Application Note, V1.1, September 2006 AP16099 Scalable Pads E l ec tr ica l S p eci f ica t io n o f S c a la bl e Ou t pu t D r i vers i n 2 50 nm C M O S Te c hn ol og y XC166 Microcontroller Family Microcontrollers Never stop thinking. AP16099 Scalable Output Drivers of XC166 Family Edition 2006-09 Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 2006. All Rights Reserved. LEGAL DISCLAIMER THE INFORMATION GIVEN IN THIS APPLICATION NOTE IS GIVEN AS A HINT FOR THE IMPLEMENTATION OF THE INFINEON TECHNOLOGIES COMPONENT ONLY AND SHALL NOT BE REGARDED AS ANY DESCRIPTION OR WARRANTY OF A CERTAIN FUNCTIONALITY, CONDITION OR QUALITY OF THE INFINEON TECHNOLOGIES COMPONENT. THE RECIPIENT OF THIS APPLICATION NOTE MUST VERIFY ANY FUNCTION DESCRIBED HEREIN IN THE REAL APPLICATION. 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Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Application Note AP16099 2 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Revision History: 2006-09 Previous Version: V1.0 Page Subjects (major changes since last revision) 11 Corrected “strong-soft” in Table 2 to “strong-sharp” 125 Corrected strong-sharp driver assessment for driving a 35pF load at 15MHz V1.1 We Listen to Your Comments Any information within this document that you feel is wrong, unclear or missing at all? Your feedback will help us to continuously improve the quality of this document. Please send your proposal (including a reference to this document) to: [email protected] Application Note AP16099 3 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Table of Contents Page 1 Preface ............................................................................................................................ 5 2 2.1 2.1.1 2.1.2 2.2 2.2.1 2.2.2 2.2.3 Introduction ...................................................................................................................... 6 Pad driver scaling in detail ............................................................................................... 6 Driver characteristics .................................................................................................... 6 Edge Characteristics..................................................................................................... 6 Physical basics ................................................................................................................ 7 Load charging............................................................................................................... 7 Signal integrity .............................................................................................................. 8 Power integrity / Electromagnetic emission................................................................... 9 3 3.1 3.1.1 3.1.2 Measured Timings ......................................................................................................... 10 Load conditions and ambient temperatures.................................................................... 10 Measurement conditions used in this document ......................................................... 10 Measured rise and fall times ....................................................................................... 11 4 4.1 4.1.1 4.1.2 4.1.3 Simulated Timings ......................................................................................................... 28 Simulated timings on selected PCB trace structures ...................................................... 28 Description of structures ............................................................................................. 28 Rise/fall time diagrams................................................................................................ 29 Rise/fall waveforms..................................................................................................... 62 5 5.1 5.1.1 5.1.2 5.1.3 5.2 Measured Electromagnetic Emission ............................................................................. 79 Description of test equipment......................................................................................... 79 Conducted emission test configuration ....................................................................... 79 Radiated emission test configuration .......................................................................... 80 Instruments and software for emission data recognition............................................. 80 Emission measurement results ...................................................................................... 81 6 6.1 6.2 6.3 Result discussion ......................................................................................................... 109 CLKOUT driver, conducted emission ........................................................................... 109 GPIO drivers, conducted emission............................................................................... 111 Radiated emission ....................................................................................................... 120 7 7.1 7.2 Recommended settings for signal categories............................................................... 122 General........................................................................................................................ 122 Decision Tables and Graphs........................................................................................ 123 8 Glossary ...................................................................................................................... 141 Application Note AP16099 4 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family 1 Preface Output driver scaling, also referred to as „slew rate control“, is an effective technique to reduce the electromagnetic emission of an integrated circuit by reducing the driver strength and/or smoothing the rising and falling edges of one or more pad output drivers. Output driver scaling makes sense only when a certain margin regarding signal frequency and/or capacitive output load is available. Any driver scaling must maintain proper signal integrity. This application note presents a huge set of output driver characterization data, which shall enable the system designers to select proper driver settings to reduce the electromagnetic emission caused by the driver switching, while maintaining the desired signal integrity. Parameters under consideration are switching frequency, capacitive output load, and ambient temperature. Chapter 2 introduces physical basics behind the scaling. Chapter 3 provides a set of measured rise/fall times under various conditions. Chapter 4 documents rise/fall time simulations performed on PCB models of different signal routing structures. Chapter 5 shows a set of measured electromagnetic emission under various conditions. Chapter 6 discusses these emission results using a lot of comparison diagrams. Chapter 7 recommends useful settings for the drivers by introducing signal categories and giving lots of decision tables and graphs. The application note ends with a glossary. The data provided in chapter 7 should be preferrably referenced if a suitable pad driver setting is searched for a given signal data rate and a given capacitive load connected to this signal. This suitable pad driver setting leads to minimum electromagnetic emission under the given constraints for data rate and capacitive load. Chapters 3 to 6 serve as data pool for detailled timing and electromagnetic emission behaviour for all pad driver settings under various temperature and capacitve load conditions. The information given in this application note is valid for Infineon microcontrollers of the XC166 Family, fabricated in 250 nm CMOS technology. Please note that all numbers given in this application note are no specification values. They are verified by design without being monitored during the IC fabrication process. The numbers are based on timing measurements performed on center lot devices. Thus all values are subject to approx. 10% offset, depending on parameter variations such as fabrication process and pad supply voltages different from nominal conditions. The final selection of driver settings in system applications should consider this offset. Application Note AP16099 5 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family 2 Introduction Output driver scaling is introduced by setting corresponding control bits in registers. Fig. 1 shows an example of a pad driver control register, taken from the XC161 specification. While the location and function of the control bits may differ among the available Infineon microcontrollers, the electrical effects caused by these bits remain similar for a given technology. 2.1 Pad driver scaling in detail 2.1.1 Driver characteristics Basically, we distinguish between driver control and edge control. Driver control bits set the general DC driving capability of the respective driver. Reducing the driver strength increases the output’s internal resistance which attenuates noise that is imported/exported via the output line. For a given external load, charging and discharging time varies with the driver strength, thus the rise/fall times will change accordingly. For driving LEDs or power transistors, however, a stable high output current may still be required independent of low toggle rates which would normally allow to decide for weak drivers due to their low transitions and thus low noise emission. The controllable output drivers of the XC161 pins feature three differently sized transistors Figure 1: Pad output driver schematic (strong, medium, and weak) for each direction (push and pull). The time of activating/deactivating these transistors determines the output characteristics of the respective port driver. The strength of the driver can be selected to adapt the driver characteristics to the application’s requirements: In Strong Driver Mode, the medium and strong transistors are activated. In this mode the driver provides maximum output current even after the target signal level is reached. In Medium Driver Mode, only the medium transistor is activated while the other transistors remain off. In Weak Driver Mode, only the weak transistor is activated while the other transistors remain off. This results in smooth transitions with low current peaks (and reduced susceptibility for noise) on the cost of increased transition times, i.e. slower edges, depending on the capacitive load, and low static current. 2.1.2 Edge Characteristics This defines the rise/fall time for the respective output, i.e. the output transition time. Soft edges reduce the peak currents that are drawn when changing the voltage level of an external capacitive load. For a bus interface, however, sharp edges may still be required. Edge characteristic effects the predriver which controls the final output driver stage. Application Note AP16099 Figure 2: Port output control register example 6 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family The Port Output Control registers POCONx provide the corresponding control bits. A 4-bit control field configures the driver strength and the edge shape. Word ports consume four control nibbles each, byte ports consume two control nibbles each, where each control nibble controls 4 pins of the respective port. Fig. 2 shows an example of a POCON register and the allocation of control bit fields and port pins. In this guideline, the scaling effects of output drivers fabricated in 250nm CMOS technology is described. It serves as a reference addendum to the respective microcontroller product specifications where the individual bit settings can be found. 