22 pF Rise Time SSO 22 pF Fall Time SSO 33 pF Rise Time SSO 33 pF Fall Time 10,00 9,00 8,00 7,00 SSO 47 pF Rise Time SSO 47 pF Fall Time 6,00 5,00 4,00 3,00 2,00 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 Ambient Temperature [°C] Figure 20: Rise/fall times for Class A1+ strong-soft driver setting at VDDP=3.30V Application Note 28 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission 5.7 Rise/fall time diagrams for Class A2 drivers Weak Driver Rise/Fall Times over Temperature 3.3V Pad Supply; Pad Class A2 100,00 90,00 Rise/Fall Time [ns] 80,00 WEA 10 pF Rise Time WEA 10 pF Fall Time WEA WEA WEA WEA WEA WEA 70,00 60,00 15 pF Rise Time 15 pF Fall Time 22 pF Rise Time 22 pF Fall Time 33 pF Rise Time 33 pF Fall Time WEA 47 pF Rise Time WEA 47 pF Fall Time 50,00 40,00 30,00 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 Ambient Temperature [°C] Figure 21: Rise/fall times for Class A2 weak driver setting at VDDP=3.30V Medium Driver Rise/Fall Times over Temperature 3.3V Pad Supply; Pad Class A2 30,00 28,00 Rise/Fall Time [ns] 26,00 24,00 MED 10 pF Rise Time MED 10 pF Fall Time 22,00 18,00 MED MED MED MED MED MED 16,00 MED 47 pF Rise Time MED 47 pF Fall Time 20,00 15 pF Rise Time 15 pF Fall Time 22 pF Rise Time 22 pF Fall Time 33 pF Rise Time 33 pF Fall Time 14,00 12,00 10,00 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 Ambient Temperature [°C] Figure 22: Rise/fall times for Class A2 medium driver setting at VDDP=3.30V Application Note 29 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Strong Driver Soft-Edge Rise/Fall Times over Temperaure 3.3V Pad Supply; Pad Class A2 12,00 11,00 10,00 Rise/Fall Time [ns] SSO 10 pF Rise Time SSO 10 pF Fall Time 9,00 SSO 15 pF Rise Time SSO 15 pF Fall Time SSO 22 pF Rise Time SSO 22 pF Fall Time SSO 33 pF Rise Time SSO 33 pF Fall Time 8,00 7,00 SSO 47 pF Rise Time SSO 47 pF Fall Time 6,00 5,00 4,00 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 Ambient Temperature [°C] Figure 23: Rise/fall times for Class A2 strong-soft driver setting at VDDP=3.30V Strong Driver Medium-Minus-Edge Rise/Fall Times over Temperature 3.3V Pad Supply; Pad Class A2 7,00 6,50 Rise/Fall Time [ns] 6,00 5,50 SMM 10 pF Rise Time SMM 10 pF Fall Time 5,00 4,00 SMM SMM SMM SMM SMM SMM 3,50 SMM 47 pF Rise Time SMM 47 pF Fall Time 4,50 15 pF Rise Time 15 pF Fall Time 22 pF Rise Time 22 pF Fall Time 33 pF Rise Time 33 pF Fall Time 3,00 2,50 2,00 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 Ambient Temperature [°C] Figure 24: Rise/fall times for Class A2 strong-medium-minus driver setting at VDDP=3.30V Application Note 30 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Strong Driver Medium-Edge Rise/Fall Times over Temperature 3.3V Pad Supply; Pad Class A2 4,50 4,00 Rise/Fall Time [ns] 3,50 SME 10 pF Rise Time SME 10 pF Fall Time SME SME SME SME SME SME 3,00 2,50 15 pF Rise Time 15 pF Fall Time 22 pF Rise Time 22 pF Fall Time 33 pF Rise Time 33 pF Fall Time SME 47 pF Rise Time SME 47 pF Fall Time 2,00 1,50 1,00 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 Ambient Temperature [°C] Figure 25: Rise/fall times for Class A2 strong-medium driver setting at VDDP=3.30V Strong Driver Sharp-Minus-Edge Rise/Fall Times over Temperature 3.3V Pad Supply; Pad Class A2 3,50 Rise/Fall Time [ns] 3,00 2,50 SSM 10 pF Rise Time SSM 10 pF Fall Time 2,00 SSM SSM SSM SSM SSM SSM 15 pF Rise Time 15 pF Fall Time 22 pF Rise Time 22 pF Fall Time 33 pF Rise Time 33 pF Fall Time SSM 47 pF Rise Time SSM 47 pF Fall Time 1,50 1,00 0,50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 Ambient Temperature [°C] Figure 26: Rise/fall times for Class A2 strong-sharp-minus driver setting at VDDP=3.30V Application Note 31 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Strong Driver Sharp-Edge Rise/Fall Times over Temperature 3.3V Pad Supply; Pad Class A2 2,50 2,00 Rise/Fall Time [ns] SSH 10 pF Rise Time SSH 10 pF Fall Time SSH SSH SSH SSH SSH SSH 1,50 15 pF Rise Time 15 pF Fall Time 22 pF Rise Time 22 pF Fall Time 33 pF Rise Time 33 pF Fall Time SSH 47 pF Rise Time SSM 47 pF Fall Time 1,00 0,50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 Ambient Temperature [°C] Figure 27: Rise/fall times for Class A2 strong-sharp driver setting at VDDP=3.30V Application Note 32 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission 5.8 Rise/fall time diagrams for increased capacitive loads Weak Driver 150pF Rise/Fall Times over Temperature 3.3V Pad Supply; Pad Classes A1, A1+, A2 240 220 Rise/Fall Time [ns] 200 A2 WEA 150pF Rise Time A2 WEA 150pF Fall Time A1+ WEA 150pF Rise Time A1+ WEA 150pF Fall Time A1 WEA 150pF Rise Time A1 WEA 150pF Fall Time 180 160 140 120 100 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 Ambient Temperature [°C] Figure 28: Rise/fall times for weak driver setting at VDDP=3.30V and 150pF load Medium Driver 150pF Rise/Fall Times over Temperature 3.3V Pad Supply; Pad Classes A1, A1+, A2 70,0 65,0 Rise/Fall Time [ns] 60,0 55,0 A2 MED 150pF Rise Time A2 MED 150pF Fall Time A1+ MED 150pF Rise Time A1+ MED 150pF Fall Time A1 MED 150pF Rise Time A1 MED 150pF Fall Time 50,0 45,0 40,0 35,0 30,0 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 Ambient Temperature [°C] Figure 29: Rise/fall times for medium driver setting at VDDP=3.30V and 150pF load Application Note 33 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Weak Driver 1500pF Rise/Fall Times over Temperature 3.3V Pad Supply; Pad Classes A1, A1+, A2 1900 1800 1700 1600 Rise/Fall Time [ns] 1500 A2 WEA 1500pF Rise Time A2 WEA 1500pF Fall Time A1+ WEA 1500pF Rise Time A1+ WEA 1500pF Fall Time A1 WEA 1500pF Rise Time A1 WEA 1500pF Fall Time 1400 1300 1200 1100 1000 900 800 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 Ambient Temperature [°C] Figure 30: Rise/fall times for weak driver setting at VDDP=3.30V and 1.5nF load Medium Driver 1500pF Rise/Fall Times over Temperature 3.3V Pad Supply; Pad Classes A1, A1+, A2 550 500 Rise/Fall Time [ns] 450 A2 MED 1500pF Rise Time A2 MED 1500pF Fall Time A1+ MED 1500pF Rise Time A1+ MED 1500pF Fall Time A1 MED 1500pF Rise Time A1 MED 1500pF Fall Time 400 350 300 250 200 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 Ambient Temperature [°C] Figure 31: Rise/fall times for weak driver setting at VDDP=3.30V and 1.5nF load Application Note 34 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Weak Driver 20nF Rise/Fall Times over Temperature 3.3V Pad Supply; Pad Classes A1, A1+, A2 24000 22000 Rise/Fall Time [ns] 20000 A2 WEA 20nF Rise Time A2 WEA 20nF Fall Time A1+ WEA 20nF Rise Time A1+ WEA 20nF Fall Time A1 WEA 20nF Rise Time A1 WEA 20nF Fall Time 18000 16000 14000 12000 10000 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 Ambient Temperature [°C] Figure 32: Rise/fall times for weak driver setting at VDDP=3.30V and 20nF load Medium Driver 20nF Rise/Fall Times over Temperature 3.3V Pad Supply; Pad Classes A1, A1+, A2 8000 7000 Rise/Fall Time [ns] 6000 A2 MED 20nF Rise Time A2 MED 20nF Fal lTime A1+ MED 20nF Rise Time A1+ MED 20nF Fall Time A1 MED 20nF Rise Time A1 MED 20nF Fall Time 5000 4000 3000 2000 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 Ambient Temperature [°C] Figure 33: Rise/fall times for weak driver setting at VDDP=3.30V and 20nF load Application Note 35 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Strong Driver Sharp-Edge 100pF Rise/Fall Times over Temperature; 3.3V PadSupply; PadClass A2 4,50 Rise/Fall Time [ns] 4,00 SSH 100 pF Rise Time SSH 100 pF Fall Time 3,50 3,00 2,50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 Ambient Temperature [°C] Figure 34: Rise/fall times for Class A2 strong-sharp driver setting at VDDP=3.30V and 100pF load Application Note 36 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission 6 Measured electromagnetic emission 6.1 Microcontroller operation mode In addition to signal integrity, the scaling of pad drivers helps to reduce electromagnetic emission (EME) caused by switching output pins. This is because slower signal edges produce less high frequency contents in the emission spectra. The following rule should be obeyed when selecting pad driver strength: Use the weakest/slowest driver setting which provides the required signal timing at worst-case operating conditions. Worst-case operating conditions wrt. timing are: - maximal ambient temperature (+140°C) - minimal pad supply voltage (3.30V -5% = 3.13V) - realistic capacitive output load (consider trace length and structure (i.e. PCB layer stack, microstrip or stripline, receiver input loads) - weak driver settings Worst-case operating conditions wrt. electromagnetic emission are: - minimal ambient temperature (-40°C) - maximal pad supply voltage (3.30V +5% = 3.47V) - strong driver settings To illustrate the benefits of driver scaling for low EME, some sample measurement results are provided. The measurements have been performed under the following operating conditions: All function units of the TC1782 were active according Table 9. The pad drivers were