2.2 Physical basics Two main constraints have to be met when deciding for a certain clock driver setting: signal integrity and power integrity. Both issues will be discussed after a general introduction to capacitive load charging. 2.2.1 Load charging Generally, a switching transistor output stage delivers charge to its corresponding load capacitor during rising edge and draws charge from its load capacitor during falling edge. Timing diagrams normally show the signal’s voltage over time characteristics. However, the resulting timing is a result of the electrical charge transfer described above. Charge is transferred by flowing current. A bigger pad driver means a smaller resistance in the loading path of the external load. Fig. 3 shows the load current and voltage of two examples of pad drivers connected to a load of C=40pF. The strong driver has on output resistance of 25Ω, the weak driver 50Ω. For times t<0, the output voltage is 0V. At t=0, the load capacitor C is connected to the target output voltage U=5V via the respective driver pullup transistor. As a reaction, the load current steps immediately to the value I=U/R. I is bigger for smaller values of R. This means that the strong driver generates a bigger current jump and charges the load capacitor in a shorter time. In frequency domain, the current peak which is resulting from the charging of the load capacitor and from the over- or undershoots, causes significant RF energy and thus electromagnetic emission on the pad power supply. These effects are discussed in chapter 2.2.3. Charging Voltage and Current at 40pF Load 0.2 4.5 0.18 4 0.16 3.5 0.14 3 0.12 2.5 0.1 2 0.08 1.5 0.06 1 0.04 0.5 0.02 0 -2.0E-09 0.0E+00 2.0E-09 4.0E-09 6.0E-09 8.0E-09 Current [A] 5 Voltage [V] In time domain this leads to bigger reflections for not adapted driver impedances. Since typical trace impedances range from 60 to 120Ω , a strong driver with Z=10Ω is poorly adapted and may cause big voltage overand undershoots. A weak driver with Z=100Ω may fit perfectly and generate a clean voltage switching signal without over- or undershoots. These effects are discussed in chapter 2.2.2. 0 1.0E-08 Time [s] Voltage R=50Ohm Voltage R=25Ohm Current R=50Ohm Current R=25Ohm Figure 3: Current-/voltage charging curves for different driver strengths Not only the pad driver impedance, but also the connected capacitive load determines the electromagnetic emission amplitudes. Fig. 4 illustrates the differences in charging current and voltage between a capacitive load of 40pF and one of 20pF. In both cases, the driver impedance is set to 50Ω. As expected, the charging voltage increases faster for a smaller load. However, the starting value of the charging current is only determined by the driver impedance and is thus load-independent. The Application Note AP16099 7 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family The selection of a weaker driver setting slows down the pad switching time, so care must be taken to maintain the required signal integrity. 5 0.2 4.5 0.18 4 0.16 3.5 0.14 3 0.12 2.5 0.1 2 0.08 1.5 0.06 1 0.04 0.5 0.02 0 -2.0E-09 0.0E+00 2.0E-09 4.0E-09 6.0E-09 8.0E-09 Current [A] This disadvantage can be compensated by chosing a smaller pad driver, i.e. a weaker driver setting, causing bigger driver impedance and thus smaller di/dt for the charging current. Charging Voltage and Current at 50Ohm Driver Impedance Voltage [V] load affects only the speed of load current decrease. It decreases faster if the load is smaller. This means on the other hand a bigger di/dt for smaller loads, resulting in higer emission for smaller loads. 0 1.0E-08 Time [s] Voltage Cload=40pF Voltage Cload=20pF Current Cload=40pF Current Cload=20pF Figure 4: Current-/voltage charging curves for different capacitive loads 2.2.2 Signal integrity Maintaining signal integrity means to select the rise/fall times such that all signal handshaking and data communication timing and levels are ensured for proper system operation. This means the data interchange between the microcontroller and external ICs like Flash memory, line drivers, receivers and transmitters etc. runs properly. Therefore, it has to be taken into account that CMOS transistors become slower with rising temperature. Thus the timing of a critical signal has to be matched for proper operation at highest ambient temperature. Depending on the application, common temperature ranges are up to 85°C or up to 125°C. Several automotive control units specify an ambient temperature range from 40°C up to 125°C. The die temperature may reach values up to 150°C during operation. Rules: • Choose driver characteristics to meet the DC driving requirements. Make sure that the DC current provided by the microcontroller’s pad drivers is sufficient to drive actuators into the desired logic state. • Choose edge settings to Figure 5: Signal over- and undershoots meet system timing constraints at the highest system temperature. Make sure that no too strong driver settings are selected. This would lead to unnecessarily fast signal edges, causing two disadvantages regarding electromagnetic emission: (1) The slopes are too fast and cause undesired high emission energy at higher frequencies; (2) Over- and undershoot appears with the danger of latchup, spikes leading to wrong logic states or increased data stable delays and undesired high frequency emission. Application Note AP16099 8 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family • 2.2.3 If system timing requires short signal rise/fall times, series termination is recommended to avoid over-/undershoot at signal transitions, see Fig. 5. The value of the termination resistor has to be chosen identical to the signal line impedance. Power integrity / Electromagnetic emission Any switching between low and high voltage levels generates RF noise. This happens whenever the switching voltage or the switching current has no sinusoidal shape. Switching currents are mainly responsible for electromagnetic emission because of the voltage drop across line inductances such as bond wires and lead frames. Any shapes other than sinusoidal are composed by the overlay of multiple frequencies, also known as harmonics. To reach a significantly steep edge of a trapezoidal voltage of a clock signal, short current pulses during the edges are required. These switching currents are outlined as nearly triangular peaks which are composed from the base frequency and a set of odd and even harmonics, depending Figure 6: Spectrum envelope for different clocks and edges on the exact pulse shape. The steeper a switching pulse is, the higher frequencies are required to form the rising and falling edges. A rise time of 1ns leads to a spectrum composed from harmonics up to at least 500 MHz. A typical clock signal consists of 10% rise time, 40% high level, 10% fall time and 40% low level. Operating at 100MHz – equal to 10ns period time – this clock signal already generates at least harmonics up to 500MHz. Unfortunately not the clock frequency, but the rise/fall times determine the resulting RF spectrum. Even if a clock driver operates at a relatively low toggle rate, it may generate the same RF spectrum as if it would operate at a significantly higher toggle rate – as long as its rise/fall times are not adjusted to the lower toggle rate by slowing down the transitions. For example, if the mentioned 100MHz clock driver operates at only 10 MHz, its rise/fall times should be extended from 1 ns to 10 ns, still maintaining the 10% ratio relatively to the clock period time. Fig. 6 illustrates that behaviour. Rule: • Choose driver and edge characteristics to result in lowest electromagnetic emission while meeting all system timing requirements at highest system temperature. Application Note AP16099 9 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family 3 Measured Timings 3.1 Load conditions and ambient temperatures The XC16x microcontroller family uses two types of pad drivers: CLKOUT serving as a timing reference signal provides stronger drivers than all other port pins. These other port pins are referred to as “General Purpose I/Os” (GPIO). 3.1.1 Measurement conditions used in this document • A temperature range from TA=25°C to TA=150°C is covered for the timings. Please note that the IC operating conditions are specified from TA=-40°C to TA=125°C. Since switching times decrease with lower temperature, no timing problems should occur when an appropriate driver setting for high temperature has been selected. However, eventual over- or undershoot resulting from improper impedance matching between pad drivers and external load may increase at low temperature. The timing at TA=125°C is a little bit faster than that documented in this guideline at TA=150°C. • If the user is interested in rise/fall time values at other temperatures, a linear interpolation between 25°C and 150°C can be done. For temperatures below 25°C, a linear extrapolation can be applied. • Electromagnetic emission is always measured at TA=25°C. • The supply voltage for pad drivers is 5.0V for measurements at TA=25°C. • The supply voltage for pad drivers is 4.5V for measurements at TA=150°C. Load capacitors are selected in a way that together with the measurement probe capacitance of 8pF total capacitance values of 18pF up to 55pF are reached. Table 1 shows the reference between real loads and numbers given in the result diagrams. For easy reading, these capacitances are referred to as 20, 30, 40 and 50 pF in the result diagrams. Probe capacitance SMD load capacitor Resulting physical Referred C capacitance 8 pF 10 pF 18 pF 20 pF 8 pF 22 pF 30 pF 30 pF 8 pF 33 pF 41 pF 40 pF 8 pF 47 pF 55 pF 50 pF Table 1: Overview of capacitive loads used for timing measurements The result diagrams show the measured rising and falling edge timing using an oscilloscope probe of 8pF||1MΩ. The reference points are 10% and 90% as indicated in Fig. 7. For measurements at TA=150°C, the pad supply voltage VDDP has been decreased to 4.50V (nominal VDDP minus 10%). Thus the voltage levels references for timing measurements at TA=150°C are: 0.45V (low reference) and 4.05V (high reference). Application Note AP16099 Figure 7: Voltage level references for timing measurement 10 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family 3.1.2 Measured rise and fall times The following diagrams show the 10-90% rise times and 90-10% fall times of all CLKOUT and GPIO driver strengths at TA=25°C and TA=150°C. The physically connected load capacitor values are according the “Referred capacitances” listed in Table 1. The abbreviations used for driver strangth and load description are listed in Table 2. The respective load capacitor is connected close to the pin of the CLKOUT or GPIO driver pin. It is connected from the pin to GND. GPIO measurements have been done at Port 3.13 of the XC161CS and are valid for all other GPIO pins of the XC166 Family members fabricated in 0.25µm CMOS technology. In Fig. 8-13 the rise and fall times are given for CLKOUT and GPIO set to different driver strengths. Fig. 14-23 extrapolate the measurement temperatures of 25°C and 150°C down to -40°C in a linear way (which reflects reality with good approximation). Abbreviation Driver strength Resulting physical capacitor SSH-20pF Strong-sharp 18 pF SSH-30pF Strong-sharp 30 pF SSH-40pF Strong-sharp 41 pF SSH-50pF Strong-sharp 55 pF SME-20pF Strong-medium 18 pF SME-30pF Strong-medium 30 pF SME-40pF Strong-medium 41 pF SME-50pF Strong-medium 55 pF SSO-20pF Strong-soft 18 pF SSO-30pF Strong-soft 30 pF SSO-40pF Strong-soft 41 pF SSO-50pF Strong-soft 55 pF MED-20pF Medium 18 pF MED-30pF Medium 30 pF MED-40pF Medium 41 pF MED-50pF