active according Table 10. Please note that only special function drivers have been activated; general purpose I/Os (GPIO) stayed inactive. The pad driver settings have been varied according Table 11. All I/Os not listed in Table 11 were inactive. Conducted emission is measured at pad supply (VDDP) according to chapter 5.2.1. Radiated emission is measured in mini-TEM cell according to chapter 5.2.2. Application Note 37 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Function unit Operating mode Settings PLL • system clock generation • system clock = 180.0 MHz CPU • cyclicSPRAM copy (address 0xC0000000 first 8K to last 8K and reverse) • module clock = 180.0 MHz • cycle time = 1.1 µs PCP • 3 tasks executed in cyclic sequential order: • task 1: PMEM read, increment, store (per pointer over data page, address 0xF0050400); pointer store DMI) • task 2: 32 * 32 multiplication • task 3: value DMI rotate ASC0 ASC1 • 8-bit data asynchronous operation • module clock = 80.0 MHz • one stop bit • baud rate = 19.231 kBaud • receiver disabled • deviation from 19.200 kBaud = 0.16 % • 8-bit data synchronous operation • module clock = 80.0 MHz • baud rate = 10.0 MBaud MultiCAN • CAN0 controlled via Transmit Interrupt. • module clock = 40.0 MHz • CAN1 inactive, (ASC1 in use) • baud rate = 1.0 Mbaud • normal divider mode selected • sample point = 65 % • 12 time quanta before sample point • 7 time quanta after sample point • (re)synchronization jump width = 2 time quanta MSC0 • single ended driver used • module clock = 20.0 MHz • LVDS differential Interface disabled • baud rate = 10.0 Mbaud • data repetition mode (content register MSC0_DD = 0x0000A953) MLI0 SSC0+SSC1 • normal divider mode is selected • module clock = 20.0 MHz • endless transmit • baud rate = 10.0 Mbaud • normal divider mode is selected • module clock = 20.0 MHz • configured as SSC master • baud rate = 2.0 Mbaud • transfer data width is 16 bit • transfer/receive MSB first • shift transmit data on the leading clock edge, latch on trailing edge • idle clock line is low, leading clock edge is low-tohigh transition • slave output select leading delay: 1 SCLK periods • slave output select trailing delay: 0 SCLK periods • slave output select inactive delay: 1 SCLK periods • data transmit via receive Interrupt. Application Note 38 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission GPTA0 • normal divider mode selected • module clock = 20.0 MHz • GPTA running at 20 MHz, 32 GTC cells compare a specific GT0 value and toggle their outputs • GTO clock = 2.5 MHz • GT1 clock = max. 3 MHz • Out of 64 LTCs 16 are used as timer with 20 MHz, the other 48 cells use compare. • LTCA2 is only working when GPTA0 is active SCU • SYSCLK (normal mode) • Pin 4.3 (SYSCLK) toggles at 7.5 MHz FADC • fractional divider mode is selected • module clock = 32.031 MHz • channel0 to channel3 convert continuously via neighbour trigger • deviation from 32.000 MHz = 0.10% • 16 channels per autoscan • digital clock = 80 MHz • 10Bit resolution • analog clock = 10 MHz ADC0/1 Table 9: Operating modes and settings of TC1782 function units Active pads Pad function Pad class Driver config. reg. P0.10 E-ray A data out A2 P0_PDR.PD1 P0.11 E-ray B data out A2 P0_PDR.PD1 P0.12 E-ray A enable out A2 P0_PDR.PD1 P0.13 E-ray B enable out A2 P0_PDR.PD1 P0.14 MSC CLK out A1+ P0_PDR.PD1 P0.15 MSC data out A1+ P0_PDR.PD1 P1.8 SSC1 A1+ P1_PDR.PDSSC1B P1.9 SSC1 A1+ P1_PDR.PDSSC1B P1.10 SSC1 A1+ P1_PDR.PDSSC1B P1.11 SSC1 A1+ P1_PDR.PDSSC1B P2.1 MLI A2 P2_PDR.PDMSC0 P2.2 MLI A2 P2_PDR.PDMLI0 P2.3 MLI A2 P2_PDR.PDMLI0 P2.4 MLI A2 P2_PDR.PD0 P2.5 MLI A2 P2_PDR.PDMLI0 P2.6 LED driver A2 P2_PDR.PD0 P2.7 MLI A2 P2_PDR.PD0 P2.8 SSC_SLSO A2 P2_PDR.PDMSC0 P2.9 SSC_SLSO A2 P2_PDR.PDMSC0 P2.10 SSC1_Input A1+ P2_PDR.PDSSC1 P2.11 MSC0 A1+ P2_PDR.PDSSC1 P2.12 MSC0 A1+ P2_PDR.PDSSC1 P2.13 MSC0_Input A1 P2_PDR.PD1 P3.0 RX0DA (A1+) pull-down P3_PDR.PDASC0 P3.1 TX0DA A1+ P3_PDR.PDASC0 Application Note 39 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission P3.2 SSC0 A1+ P3_PDR.PDASC0 P3.3 SSC0 (A1+) pull-down P3_PDR.PDASC0 P3.4 SSC0 A1+ P3_PDR.PDASC0 P3.5 SSC0_SLSO A1+ P3_PDR.PDASC0 P3.6 SSC0_SLSO A1+ P3_PDR.PDASC0 P3.7 SSC0_SLSO A2 P3_PDR.PDASC0 P3.8 RX1DA A2 P3_PDR.PD1 P3.9 TX1DA A1 P3_PDR.PD1 P3.12 RXDCAN0 (A1) pull-down P3_PDR.PD1 P3.13 TXDCAN0 A2 P3_PDR.PD1 P3.14 RXDCAN1 (A1) pull-down P3_PDR.PD1 P3.15 TXDCAN1 A2 P3_PDR.PD1 P4.3 SYSCLK A2 P4_PDR.PDEXTCLK0 P5.8 MLI0_Input A2 P5_PDR.PD2 P5.9 MLI0_Input A2 P5_PDR.PD2 P5.10 MLI0 A2 P5_PDR.PDMLI0 P5.11 MLI0_Input A2 P5_PDR.PD2 P5.12 MLI0 A1+ P5_PDR.PDMLI0 P5.13 MLI0 A1+ P5_PDR.PDMLI0 P5.14 MLI0_Input A1+ P5_PDR.PD2 P5.15 MLI0 A1+ P5_PDR.PDMLI0 P6.0 MSC0 A1 P6_PDR.PD0 P6.1 MSC0 A1 P6_PDR.PD0 P6.2 MSC0 A1 P6_PDR.PD0 P6.3 MSC0 A1 P6_PDR.PD0 Table 10: Active pad drivers Configuration name Class A2 setting Class A1+ setting Class A1 setting SSH strong-sharp strong-soft medium SSM strong-sharp-minus strong-soft medium SME strong-medium strong-soft medium SMM strong-medium-minus strong-soft medium SSO strong-soft strong-soft 1) strong-slow medium 1) strong-slow1) SSL strong-slow MED medium medium medium WEA weak weak weak Table 11: Configurations of pad scaling Application Note 40 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission 6.2 Description of test equipment 6.2.1 Conducted emission test configuration Conducted emission is measured using the standardized 150Ω network, see Figure 30. This network is used for both port and power supply emission measurements. The frequency range is from 150kHz to 1000MHz. For reference purpose, only the emission measured on the supply domain VDDP is documented. Since all digital port pin drivers are supplied by VDDP, the electromagnetic emission on this net is influenced significantly by the driver setting variation. Nevertheless, emission variations can be observed on other power supply domains and on passive (i.e. nonswitching) pad pins as well due to RF coupling in the microcontroller and on the test board. However, VDDP shows the strongest link between driver down-scaling and emission reduction. 150Ω networks are provided for conducted emission measurements according IEC 61967 part 4 and BISS emission test specification. Figure 35: Conducted emission probing points 6.2.2 Radiated emission test configuration Radiated emission is measured using the standard Mini TEM Cell according IEC 61967 part 2 and BISS emission test specification, see Figure 31. The frequency range is from 150kHz to 1000MHz. Figure 36: Radiated emission test setup Application Note 41 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission 6.2.3 Measurement settings Spectrum analyzer: Rohde & Schwarz FSP7 Frequency range: 150kHz to 1GHz Bandwidth RBW: 10kHz Detector type: Peak detector Dwell time: 10ms Pre-Amplifier: internal Measurement time: For all measurements, the emission measurement time (dwell time 10ms) at one frequency is longer than the test software loop duration. Data generation software: Rohde & Schwarz EMIPAK 9950 Environment: Temperature 23°C ±5°C Supply: Nominal voltage ±5% Application Note 42 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission 6.3 Emission test result discussion Note: To eliminate emission effects not caused by the microcontroller, the diagrams in Figures 32 to 43 cut the frequency above 800MHz because of GSM disturbance around 900MHz. In this section electromagnetic emissions are compared for the different driver settings explained in chapter 6.1. The capacitive loads at all switching port pins have been 10pF (Figures 32, 33) and 47pF (Figures 34, 35), respectively. These emission results were obtained at nominal operating conditions, i.e. room temperature (+25°C), and 3.30V pad supply. Result: Significant emission is caused by strong-sharp and strong-medium driver settings. Strong-soft setting causes visible emission only in the low frequency range below 100MHz. Medium and weak settings do not show any significant emission. Table 12 lists average emission damping values caused by different driver settings (0 dB reference is strongsharp setting): Driver setting Emission damping (average approx. numbers) Average toggling speed (1-10 MHz) High toggling speed (>20 MHz) Strong-sharp 0 dB 0 dB Strong-sharp-minus -4 dB -6 dB Strong-medium -6 dB -10 dB Strong-medium-minus -8 dB -15 dB Strong-soft -10 dB -20 dB Strong-slow -10 dB n/a Medium < -10 dB (noise floor) n/a Weak < -10 dB (noise floor) n/a Table 12: Average emission damping from driver settings Figures 36 and 37 indicate the span of electromagnetic emission with respect to extreme values of pad supply voltage (VDDP) and ambient temperature. Therefore, instead of really changing the ambient temperature, VDDP was selected in a way that the resulting switching waveform was similar to the switching waveform at the respective ambient temperature at nominal VDDP. For “SLOW” case VDDP went below 3.13V (VDDPnom -5%) to reflect the even slower transistors switching at +140°C ambient temperature. Vice versa, the “FAST” case was emulated by VDDP exceeding 3.47V, thus reflecting the faster transistor switching at -40°C ambient temperature. Result: Voltage and temperature variation within the microcontroller specification leads to maximal ca. 3dB deviation above and below the emission at nominal conditions. Figures 38 to 43 emphasize the benefit of the 5 available scaling steps in the Class A2 drivers. Therefore, the toggle rate of EXTCLK at port pin P4.3 was selectedto be 22.5MHz, providing a still good signal integrity for strong-soft driver setting, i.e. reaching the 10%/90% signal levels and staying at high/low level ca. 4 times longer than the rise/fall times. Result: Up to 25dB emission reduction can be obtained if the strong-soft driver setting is used instead of the strong-sharp setting. All other strong driver settings range between these extremes. Application Note 43 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Conducted electromagnetic emission 150kHz - 800MHz on I/O supply net for all driver settings at 10pF load VDDP = 3.30V / Ambient temperature = 25°C 30 25 dBµV 20 15 10 5 0 100 200 300 400 500 600 700 800 strong slow medium Frequency/MHz strong sharp strong sharp-minus strong medium strong medium-minus strong soft weak Figure 37: Conducted emission spectra for different driver settings at 10pF Conducted electromagnetic emission zoom 160MHz - 200MHz on I/O supply net for all driver settings at 10pF load VDDP = 3.30V / Ambient temperature = 25°C 30 25 dBµV 20 15 10 5 160 165 170 175 180 185 190 195 200 strong slow medium Frequency/MHz strong sharp strong sharp-minus strong medium strong medium-minus strong soft weak Figure 38: Zoomed conducted noise transfer behaviour for different driver settings at 10pF Application Note 44 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Conducted electromagnetic emission 150kHz - 800MHz on I/O supply net for all driver settings at 47pF load VDDP = 3.30V / Ambient temperature = 25°C 30 25 dBµV 20 15 10 5 0 100 200 300 400 500 600 700 800 strong slow medium Frequency/MHz strong sharp strong sharp-minus strong medium strong medium-minus strong soft weak Figure 39: Conducted emission spectra for different driver settings at 47pF Conducted electromagnetic emission zoom 160MHz - 200MHz on I/O supply net for all driver settings at 47pF load VDDP = 3.30V / Ambient temperature = 25°C 30 25 dBµV 20 15 10 5 160 165 170 175 180 185 190 195 200 strong slow medium Frequency/MHz strong sharp strong sharp-minus strong medium strong medium-minus strong soft weak Figure 40: Zoomed conducted noise transfer behaviour for different driver settings at 47pF Application Note 45 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Conducted electromagnetic emission 150kHz - 800MHz on I/O supply net for strong sharp driver settings at 10pF load slow (VDDP=3.13V/Ta=150°C) / nom (VDDP=3.30V/Ta=25°C) / fast (VDDP=3.47V/Ta=-40°C) 30 25 dBµV 20 15 10 5 0 100 200 300 400 500 600 700 800 Frequency/MHz SLOW 150°C - 3.13V NOM 25°C - 3.30V FAST -40°C - 3.47V Figure 41: Conducted emission spectra for strong-sharp driver setting at 10pF and PVT variation Conducted electromagnetic emission 150kHz - 800MHz on I/O supply net for strong sharp driver settings at 47pF load slow (VDDP=3.13V/Ta=150°C) / nom (VDDP=3.30V/Ta=25°C) / fast (VDDP=3.47V/Ta=-40°C) 30 25 dBµV 20 15 10 5 0 100 200 300 400 500 600 700 800 Frequency/MHz SLOW 150°C - 3,14V NOM 25°C - 3,3V FAST -40°C - 3,47V Figure 42: Conducted emission spectra for strong-sharp driver setting at 47pF and PVT variation Application Note 46 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Conducted electromagnetic emission 150kHz - 800MHz on I/O supply net for all Class A2 strong driver settings at 47pF load VDDP = 3.30V / Ambient temperature = 25°C 40 35 dBµV 30 25 20 15 10 5 0 100 200 300 400 500 600 700 800 Frequency/MHz strong sharp strong sharp-minus strong medium strong medium-minus strong soft Figure 43: Conducted emission spectra for different Class A2 strong driver settings at 47pF Conducted electromagnetic emission 150kHz - 800MHz on I/O supply net VDDP for strong sharp driver setting at 47pF load 40 35 30 dBµV 25 20 15 10 5 0 0 100 200 300 400 500 600 700 800 Frequency/MHz Figure 44: Conducted emission spectrum for strong-sharp driver setting at 47pF Application Note 47 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Conducted electromagnetic emission 150kHz - 800MHz on I/O supply net VDDP for strong sharp-minus driver setting at 47pF load 40 35 30 dBµV 25 20 15 10 5 0 0 100 200 300 400 500 600 700 800 Frequency/MHz Figure 45: Conducted emission spectrum for strong-sharp-minus driver setting at 47pF Conducted electromagnetic emission 150kHz - 800MHz on I/O supply net VDDP for strong medium driver setting at 47pF load 40 35 30 dBµV 25 20 15 10 5 0 0 100 200 300 400 500 600 700 800 Frequency/MHz Figure 46: Conducted emission spectrum for strong-medium driver setting at 47pF Application Note 48 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Conducted electromagnetic emission 150kHz - 800MHz on I/O supply net VDDP for strong medium-minus driver setting at 47pF load 40 35 30 dBµV 25 20 15 10 5 0 0 100 200 300 400 500 600 700 800 Frequency/MHz Figure 47: Conducted emission spectrum for strong-medium-minus driver setting at 47pF Conducted electromagnetic emission 150kHz - 800MHz on I/O supply net VDDP for strong soft driver setting at 47pF load 40 35 30 dBµV 25 20 15 10 5 0 0 100 200 300 400 500 600 700 800 Frequency/MHz Figure 48: Conducted emission spectrum for strong-soft driver setting at 47pF Application Note 49 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Conclusion: Generally all strong driver settings (strong-sharp, strong-sharp-minus, strong-medium, strong-medium-minus, strong-soft) lead to considerable emission. Consequently, all “low-speed” signals up to ca. 5MHz should be driven by medium or weak drivers. All “high-rate” signals above ca. 5MHz require strong driver settings in order to achieve good signal integrity. However, the recommended settings depend not only on the signal’s data rate, but significantly on the external capacitive load, the maximal ambient temperature and additional timing protocol constraints such as maximal slew rate. Detailed selection diagrams for the recommended driver settings depending on given data rates are provided in Chapter 7. Application Note 50 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission 7 Recommended pad driver settings 7.1 Signal categories In the previous chapters, many detailed data was provided for the impact of driver settings and load capacitance on the resulting rise and fall times as well as on conducted and radiated emission. Generally, the required signal integrity determines the selection of driver strength and slew rate for a given toggle rate and capacitive load. However, due to the simultaneous impact on electromagnetic emission, the weakest possible driver setting which still meets the signal integrity should be chosen. To decide for the proper pad driver settings for a signal, its electrical characteristics should be considered. This leads to the definition of signal categories by means of clock or data transfer (AC view) or current driving capability (DC view). According to these views, any signal can be classified as shown in Table 13. Signal category Clock rate Capacitive load DC driving capability System clock >20MHz 10 … 50 pF n/a High-speed data line 5 … 20 MHz 10 … 50 pF n/a Low-speed data line 0.5 … 5 MHz 10 … 50 pF n/a Low-speed control line <1 MHz <20 pF n/a High-current control line n/a n/a 10 … 30 mA Medium-current control line n/a n/a 1 … 10 mA Low-current control line n/a n/a <1 mA Table 13: Signal categories The following settings for pad output drivers are available, see also Table 2: • strong driver / sharp edge (Class A2 only) • strong driver / sharp-minus edge (Class A2 only) • strong driver / medium edge (Class A2 only) • strong driver / medium-minus edge (Class A2 only) • strong driver / soft edge (Classes A1+ and A2 only) • strong driver / slow edge (Class A1+ only) • medium driver / no edge configuration available • weak driver / no edge configuration available Application Note 51 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Driver configuration Edge configuration Signal category Capacitive Load DC Current 1) STRONG SHARP System clock >40MHz Medium 2.5 / 10 mA STRONG MEDIUM System clock >20MHz Low 2.5 / 10 mA High-speed data lines High High-speed data lines Low High-current control lines All Low-speed data lines All Medium-current control lines All Very low-speed control lines All Low-current control line All STRONG MEDIUM SOFT none WEAK none 2.5 / 10 mA 1.0 / 4.0 mA 0.1 / 0.5 mA Table 14: Recommended output driver settings Note 1) : Two values are given for the DC current of I/O pins in the format “nominal / max mA”. The “max mA” value can only be drawn from a pin if maximal 2 other pins in the same 16-bit port group are also driving this maximum current. This restriction is due to danger of electromigration damage. The following parameters determine the final selection of driver settings: • signal performance category (AC and DC) • maximal temperature • maximal acceptable electromagnetic emission 7.2 Decision tables and diagrams Following the recommendations given above, the driver setting selection should be based on (1) proper signal integrity and (2) minimal electromagnetic emission. Since electromagnetic emission increases with stronger driver settings, the weakest driver and slew rate settings should be selected that are able to provide the rise/fall times required for the desired signal integrity. This chapter offers decision numbers in table and graphical format for proper driver settings at maximum clock or data rates expected to be driven. The rise/fall times occupy 1/6th of the clock period each, see Figure 44. If other rise/fall-to-period ratios are of interest, the given data rate values must be multiplied with “desired_ratio divided by 1/6”, see Table 15. Ratio rise/fall time1) to period Multiply all given frequency values by: 1/20 0.3 1/10 0.6 1/8 0.75 1/6 1.0 1/4 1.5 Table 15: Correction factors for different edge-to-period ratios Note 1) : To calculate the ratio, please select the shorter one from rise and fall time. Application Note 52 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 49: Assumed rise/fall timing conditions related to signal period T Please note that all values given in this chapter are proposals for system application designers using Infineon TC1782 microcontrollers in 90nm CMOS technology. They are based on timing measurements performed on center lot devices. Thus all values are subject to less than 10% offset depending according fabrication process variation. Additionally, pad supply voltages different from nominal conditions impact the resulting timing. The finally selected driver setting should consider these facts. The decision tables provided in sections 6.2.1 (pad class A2), 6.2.2 (pad class A1+) and 6.2.3 (pad class A1) should be handled in the following way: • I/O supply voltage has nominal value (VDDP=3.30V) except for WORST and BEST cases. • Several ambient temperatures are distinguished by color: Æ wide-spread industrial IC temperature specifications: 125°C, 110°C, 85°C, 70°C. Æ 140°C / -40°C as maximal / minimal ambient temperatures for TC1782 during operation. Æ 25°C as room temperature. Æ WORST case: measured at -40°C with increased I/O supply voltage (VDDP=3.30V+5%=3.47V). Æ BEST case: measured at 140°C with decreased I/O supply voltage (VDDP=3.30V-5%=3.13V). • All values are given in [MHz]; they represent the maximal data rate possible under the named conditions in case the rise and fall time occupy 1/6 of the clock period. • The strong-sharp driver is additionally characterized with 100pF load according specification. • The weak driver is additionally characterized with 20nF load according specification. The driver settings in the decision tables and in the decision diagrams are named as follows: • SSH=strong-sharp SSM = strong-sharp-minus SME = strong-medium SMM = strong-medium-minus SSO = strong-soft SSL = strong-slow MED = medium WEA = weak Application Note 53 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 45 shows an example of a decision diagram. The title of each diagram indicates the conditions (Edge-toperiod ratio, I/O voltage VDDP, ambient temperature) for the shown values: Edge is alwaysr “T/6” (meaning the rise time and the fall time take each 1/6 of the data rate period). Voltage indicates the I/O pad supply voltage VDDP and is nominal “3.30V”. “Best case” conditions are -40°C and VDDP=3.13V (VDDPnom-5%); “worst case” conditions are +140°C and VDDP=3.47V (VDDPnom+5%). Temperature indicates the ambient temperature and is one of the following values: “-40°C”, “+25°C”, “+70°C”, “+85°C”, “+110°C”, “+125°C” or “+140°C”. The maximal clock/data rate (“Frequency”) to meet good signal integrity is given in [MHz] for capacitive loads from 10pF to 47pF. After selecting the crossing point of the driver load and the desired data rate, the suggested driver can be read out of the diagram. Figure 45 gives four examples, marked with red circles A to D: Circle A marks 2MHz data rate at 25pF load. Since the center of the circle stays below the green line, the weak driver is recommended. Circle B marks 4MHz at 17pF and selects the medium driver since it stays below the blue line. Circle C marks 8MHz at 30pF and suggests the strong-soft setting (below yellow line). Circle D marks 33MHz at 20pF and recommends the strong-medium driver (below red line). Like in Figure 45 (Ta=+140°C), it is always recommended to take the decision diagram for the highest ambient operating temperature of the microcontroller. General rule: Select always the weakest possible driver which is able to toggle the maximal desired data rate at the given external load and temperature. Please note that according Table 3, several driver settings are available in several pad classes. Since there are small deviations among same driver scaling in different pad classes, please refer always to the decision diagram of the correct pad class (A1, A1+, A2). Figure 50: Driver decision diagram example Application Note 54 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission 7.2.1 Decision table for pad class A2 15pF 160,79 72,46 52,58 32,06 17,41 8,03 2,39 22pF 133,84 65,90 48,78 29,27 16,78 7,63 2,26 33pF 100,99 56,88 42,44 26,18 15,40 6,69 1,97 47pF 100pF 150pF 74,30 57,38 47,85 38,99 23,89 14,49 5,63 2,83 1,70 0,81 1500pF 20nF SSH SSM SME SMM SSO MED WEA 10pF 189,97 88,91 59,65 35,63 18,95 9,31 2,74 0,371 0,101 0,02648 0,00780 15pF 165,02 75,08 54,64 32,87 17,41 8,35 2,48 22pF 136,61 68,03 50,20 30,14 16,78 7,85 2,33 33pF 103,52 58,69 43,98 27,01 15,40 6,95 2,04 47pF 100pF 150pF 76,45 59,10 49,46 39,87 23,89 14,91 5,84 2,92 1,76 0,83 1500pF 20nF SSH SSM SME SMM SSO MED WEA 10pF 196,31 90,09 61,96 36,39 18,95 9,57 2,84 0,381 0,103 0,02684 0,00801 15pF 169,24 77,69 56,71 33,69 18,47 8,66 2,58 22pF 139,38 70,15 51,62 31,01 17,66 8,07 2,40 33pF 106,05 60,49 45,51 27,84 16,41 7,20 2,11 47pF 100pF 150pF 78,61 60,82 51,07 40,75 25,13 15,32 6,06 3,01 1,82 0,86 1500pF 20nF SSH SSM SME SMM SSO MED WEA 10pF 202,65 91,27 64,26 37,15 20,08 9,83 2,95 0,390 0,105 0,02720 0,00821 15pF 176,38 82,09 60,04 34,90 19,30 9,18 2,74 22pF 143,67 73,67 53,79 32,41 18,35 8,42 2,51 33pF 109,99 63,48 47,99 29,08 17,18 7,61 2,22 47pF 100pF 150pF 82,18 63,56 53,63 42,10 26,05 15,96 6,41 3,16 1,91 0,90 1500pF 20nF SSH SSM SME SMM SSO MED WEA 10pF 212,85 92,37 67,92 38,09 20,90 10,18 3,11 0,407 0,108 0,02766 0,00854 10pF 219,53 95,79 70,59 39,69 21,73 10,65 3,24 15pF 180,08 84,35 62,15 36,04 19,95 9,54 2,84 22pF 146,57 75,18 55,73 33,54 19,03 8,76 2,61 33pF 113,10 65,58 49,63 30,29 17,88 7,92 2,32 47pF 100pF 150pF 84,23 65,71 55,60 43,33 27,04 16,52 6,65 3,27 1,99 0,92 1500pF 20nF SSH SSM SME SMM SSO MED WEA 0,415 0,111 0,02838 0,00875 140°C 125°C 110°C 85°C 70°C Application Note 55 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Decision table for pad class A2 (continued): 10pF 242,60 107,53 79,37 45,05 24,55 12,19 3,67 15pF 192,01 92,08 69,44 39,78 22,13 10,58 3,20 22pF 158,73 82,51 61,96 36,47 20,58 9,51 2,85 33pF 123,46 74,07 55,19 34,08 19,98 8,87 2,61 47pF 100pF 150pF 91,07 72,05 61,50 47,08 29,87 18,20 7,30 3,58 2,20 0,99 1500pF 20nF SSH SSM SME SMM SSO MED WEA 0,439 0,119 0,03069 0,00932 10pF 268,82 123,46 91,58 52,74 27,32 14,42 4,40 15pF 199,60 104,82 79,37 45,91 24,58 12,48 3,75 22pF 163,40 93,63 71,53 42,52 23,44 11,22 3,35 33pF 132,28 84,18 64,35 39,59 22,74 10,47 3,08 47pF 100pF 150pF 97,47 78,13 68,87 53,42 34,08 20,65 8,54 4,11 2,52 1,12 1500pF 20nF SSH SSM SME SMM SSO MED WEA 0,489 0,132 0,03243 0,01006 10pF 174,61 77,75 56,52 31,92 17,74 8,83 2,60 15pF 156,75 70,46 51,19 30,51 16,83 7,92 2,34 22pF 124,25 60,42 44,29 26,34 S81 7,02 2,09 33pF 99,43 53,84 41,27 24,86 14,53 6,43 1,93 47pF 100pF 150pF 68,26 54,39 45,55 36,05 22,79 13,80 5,53 2,76 1,63 0,76 1500pF 20nF SSH SSM SME SMM SSO MED WEA 0,357 0,097 0,02474 0,00746 15pF 214,50 113,38 85,03 49,46 27,32 13,25 4,04 22pF 170,07 96,34 75,08 44,33 25,29 11,81 3,55 33pF 133,33 86,81 66,67 41,25 23,91 ?T87 3,17 47pF 100pF 150pF 99,21 79,11 71,84 55,93 36,15 21,73 9,02 4,07 2,66 1,15 1500pF 20nF SSH SSM SME SMM SSO MED WEA 10pF 269,69 130,21 94,16 53,76 28,99 14,56 4,53 0,502 0,137 0,03388 0,01050 25°C -40°C WORST BEST Application Note 56 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission 7.2.2 Decision table for pad class A1+ 15pF 21,50 4,11 7,99 2,42 22pF 20,43 10,32 7,72 2,19 33pF 15,78 9,35 6,83 2,05 47pF 10,76 7,64 5,20 1,64 150pF 1500pF 20nF SSO SSL MED WEA 10pF 31,11 13,19 9,53 2,93 2,55 0,76 0,312 0,092 0,0246 0,00767 15pF 22,22 11,65 8,29 2,51 22pF 20,76 10,69 7,91 2,29 33pF 15,98 9,68 7,01 2,11 47pF 11,00 7,93 5,42 1,72 150pF 1500pF 20nF SSO SSL MED WEA 10pF 31,69 13,52 9,74 2,98 2,62 0,78 0,316 0,094 0,0250 0,00780 15pF 