Medium 55 pF WEA-20pF Weak 18 pF WEA-30pF Weak 30 pF WEA-40pF Weak 41 pF WEA-50pF Weak 55 pF Table 2: Abbreviations used in the timing result diagrams Application Note AP16099 11 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Figure 8: Timings CLKOUT for all driver settings Application Note AP16099 12 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Figure 9: Zoomed timings CLKOUT for strong and medium driver settings Application Note AP16099 13 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Figure 10: Timings GPIO for all driver settings Application Note AP16099 14 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Figure 11: Zoomed timings GPIO for strong and medium driver settings Application Note AP16099 15 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Figure 12: Zoomed rise times CLKOUT and GPIO for strong and medium driver settings Application Note AP16099 16 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Figure 13: Zoomed fall times CLKOUT and GPIO for strong and medium driver settings Application Note AP16099 17 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Figure 14: CLKOUT “strong-sharp” driver rise/fall times over full ambient temperature range Application Note AP16099 18 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Figure 15: CLKOUT “strong-medium” driver rise/fall times over full ambient temperature range Application Note AP16099 19 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Figure 16: CLKOUT “strong-soft” driver rise/fall times over full ambient temperature range Application Note AP16099 20 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Figure 17: CLKOUT “medium” driver rise/fall times over full ambient temperature range Application Note AP16099 21 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Figure 18: CLKOUT “weak” driver rise/fall times over full ambient temperature range Application Note AP16099 22 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Figure 19: GPIO “strong-sharp” driver rise/fall times over full ambient temperature range Application Note AP16099 23 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Figure 20: GPIO “strong-medium” driver rise/fall times over full ambient temperature range Application Note AP16099 24 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Figure 21: GPIO “strong-soft” driver rise/fall times over full ambient temperature range Application Note AP16099 25 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Figure 22: GPIO “medium” driver rise/fall times over full ambient temperature range Application Note AP16099 26 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Figure 23: GPIO “weak” driver rise/fall times over full ambient temperature range Application Note AP16099 27 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family 4 Simulated Timings 4.1 Simulated timings on selected PCB trace structures 4.1.1 Description of structures A temperature range from TA=25°C to TA=150°C is covered for the timings. Please note that in addition to the measured timings, which use discrete load capacitors, it is interesting to compare timing waveforms for various PCB structures. This overview provides a good guess on the impact of serial termination, the use of via contacts, and the shape of trace structures connected to a pad driver. We use 4 different structures, shown in Fig. 24: (a) Point-to-Point, (b) Bus, (c) Star, (d) Tree. Each of the structures was drawn in 4 versions and simulated with Sigrity Speed2000™. The 4 versions are: (1) no vias, no series termination, (2) no vias, series termination at transmitter, (3) vias, no series termination, (4) vias, series termination. In case of no vias, all traces are routed on the top PCB layer where transmitter and receivers are soldered. In case of vias, the red traces in Fig. 24 are routed on the bottom PCB layer. In case of series termination, a 51Ω resistor Rt is connected directly at the transmitter output in the data line. Figure 24: Set of PCB trace structures The layer stack of the printed circuit board model is shown in Fig. 25. It consists of 4 layers in standard FR4 material in the order signal-GND-VCC-signal. 300µm trace width results in a 57Ω trace impedance. The capacitance per unit length is 1pF/cm. An input capacitance of 5pF per CMOS receiver input is assumed. The driver is represented by the IBIS model listed in Appendix A. The driver strength can be selected to be “strongsharp”, “strong-medium”, “strong-soft”, “medium” and “weak”. Application Note AP16099 Figure 25: PCB layer stack 28 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family The length of each trace piece marked “l” in Fig. 24 has been dimensioned such that the resulting total trace capacitance plus the receiver gate capacitances are 20pF, 30pF, 40pF and 50pF. Table 3 lists the resulting trace lengths. The via contacts connect signals on the top layer with signals on the bottom layer. Length “l” Width “w” Load 20 pF 5.1 cm 300 µm 30 pF 8.5 cm 300 µm 40pF 11.9 cm 300 µm 50 pF 15.3 cm 300 µm Bus 20 pF 4.4 cm 300 µm 30 pF 7.9 cm 300 µm 40 pF 12.5 cm 300 µm 50 pF 16.8 cm 300 µm Star 20 pF 4.2 cm 300 µm 30 pF 8.1 cm 300 µm 40 pF 12.2 cm 300 µm 50 pF 16.9 cm 300 µm Tree 20 pF 5.9 cm 300 µm 30 pF 11.4 cm 300 µm 40 pF 17.2 cm 300 µm 50 pF 21.3 cm 300 µm Table 3: Dimensions of PCB structures Structure Point-toPoint Fig. 26-57 show the simulated rise and fall times as a function of PCB structures with different capacitive loads. In each diagram, the measured timings and the simulated timings with ideal capacitive load are given for reference. To keep a better overview, one diagram contains only the curves for one structure operating at one temperature. The parameters varied in one diagram are the load capacitance and the driver settings. The abbreviations are as defined in Table 2. 4.1.2 Rise/fall time diagrams All rise/fall times refer to the 10-90% rising edge and to the 90-10% falling edge of the transmitter output voltage. Details are identical to the measured timings and levels described in chapter 3.1.1. Weak driver strength has not been simulated because of the very low rise and fall times. Main purpose is to show the influence of via contacts which are placed on the traces, and series termination resistors placed at the driver outputs. The 4 via/termination combinations are marked in the diagrams as follows: “Vias No Term No” = no via contacts, no termination resistor “Vias Yes Term No” = via contacts, but no termination resistor “Vias No Term Yes” = no via contacts, but termination resistor “Vias Yes Term Yes” = via contacts and termination resistor Application Note AP16099 29 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Figure 26: CLKOUT rise times for “Point-to-Point” layout at 25°C Application Note AP16099 30 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Figure 27: CLKOUT rise times for “Point-to-Point” layout at 150°C Application Note AP16099 31 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Figure 28: CLKOUT fall times for “Point-to-Point” layout at 25°C Application Note AP16099 32 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Figure 29: CLKOUT fall times for “Point-to-Point” layout at 150°C Application Note AP16099 33 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Figure 30: CLKOUT rise times for “Star” layout at 25°C Application Note AP16099 34 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Figure 31: CLKOUT rise times for “Star” layout at 150°C Application Note AP16099 35 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Figure 32: CLKOUT fall times for “Star” layout at 25°C Application Note AP16099 36 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Figure 33: CLKOUT fall times for “Star” layout at 150°C Application Note AP16099 37 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Figure 34: CLKOUT rise times for “Tree” layout at 25°C Application Note AP16099 38 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Figure 35: CLKOUT rise times for “Tree” layout at 150°C Application Note AP16099 39 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Figure 36: CLKOUT fall times for “Tree” layout at 25°C Application Note AP16099 40 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Figure 37: CLKOUT fall times for “Tree” layout at 150°C Application Note AP16099 41 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Figure 38: CLKOUT rise times for “Bus” layout at 25°C Application Note AP16099 42 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Figure 39: CLKOUT rise times for “Bus” layout at 150°C Application Note AP16099 43 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Figure 40: CLKOUT fall times for “Bus” layout at 25°C Application Note AP16099 44 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Figure 41: CLKOUT fall times for “Bus” layout at 150°C Application Note AP16099 45 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Figure 42: GPIO rise times for “Point-to-Point” layout at 25°C Application Note AP16099 46 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Figure 43: GPIO rise times for “Point-to-Point” layout at 150°C Application Note AP16099 47 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Figure 44: GPIO fall times for “Point-to-Point” layout at 25°C Application Note AP16099 48 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Figure 45: GPIO fall times for “Point-to-Point” layout at 150°C Application Note AP16099 49 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Figure 46: GPIO rise times for “Star” layout at 25°C Application Note AP16099 50 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Figure 47: GPIO rise times for “Star” layout at 150°C Application Note AP16099 51 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Figure 48: GPIO fall times for “Star” layout at 25°C Application Note AP16099 52 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Figure 49: GPIO fall times for “Star” layout at 150°C Application Note AP16099 53 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Figure 50: GPIO rise times for “Tree” layout at 25°C Application Note AP16099 54 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Figure 51: GPIO rise times for “Tree” layout at 150°C Application Note AP16099 55 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Figure 52: GPIO fall times for “Tree” layout at 25°C Application Note AP16099 56 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Figure 53: GPIO fall times for “Tree” layout at 150°C Application Note AP16099 57 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Figure 54: GPIO rise times for “Bus” layout at 25°C Application Note AP16099 58 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Figure 55: GPIO rise times for “Bus” layout at 150°C Application Note AP16099 59 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Figure 56: GPIO fall times for “Bus” layout at 25°C Application Note AP16099 60 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Figure 57: GPIO fall times for “Bus” layout at 150°C Application Note AP16099 61 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family 4.1.3 Rise/fall waveforms The following waveforms result from Speed2000™ timing simulations of the PCB structures described in chapter 4.1.1. Since the waveforms of the different structures are very similar, only “point-to-point” and “bus” structures are presented here with loads of 20pF and 40pF. However, the influence of via contacts and termination resistors is visible from the waveforms. Each of Fig. 59-90 contains 4 waveforms for a given pad type (CLKOUT or GPOI), a given ambient temperature (25°C or 150°C) and a given driver strength. Depending on these settings, certain clock