22,95 12,05 8,59 2,60 22pF 21,08 11,06 8,11 2,39 33pF 16,18 10,02 7,19 2,17 47pF 11,24 8,22 5,65 1,79 150pF 1500pF 20nF SSO SSL MED WEA 10pF 32,26 13,85 9,94 3,03 2,69 0,80 0,320 0,095 0,0254 0,00793 15pF 24,12 12,68 9,06 2,74 22pF 21,46 11,61 8,37 2,54 33pF I139 10,59 7,45 2,27 47pF 11,65 8,73 6,04 1,92 150pF 1500pF 20nF SSO SSL MED WEA 10pF 33,02 14,31 10,21 3,09 2,80 0,83 0,325 0,098 0,0260 0,00812 10pF 33,90 14,94 10,63 3,23 15pF 24,68 13,19 9,41 2,86 22pF 22,04 12,11 8,71 2,64 33pF 16,92 10,92 7,73 2,35 47pF 11,90 8,93 6,22 1,97 150pF 1500pF 20nF SSH SSM SME SMM 2,88 0,84 0,333 0,101 0,0268 0,00828 10pF 15pF 22pF SSO 37,54 27,55 24,73 SSL 16,65 14,92 13,89 MED 11,79 10,58 9,86 WEA 3,65 3,21 3,00 33pF 18,34 12,12 8,64 2,60 47pF 12,59 9,61 6,79 2,14 150pF 1500pF 20nF 3,16 0,92 0,356 0,109 0,0290 0,00886 33pF 20,48 13,94 10,00 3,06 47pF 13,76 12,04 7,97 2,48 150pF 1500pF 20nF 3,45 1,02 0,391 0,118 0,0310 0,00968 140°C 125°C 110°C 85°C 70°C 25°C -40°C SSO SSL MED WEA Application Note 10pF 41,46 19,16 13,75 4,27 15pF 30,14 16,95 12,04 3,78 22pF 26,97 15,87 11,40 3,50 57 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Decision table for pad class A1+ (continued): 15pF 21,85 10,89 7,68 2,42 22pF 18,87 10,47 7,96 2,35 33pF 15,53 9,07 6,56 1,94 47pF 10,86 7,59 5,37 1,61 150pF 1500pF 20nF SSO SSL MED WEA 10pF 28,15 12,10 8,61 2,71 2,46 0,72 0,291 0,089 0,0238 0,00726 15pF 30,25 17,49 12,57 3,88 22pF 27,69 16,58 11,90 3,64 33pF 20,94 14,28 10,18 3,15 47pF 14,15 11,14 7,86 2,49 150pF 1500pF 20nF SSO SSL MED WEA 10pF 42,74 19,82 14,39 4,41 3,60 1,04 0,405 0,123 0,0319 0,01 WORST BEST Application Note 58 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission 7.2.3 Decision table for pad class A1 10pF 15pF 22pF 33pF 47pF MED 8,92 7,88 7,76 6,66 5,50 WEA 2,96 2,39 2,29 2,04 1,68 150pF 2,65 0,79 1500pF 20nF 0,320 0,02515 0,104 0,00734 MED WEA 10pF 15pF 22pF 33pF 47pF 9,35 8,17 8,02 6,91 5,66 3,02 2,46 2,37 2,10 1,74 150pF 2,71 0,81 1500pF 20nF 0,325 0,02560 0,107 0,00749 MED WEA 10pF 15pF 22pF 33pF 47pF 9,78 8,45 8,27 7,16 5,82 3,08 2,53 2,45 2,15 1,80 150pF 2,77 0,82 1500pF 20nF 0,330 0,02606 0,109 0,00764 85°C 10pF 15pF 22pF 33pF 47pF MED 10,48 8,90 8,67 7,57 6,08 WEA 3,15 2,64 2,58 2,25 1,90 150pF 2,86 0,85 1500pF 20nF 0,336 0,02676 0,114 0,00787 70°C 10pF 15pF 22pF 33pF 47pF SME 10,89 9,23 9,00 7,83 6,37 SMM 3,28 2,75 2,68 2,33 1,97 150pF 2,95 0,87 1500pF 20nF 0,344 0,02740 0,114 0,00806 25°C 10pF 15pF 22pF 33pF 47pF MED 12,28 10,34 10,10 8,53 6,85 WEA 3,70 3,08 2,99 2,60 2,18 150pF 3,22 0,95 1500pF 20nF 0,364 0,02924 0,117 0,00872 -40°C 10pF 15pF 22pF 33pF 47pF MED 14,12 11,81 11,49 9,96 7,71 WEA 4,32 3,59 3,47 3,02 2,49 150pF 3,55 1,07 1500pF 20nF 0,408 0,03211 0,129 0,00936 10pF 15pF 22pF 33pF 47pF 8,69 7,71 7,52 6,26 5,45 2,57 2,27 2,20 1,91 1,66 150pF 2,52 0,75 1500pF 20nF 0,320 0,02464 0,094 0,00714 10pF 15pF 22pF 33pF 47pF 150pF MED 21,87 18,36 17,56 15,19 11,66 5,50 WEA 6,75 3,20 5,36 4,68 3,78 1,63 1500pF 20nF 0,385 0,04854 0,200 0,00966 140°C 125°C 110°C WORST MED WEA BEST Application Note 59 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission 7.2.4 Decision diagrams for pad class A2 Frequency Limits, Edge=T/6, VDDP=3.13V, Ta=+140°C Pad Class A2 Frequency [MHz] 1000,00 SSH SSM SME SMM SSO MED WEA 100,00 10,00 1,00 10 20 30 40 50 60 70 80 90 100 C load [pF] Figure 51: Class A2 driver selection diagram for WORST case TA=140°C; VDDP=3.13V; edges=1/6 period Frequency Limits, Edge=T/6, VDDP=3.30V, Ta=+140°C Pad Class A2 Frequency [MHz] 1000,00 SSH SSM SME SMM SSO MED WEA 100,00 10,00 1,00 10 20 30 40 50 60 70 80 90 100 C load [pF] Figure 52: Class A2 driver selection diagram for TA=140°C; VDDP=3.30V; edges=1/6 period Application Note 60 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Frequency Limits, Edge=T/6, VDDP=3.30V, Ta=+125°C Pad Class A2 Frequency [MHz] 1000,00 SSH SSM SME SMM SSO MED WEA 100,00 10,00 1,00 10 20 30 40 50 60 70 80 90 100 C load [pF] Figure 53: Class A2 driver selection diagram for TA=125°C; VDDP=3.30V; edges=1/6 period Frequency Limits, Edge=T/6, VDDP=3.30V, Ta=+110°C Pad Class A2 Frequency [MHz] 1000,00 SSH SSM SME SMM SSO MED WEA 100,00 10,00 1,00 10 20 30 40 50 60 70 80 90 100 C load [pF] Figure 54 Class A2 driver selection diagram for TA=110°C; VDDP=3.30V; edges=1/6 period Application Note 61 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Frequency Limits, Edge=T/6, VDDP=3.30V, Ta=+85°C Pad Class A2 Frequency [MHz] 1000,00 SSH SSM SME SMM SSO MED WEA 100,00 10,00 1,00 10 20 30 40 50 60 70 80 90 100 C load [pF] Figure 55: Class A2 driver selection diagram for TA=85°C; VDDP=3.30V; edges=1/6 period Frequency Limits, Edge=T/6, VDDP=3.30V, Ta=+70°C Pad Class A2 Frequency [MHz] 1000,00 SSH SSM SME SMM SSO MED WEA 100,00 10,00 1,00 10 20 30 40 50 60 70 80 90 100 C load [pF] Figure 56: Class A2 driver selection diagram for TA=70°C; VDDP=3.30V; edges=1/6 period Application Note 62 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Frequency Limits, Edge=T/6, VDDP=3.30V, Ta=+25°C Pad Class A2 Frequency [MHz] 1000,00 SSH SSM SME SMM SSO MED WEA 100,00 10,00 1,00 10 20 30 40 50 60 70 80 90 100 C load [pF] Figure 57: Class A2 driver selection diagram for TA=25°C; VDDP=3.30V; edges=1/6 period Frequency Limits, Edge=T/6, VDDP=3.30V, Ta=-40°C Pad Class A2 Frequency [MHz] 1000,00 SSH SSM SME SMM SSO MED WEA 100,00 10,00 1,00 10 20 30 40 50 60 70 80 90 100 C load [pF] Figure 58: Class A2 driver selection diagram for TA=-40°C; VDDP=3.30V; edges=1/6 period Application Note 63 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Frequency Limits, Edge=T/6, VDDP=3.47V, Ta=-40°C Pad Class A2 Frequency [MHz] 1000,00 SSH SSM SME SMM SSO MED WEA 100,00 10,00 1,00 10 20 30 40 50 60 70 80 90 100 C load [pF] Figure 59: Class A2 driver selection diagram for BEST case TA=-40°C; VDDP=3.47V; edges=1/6 period Application Note 64 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission 7.2.5 Decision diagrams for pad class A1+ Frequency Limits, Edge=T/6, VDDP=3.13V, Ta=+140°C Pad Class A1+ Frequency [MHz] 100,00 SSO SSL MED WEA 10,00 1,00 10 15 20 25 30 35 40 45 C load [pF] Figure 60: Class A1+ driver selection diagram for WORST case TA=140°C; VDDP=3.13V; edges=1/6 period Frequency Limits, Edge=T/6, VDDP=3.30V, Ta=+140°C Pad Class A1+ Frequency [MHz] 100,00 SSO SSL MED WEA 10,00 1,00 10 15 20 25 30 35 40 45 C load [pF] Figure 61: Class A1+ driver selection diagram for TA=140°C; VDDP=3.30V; edges=1/6 period Application Note 65 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Frequency Limits, Edge=T/6, VDDP=3.30V, Ta=+125°C Pad Class A1+ 45,00 40,00 Frequency [MHz] 35,00 30,00 SSO SSL MED WEA 25,00 20,00 15,00 10,00 5,00 0,00 10 15 20 25 30 35 40 45 C load [pF] Figure 62: Class A1+ driver selection diagram for TA=125°C; VDDP=3.30V; edges=1/6 period Frequency Limits, Edge=T/6, VDDP=3.30V, Ta=+110°C Pad Class A1+ 45,00 40,00 Frequency [MHz] 35,00 30,00 SSO SSL MED WEA 25,00 20,00 15,00 10,00 5,00 0,00 10 15 20 25 30 35 40 45 C load [pF] Figure 63 Class A1+ driver selection diagram for TA=110°C; VDDP=3.30V; edges=1/6 period Application Note 66 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Frequency Limits, Edge=T/6, VDDP=3.30V, Ta=+85°C Pad Class A1+ 45,00 40,00 Frequency [MHz] 35,00 30,00 SSO SSL MED WEA 25,00 20,00 15,00 10,00 5,00 0,00 10 15 20 25 30 35 40 45 C load [pF] Figure 64: Class A1+ driver selection diagram for TA=85°C; VDDP=3.30V; edges=1/6 period Frequency Limits, Edge=T/6, VDDP=3.30V, Ta=+70°C Pad Class A1+ 45,00 40,00 Frequency [MHz] 35,00 30,00 SSO SSL MED WEA 25,00 20,00 15,00 10,00 5,00 0,00 10 15 20 25 30 35 40 45 C load [pF] Figure 65: Class A1+ driver selection diagram for TA=70°C; VDDP=3.30V; edges=1/6 period Application Note 67 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Frequency Limits, Edge=T/6, VDDP=3.30V, Ta=+25°C Pad Class A1+ 45,00 40,00 Frequency [MHz] 35,00 30,00 SSO SSL MED WEA 25,00 20,00 15,00 10,00 5,00 0,00 10 15 20 25 30 35 40 45 C load [pF] Figure 66: Class A1+ driver selection diagram for TA=25°C; VDDP=3.30V; edges=1/6 period Frequency Limits, Edge=T/6, VDDP=3.30V, Ta=-40°C Pad Class A1+ 45,00 40,00 Frequency [MHz] 35,00 30,00 SSO SSL MED WEA 25,00 20,00 15,00 10,00 5,00 0,00 10 15 20 25 30 35 40 45 C load [pF] Figure 67: Class A1+ driver selection diagram for TA=-40°C; VDDP=3.30V; edges=1/6 period Application Note 68 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Frequency Limits, Edge=T/6, VDDP=3.47V, Ta=-40°C Pad Class A1+ 45,00 40,00 Frequency [MHz] 35,00 30,00 SSO SSL MED WEA 25,00 20,00 15,00 10,00 5,00 0,00 10 15 20 25 30 35 40 45 C load [pF] Figure 68: Class A1+ driver selection diagram for BEST case TA=-40°C; VDDP=3.47V; edges=1/6 period Application Note 69 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission 7.2.6 Decision diagrams for pad class A1 Frequency [MHz] Frequency Limits, Edge=T/6, VDDP=3.13V, Ta=+140°C Pad Class A1 15,00 14,00 13,00 12,00 11,00 10,00 9,00 8,00 7,00 6,00 5,00 4,00 3,00 2,00 1,00 0,00 MED WEA 10 15 20 25 30 35 40 45 C