frequencies can be driven or not. The waveforms show one of 3 frequencies: 10MHz, 5MHz or 2.5MHz – whatever is the highest frequency for a given setting which shows an acceptable signal integrity (i.e. high and low voltage levels of 5.0V and 0.0V are reached during switching). The 4 configurations shown in one figure are distributed as follows: 20pF Capacitive Load 40pF Capacitive Load No Termination Resistor No Termination Resistor 20pF Capacitive Load 40pF Capacitive Load 51Ω Termination Resistor 51Ω Termination Resistor Figure 58: General grouping of waveform configurations Application Note AP16099 62 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family CLKOUT 25°C P2P w/ Vias w/o Term 20pF Strong-Sharp CLKOUT 25°C P2P w/ Vias w/o Term 40pF Strong-Sharp 8.0V 8.0V 7.0V 7.0V 6.0V 6.0V 5.0V 5.0V 4.0V 4.0V 3.0V 3.0V 2.0V 2.0V 1.0V 1.0V 0.0V 0.0V -1.0V -1.0V -2.0V -2.0V -3.0V -3.0V 000.0E+0s 20.0E-9s 40.0E-9s 60.0E-9s 80.0E-9s 100.0E-9s 120.0E-9s -4.0V 000.0E+0s 140.0E-9s 6.0V 5.0V 5.0V 4.0V 4.0V 3.0V 3.0V 2.0V 2.0V 1.0V 1.0V 0.0V 0.0V 20.0E-9s 40.0E-9s 60.0E-9s 80.0E-9s 100.0E-9s 120.0E-9s 40.0E-9s 60.0E-9s 80.0E-9s 100.0E-9s 120.0E-9s 140.0E-9s CLKOUT 25°C P2P w/ Vias w/ Term 40pF Strong-Sharp CLKOUT 25°C P2P w/ Vias w/ Term 20pF Strong-Sharp 6.0V -1.0V 000.0E+0s 20.0E-9s -1.0V 000.0E+0s 140.0E-9s 20.0E-9s 40.0E-9s 60.0E-9s 80.0E-9s 100.0E-9s 120.0E-9s 140.0E-9s Figure 59: Waveforms CLKOUT 20 MHz “Strong-Sharp” / “Point-to-Point” at 25°C ambient temperature CLKOUT 25°C Bus w/ vias w/o Term 40pF Strong-Sharp CLKOUT 25°C Bus w/ Vias w/o Term 20pF Strong-Sharp 7.0V 10.0V 6.0V 8.0V 5.0V 6.0V 4.0V 4.0V 3.0V 2.0V 2.0V 1.0V 0.0V 0.0V -2.0V -1.0V -4.0V -2.0V -3.0V 000.0E+0s 20.0E-9s 40.0E-9s 60.0E-9s 80.0E-9s 100.0E-9s 120.0E-9s -6.0V 000.0E+0s 140.0E-9s CLKOUT 25°C Bus w/ Vias w/ Term 20pF Strong-Sharp 20.0E-9s 40.0E-9s 60.0E-9s 80.0E-9s 100.0E-9s 120.0E-9s 140.0E-9s CLKOUT 25°C Bus w/ Vias w/ Term 40pF Strong-Sharp 6.0V 7.0V 6.0V 5.0V 5.0V 4.0V 4.0V 3.0V 3.0V 2.0V 2.0V 1.0V 1.0V 0.0V 0.0V -1.0V -1.0V 000.0E+0s 20.0E-9s 40.0E-9s 60.0E-9s 80.0E-9s 100.0E-9s 120.0E-9s -2.0V 000.0E+0s 140.0E-9s 20.0E-9s 40.0E-9s 60.0E-9s 80.0E-9s 100.0E-9s 120.0E-9s 140.0E-9s Figure 60: Waveforms CLKOUT 20 MHz “Strong-Sharp” / “Bus” at 25°C ambient temperature Application Note AP16099 63 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family CLKOUT 150°C P2P w/ Vias w/o Term 40pF Strong-Sharp CLKOUT 150°C P2P w/ Vias w/o Term 20pF Strong-Sharp 7.0V 6.0V 6.0V 5.0V 5.0V 4.0V 4.0V 3.0V 3.0V 2.0V 2.0V 1.0V 1.0V 0.0V 0.0V -1.0V -1.0V 000.0E+0s 20.0E-9s 40.0E-9s 60.0E-9s 80.0E-9s 100.0E-9s 120.0E-9s -2.0V 000.0E+0s 140.0E-9s 6.0V 6.0V 5.0V 5.0V 4.0V 4.0V 3.0V 3.0V 2.0V 2.0V 1.0V 1.0V 0.0V 0.0V -1.0V 000.0E+0s 20.0E-9s 40.0E-9s 60.0E-9s 80.0E-9s 100.0E-9s 120.0E-9s 20.0E-9s 40.0E-9s 60.0E-9s 80.0E-9s 100.0E-9s 120.0E-9s 140.0E-9s CLKOUT 150°C P2P w/ Vias w/ Term 20pF Strong-Sharp CLKOUT 150°C P2P w/ Vias w/ Term 20pF Strong-Sharp -1.0V 000.0E+0s 140.0E-9s 20.0E-9s 40.0E-9s 60.0E-9s 80.0E-9s 100.0E-9s 120.0E-9s 140.0E-9s Figure 61: Waveforms CLKOUT 20 MHz “Strong-Sharp” / “Point-to-Point” at 150°C ambient temperat. CLKOUT 150°C Bus w/ Vias w/o Term 40pF Strong-Sharp CLKOUT 150°C Bus w/ Vias w/o Term 20pF Strong-Sharp 8.0V 6.0V 7.0V 5.0V 6.0V 5.0V 4.0V 4.0V 3.0V 3.0V 2.0V 2.0V 1.0V 1.0V 0.0V -1.0V 0.0V -2.0V -1.0V 000.0E+0s 20.0E-9s 40.0E-9s 60.0E-9s 80.0E-9s 100.0E-9s 120.0E-9s -3.0V 000.0E+0s 140.0E-9s 20.0E-9s 40.0E-9s 60.0E-9s 80.0E-9s 100.0E-9s 120.0E-9s 140.0E-9s CLKOUT 150°C Bus w/ Vias w/ Term 40pF Strong-Sharp CLKOUT 150°C Bus w/ Vias w/ Term 20pF Strong-Sharp 7.0V 6.0V 6.0V 5.0V 5.0V 4.0V 4.0V 3.0V 3.0V 2.0V 2.0V 1.0V 1.0V 0.0V 0.0V -1.0V -1.0V 000.0E+0s 20.0E-9s 40.0E-9s 60.0E-9s 80.0E-9s -2.0V 000.0E+0s 100.0E-9s 120.0E-9s 140.0E-9s 20.0E-9s 40.0E-9s 60.0E-9s 80.0E-9s 100.0E-9s 120.0E-9s 140.0E-9s Figure 62: Waveforms CLKOUT 20 MHz “Strong-Sharp” / “Bus” at 150°C ambient temperature Application Note AP16099 64 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family CLKOUT 25°C P2P w/ Vias w/o Term 40pF Strong-Medium CLKOUT 25°C P2P w/ Vias w/o Term 20pF Strong-Medium 7.0V 6.0V 6.0V 5.0V 5.0V 4.0V 4.0V 3.0V 3.0V 2.0V 2.0V 1.0V 0.0V 1.0V -1.0V 0.0V -2.0V -1.0V 000.0E+0s 20.0E-9s 40.0E-9s 60.0E-9s 80.0E-9s 100.0E-9s 120.0E-9s -3.0V 000.0E+0s 140.0E-9s 6.0V 6.0V 5.0V 5.0V 4.0V 4.0V 3.0V 3.0V 2.0V 2.0V 1.0V 1.0V 0.0V 0.0V 20.0E-9s 40.0E-9s 60.0E-9s 80.0E-9s 100.0E-9s 120.0E-9s 40.0E-9s 60.0E-9s 80.0E-9s 100.0E-9s 120.0E-9s 140.0E-9s CLKOUT 25°C P2P w/ Vias w/ Term 40pF Strong-Medium CLKOUT 25°C P2P w/ Vias w/ Term 20pF Strong-Medium -1.0V 000.0E+0s 20.0E-9s -1.0V 000.0E+0s 140.0E-9s 20.0E-9s 40.0E-9s 60.0E-9s 80.0E-9s 100.0E-9s 120.0E-9s 140.0E-9s Figure 63: Waveforms CLKOUT 20 MHz “Strong-Medium” / “Point-to-Point” 25°C ambient temperature CLKOUT 25°C Bus w/ Vias w/o Term 40pF Strong-Medium CLKOUT 25°C Bus w/ Vias w/o Term 20pF Strong-Medium 8.0V 7.0V 7.0V 6.0V 6.0V 5.0V 5.0V 4.0V 4.0V 3.0V 3.0V 2.0V 2.0V 1.0V 1.0V 0.0V 0.0V -1.0V -1.0V -2.0V -2.0V 000.0E+0s 20.0E-9s 40.0E-9s 60.0E-9s 80.0E-9s 100.0E-9s 120.0E-9s -3.0V 000.0E+0s 140.0E-9s 6.0V 6.0V 5.0V 5.0V 4.0V 4.0V 3.0V 3.0V 2.0V 2.0V 1.0V 1.0V 0.0V 0.0V 20.0E-9s 40.0E-9s 60.0E-9s 80.0E-9s 100.0E-9s 120.0E-9s 40.0E-9s 60.0E-9s 80.0E-9s 100.0E-9s 120.0E-9s 140.0E-9s CLKOUT 25°C Bus w/ Vias w/ Term 40pF Strong Medium CLKOUT 25°C Bus w/ Vias w/ Term 20pF Strong Medium -1.0V 000.0E+0s 20.0E-9s -1.0V 000.0E+0s 140.0E-9s 20.0E-9s 40.0E-9s 60.0E-9s 80.0E-9s 100.0E-9s 120.0E-9s 140.0E-9s Figure 64: Waveforms CLKOUT 20 MHz “Strong-Medium” / “Bus” at 25°C ambient temperature Application Note AP16099 65 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family CLKOUT 150°C P2P w/ Vias w/o Term 40pF Strong-Medium CLKOUT 150°C P2P w/ Vias w/o Term 20pF Strong-Medium 6.0V 6.0V 5.0V 5.0V 4.0V 4.0V 3.0V 3.0V 2.0V 2.0V 1.0V 1.0V 0.0V 0.0V -1.0V 000.0E+0s 20.0E-9s 40.0E-9s 60.0E-9s 80.0E-9s 100.0E-9s 120.0E-9s -1.0V 000.0E+0s 140.0E-9s CLKOUT 150°C P2P w/ Vias w/ Term 20pF Strong-Medium 6.0V 5.0V 5.0V 4.0V 4.0V 3.0V 3.0V 2.0V 2.0V 1.0V 1.0V 0.0V 0.0V 20.0E-9s 40.0E-9s 60.0E-9s 80.0E-9s 100.0E-9s 120.0E-9s 40.0E-9s 60.0E-9s 80.0E-9s 100.0E-9s 120.0E-9s 140.0E-9s CLKOUT 150°C P2P w/ Vias w/ Term 40pF Strong-Medium 6.0V -1.0V 000.0E+0s 20.0E-9s -1.0V 000.0E+0s 140.0E-9s 20.0E-9s 40.0E-9s 60.0E-9s 80.0E-9s 100.0E-9s 120.0E-9s 140.0E-9s Figure 65: Waveforms CLKOUT 20 MHz “Strong-Medium” / “Point-to-Point” at 150°C ambient temper. CLKOUT 150°C Bus w/ Vias w/o Term 40pF Strong-Medium CLKOUT 150°C Bus w/ Vias w/o Term 20pF Strong-Medium 6.0V 7.0V 5.0V 6.0V 4.0V 5.0V 4.0V 3.0V 3.0V 2.0V 2.0V 1.0V 1.0V 0.0V 0.0V -1.0V -1.0V 000.0E+0s 20.0E-9s 40.0E-9s 60.0E-9s 80.0E-9s 100.0E-9s 120.0E-9s -2.0V 000.0E+0s 140.0E-9s CLKOUT 150°C Bus w/ Vias w/ Term 20pF Strong-Medium 6.0V 5.0V 5.0V 4.0V 4.0V 3.0V 3.0V 2.0V 2.0V 1.0V 1.0V 0.0V 0.0V 20.0E-9s 40.0E-9s 60.0E-9s 80.0E-9s 100.0E-9s 120.0E-9s 40.0E-9s 60.0E-9s 80.0E-9s 100.0E-9s 120.0E-9s 140.0E-9s CLKOUT 150°C Bus w/ Vias w/ Term 40pF Strong-Medium 6.0V -1.0V 000.0E+0s 20.0E-9s -1.0V 000.0E+0s 140.0E-9s 20.0E-9s 40.0E-9s 60.0E-9s 80.0E-9s 100.0E-9s 120.0E-9s 140.0E-9s Figure 66: Waveforms CLKOUT 20 MHz “Strong-Medium” / “Bus” at 150°C ambient temperature Application Note AP16099 66 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family CLKOUT 25°C P2P w/ Vias w/o Term 40pF Strong-Soft CLKOUT 25°C P2P w/ Vias w/o Term 20pF Strong-Soft 6.0V 6.0V 5.0V 5.0V 4.0V 4.0V 3.0V 3.0V 2.0V 2.0V 1.0V 1.0V 0.0V 0.0V -1.0V 000.0E+0s 50.0E-9s 100.0E-9s 150.0E-9s 200.0E-9s 250.0E-9s 300.0E-9s -1.0V 000.0E+0s 6.0V 6.0V 5.0V 5.0V 4.0V 4.0V 3.0V 3.0V 2.0V 2.0V 1.0V 1.0V 0.0V 0.0V 50.0E-9s 100.0E-9s 150.0E-9s 200.0E-9s 250.0E-9s 100.0E-9s 150.0E-9s 200.0E-9s 250.0E-9s 300.0E-9s CLKOUT 25°C P2P w/ Vias w/ Term 40pF Strong-Soft CLKOUT 25°C P2P w/ Vias w/ Term 20pF Strong-Soft -1.0V 000.0E+0s 50.0E-9s 300.0E-9s -1.0V 000.0E+0s 50.0E-9s 100.0E-9s 150.0E-9s 200.0E-9s 250.0E-9s 300.0E-9s Figure 67: Waveforms CLKOUT 10 MHz “Strong-Soft” / “Point-to-Point” at 25°C ambient temperature CLKOUT 25°C Bus w/ Vias w/o Term 40pF Strong-Soft CLKOUT 25°C Bus w/ Vias w/o Term 20pF Strong-Soft 6.0V 6.0V 5.0V 5.0V 4.0V 4.0V 3.0V 3.0V 2.0V 2.0V 1.0V 1.0V 0.0V 0.0V -1.0V 000.0E+0s 50.0E-9s 100.0E-9s 150.0E-9s 200.0E-9s 250.0E-9s 300.0E-9s -1.0V 000.0E+0 CLKOUT 25°C Bus w/ Vias w/ Term 20pF Strong-Soft 6.0V 5.0V 5.0V 4.0V 4.0V 3.0V 3.0V 2.0V 2.0V 1.0V 1.0V 0.0V 0.0V 50.0E-9s 100.0E-9s 150.0E-9s 200.0E-9s 250.0E-9s 100.0E-9 150.0E-9 200.0E-9 250.0E-9 300.0E-9 CLKOUT 25°C Bus w/ Vias w/ Term 40pF Strong-Soft 6.0V -1.0V 000.0E+0s 50.0E-9 300.0E-9s -1.0V 000.0E+0s 50.0E-9s 100.0E-9s 150.0E-9s 200.0E-9s 250.0E-9s 300.0E-9s Figure 68: Waveforms CLKOUT 10 MHz “Strong-Soft” / “Bus” at 25°C ambient temperature Application Note AP16099 67 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family CLKOUT 150°C P2P w/ Vias w/o Term 40pF Strong-Soft CLKOUT 150°C P2P w/ Vias w/o Term 20pF Strong-Soft 6.0V 6.0V 5.0V 5.0V 4.0V 4.0V 3.0V 3.0V 2.0V 2.0V 1.0V 1.0V 0.0V 0.0V -1.0V 000.0E+0s 50.0E-9s 100.0E-9s 150.0E-9s 200.0E-9s 250.0E-9s 300.0E-9s -1.0V 000.0E+0s 6.0V 5.0V 5.0V 4.0V 4.0V 3.0V 3.0V 2.0V 2.0V 1.0V 1.0V 0.0V 0.0V 50.0E-9s 100.0E-9s 150.0E-9s 200.0E-9s 250.0E-9s 100.0E-9s 150.0E-9s 200.0E-9s 250.0E-9s 300.0E-9s CLKOUT 150°C P2P w/ Vias w/ Term 40pF Strong-Soft CLKOUT 150°C P2P w/ Vias w/ Term 20pF Strong-Soft 6.0V -1.0V 000.0E+0s 50.0E-9s 300.0E-9s -1.0V 000.0E+0s 50.0E-9s 100.0E-9s 150.0E-9s 200.0E-9s 250.0E-9s 300.0E-9s Figure 69: Waveforms CLKOUT 10 MHz “Strong-Soft” / “Point-to-Point” at 150°C ambient temperature CLKOUT 150°C Bus w/ Vias w/o Term 40pF Strong-Soft CLKOUT 150°C Bus w/ Vias w/o Term 20pF Strong-Soft 6.0V 6.0V 5.0V 5.0V 4.0V 4.0V 3.0V 3.0V 2.0V 2.0V 1.0V 1.0V 0.0V 0.0V -1.0V 000.0E+0s 50.0E-9s 100.0E-9s 150.0E-9s 200.0E-9s 250.0E-9s 300.0E-9s -1.0V 000.0E+0s 6.0V 5.0V 5.0V 4.0V 4.0V 3.0V 3.0V 2.0V 2.0V 1.0V 1.0V 0.0V 0.0V 50.0E-9s 100.0E-9s 150.0E-9s 200.0E-9s 250.0E-9s 100.0E-9s 150.0E-9s 200.0E-9s 250.0E-9s 300.0E-9s CLKOUT 150°C Bus w/ Vias w/ Term 40pF Strong-Soft CLKOUT 150°C Bus w/ Vias w/ Term 20pF Strong-Soft 6.0V -1.0V 000.0E+0s 50.0E-9s 300.0E-9s -1.0V 000.0E+0s 50.0E-9s 100.0E-9s 150.0E-9s 200.0E-9s 250.0E-9s 300.0E-9s Figure 70: Waveforms CLKOUT 10 MHz “Strong-Soft” / “Bus” at 150°C ambient temperature Application Note AP16099 68 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family CLKOUT 25°C P2P w/ Vias w/o Term 40pF Medium CLKOUT 25°C P2P w/ Vias w/o Term 20pF Medium 6.0V 6.0V 5.0V 5.0V 4.0V 4.0V 3.0V 3.0V 2.0V 2.0V 1.0V 1.0V 0.0V 0.0V -1.0V 000.0E+0s 100.0E-9s 200.0E-9s 300.0E-9s 400.0E-9s 500.0E-9s 600.0E-9s -1.0V 000.0E+0s 6.0V 5.0V 5.0V 4.0V 4.0V 3.0V 3.0V 2.0V 2.0V 1.0V 1.0V 0.0V 0.0V 100.0E-9s 200.0E-9s 300.0E-9s 400.0E-9s 500.0E-9s 200.0E-9s 300.0E-9s 400.0E-9s 500.0E-9s 600.0E-9s CLKOUT 25°C P2P w/ Vias w/ Term 40pF Medium CLKOUT 25°C P2P w/ Vias w/ Term 20pF Medium 6.0V -1.0V 000.0E+0s 100.0E-9s 600.0E-9s -1.0V 000.0E+0s 100.0E-9s 200.0E-9s 300.0E-9s 400.0E-9s 500.0E-9s 600.0E-9s Figure 71: Waveforms CLKOUT 5 MHz “Medium” / “Point-to-Point” at 25°C ambient temperature CLKOUT 25°C Bus w/ Vias w/o Term 20pF Medium CLKOUT 25°C Bus w/ Vias w/o Term 40pF Medium 6.0V 6.0V 5.0V 5.0V 4.0V 4.0V 3.0V 3.0V 2.0V 2.0V 1.0V 1.0V 0.0V 0.0V -1.0V 000.0E+0s 100.0E-9s 200.0E-9s 300.0E-9s 400.0E-9s 500.0E-9s 600.0E-9s -1.0V 000.0E+0s 6.0V 5.0V 5.0V 4.0V 4.0V 3.0V 3.0V 2.0V 2.0V 1.0V 1.0V 0.0V 0.0V 100.0E-9s 200.0E-9s 300.0E-9s 400.0E-9s 500.0E-9s 200.0E-9s 300.0E-9s 400.0E-9s 500.0E-9s 600.0E-9s CLKOUT 25°C Bus w/ Vias w/ Term 40pF Medium CLKOUT 25°C Bus w/ Vias w/ Term 20pF Medium 6.0V -1.0V 000.0E+0s 100.0E-9s 600.0E-9s -1.0V 000.0E+0s 100.0E-9s 200.0E-9s 