load [pF] Figure 69: Class A1 driver selection diagram for WORST case TA=140°C; VDDP=3.13V; edges=1/6 period Frequency [MHz] Frequency Limits, Edge=T/6, VDDP=3.30V, Ta=+140°C Pad Class A1 15,00 14,00 13,00 12,00 11,00 10,00 9,00 8,00 7,00 6,00 5,00 4,00 3,00 2,00 1,00 0,00 MED WEA 10 15 20 25 30 35 40 45 C load [pF] Figure 70: Class A1 driver selection diagram for TA=140°C; VDDP=3.30V; edges=1/6 period Application Note 70 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Frequency [MHz] Frequency Limits, Edge=T/6, VDDP=3.30V, Ta=+125°C Pad Class A1 15,00 14,00 13,00 12,00 11,00 10,00 9,00 8,00 7,00 6,00 5,00 4,00 3,00 2,00 1,00 0,00 MED WEA 10 15 20 25 30 35 40 45 C load [pF] Figure 71: Class A1 driver selection diagram for TA=125°C; VDDP=3.30V; edges=1/6 period Frequency [MHz] Frequency Limits, Edge=T/6, VDDP=3.30V, Ta=+110°C Pad Class A1 15,00 14,00 13,00 12,00 11,00 10,00 9,00 8,00 7,00 6,00 5,00 4,00 3,00 2,00 1,00 0,00 MED WEA 10 15 20 25 30 35 40 45 C load [pF] Figure 72: Class A1 driver selection diagram for TA=110°C; VDDP=3.30V; edges=1/6 period Application Note 71 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Frequency [MHz] Frequency Limits, Edge=T/6, VDDP=3.30V, Ta=+85°C Pad Class A1 15,00 14,00 13,00 12,00 11,00 10,00 9,00 8,00 7,00 6,00 5,00 4,00 3,00 2,00 1,00 0,00 MED WEA 10 15 20 25 30 35 40 45 C load [pF] Figure 73: Class A1 driver selection diagram for TA=85°C; VDDP=3.30V; edges=1/6 period Frequency [MHz] Frequency Limits, Edge=T/6, VDDP=3.30V, Ta=+70°C Pad Class A1 15,00 14,00 13,00 12,00 11,00 10,00 9,00 8,00 7,00 6,00 5,00 4,00 3,00 2,00 1,00 0,00 MED WEA 10 15 20 25 30 35 40 45 C load [pF] Figure 74: Class A1 driver selection diagram for TA=70°C; VDDP=3.30V; edges=1/6 period Application Note 72 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Frequency [MHz] Frequency Limits, Edge=T/6, VDDP=3.30V, Ta=+25°C Pad Class A1 15,00 14,00 13,00 12,00 11,00 10,00 9,00 8,00 7,00 6,00 5,00 4,00 3,00 2,00 1,00 0,00 MED WEA 10 15 20 25 30 35 40 45 C load [pF] Figure 75: Class A1 driver selection diagram for TA=25°C; VDDP=3.30V; edges=1/6 period Frequency [MHz] Frequency Limits, Edge=T/6, VDDP=3.30V, Ta=-40°C Pad Class A1 15,00 14,00 13,00 12,00 11,00 10,00 9,00 8,00 7,00 6,00 5,00 4,00 3,00 2,00 1,00 0,00 MED WEA 10 15 20 25 30 35 40 45 C load [pF] Figure 76: Class A1 driver selection diagram for TA=-40°C; VDDP=3.30V; edges=1/6 period Application Note 73 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Frequency [MHz] Frequency Limits, Edge=T/6, VDDP=3.47V, Ta=-40°C Pad Class A1 15,00 14,00 13,00 12,00 11,00 10,00 9,00 8,00 7,00 6,00 5,00 4,00 3,00 2,00 1,00 0,00 MED WEA 10 15 20 25 30 35 40 45 C load [pF] Figure 77: Class A1 driver selection diagram for BEST case TA=-40°C; VDDP=3.47V; edges=1/6 period Application Note 74 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission 7.2.7 Decision diagrams for weak driver at high capacitive load Frequency Limits Weak Driver, Edge=T/6, VDDP=3.13V, Ta=+140°C Pad Classes A1, A1+, A2 10,000 Frequency [MHz] 1,000 Class A1 Class A1+ Class A2 0,100 0,010 0,001 10 100 1000 10000 100000 C load [pF] Figure 78: Weak driver load capability diagram for WORST case TA=140°C; VDDP=3.13V; edges=1/6 per. Frequency Limits Weak Driver, Edge=T/6, VDDP=3.30V, Ta=+140°C Pad Classes A1, A1+, A2 10,000 Frequency [MHz] 1,000 Class A1 Class A1+ Class A2 0,100 0,010 0,001 10 100 1000 10000 100000 C load [pF] Figure 79: Weak driver load capability diagram for TA=140°C; VDDP=3.30V; edges=1/6 period Application Note 75 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Frequency Limits Weak Driver, Edge=T/6, VDDP=3.30V, Ta=+125°C Pad Classes A1, A1+, A2 10,000 Frequency [MHz] 1,000 Class A1 Class A1+ Class A2 0,100 0,010 0,001 10 100 1000 10000 100000 C load [pF] Figure 80: Weak driver load capability diagram for TA=125°C; VDDP=3.30V; edges=1/6 period Frequency Limits Weak Driver, Edge=T/6, VDDP=3.30V, Ta=+110°C Pad Classes A1, A1+, A2 10,000 Frequency [MHz] 1,000 Class A1 Class A1+ Class A2 0,100 0,010 0,001 10 100 1000 10000 100000 C load [pF] Figure 81: Weak driver load capability diagram for TA=110°C; VDDP=3.30V; edges=1/6 period Application Note 76 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Frequency Limits Weak Driver, Edge=T/6, VDDP=3.30V, Ta=+85°C Pad Classes A1, A1+, A2 10,000 Frequency [MHz] 1,000 Class A1 Class A1+ Class A2 0,100 0,010 0,001 10 100 1000 10000 100000 C load [pF] Figure 82: Weak driver load capability diagram for TA=85°C; VDDP=3.30V; edges=1/6 period Frequency Limits Weak Driver, Edge=T/6, VDDP=3.30V, Ta=+70°C Pad Classes A1, A1+, A2 10,000 Frequency [MHz] 1,000 Class A1 Class A1+ Class A2 0,100 0,010 0,001 10 100 1000 10000 100000 C load [pF] Figure 83: Weak driver load capability diagram for TA=70°C; VDDP=3.30V; edges=1/6 period Application Note 77 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Frequency Limits Weak Driver, Edge=T/6, VDDP=3.30V, Ta=+25°C Pad Classes A1, A1+, A2 10,000 Frequency [MHz] 1,000 Class A1 Class A1+ Class A2 0,100 0,010 0,001 10 100 1000 10000 100000 C load [pF] Figure 84: Weak driver load capability diagram for TA=25°C; VDDP=3.30V; edges=1/6 period Frequency Limits Weak Driver, Edge=T/6, VDDP=3.30V, Ta=-40°C Pad Classes A1, A1+, A2 10,000 Frequency [MHz] 1,000 Class A1 Class A1+ Class A2 0,100 0,010 0,001 10 100 1000 10000 100000 C load [pF] Figure 85: Weak driver load capability diagram for TA=-40°C; VDDP=3.30V; edges=1/6 period Application Note 78 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Frequency Limits Weak Driver, Edge=T/6, VDDP=3.47V, Ta=-40°C Pad Classes A1, A1+, A2 10,000 Frequency [MHz] 1,000 Class A1 Class A1+ Class A2 0,100 0,010 0,001 10 100 1000 10000 100000 C load [pF] Figure 86: Weak driver load capability diagram for BEST case TA=-40°C; VDDP=3.47V; edges=1/6 period Application Note 79 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission 7.2.8 Decision diagrams for medium driver at high capacitive load Frequency Limits Medium Driver, Edge=T/6, VDDP=3.13V, Ta=+140°C Pad Classes A1, A1+, A2 100,000 Frequency [MHz] 10,000 Class A1 Class A1+ Class A2 1,000 0,100 0,010 10 100 1000 10000 100000 C load [pF] Figure 87: Medium driver load capability diagram WORST case TA=140°C; VDDP=3.13V; edges=1/6 per. Frequency Limits Medium Driver, Edge=T/6, VDDP=3.30V, Ta=+140°C Pad Classes A1, A1+, A2 100,000 Frequency [MHz] 10,000 Class A1 Class A1+ Class A2 1,000 0,100 0,010 10 100 1000 10000 100000 C load [pF] Figure 88: Medium driver load capability diagram for TA=140°C; VDDP=3.30V; edges=1/6 period Application Note 80 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Frequency Limits Medium Driver, Edge=T/6, VDDP=3.30V, Ta=+125°C Pad Classes A1, A1+, A2 100,000 Frequency [MHz] 10,000 Class A1 Class A1+ Class A2 1,000 0,100 0,010 10 100 1000 10000 100000 C load [pF] Figure 89: Medium driver load capability diagram for TA=125°C; VDDP=3.30V; edges=1/6 period Frequency Limits Medium Driver, Edge=T/6, VDDP=3.30V, Ta=+110°C Pad Classes A1, A1+, A2 100,000 Frequency [MHz] 10,000 Class A1 Class A1+ Class A2 1,000 0,100 0,010 10 100 1000 10000 100000 C load [pF] Figure 90: Medium driver load capability diagram for TA=110°C; VDDP=3.30V; edges=1/6 period Application Note 81 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Frequency Limits Medium Driver, Edge=T/6, VDDP=3.30V, Ta=+85°C Pad Classes A1, A1+, A2 100,000 Frequency [MHz] 10,000 Class A1 Class A1+ Class A2 1,000 0,100 0,010 10 100 1000 10000 100000 C load [pF] Figure 91: Medium driver load capability diagram for TA=85°C; VDDP=3.30V; edges=1/6 period Frequency Limits Medium Driver, Edge=T/6, VDDP=3.30V, Ta=+70°C Pad Classes A1, A1+, A2 100,000 Frequency [MHz] 10,000 Class A1 Class A1+ Class A2 1,000 0,100 0,010 10 100 1000 10000 100000 C load [pF] Figure 92: Medium driver load capability diagram for TA=70°C; VDDP=3.30V; edges=1/6 period Application Note 82 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Frequency Limits Medium Driver, Edge=T/6, VDDP=3.30V, Ta=+25°C Pad Classes A1, A1+, A2 100,000 Frequency [MHz] 10,000 Class A1 Class A1+ Class A2 1,000 0,100 0,010 10 100 1000 10000 100000 C load [pF] Figure 93: Medium driver load capability diagram for TA=25°C; VDDP=3.30V; edges=1/6 period Frequency Limits Medium Driver, Edge=T/6, VDDP=3.30V, Ta=-40°C Pad Classes A1, A1+, A2 100,000 Frequency [MHz] 10,000 Class A1 Class A1+ Class A2 1,000 0,100 0,010 10 100 1000 10000 100000 C load [pF] Figure 94: Medium driver load capability diagram for TA=-40°C; VDDP=3.30V; edges=1/6 period Application Note 83 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Frequency Limits Medium Driver, Edge=T/6, VDDP=3.47V, Ta=-40°C Pad Classes A1, A1+, A2 100,000 Frequency [MHz] 10,000 Class A1 Class A1+ Class A2 1,000 0,100 0,010 10 100 1000 10000 100000 C load [pF] Figure 95: Medium driver load capability diagram for BEST case TA=-40°C; VDDP=3.47V; edges=1/6 period Application Note 84 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission 8 Pad Scaling Calculator (PASTOR) 8.1 Scope of the software For the TC1782 microcontroller, a new software is provided to calculate optimal pad driver settings depending on electrical and environmental constraints. PASTOR displays rising and falling edge including over- and undershoot for driver settings under these system constraints. What you can do with PASTOR: - Configure the general settings of your application (capacitive load, pad supply voltage, ambient temperature) - Choose a pad driver scaling and calculate how the driver behaves - Choose a data signal performance (either by entering rise and fall time or by entering a data rate plus period-to-edge ratio) - Calculate the weakest driver setting which fulfils your system requirements - Display rising edge waveform including overshoot (all timings calculated as 10% to 90% level) - Display falling edge waveform including undershoot (all timings calculated as 90% to 10% level) - Save waveforms 8.2 How to use PASTOR 1) Start program - Launch the Excel file "Pad Scaling Calculator TC1782" and enable Macros or make sure they are enabled. 