300.0E-9s 400.0E-9s 500.0E-9s 600.0E-9s Figure 72: Waveforms CLKOUT 5 MHz “Medium” / “Bus” at 25°C ambient temperature Application Note AP16099 69 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family CLKOUT 150°C P2P w/ Vias w/o Term 40pF Medium CLKOUT 150°C P2P w/ Vias w/o Term 20pF Medium 6.0V 6.0V 5.0V 5.0V 4.0V 4.0V 3.0V 3.0V 2.0V 2.0V 1.0V 1.0V 0.0V 0.0V -1.0V 000.0E+0s 100.0E-9s 200.0E-9s 300.0E-9s 400.0E-9s 500.0E-9s 600.0E-9s -1.0V 000.0E+0s CLKOUT 150°C P2P w/ Vias w/ Term 20pF Medium 6.0V 5.0V 5.0V 4.0V 4.0V 3.0V 3.0V 2.0V 2.0V 1.0V 1.0V 0.0V 0.0V 100.0E-9s 200.0E-9s 300.0E-9s 400.0E-9s 500.0E-9s 200.0E-9s 300.0E-9s 400.0E-9s 500.0E-9s 600.0E-9s CLKOUT 150°C P2P w/ Vias w/ Term 40pF Medium 6.0V -1.0V 000.0E+0s 100.0E-9s 600.0E-9s -1.0V 000.0E+0s 100.0E-9s 200.0E-9s 300.0E-9s 400.0E-9s 500.0E-9s 600.0E-9s Figure 73: Waveforms CLKOUT 5 MHz “Medium” / “Point-to-Point” at 150°C ambient temperature CLKOUT 150°C Bus w/ Vias w/o Term 40pF Medium CLKOUT 150°C Bus w/ Vias w/o Term 20pF Medium 6.0V 6.0V 5.0V 5.0V 4.0V 4.0V 3.0V 3.0V 2.0V 2.0V 1.0V 1.0V 0.0V 0.0V -1.0V 000.0E+0s 100.0E-9s 200.0E-9s 300.0E-9s 400.0E-9s 500.0E-9s 600.0E-9s -1.0V 000.0E+0s CLKOUT 150°C Bus w/ Vias w/ Term 20pF Medium 6.0V 5.0V 5.0V 4.0V 4.0V 3.0V 3.0V 2.0V 2.0V 1.0V 1.0V 0.0V 0.0V 100.0E-9s 200.0E-9s 300.0E-9s 400.0E-9s 500.0E-9s 200.0E-9s 300.0E-9s 400.0E-9s 500.0E-9s 600.0E-9s CLKOUT 150°C Bus w/ Vias w/ Term 40pF Medium 6.0V -1.0V 000.0E+0s 100.0E-9s 600.0E-9s -1.0V 000.0E+0s 100.0E-9s 200.0E-9s 300.0E-9s 400.0E-9s 500.0E-9s 600.0E-9s Figure 74: Waveforms CLKOUT 5 MHz “Medium” / “Bus” at 150°C ambient temperature Application Note AP16099 70 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family GPIO 25°C P2P w/ Vias w/o Term 40pF Strong-Sharp GPIO 25°C P2P w/ Vias w/o Term 20pF Strong-Sharp 6.0V 6.0V 5.0V 5.0V 4.0V 4.0V 3.0V 3.0V 2.0V 2.0V 1.0V 1.0V 0.0V 0.0V -1.0V -1.0V -2.0V 000.0E+0s 20.0E-9s 40.0E-9s 60.0E-9s 80.0E-9s 100.0E-9s 120.0E-9s -2.0V 000.0E+0s 140.0E-9s 6.0V 5.0V 5.0V 4.0V 4.0V 3.0V 3.0V 2.0V 2.0V 1.0V 1.0V 0.0V 0.0V 20.0E-9s 40.0E-9s 60.0E-9s 80.0E-9s 100.0E-9s 120.0E-9s 40.0E-9s 60.0E-9s 80.0E-9s 100.0E-9s 120.0E-9s 140.0E-9s GPIO 25°C P2P w/ Vias w/ Term 40pF Strong-Sharp GPIO 25°C P2P w/ Vias w/ Term 20pF Strong-Sharp 6.0V -1.0V 000.0E+0s 20.0E-9s -1.0V 000.0E+0s 140.0E-9s 20.0E-9s 40.0E-9s 60.0E-9s 80.0E-9s 100.0E-9s 120.0E-9s 140.0E-9s Figure 75: Waveforms GPIO 20 MHz “Strong-Sharp” / “Point-to-Point” at 25°C ambient temperature GPIO 25°C Bus w/ Vias w/o Term 40pF Strong-Sharp GPIO 25°C Bus w/ Vias w/o Term 20pF Strong-Sharp 8.0V 7.0V 7.0V 6.0V 6.0V 5.0V 5.0V 4.0V 4.0V 3.0V 3.0V 2.0V 2.0V 1.0V 1.0V 0.0V 0.0V -1.0V -1.0V -2.0V 000.0E+0s -2.0V 20.0E-9s 40.0E-9s 60.0E-9s 80.0E-9s 100.0E-9s 120.0E-9s -3.0V 000.0E+0s 140.0E-9s 6.0V 5.0V 5.0V 4.0V 4.0V 3.0V 3.0V 2.0V 2.0V 1.0V 1.0V 0.0V 0.0V 20.0E-9s 40.0E-9s 60.0E-9s 80.0E-9s 100.0E-9s 120.0E-9s 40.0E-9s 60.0E-9s 80.0E-9s 100.0E-9s 120.0E-9s 140.0E-9s GPIO 25°C Bus w/ Vias w/ Term 40pF Strong-Sharp GPIO 25°C Bus w/ Vias w/ Term 20pF Strong-Sharp 6.0V -1.0V 000.0E+0s 20.0E-9s -1.0V 000.0E+0s 140.0E-9s 20.0E-9s 40.0E-9s 60.0E-9s 80.0E-9s 100.0E-9s 120.0E-9s 140.0E-9s Figure 76: Waveforms GPIO 20 MHz “Strong-Sharp” / “Bus” at 25°C ambient temperature Application Note AP16099 71 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family GPIO 150°C P2P w/ Vias w/o Term 40pF Strong-Sharp GPIO 150°C P2P w/ Vias w/o Term 20pF Strong-Sharp 6.0V 6.0V 5.0V 5.0V 4.0V 4.0V 3.0V 3.0V 2.0V 2.0V 1.0V 1.0V 0.0V 0.0V -1.0V 000.0E+0s 20.0E-9s 40.0E-9s 60.0E-9s 80.0E-9s 100.0E-9s 120.0E-9s -1.0V 000.0E+0s 140.0E-9s 6.0V 5.0V 5.0V 4.0V 4.0V 3.0V 3.0V 2.0V 2.0V 1.0V 1.0V 0.0V 0.0V 20.0E-9s 40.0E-9s 60.0E-9s 80.0E-9s 100.0E-9s 120.0E-9s 40.0E-9s 60.0E-9s 80.0E-9s 100.0E-9s 120.0E-9s 140.0E-9s GPIO 150°C P2P w/ Vias w/ Term 40pF Strong-Sharp GPIO 150°C P2P w/ Vias w/ Term 20pF Strong-Sharp 6.0V -1.0V 000.0E+0s 20.0E-9s -1.0V 000.0E+0s 140.0E-9s 20.0E-9s 40.0E-9s 60.0E-9s 80.0E-9s 100.0E-9s 120.0E-9s 140.0E-9s Figure 77: Waveforms GPIO 20 MHz “Strong-Sharp” / “Point-to-Point” at 150°C ambient temperature GPIO 150°C Bus w/ Vias w/o Term 20pF Strong-Sharp GPIO 150°C Bus w/ Vias w/o Term 40pF Strong-Sharp 6.0V 6.0V 5.0V 5.0V 4.0V 4.0V 3.0V 3.0V 2.0V 2.0V 1.0V 1.0V 0.0V 0.0V -1.0V 000.0E+0s 20.0E-9s 40.0E-9s 60.0E-9s 80.0E-9s 100.0E-9s 120.0E-9s -1.0V 000.0E+0s 140.0E-9s 6.0V 5.0V 5.0V 4.0V 4.0V 3.0V 3.0V 2.0V 2.0V 1.0V 1.0V 0.0V 0.0V 20.0E-9s 40.0E-9s 60.0E-9s 80.0E-9s 100.0E-9s 120.0E-9s 40.0E-9s 60.0E-9s 80.0E-9s 100.0E-9s 120.0E-9s 140.0E-9s GPIO 150°C Bus w/ Vias w/ Term 40pF Strong-Sharp GPIO 150°C Bus w/ Vias w/ Term 20pF Strong-Sharp 6.0V -1.0V 000.0E+0s 20.0E-9s -1.0V 000.0E+0s 140.0E-9s 20.0E-9s 40.0E-9s 60.0E-9s 80.0E-9s 100.0E-9s 120.0E-9s 140.0E-9s Figure 78: Waveforms GPIO 20 MHz “Strong-Sharp” / “Bus” at 150°C ambient temperature Application Note AP16099 72 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family GPIO 25°C P2P w/ Vias w/o Term 40pF Strong-Medium GPIO 25°C P2P w/ Vias w/o Term 20pF Strong-Medium 6.0V 6.0V 5.0V 5.0V 4.0V 4.0V 3.0V 3.0V 2.0V 2.0V 1.0V 1.0V 0.0V 0.0V -1.0V 000.0E+0s 50.0E-9s 100.0E-9s 150.0E-9s 200.0E-9s 250.0E-9s 300.0E-9s -1.0V 000.0E+0s 6.0V 5.0V 5.0V 4.0V 4.0V 3.0V 3.0V 2.0V 2.0V 1.0V 1.0V 0.0V 0.0V 50.0E-9s 100.0E-9s 150.0E-9s 200.0E-9s 250.0E-9s 100.0E-9s 150.0E-9s 200.0E-9s 250.0E-9s 300.0E-9s GPIO 25°C P2P w/ Vias w/ Term 40pF Strong-Medium GPIO 25°C P2P w/ Vias w/ Term 20pF Strong-Medium 6.0V -1.0V 000.0E+0s 50.0E-9s 300.0E-9s -1.0V 000.0E+0s 50.0E-9s 100.0E-9s 150.0E-9s 200.0E-9s 250.0E-9s 300.0E-9s Figure 79: Waveforms GPIO 10 MHz “Strong-Medium” / “Point-to-Point” at 25°C ambient temperature GPIO 25°C Bus w/ Vias w/o Term 40pF Strong-Medium GPIO 25°C Bus w/ Vias w/o Term 20pF Strong-Medium 6.0V 6.0V 5.0V 5.0V 4.0V 4.0V 3.0V 3.0V 2.0V 2.0V 1.0V 1.0V 0.0V 0.0V -1.0V 000.0E+0s 50.0E-9s 100.0E-9s 150.0E-9s 200.0E-9s 250.0E-9s 300.0E-9s -1.0V 000.0E+0s 6.0V 6.0V 5.0V 5.0V 4.0V 4.0V 3.0V 3.0V 2.0V 2.0V 1.0V 1.0V 0.0V 0.0V 50.0E-9s 100.0E-9s 150.0E-9s 200.0E-9s 250.0E-9s 100.0E-9s 150.0E-9s 200.0E-9s 250.0E-9s 300.0E-9s GPIO 25°C Bus w/ Vias w/ Term 40pF Strong-Medium GPIO 25°C Bus w/ Vias w/ Term 20pF Strong-Medium -1.0V 000.0E+0s 50.0E-9s 300.0E-9s -1.0V 000.0E+0s 50.0E-9s 100.0E-9s 150.0E-9s 200.0E-9s 250.0E-9s 300.0E-9s Figure 80: Waveforms GPIO 10 MHz “Strong-Medium” / “Bus” at 25°C ambient temperature Application Note AP16099 73 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family GPIO 150°C P2P w/ Vias w/o Term 20pF Strong-Medium GPIO 150°C P2P w/ Vias w/o Term 40pF Strong-Medium 6.0V 6.0V 5.0V 5.0V 4.0V 4.0V 3.0V 3.0V 2.0V 2.0V 1.0V 1.0V 0.0V 0.0V -1.0V 000.0E+0s 50.0E-9s 100.0E-9s 150.0E-9s 200.0E-9s 250.0E-9s 300.0E-9s -1.0V 000.0E+0s GPIO 150°C P2P w/ Vias w/ Term 20pF Strong-Medium 6.0V 5.0V 5.0V 4.0V 4.0V 3.0V 3.0V 2.0V 2.0V 1.0V 1.0V 0.0V 0.0V 50.0E-9s 100.0E-9s 150.0E-9s 200.0E-9s 250.0E-9s 100.0E-9s 150.0E-9s 200.0E-9s 250.0E-9s 300.0E-9s GPIO 150°C Bus w/ Vias w/ Term 40pF Strong-Medium 6.0V -1.0V 000.0E+0s 50.0E-9s 300.0E-9s -1.0V 000.0E+0s 50.0E-9s 100.0E-9s 150.0E-9s 200.0E-9s 250.0E-9s 300.0E-9s Figure 81: Waveforms GPIO 10 MHz “Strong-Medium” / “Point-to-Point” at 150°C ambient temperature GPIO 150°C Bus w/ Vias w/o Term 40pF Strong-Medium GPIO 150°C Bus w/ Vias w/o Term 20pF Strong-Medium 6.0V 6.0V 5.0V 5.0V 4.0V 4.0V 3.0V 3.0V 2.0V 2.0V 1.0V 1.0V 0.0V 0.0V -1.0V 000.0E+0s 50.0E-9s 100.0E-9s 150.0E-9s 200.0E-9s 250.0E-9s 300.0E-9s -1.0V 000.0E+0s GPIO 150°C Bus w/ Vias w/ Term 20pF Strong-Medium 6.0V 5.0V 5.0V 4.0V 4.0V 3.0V 3.0V 2.0V 2.0V 1.0V 1.0V 0.0V 0.0V 50.0E-9s 100.0E-9s 150.0E-9s 200.0E-9s 250.0E-9s 100.0E-9s 150.0E-9s 200.0E-9s 250.0E-9s 300.0E-9s GPIO 150°C Bus w/ Vias w/ Term 40pF Strong-Medium 6.0V -1.0V 000.0E+0s 50.0E-9s 300.0E-9s -1.0V 000.0E+0s 50.0E-9s 100.0E-9s 150.0E-9s 200.0E-9s 250.0E-9s 300.0E-9s Figure 82: Waveforms GPIO 10 MHz “Strong-Medium” / “Bus” at 150°C ambient temperature Application Note AP16099 74 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family GPIO 25°C P2P w/ Vias w/o Term 40pF Strong-Soft GPIO 25°C P2P w/ Vias w/o Term 20pF Strong-Soft 6.0V 6.0V 5.0V 5.0V 4.0V 4.0V 3.0V 3.0V 2.0V 2.0V 1.0V 1.0V 0.0V 0.0V -1.0V 000.0E+0s 50.0E-9s 100.0E-9s 150.0E-9s 200.0E-9s 250.0E-9s 300.0E-9s -1.0V 000.0E+0s 6.0V 5.0V 5.0V 4.0V 4.0V 3.0V 3.0V 2.0V 2.0V 1.0V 1.0V 0.0V 0.0V 50.0E-9s 100.0E-9s 150.0E-9s 200.0E-9s 250.0E-9s 100.0E-9s 150.0E-9s 200.0E-9s 250.0E-9s 300.0E-9s GPIO 25°C P2P w/ Vias w/ Term 40pF Strong-Soft GPIO 25°C P2P w/ Vias w/ Term 20pF Strong-Soft 6.0V -1.0V 000.0E+0s 50.0E-9s 300.0E-9s -1.0V 000.0E+0s 50.0E-9s 100.0E-9s 150.0E-9s 200.0E-9s 250.0E-9s 300.0E-9s Figure 83: Waveforms GPIO 10 MHz “Strong-Soft” / “Point-to-Point” at 25°C ambient temperature GPIO 25°C Bus w/ Vias w/o Term 40pF Strong-Soft GPIO 25°C Bus w/ Vias w/o Term 20pF Strong-Soft 6.0V 6.0V 5.0V 5.0V 4.0V 4.0V 3.0V 3.0V 2.0V 2.0V 1.0V 1.0V 0.0V 0.0V -1.0V 000.0E+0s 50.0E-9s 100.0E-9s 150.0E-9s 200.0E-9s 250.0E-9s 300.0E-9s -1.0V 000.0E+0s 6.0V 5.0V 5.0V 4.0V 4.0V 3.0V 3.0V 2.0V 2.0V 1.0V 1.0V 0.0V 0.0V 50.0E-9s 100.0E-9s 150.0E-9s 200.0E-9s 250.0E-9s 100.0E-9s 150.0E-9s 200.0E-9s 250.0E-9s 300.0E-9s GPIO 25°C Bus w/ Vias w/ Term 40pF Strong-Soft GPIO 25°C Bus w/ Vias w/ Term 20pF Strong-Soft 6.0V -1.0V 000.0E+0s 50.0E-9s 300.0E-9s -1.0V 000.0E+0s 50.0E-9s 100.0E-9s 150.0E-9s 200.0E-9s 250.0E-9s 300.0E-9s Figure 84: Waveforms GPIO 10 MHz “Strong-Soft” / “Bus” at 25°C ambient temperature Application Note AP16099 75 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family GPIO 150°C P2P w/ Vias w/o Term 40pF Strong-Soft GPIO 150°C P2P w/ Vias w/o Term 20pF Strong-Soft 6.0V 6.0V 5.0V 5.0V 4.0V 4.0V 3.0V 3.0V 2.0V 2.0V 1.0V 1.0V 0.0V 0.0V -1.0V 000.0E+0s 50.0E-9s 100.0E-9s 150.0E-9s 200.0E-9s 250.0E-9s 300.0E-9s -1.0V 000.0E+0s 6.0V 5.0V 5.0V 4.0V 4.0V 3.0V 3.0V 2.0V 2.0V 1.0V 1.0V 0.0V 0.0V 50.0E-9s 100.0E-9s 150.0E-9s 200.0E-9s 250.0E-9s 100.0E-9s 150.0E-9s 200.0E-9s 250.0E-9s 300.0E-9s GPIO 150°C P2P w/ Vias w/ Term 40pF Strong-Soft GPIO 150°C P2P w/ Vias w/ Term 20pF Strong-Soft 6.0V -1.0V 000.0E+0s 50.0E-9s 300.0E-9s -1.0V 000.0E+0s 50.0E-9s 100.0E-9s 150.0E-9s 200.0E-9s 250.0E-9s 300.0E-9s Figure 85: Waveforms GPIO 10 MHz “Strong-Soft” / “Point-to-Point” at 150°C ambient temperature GPIO 150°C Bus w/ Vias w/o Term 20pF Strong-Soft GPIO 150°C Bus w/ Vias w/o Term 40pF Strong-Soft 6.0V 6.0V 5.0V 5.0V 4.0V 4.0V 3.0V 3.0V 2.0V 2.0V 1.0V 1.0V 0.0V 0.0V -1.0V 000.0E+0s 50.0E-9s 100.0E-9s 150.0E-9s 200.0E-9s 250.0E-9s 300.0E-9s -1.0V 000.0E+0s 6.0V 5.0V 5.0V 4.0V 4.0V 3.0V 3.0V 2.0V 2.0V 1.0V 1.0V 0.0V 0.0V 50.0E-9s 100.0E-9s 150.0E-9s 200.0E-9s 250.0E-9s 100.0E-9s 150.0E-9s 200.0E-9s 250.0E-9s 300.0E-9s GPIO 150°C Bus w/ Vias w/ Term 40pF Strong-Soft GPIO 150°C Bus w/ Vias w/ Term 20pF Strong-Soft 6.0V -1.0V 000.0E+0s 50.0E-9s 300.0E-9s -1.0V 000.0E+0s 50.0E-9s 100.0E-9s 150.0E-9s 200.0E-9s 250.0E-9s 300.0E-9s Figure 86: Waveforms GPIO 10 MHz “Strong- Soft” / “Bus” at 150°C ambient temperature Application Note AP16099 76 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family GPIO 25°C P2P w/ Vias w/o Term 40pF Medium GPIO 25°C P2P w/ Vias w/o Term 20pF Medium 6.0V 6.0V 5.0V 5.0V 4.0V 4.0V 3.0V 3.0V 2.0V 2.0V 1.0V 1.0V 0.0V 0.0V -1.0V 000.0E+0s 100.0E-9s 200.0E-9s 300.0E-9s 400.0E-9s 500.0E-9s 600.0E-9s -1.0V 000.0E+0s GPIO 25°C P2P w/ Vias w/ Term 20pF Medium 6.0V 5.0V 5.0V 4.0V 4.0V 3.0V 3.0V 2.0V 2.0V 1.0V 1.0V 0.0V 0.0V 100.0E-9s 200.0E-9s 300.0E-9s 400.0E-9s 500.0E-9s 200.0E-9s 300.0E-9s 400.0E-9s 500.0E-9s 600.0E-9s GPIO 25°C P2P w/ Vias w/ Term 40pF Medium 6.0V -1.0V 000.0E+0s 100.0E-9s 600.0E-9s -1.0V 000.0E+0s 100.0E-9s 200.0E-9s 300.0E-9s 400.0E-9s 500.0E-9s 600.0E-9s Figure 87: Waveforms GPIO 5 MHz “Medium” / “Point-to-Point” at 25°C ambient temperature GPIO 25°C Bus w/ Vias w/o Term 40pF Medium GPIO 25°C Bus w/ Vias w/o Term 20pF Strong-Medium 6.0V 6.0V 5.0V 5.0V 4.0V 4.0V 3.0V 3.0V 2.0V 2.0V 1.0V 1.0V 0.0V 0.0V -1.0V 000.0E+0s 100.0E-9s 200.0E-9s 300.0E-9s 400.0E-9s 500.0E-9s 600.0E-9s -1.0V 000.0E+0s GPIO 25°C Bus w/ Vias w/ Term 20pF Medium 6.0V 5.0V 5.0V 4.0V 4.0V 3.0V 3.0V 2.0V 2.0V 1.0V 1.0V 0.0V 0.0V 100.0E-9s 200.0E-9s 300.0E-9s 400.0E-9s 500.0E-9s 200.0E-9s 300.0E-9s 400.0E-9s 500.0E-9s 600.0E-9s GPIO 25°C Bus w/ Vias w/ Term 40pF Medium 6.0V -1.0V 000.0E+0s 100.0E-9s 600.0E-9s -1.0V 000.0E+0s 100.0E-9s 200.0E-9s 300.0E-9s 400.0E-9s 500.0E-9s 600.0E-9s Figure 88: Waveforms GPIO 5 MHz “Medium” / “Bus” at 25°C ambient temperature Application Note AP16099 77 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family GPIO 150°C P2P w/ Vias w/o Term 40pF Medium GPIO 150°C P2P w/ Vias w/o Term 20pF Medium 6.0V 6.0V 5.0V 5.0V 4.0V 4.0V 3.0V 3.0V 2.0V 2.0V 1.0V 1.0V 0.0V 0.0V -1.0V 000.0E+0s 100.0E-9s 200.0E-9s 300.0E-9s 400.0E-9s 500.0E-9s 600.0E-9s -1.0V 000.0E+0s 6.0V 5.0V 5.0V 4.0V 4.0V 3.0V 3.0V 2.0V 2.0V 1.0V 1.0V 0.0V 0.0V 100.0E-9s 200.0E-9s 300.0E-9s 400.0E-9s 500.0E-9s 200.0E-9s 300.0E-9s 400.0E-9s 500.0E-9s 600.0E-9s GPIO 150°C P2P w/ Vias w/ Term 40pF Medium GPIO 150°C P2P w/ Vias w/ Term 20pF Medium 6.0V -1.0V 000.0E+0s 100.0E-9s 600.0E-9s -1.0V 000.0E+0s 100.0E-9s 200.0E-9s 300.0E-9s 400.0E-9s 500.0E-9s 600.0E-9s Figure 89: Waveforms GPIO 5 MHz “Medium” / “Point-to-Point” at 150°C ambient temperature GPIO 150°C Bus w/ Vias w/o Term 20pF Medium GPIO 150°C Bus w/ Vias w/o Term 40pF Medium 6.0V 6.0V 5.0V 5.0V 4.0V 4.0V 3.0V 3.0V 2.0V 2.0V 1.0V 1.0V 0.0V 0.0V -1.0V 000.0E+0s 100.0E-9s 200.0E-9s 300.0E-9s 400.0E-9s 500.0E-9s 600.0E-9s -1.0V 000.0E+0s 6.0V 5.0V 5.0V 4.0V 4.0V 3.0V 3.0V 2.0V 2.0V 1.0V 1.0V 0.0V 0.0V 100.0E-9s 200.0E-9s 300.0E-9s 400.0E-9s 500.0E-9s 200.0E-9s 300.0E-9s 400.0E-9s 500.0E-9s 600.0E-9s GPIO 150°C Bus w/ Vias w/ Term 40pF Medium GPIO 150°C Bus w/ Vias w/ Term 20pF Medium 6.0V -1.0V 000.0E+0s 100.0E-9s 600.0E-9s -1.0V 000.0E+0s 100.0E-9s 200.0E-9s 300.0E-9s 400.0E-9s 500.0E-9s 600.0E-9s Figure 90: Waveforms GPIO 5 MHz “Medium” / “Bus” at 150°C ambient temperature Application Note AP16099 78 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family 5 Measured Electromagnetic Emission In addition to signal integrity, the scaling of pad drivers helps to reduce electromagnetic emission (EME) caused by switching output pins. This is because slower signal edges produce less high frequency contents in the emission spectra. The following rule should be obeyed when selecting pad driver strength: Use the weakest/slowest driver setting which provides the required signal timing at worst-case operating conditions. Worst-case operating conditions are: - maximum ambient temperature (e.g. +125°C) - minimum pad supply voltage (e.g. 4.50V) - realistic capacitive output load (consider trace length, trace structure, connected receiver input loads) To illustrate the benefits of driver scaling for low EME, some sample measurement results are provided. The measurements have been performed under two operating conditions: Operating condition 1: CLKOUT toggling at 40MHz with capacitive loads of 0pF, 10pF, 22pF, 33pF, 47pF. All GPIOs inactive. Core running in idle loop. Conducted emission measured at pad supply (VDDP) and core supply (VDDC) according to chapter 5.1.1. Radiated emission measured in mini-TEM cell according to chapter 5.1.2. Operating condition 2: GPIOs toggling at ca. 700kHz with capacitive loads of 0pF, 22pF, 47pF. Toggling pins are: Port2[15:0]. CLKOUT inactive. Conducted emission measured at pad supply (VDDP) and core supply (VDDC) according to chapter 5.1.1. Radiated emission measured in mini-TEM cell according to chapter 5.1.2. Please note that all emission peaks visible between 900 MHz and 1000 MHz result from cellular phone activity and should be ignored when assessing the IC-related emission. 5.1 Description of test equipment 5.1.1 Conducted emission configuration test Conducted emission is measured using the standardized 150Ω network, see Fig. 91. This network is used for both port and power supply emission measurements. For reference purpose, only the emission measured at the supply domains VDDP (5.0V pad supply) and VDDC (2.5V core supply) are documented. Emission reduction can be observed in a similar way on passive (i.e. non-switching) pad pins. 150Ω networks are provided for conducted emission measurements according IEC 61967 part 4 and BISS emission test specification. For the measurements the probing points shown in Fig. 91 connected to VDD1 (is VDDC) and VDD2 (is VDDP) are used. No testing was performed at passive I/Os. Application Note AP16099 Figure 91: Conducted emission probing points 79 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family 5.1.2 Radiated emission test configuration Radiated emission is measured using the standard Mini TEM Cell according IEC 61967 part 2 and BISS emission test specification. The frequency range is from 150kHz to 1000MHz. Figure 92: Radiated emission test setup 5.1.3 Instruments and software for emission data recognition Spectrum analyzer: Advantest R3361C Detector type: Peak detector Measurement time: For all measurements, the emission measurement time (10ms) at one frequency is longer than the test software loop duration. Pre-Amplifier: Advantest R14601A Data generation software: Rohde&Schwarz EMIPAK 9950 Environment: temperature 23°C ±5°C Supply: nominal voltage ±5% For all measurements the noise floor is at least 6dB below the limit. Spectrum Analyzer TEM 150 Ω Frequency range RBW 150 kHz to 30 MHz 30 MHz to 200 MHz 200 MHz to 1000 MHz Sweep time* 10kHz ts = 100kHz NP ⋅ LT ⋅ FR RBW Table 4: Spectrum analyzer settings for EME measurements *) NP=number of points; LT=loop time; FR=frequency range Application Note AP16099 80 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family 5.2 Emission measurement results CLKOUT Strong-Sharp no Load VDDP 70 65 60 55 50 dBµV 45 40 35 30 25 20 15 10 5 0 0 100 200 300 400 500 600 700 800 900 1000 Frequency/MHz Figure 93: CLKOUT „Strong-Sharp“ driver at 0pF load – conducted emission on VDDP CLKOUT Strong-Sharp no Load VDDC 50 45 40 35 dBµV 30 25 20 15 10 5 0 0 100 200 300 400 500 600 700 800 900 1000 Frequency/MHz Figure 94: CLKOUT „Strong-Sharp“ driver at 0pF load – conducted emission on VDDC Application Note AP16099 81 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family CLKOUT Strong-Sharp 10pF VDDP 70 65 60 55 50 dBµV 45 40 35 30 25 20 15 10 5 0 0 100 200 300 400 500 600 700 800 900 1000 Frequency/MHz Figure 95: CLKOUT „Strong-Sharp“ driver at 10pF load – conducted emission on VDDP CLKOUT Strong-Sharp 10pF VDDC 50 45 40 35 dBµV 30 25 20 15 10 5 0 0 100 200 300 400 500 600 700 800 900 1000 Frequency/MHz Figure 96: CLKOUT „Strong-Sharp“ driver at 10pF load – conducted emission on VDDC Application Note AP16099 82 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family CLKOUT Strong-Sharp 22pF VDDP 70 65 60 55 50 dBµV 45 40 35 30 25 20 15 10 5 0 0 100 200 300 400 500 600 700 800 900 1000 Frequency/MHz Figure 97: CLKOUT „Strong-Sharp“ driver at 22pF load – conducted emission on VDDP CLKOUT Strong-Sharp 22pF VDDC 50 45 40 35 dBµV 30 25 20 15 10 5 0 0 100 200 300 400 500 600 700 800 900 1000 Frequency/MHz Figure 98: CLKOUT „Strong-Sharp“ driver at 22pF load – conducted emission on VDDC Application Note AP16099 83 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family CLKOUT Strong-Sharp 33pF VDDP 70 65 60 55 50 dBµV 45 40 35 30 25 20 15 10 5 0 0 100 200 300 400 500 600 700 800 900 1000 Frequency/MHz Figure 99: CLKOUT „Strong-Sharp“ driver at 33pF load – conducted emission on VDDP CLKOUT Strong-Medium 33pF VDDC 50 45 40 35 dBµV 30 25 20 15 10 5 0 0 100 200 300 400 500 600 700 800 900 1000 Frequency/MHz Figure 100: CLKOUT „Strong-Sharp“ driver at 33pF load – conducted emission on VDDC Application Note AP16099 84 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family CLKOUT Strong-Sharp 47pF VDDP 70 65 60 55 50 dBµV 45 40 35 30 25 20 15 10 5 0 0 100 200 300 400 500 600 700 800 900 1000 Frequency/MHz Figure 101: CLKOUT „Strong-Sharp“ driver at 47pF load – conducted emission on VDDP CLKOUT Strong-Sharp 47pF VDDC 50 45 40 35 dBµV 30 25 20 15 10 5 0 0 100 200 300 400 500 600 700 800 900 1000 Frequency/MHz Figure 102: CLKOUT „Strong-Sharp“ driver at 47pF load – conducted emission on VDDC Application Note AP16099 85 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family CLKOUT Strong-Medium no Load VDDP 70 65 60 55 50 dBµV 45 40 35 30 25 20 15 10 5 0 0 100 200 300 400 500 600 700 800 900 1000 Frequency/MHz Figure 103: CLKOUT „Strong-Medium“ driver at 0pF load – conducted emission on VDDP CLKOUT Strong-Medium no Load VDDC 50 45 40 35 dBµV 30 25 20 15 10 5 0 0 100 200 300 400 500 600 700 800 900 1000 Frequency/MHz Figure 104: CLKOUT „Strong-Medium“ driver at 0pF load – conducted emission on VDDC Application Note AP16099 86 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family CLKOUT Strong-Medium 10pF VDDP 70 65 60 55 50 dBµV 45 40 35 30 25 20 15 10 5 0 0 100 200 300 400 500 600 700 800 900 1000 Frequency/MHz Figure 105: CLKOUT „Strong-Medium“ driver at 10pF load – conducted emission on VDDP CLKOUT Strong-Medium 10pF VDDC 50 45 40 35 dBµV 30 25 20 15 10 5 0 0 100 200 300 400 500 600 700 800 900 1000 Frequency/MHz Figure 106: CLKOUT „Strong-Medium“ driver at 10pF load – conducted emission on VDDC Application Note AP16099 87 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family CLKOUT Strong-Medium 22pF VDDP 70 65 60 55 50 dBµV 45 40 35 30 25 20 15 10 5 0 0 100 200 300 400 500 600 700 800 900 1000 Frequency/MHz Figure 107: CLKOUT „Strong-Medium“ driver at 22pF load – conducted emission on VDDP CLKOUT Strong-Medium 22pF VDDC 50 45 40 35 dBµV 30 25 20 15 10 5 0 0 100 200 300 400 500 600 700 800 900 1000 Frequency/MHz Figure 108: CLKOUT „Strong-Medium“ driver at 22pF load – conducted emission on VDDC Application Note AP16099 88 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family CLKOUT Strong-Medium 33pF VDDP 70 65 60 55 50 dBµV 45 40 35 30 25 20 15 10 5 0 0 100 200 300 400 500 600 700 800 900 1000 Frequency/MHz Figure 109: CLKOUT „Strong-Medium“ driver at 33pF load – conducted emission on VDDP CLKOUT Strong-Medium 33pF VDDC 50 45 40 35 dBµV 30 25 20 15 10 5 0 0 100 200 300 400 500 600 700 800 900 1000 Frequency/MHz Figure 110: CLKOUT „Strong-Medium“ driver at 33pF load – conducted emission on VDDC Application Note AP16099 89 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family CLKOUT Strong-Medium 47pF VDDP 70 65 60 55 50 dBµV 45 40 35 30 25 20 15 10 5 0 0 100 200 300 400 500 600 700 800 900 1000 Frequency/MHz Figure 111: CLKOUT „Strong-Medium“ driver at 47pF load – conducted emission on VDDP CLKOUT Strong-Medium 47pF VDDC 50 45 40 35 dBµV 30 25 20 15 10 5 0 0 100 200 300 400 500 600 700 800 900 1000 Frequency/MHz Figure 112: CLKOUT „Strong-Medium“ driver at 47pF load – conducted emission on VDDC Application Note AP16099 90 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family GPIO Strong-Sharp no Load VDDP 70 65 60 55 50 dBµV 45 40 35 30 25 20 15 10 5 0 0 100 200 300 400 500 600 700 800 900 1000 Frequency/MHz Figure 113: GPIO „Strong-Sharp“ driver at 0pF load – conducted emission on VDDP GPIO Strong-Sharp no Load VDDC 50 45 40 35 dBµV 30 25 20 15 10 5 0 0 100 200 300 400 500 600 700 800 900 1000 Frequency/MHz Figure 114: GPIO „Strong-Sharp“ driver at 0pF load – conducted emission on VDDC Application Note AP16099 91 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family GPIO Strong-Sharp 