2) Configure program - Click the "START" button to enter conditional parameter values. - Choose one of three input options by clicking on the small check box present in every option part in the left frame: o Data Rate: enter your maximal expected toggle frequency (in MHz) and change the slope to period ratio with the spinbutton. In this case the rise and fall times are considered to be identical. For further information just click on the help button just beside. Take into consideration that the frequency specification limit is 180 MHz. o Rise/Fall Times: enter the rise and the fall time (in nanoseconds). Accepted values are limited to a realistic range wrt. the frequency limit of 180 MHz. o Pad Driver: in this field you can select your desired pad driver among the three existing class A1, A1+ and A2. - Note: Only one of those could be selected in the same time, and only the last one ticked will be used during the execution. - After option selection, you have to enter values for the load capacitor (in pF), the ambient temperature (in degrees Celsius), and the pad supply voltage (in Volts). - The following restrictions apply: o Valid ambient temperature range is between -40 and +140 degrees Celsius. o Load capacitance must not exceed the specified maximal load depending on the pad driver setting (50, 100, 20000 pF). o The pad supply voltage must stay within 3.3V ± 5%. 3) Calculte driver properties - Click the "EXE" button to start the simulation. Application Note 85 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission - A new window will appear (if the parameters you entered fit to the specifications): o It shows an estimated waveform of the rising edge for your driver. o You may view the falling edge waveform by clicking on "VIEW FALL TIME". o The values of Over and Undershoots are displayed too. - The displayed waveform corresponds to the weakest recommended driver matching all previously entered conditions. - In case you selected a driver before, the displayed waveforms shows this driver's behaviour under the previously entered conditions. - All the parameters on the left frame are now filled with values, and you can change them easily to run a new execution. - Note: the slope to period ratio item is always available for value change after the first run. Thus you can change it to see the effect on the resulting data rate - Note: If a warning appears next to the data rate value, it means that you exceed the frequency limit. You can click on the warning icon to read the warning message. 4) Save waveforms: - 8.3 Every time you run an execution, rise and fall time waveforms are saved in a folder named "Graphics": o This folder is automatically generated in the current directory. o The filename of these pictures is built with the parameters you entered. - By clicking the "Restart" button you will erase all these pictures and arrive on the first clean window. - If you decide to leave the program you can click on one of the small crosses in the window's top right corner, or press "Exit" button which will quit Excel definitely. All waveforms are still available in the "Graphics" directory. - Every new start of the program will delete all previously waveforms stored in the "Graphics" directory. PASTOR screenshots Figure 96 shows the start-up screen of the PASTOR calculator. After clicking the “START” button, the PASTOR selection screen (Figure 97) appears; the user may now change the I/O supply voltage. Valid values for capacitive load and ambient temperature must be filled into the respective input fields. Depending on the kind of investigation, the user has to select either “Data Rate” or “Rise/Fall Times” or “Pad Driver” by checking one of the related boxes, and provide parameter values afterwards. Figure 98 shows an example for user selection “Data Rate”. The appropriate driver for a 10MHz data rate (slope-to-period ratio = 4, see Chapter 7.2), loaded with 25pF and operated at 3.3V (nominal) and 125°C ambient temperature will be calculated after clicking the “EXE” button. Result: The medium driver provides the required performance and lowest electromagnetic emission to fulfil 10MHz data rate under the specified conditions. Figure 99 shows an example for user selection “Rise/Fall Times”. The appropriate driver for a clock/data signal of 2.5ns rise and fall time, loaded with 40pF and operated at 3.3V (nominal) and 85°C ambient temperature will be calculated after clicking the “EXE” button. Result: The strong-sharp driver provides the required performance to drive 40pF load at rising and falling edges (10/90%) of 2.5ns under the specified conditions. Please note that this driver provides an even faster rise/fall time of 1.67ns; however, the next weaker driver (strong-sharp-minus) does not fulfil the 2.5ns requirement. By default, the rising edge including estimated overshoot is displayed. To show the falling edge including undershoot, click on “View Fall Time”; the result for the previous example is shown in Figure 100. Figure 101 shows an example for user selection “Driver”. This is how the class A1+ strong-slow driver performs under the specified conditions: it can drive 20pF load with ca. 14ns rise/fall time – equivalent to 11.75MHz data rate with a slope-to-period ratio of 6. The slope-to-period ratio can be changed to calculate other data rates. A new ratio of 4 will allow a data rate up to 17.64MHz. Application Note 86 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 96: PASTOR start-up screen Figure 97: PASTOR selection screen Application Note 87 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 98: Example for user selection “Data Rate” Figure 99: Example for user selection “Rise/Fall Times”, displaying the rising edge Application Note 88 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 100: Example for user selection “Rise/Fall Times”, displaying the falling edge Figure 101: Example for user selection “Driver” Application Note 89 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Annex A: Measured rise/fall waveforms Rise/fall timing diagrams are provided for selected Class A2 driver settings and capacitive loads, as listed in Table 16. These results have been summarized in Chapter 5. This Annex A shows selected measured timing diagrams for signal integrity reference puposes. Driver strength Physical load capacitor VDDP supply voltages @ ambient temperature Strong-sharp 10pF 3.47V@-40°C/3.30V@25°C/3.13V@125°C Strong-sharp 22 pF 3.47V@-40°C/3.30V@25°C/3.13V@125°C Strong-sharp 47 pF 3.47V@-40°C/3.30V@25°C/3.13V@125°C Strong-sharp 100 pF 3.47V@-40°C/3.30V@25°C/3.13V@125°C Strong-sharp-minus 10pF 3.47V@-40°C/3.30V@25°C/3.13V@125°C Strong-sharp-minus 22 pF 3.47V@-40°C/3.30V@25°C/3.13V@125°C Strong-sharp-minus 47 pF 3.47V@-40°C/3.30V@25°C/3.13V@125°C Strong-medium 10pF 3.47V@-40°C/3.30V@25°C/3.13V@125°C Strong-medium 22 pF 3.47V@-40°C/3.30V@25°C/3.13V@125°C Strong-medium 47 pF 3.47V@-40°C/3.30V@25°C/3.13V@125°C Strong-medium-minus 10pF 3.47V@-40°C/3.30V@25°C/3.13V@125°C Strong-medium-minus 22 pF 3.47V@-40°C/3.30V@25°C/3.13V@125°C Strong-medium-minus 47 pF 3.47V@-40°C/3.30V@25°C/3.13V@125°C Strong-soft 10pF 3.47V@-40°C/3.30V@25°C/3.13V@125°C Strong-soft 22 pF 3.47V@-40°C/3.30V@25°C/3.13V@125°C Strong-soft 47 pF 3.47V@-40°C/3.30V@25°C/3.13V@125°C Strong-slow 10pF 3.47V@-40°C/3.30V@25°C/3.13V@125°C Strong-slow 22 pF 3.47V@-40°C/3.30V@25°C/3.13V@125°C Strong-slow 47 pF 3.47V@-40°C/3.30V@25°C/3.13V@125°C Medium 10pF 3.47V@-40°C/3.30V@25°C/3.13V@125°C Medium 22 pF 3.47V@-40°C/3.30V@25°C/3.13V@125°C Medium 47 pF 3.47V@-40°C/3.30V@25°C/3.13V@125°C Medium 150 pF 3.47V@-40°C/3.30V@25°C/3.13V@125°C Medium 1500 pF 3.47V@-40°C/3.30V@25°C/3.13V@125°C Medium 20000 pF 3.47V@-40°C/3.30V@25°C/3.13V@125°C Weak 10pF 3.47V@-40°C/3.30V@25°C/3.13V@125°C Weak 22 pF 3.47V@-40°C/3.30V@25°C/3.13V@125°C Weak 47 pF 3.47V@-40°C/3.30V@25°C/3.13V@125°C Weak 150 pF 3.47V@-40°C/3.30V@25°C/3.13V@125°C Weak 