22pF VDDP 70 65 60 55 50 dBµV 45 40 35 30 25 20 15 10 5 0 0 100 200 300 400 500 600 700 800 900 1000 Frequency/MHz Figure 115: GPIO „Strong-Sharp“ driver at 22pF load – conducted emission on VDDP GPIO Strong-Sharp 22pF VDDC 50 45 40 35 dBµV 30 25 20 15 10 5 0 0 100 200 300 400 500 600 700 800 900 1000 Frequency/MHz Figure 116: GPIO „Strong-Sharp“ driver at 22pF load – conducted emission on VDDC Application Note AP16099 92 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family GPIO Strong-Sharp 47pF VDDP 70 65 60 55 50 dBµV 45 40 35 30 25 20 15 10 5 0 0 100 200 300 400 500 600 700 800 900 1000 Frequency/MHz Figure 117 GPIO „Strong-Sharp“ driver at 47pF load – conducted emission on VDDP GPIO Strong-Sharp 47pF VDDC 50 45 40 35 dBµV 30 25 20 15 10 5 0 0 100 200 300 400 500 600 700 800 900 1000 Frequency/MHz Figure 118: GPIO „Strong-Sharp“ driver at 47pF load – conducted emission on VDDC Application Note AP16099 93 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family GPIO Strong-Medium no Load VDDP 70 65 60 55 50 dBµV 45 40 35 30 25 20 15 10 5 0 0 100 200 300 400 500 600 700 800 900 1000 Frequency/MHz Figure 119: GPIO „Strong-Medium“ driver at 0pF load – conducted emission on VDDP GPIO Strong-Medium no Load VDDC 50 45 40 35 dBµV 30 25 20 15 10 5 0 0 100 200 300 400 500 600 700 800 900 1000 Frequency/MHz Figure 120: GPIO „Strong-Medium“ driver at 0pF load – conducted emission on VDDC Application Note AP16099 94 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family GPIO Strong-Medium 22pF VDDP 70 65 60 55 50 dBµV 45 40 35 30 25 20 15 10 5 0 0 100 200 300 400 500 600 700 800 900 1000 Frequency/MHz Figure 121: GPIO „Strong-Medium“ driver at 22pF load – conducted emission on VDDP GPIO Strong-Medium 22pF VDDC 50 45 40 35 dBµV 30 25 20 15 10 5 0 0 100 200 300 400 500 600 700 800 900 1000 Frequency/MHz Figure 122: GPIO „Strong-Medium“ driver at 22pF load – conducted emission on VDDC Application Note AP16099 95 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family GPIO Strong-Medium 47pF VDDP 70 65 60 55 50 dBµV 45 40 35 30 25 20 15 10 5 0 0 100 200 300 400 500 600 700 800 900 1000 Frequency/MHz Figure 123: GPIO „Strong-Medium“ driver at 47pF load – conducted emission on VDDP GPIO Strong-Medium 47pF VDDC 50 45 40 35 dBµV 30 25 20 15 10 5 0 0 100 200 300 400 500 600 700 800 900 1000 Frequency/MHz Figure 124: GPIO „Strong-Medium“ driver at 47pF load – conducted emission on VDDC Application Note AP16099 96 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family GPIO Strong-Soft no Load VDDP 70 65 60 55 50 dBµV 45 40 35 30 25 20 15 10 5 0 0 100 200 300 400 500 600 700 800 900 1000 Frequency/MHz Figure 125: GPIO „Strong-Soft“ driver at 0pF load – conducted emission on VDDP GPIO Strong-Soft no Load VDDC 50 45 40 35 dBµV 30 25 20 15 10 5 0 0 100 200 300 400 500 600 700 800 900 1000 Frequency/MHz Figure 126: GPIO „Strong-Soft“ driver at 0pF load – conducted emission on VDDC Application Note AP16099 97 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family GPIO Strong-Soft 22pF VDDP 70 65 60 55 50 dBµV 45 40 35 30 25 20 15 10 5 0 0 100 200 300 400 500 600 700 800 900 1000 Frequency/MHz Figure 127: GPIO „Strong-Soft“ driver at 22pF load – conducted emission on VDDP GPIO Strong-Soft 22pF VDDC 50 45 40 35 dBµV 30 25 20 15 10 5 0 0 100 200 300 400 500 600 700 800 900 1000 Frequency/MHz Figure 128: GPIO „Strong-Soft“ driver at 22pF load – conducted emission on VDDC Application Note AP16099 98 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family GPIO Strong-Soft 47pF VDDP 70 65 60 55 50 dBµV 45 40 35 30 25 20 15 10 5 0 0 100 200 300 400 500 600 700 800 900 1000 Frequency/MHz Figure 129: GPIO „Strong-Soft“ driver at 47pF load – conducted emission on VDDP GPIO Strong-Soft 47pF VDDC 50 45 40 35 dBµV 30 25 20 15 10 5 0 0 100 200 300 400 500 600 700 800 900 1000 Frequency/MHz Figure 130: GPIO „Strong-Soft“ driver at 47pF load – conducted emission on VDDC Application Note AP16099 99 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family GPIO Medium no Load VDDP 70 65 60 55 50 dBµV 45 40 35 30 25 20 15 10 5 0 0 100 200 300 400 500 600 700 800 900 1000 Frequency/MHz Figure 131: GPIO „Medium“ driver at 0pF load – conducted emission on VDDP GPIO Medium no Load VDDC 50 45 40 35 dBµV 30 25 20 15 10 5 0 0 100 200 300 400 500 600 700 800 900 1000 Frequency/MHz Figure 132: GPIO „Medium“ driver at 0pF load – conducted emission on VDDC Application Note AP16099 100 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family GPIO Medium 22pF VDDP 70 65 60 55 50 dBµV 45 40 35 30 25 20 15 10 5 0 0 100 200 300 400 500 600 700 800 900 1000 Frequency/MHz Figure 133: GPIO „Medium“ driver at 22pF load – conducted emission on VDDP GPIO Medium 22pF VDDC 50 45 40 35 dBµV 30 25 20 15 10 5 0 0 100 200 300 400 500 600 700 800 900 1000 Frequency/MHz Figure 134: GPIO „Medium“ driver at 22pF load – conducted emission on VDDC Application Note AP16099 101 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family GPIO Medium 47pF VDDP 70 65 60 55 50 dBµV 45 40 35 30 25 20 15 10 5 0 0 100 200 300 400 500 600 700 800 900 1000 Frequency/MHz Figure 135: GPIO „Medium“ driver at 47pF load – conducted emission on VDDP GPIO Medium 47pF VDDC 50 45 40 35 dBµV 30 25 20 15 10 5 0 0 100 200 300 400 500 600 700 800 900 1000 Frequency/MHz Figure 136: GPIO „Medium“ driver at 47pF load – conducted emission on VDDC Application Note AP16099 102 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family GPIO Weak no Load VDDP 70 65 60 55 50 dBµV 45 40 35 30 25 20 15 10 5 0 0 100 200 300 400 500 600 700 800 900 1000 Frequency/MHz Figure 137: GPIO „Weak“ driver at 0pF load – conducted emission on VDDP GPIO Weak no Load VDDC 50 45 40 35 dBµV 30 25 20 15 10 5 0 0 100 200 300 400 500 600 700 800 900 1000 Frequency/MHz Figure 138: GPIO „Weak“ driver at 0pF load – conducted emission on VDDC Application Note AP16099 103 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family GPIO Weak 22pF VDDP 70 65 60 55 50 dBµV 45 40 35 30 25 20 15 10 5 0 0 100 200 300 400 500 600 700 800 900 1000 Frequency/MHz Figure 139: GPIO „Weak“ driver at 22pF load – conducted emission on VDDP GPIO Weak 22pF VDDC 50 45 40 35 dBµV 30 25 20 15 10 5 0 0 100 200 300 400 500 600 700 800 900 1000 Frequency/MHz Figure 140: GPIO „Weak“ driver at 22pF load – conducted emission on VDDC Application Note AP16099 104 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family GPIO Weak 47pF VDDP 70 65 60 55 50 dBµV 45 40 35 30 25 20 15 10 5 0 0 100 200 300 400 500 600 700 800 900 1000 Frequency/MHz Figure 141: GPIO „Weak“ driver at 47pF load – conducted emission on VDDP GPIO Weak 47pF VDDC 50 45 40 35 dBµV 30 25 20 15 10 5 0 0 100 200 300 400 500 600 700 800 900 1000 Frequency/MHz Figure 142: GPIO „Weak“ driver at 47pF load – conducted emission on VDDC Application Note AP16099 105 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family CLKOUT Strong-Sharp no Load RE GPIO Strong-Sharp no Load RE 50 50 45 45 40 40 35 dBµV dBµV 35 30 30 25 25 20 20 15 15 10 10 5 5 0 0 0 0 100 200 300 400 500 600 700 800 900 1000 100 200 300 400Frequency/MHz 500 600 700 800 900 1000 Frequency/MHz Figure 143: CLKOUT „Strong-Sharp“ driver at 0pF load – radiated emission Figure 145: GPIO „Strong-Sharp“ driver at 0pF load – radiated emission CLKOUT Strong-Medium no Load RE GPIO Strong-Medium no Load RE 50 50 45 45 40 40 35 dBµV dBµV 35 30 30 25 25 20 20 15 15 10 10 5 5 0 0 0 0 100 100 200 200 300 400 600 700 800 900 1000 300 400 Frequency/MHz 500 600 500 700 800 900 1000 Frequency/MHz Figure 144: CLKOUT „Strong-Medium“ driver at 0pF load – radiated emission Figure 146: GPIO „Strong-Medium“ driver at 0pF load – radiated emission Application Note AP16099 106 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family GPIO Strong-Soft no Load RE 50 45 40 35 dBµV 30 25 20 15 10 5 0 0 100 200 300 400 500 600 700 800 900 1000 900 1000 Frequency/MHz Figure 147: GPIO „Strong-Soft“ driver at 0pF load – radiated emission GPIO Medium no Load RE 50 45 40 35 dBµV 30 25 20 15 10 5 0 0 100 200 300 400 500 600 700 800 Frequency/MHz Figure 148: GPIO „Medium“ driver at 0pF load – radiated emission Application Note AP16099 107 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family GPIO Weak no Load RE 50 45 40 35 dBµV 30 25 20 15 10 5 0 0 100 200 300 400 500 600 700 800 900 1000 Frequency/MHz Figure 149: GPIO „Weak“ driver at 0pF load – radiated emission Application Note AP16099 108 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family 6 Result discussion The emission results presented in chapter 5 need a closer discussion regarding the impact of pad driver scaling and connected capacitive loads on the peak emission levels. This discussion is based on selected comparison data extracted from the emission tests. 6.1 CLKOUT driver, conducted emission CLKOUT uses a stronger driver than all other GPIOs. Its purpose is the distribution of the system clock either original or divided. In the presented measurements, CLKOUT was operated at 40MHz, which is equal to the system frequency. To maintain good signal integrity, no driver setting less than strong-medium must be selected. Fig. 150 compares the emissions coupled onto VDDC for strong-medium and strong-sharp settings for CLKOUT while driving different load capacitors of 0pF (i.e. no load), 10pF, 22pF, 33pF and 47pF. No additional probe capacitance was connected to the CLKOUT pin. dBµV CLKOUT crosstalk to VDDC "Driver Setting and Load Comparison" 80 75 70 65 60 55 50 45 40 35 30 25 20 15 10 5 0 -5 -10 STRONG-SHARP Group Envelope STRONG-MEDIUM Group Envelope 0 100 200 300 400 500 600 700 800 CLKOUT SME 0pF VDDC CLKOUT SME 10pF VDDC CLKOUT SME 22pF VDDC CLKOUT SME 33pF VDDC CLKOUT SME 47pF VDDC CLKOUT SSH 0pF VDDC CLKOUT SSH 10pF VDDC CLKOUT SSH 22pF VDDC CLKOUT SSH 33pF VDDC CLKOUT SSH 47pF VDDC 900 1000 Frequency/MHz Figure 150: CLKOUT „Strong-Sharp“ and “strong-soft” driver at various loads – conducted emission on VDDC Using strong-medium instead of strong-sof driver setting for CLKOUT reduces the resulting emission on VDDC up to 10dB. Application Note AP16099 109 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Fig. 151 compares the emissions coupled onto VDDP for strong-medium and strong-sharp settings for CLKOUT while driving different load capacitors of 0pF (i.e. no load), 10pF, 22pF, 33pF and 47pF. No additional probe capacitance was connected to the CLKOUT pin. dBµV CLKOUT crosstalk to VDDP "Driver Setting and Load Comparison" 80 75 70 65 60 55 50 45 40 35 30 25 20 15 10 5 0 -5 -10 STRONG-SHARP Group Envelope STRONG-MEDIUM Group Envelope 0 100 200 300 400 500 600 CLKOUT SME 0pF VDDP CLKOUT SME 10pF VDDP CLKOUT SME 22pF VDDP CLKOUT SME 33pF VDDP CLKOUT SME 47pF VDDP CLKOUT SSH 0pF VDDP CLKOUT SSH 10pF VDDP CLKOUT SSH 22pF VDDP CLKOUT SSH 33pF VDDP CLKOUT SSH 47pF VDDP 700 800 900 1000 Frequency/MHz Figure 151: CLKOUT „Strong-Sharp“ and “strong-soft” driver at various loads – conducted emission on VDDP Using strong-medium instead of strong-sof driver setting for CLKOUT reduces the resulting emission on VDDP up to 15dB. Application Note AP16099 110 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family 6.2 GPIO drivers, conducted emission GPIOs drive special peripheral functions up to a few MHz, but in real applications their data rates stay mostly in the range of 10kHz up to some 100kHz. During our emission measurement, the port switching was controlled by software. The resulting toggle rate was ca. 700kHz. On VDDC, the crosstalk noise is mainly determined by the system clock and its derivatives. These clocks determine the synchronous switching of internal logic gates. Thus the emission observed on VDDC is mainly caused by the internal switching