1500 pF 3.47V@-40°C/3.30V@25°C/3.13V@125°C Weak 20000 pF 3.47V@-40°C/3.30V@25°C/3.13V@125°C Table 16: List of all timing measurement conditions provided in Annex A Application Note 90 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Each of the Figures 83-107 contains 6 waveforms for a given driver strength, a given VDDP supply voltage (3.47V, 3.30V, 3.13V) and a given ambient temperature (-40°C, 25°C, 125°C). Depending on these settings, certain clock frequencies can be driven or not. The 6 configurations shown in one figure are distributed as indicated in Figure 82. Rising edge Falling edge VDDP=3.47V VDDP=3.47V Ta=-40°C Ta=-40°C Rising edge Falling edge VDDP=3.30V VDDP=3.30V Ta=+25°C Ta=+25°C Rising edge Falling edge VDDP=3.13V VDDP=3.13V Ta=+125°C Ta=+125°C Figure 96: General grouping of waveform configurations Application Note 91 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 97: Class A2 driver strong-sharp at 10pF load Application Note 92 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 98: Class A2 driver strong-sharp at 22pF load Application Note 93 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 99: Class A2 driver strong-sharp at 47pF load Application Note 94 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 100: Class A2 driver strong-sharp at 100pF load Application Note 95 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 101: Class A2 driver strong-sharp-minus at 10pF load Application Note 96 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 102: Class A2 driver strong-sharp-minus at 22pF load Application Note 97 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 103: Class A2 driver strong-sharp-minus at 47pF load Application Note 98 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 104: Class A2 driver strong-medium at 10pF load Application Note 99 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 105: Class A2 driver strong-medium at 22pF load Application Note 100 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 106: Class A2 driver strong-medium at 47pF load Application Note 101 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 107: Class A2 driver strong-medium-minus at 10pF load Application Note 102 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 108: Class A2 driver strong-medium-minus at 22pF load Application Note 103 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 109: Class A2 driver strong-medium-minus at 47pF load Application Note 104 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 110: Class A2 driver strong-soft at 10pF load Application Note 105 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 111: Class A2 driver strong-soft at 22pF load Application Note 106 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 112: Class A2 driver strong-soft at 47pF load Application Note 107 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 113: Class A2 driver medium at 10pF load Application Note 108 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 114: Class A2 driver medium at 22pF load Application Note 109 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 115: Class A2 driver medium at 47pF load Application Note 110 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 116: Class A2 driver medium at 150pF load Application Note 111 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 117: Class A2 driver medium at 1500pF load Application Note 112 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 118: Class A2 driver medium at 20nF load Application Note 113 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 119: Class A2 driver weak at 10pF load Application Note 114 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 120: Class A2 driver weak at 22pF load Application Note 115 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 121: Class A2 driver weak at 47pF load Application Note 116 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 122: Class A2 driver weak at 150pF load Application Note 117 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 123: Class A2 driver weak at 1500pF load Application Note 118 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 124: Class A2 driver weak at 20nF load Application Note 119 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 125: Class A1+ driver strong-soft at 10pF load Application Note 120 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 126: Class A1+ driver strong-soft at 22pF load Application Note 121 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 127: Class A1+ driver strong-soft at 47pF load Application Note 122 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 128: Class A1+ driver strong-slow at 10pF load Application Note 123 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 129: Class A1+ driver strong-slow at 22pF load Application Note 124 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 130: Class A1+ driver strong-slow at 47pF load Application Note 125 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 131: Class A1+ driver medium at 10pF load Application Note 126 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 132: Class A1+ driver medium at 22pF load Application Note 127 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 133: Class A1+ driver medium at 47pF load Application Note 128 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 134: Class A1+ driver medium at 150pF load Application Note 129 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 135: Class A1+ driver medium at 1500pF load Application Note 130 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 136: Class A1+ driver medium at 20nF load Application Note 131 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 137: Class A1+ driver weak at 10pF load Application Note 132 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 138: Class A1+ driver weak at 22pF load Application Note 133 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 139: Class A1+ driver weak at 47pF load Application Note 134 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 140: Class A1+ driver weak at 150pF load Application Note 135 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 141: Class A1+ driver weak at 1500pF load Application Note 136 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 142: Class A1+ driver weak at 20nF load Application Note 137 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 143: Class A1 driver medium at 10pF load Application Note 138 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 144: Class A1 driver medium at 22pF load Application Note 139 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 145: Class A1 driver medium at 47pF load Application Note 140 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 146: Class A1 driver medium at 150pF load Application Note 141 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 147: Class A1 driver medium at 1500pF load Application Note 142 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 148: Class A1 driver medium at 20nF load Application Note 143 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 149: Class A1 driver weak at 10pF load Application Note 144 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 150: Class A1 driver weak at 22pF load Application Note 145 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 151: Class A1 driver weak at 47pF load Application Note 146 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 152: Class A1 driver weak at 150pF load Application Note 147 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 153: Class A1 driver weak at 1500pF load Application Note 148 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Figure 154: Class A1 driver weak at 20nF load Application Note 149 V1.0, 2010-01 AP32146 TC1782 Scalable Pads Timing and Electromagnetic Emission Annex B: Glossary Cload Load Capacitor di/dt Ideal capacitive load connected to an output driver Dynamic current over time EMC Electromagnetic Compatibility The ability of an electrical device to function satisfactorily in its electromagnetic environment (“Immunity”) without having an impermissible effect on its environment (“Emission”). EME Electromagnetic Emission Æ EMC EXTCLK System Clock Output Strong output driver for the system clock GND Ground Ground reference of the power supply PI Power Integrity Good PI means a clean power supply system which is not polluted by switching noise SI Signal Integrity Good SI means proper signal waveform to fulfill the required data communication TA Ambient Temperature Temperature in the direct environment of the IC tF Fall Time Time of the falling edge of a signal measured between 10% and 90% of the high level tR Rise Time Time of the rising edge of a signal measured between 10% and 90% of the high level VDD Power supply voltage in general VDDI Core supply voltage = 1.20V nominal VDDP Pad supply voltage = 3.30V nominal, +/- 5% VSS Æ GND Application Note 150 V1.0, 2010-01 w w w . i n f i n e o n . c o m Published by Infineon Technologies AG