activity. Fig. 152 compares the emission on VDDC for all possible driver settings at 22pF. dBµV GPIO with 22pF Load / Crosstalk to VDDC "Driver Setting Comparison" 80 75 70 65 60 55 50 45 40 35 30 25 20 15 10 5 0 -5 -10 GPIO WEA 22pF VDDC GPIO MED 22pF VDDC GPIO SSO 22pF VDDC GPIO SME 22pF VDDC GPIO SSH 22pF VDDC 0 100 200 300 400 500 600 700 800 900 1000 Frequency/MHz Figure 152: GPIO various driver settings at 22pF load – conducted emission on VDDC From this result we see that the emission on VDDC is not influenced by the driver settings. Application Note AP16099 111 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family On VDDP, the crosstalk noise might be determined by the switching ports activity. This is because all pad drivers are connected to VDDP. Fig. 153 compares the emission on VDDP for all possible driver settings at no external load. dBµV GPIO without Load / Crosstalk to VDDP "Driver Setting Comparison" 80 75 70 65 60 55 50 45 40 35 30 25 20 15 10 5 0 -5 -10 GPIO WEA 0pF VDDP GPIO MED 0pF VDDP GPIO SSO 0pF VDDP GPIO SME 0pF VDDP GPIO SSH 0pF VDDP 0 100 200 300 400 500 600 700 800 900 1000 Frequency/MHz Figure 153: GPIO various driver settings at no load – conducted emission on VDDP The emission amplitudes are mainly determined by the switching ports activity if any strong driver setting is used. For weak and medium driver settings the port emission stays below the system clock emission and is not visible in the envelope curves. Application Note AP16099 112 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Fig. 154 compares the emission on VDDP for all possible driver settings at 22pF load. dBµV GPIO with 22pF Load / Crosstalk to VDDP "Driver Setting Comparison" 80 75 70 65 60 55 50 45 40 35 30 25 20 15 10 5 0 -5 -10 GPIO WEA 22pF VDDP GPIO MED 22pF VDDP GPIO SSO 22pF VDDP GPIO SME 22pF VDDP GPIO SSH 22pF VDDP 0 100 200 300 400 500 600 700 800 900 1000 Frequency/MHz Figure 154: GPIO various driver settings at 22pF load – conducted emission on VDDP Again the emission amplitudes are mainly determined by the switching ports activity if any strong driver setting is used. For weak and medium driver settings the port emission stays below the system clock emission and is not visible in the envelope curves. Application Note AP16099 113 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Fig. 155 compares the emission on VDDP for all possible driver settings at 47pF load. dBµV GPIO with 47pF Load / Crosstalk to VDDP "Driver Setting Comparison" 80 75 70 65 60 55 50 45 40 35 30 25 20 15 10 5 0 -5 -10 GPIO WEA 47pF VDDP GPIO MED 47pF VDDP GPIO SSO 47pF VDDP GPIO SME 47pF VDDP GPIO SSH 47pF VDDP 0 100 200 300 400 500 600 700 800 900 1000 Frequency/MHz Figure 155: GPIO various driver settings at 47pF load – conducted emission on VDDP Again the emission amplitudes are mainly determined by the switching ports activity if any strong driver setting is used. For weak and medium driver settings the port emission stays below the system clock emission and is not visible in the envelope curves. However, for big external loads like the 47pF we used for comparison, the emission reduction when changing from strong-sharp to strong-medium or lower is not so efficient as for smaller loads like 22pF or smaller. Application Note AP16099 114 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Fig. 156 compares the emission on VDDP in case of no load, 22pF load and 47pF load at “weak” driver setting. dBµV GPIO "weak" / Crosstalk to VDDP "Load Comparison" 80 75 70 65 60 55 50 45 40 35 30 25 20 15 10 5 0 -5 -10 GPIO WEA 0pF VDDP GPIO WEA 22pF VDDP GPIO WEA 47pF VDDP 0 100 200 300 400 500 600 700 800 900 1000 Frequency/MHz Figure 156: GPIO “weak” driver settings at various loads – conducted emission on VDDP Emissions in the higher frequency range are comparable. At low frequencies, the minimum load causes maximum emission. This is due to the higher di/dt when charging/discharging of the load starts. Please refer to chapter 2.1.3 for a physical explanation. Application Note AP16099 115 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Fig. 157 compares the emission on VDDP in case of no load, 22pF load and 47pF load at “medium” driver setting. dBµV GPIO "medium" / Crosstalk to VDDP "Load Comparison" 80 75 70 65 60 55 50 45 40 35 30 25 20 15 10 5 0 -5 -10 GPIO MED 0pF VDDP GPIO MED 22pF VDDP GPIO MED 47pF VDDP 0 100 200 300 400 500 600 700 800 900 1000 Frequency/MHz Figure 157: GPIO “medium” driver settings at various loads – conducted emission on VDDP Emissions in the higher frequency range are comparable. At low frequencies, the minimum load causes maximum emission. This is due to the higher di/dt when charging/discharging of the load starts. Please refer to chapter 2.1.3 for a physical explanation. Application Note AP16099 116 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Fig. 158 compares the emission on VDDP in case of no load, 22pF load and 47pF load at “strongsoft” driver setting. dBµV GPIO "strong-soft" / Crosstalk to VDDP "Load Comparison" 80 75 70 65 60 55 50 45 40 35 30 25 20 15 10 5 0 -5 -10 GPIO SSO 0pF VDDP GPIO SSO 22pF VDDP GPIO SSO 47pF VDDP 0 100 200 300 400 500 600 700 800 900 1000 Frequency/MHz Figure 158: GPIO “strong-soft” driver settings at various loads – conducted emission on VDDP Emissions in the higher frequency range are comparable. At low frequencies, the minimum load causes maximum emission. This is due to the higher di/dt when charging/discharging of the load starts. Please refer to chapter 2.1.3 for a physical explanation. Application Note AP16099 117 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Fig. 159 compares the emission on VDDP in case of no load, 22pF load and 47pF load at “strongmedium” driver setting. dBµV GPIO "strong-medium" / Crosstalk to VDDP "Load Comparison" 80 75 70 65 60 55 50 45 40 35 30 25 20 15 10 5 0 -5 -10 GPIO SME 0pF VDDP GPIO SME 22pF VDDP GPIO SME 47pF VDDP 0 100 200 300 400 500 600 700 800 900 1000 Frequency/MHz Figure 159: GPIO “strong-medium” driver settings at various loads – conducted emission on VDDP Emissions in the higher frequency range are comparable. At low frequencies, the minimum load causes maximum emission. This is due to the higher di/dt when charging/discharging of the load starts. Please refer to chapter 2.1.3 for a physical explanation. Application Note AP16099 118 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Fig. 160 compares the emission on VDDP in case of no load, 22pF load and 47pF load at “strongsharp” driver setting. dBµV GPIO "strong-sharp" / Crosstalk to VDDP "Load Comparison" 80 75 70 65 60 55 50 45 40 35 30 25 20 15 10 5 0 -5 -10 GPIO SSH 0pF VDDP GPIO SSH 22pF VDDP GPIO SSH 47pF VDDP 0 100 200 300 400 500 600 700 800 900 1000 Frequency/MHz Figure 160: GPIO “strong-sharp” driver settings at various loads – conducted emission on VDDP Emissions in the higher frequency range are comparable. At low frequencies, the minimum load causes maximum emission. This is due to the higher di/dt when charging/discharging of the load starts. Please refer to chapter 2.1.3 for a physical explanation. Application Note AP16099 119 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family 6.3 Radiated emission Above 100MHz, using “strong-medium” instead of “strong-sharp” driver for the CLKOUT pin leads to a radiated emission reduction between 6dB and 10dB. Fig. 161 shows the corresponding envelope curves. dBµV CLKOUT without Load / Radiated Emission "Driver Setting Comparison" 80 75 70 65 60 55 50 45 40 35 30 25 20 15 10 5 0 -5 -10 CLKOUT SME 0pF RE CLKOUT SSH 0pF RE 0 100 200 300 400 500 600 700 800 900 1000 Frequency/MHz Figure 161: CLKOUT toggling at 40MHz; various driver settings at no load – radiated emission Similar differences appear for bigger capacitive loads. Radiated emission stays ca. 15-20dB below conducted emission observed at VDDP. Please compare with Fig. 151. Application Note AP16099 120 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family If set to “strong-sharp”, the radiated emission of 16 toggling GPIO pins (toggle rate ca. 700kHz) stays more than 15dB below the radiated emission of the 40MHz CLKOUT pin. Weaker driver settings (“strong-medium” and below) reduce radiated emission ca. 10dB further. Fig. 162 shows the corresponding envelope curves. dBµV GPIO without Load / Radiated Emission "Driver Setting Comparison" 80 75 70 65 60 55 50 45 40 35 30 25 20 15 10 5 0 -5 -10 GPIO WEA 0pF RE GPIO MED 0pF RE GPIO SSO 0pF RE GPIO SME 0pF RE GPIO SSH 0pF RE 0 100 200 300 400 500 600 700 800 900 1000 Frequency/MHz Figure 162: GPIOs toggling at ca. 700kHz; various driver settings at no load – radiated emission Similar differences appear for bigger capacitive loads. Radiated emission stays ca. 10-15dB below conducted emission observed at VDDP. Please compare with Fig. 153. Whenever using driver settings less than “strong-sharp”, the radiated emission caused by the drivers should not cause any problems and are neglegible against the CLKOUT emission. Application Note AP16099 121 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family 7 Recommended Settings for Signal Categories 7.1 General In the previous chapters, many detailed data was provided for the impact of driver settings and load capacitance on the resulting rise and fall times as well as on conducted and radiated emission. Generally, the required signal integrity determines the selection of driver strength and slew rate for a given toggle rate and capacitive load. However, due to the simultaneous impact on electromagnetic emission, the weakest possible driver setting which still meets the signal integrity should be chosen. To decide for the proper pad driver settings for a signal, its electrical characteristics should be considered. This leads to the definition of signal categories by means of clock or data transfer (AC view) or current driving capability (DC view). According to these views, any signal can be classified as shown in Table 5. Signal category Clock rate Capacitive load DC driving capability System clock 20 … 40 MHz 10 … 50 pF n/a High-speed data line 5 … 20 MHz 10 … 50 pF n/a Low-speed data line 0.5 … 5 MHz 10 … 50 pF n/a Low-speed control line <1 MHz <20 pF n/a High-current control line n/a n/a 10 … 30 mA Medium-current control line n/a n/a 1 … 10 mA Low-current control line n/a n/a <1 mA Table 5: Signal categories The following settings for pad output drivers are available, see also Table 6: • strong driver / sharp edge (setting 1) • strong driver / medium edge (setting 2) • strong driver / soft edge (setting 3) • medium driver / no edge configuration available (setting 4) • weak driver / no edge configuration available (setting 5) Setting number Driver configuration Edge configuration Signal category Capacitive Load DC Current 1) 1 STRONG SHARP System clock High 2.5 / 10 mA 2 STRONG MEDIUM System clock Low High-speed data lines High High-speed data lines Low High-current control lines All Low-speed data lines All Medium-current control lines All Very low-speed control lines All Low-current control line All 3 4 5 STRONG MEDIUM WEAK SOFT none none Table 6: Recommended Output Driver Settings Application Note AP16099 122 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Note 1): Two values are given for the DC current of GPIO pins in the format “nominal / max mA”. The “max mA” value can only be drawn from a pin if maximal 2 other pins in the same 16-bit port group are also driving this maximum current. This restriction is due to danger of electromigration damage. The following parameters determine the final selection of driver settings: 7.2 • signal performance category (AC and DC) • maximum temperature • maximum acceptable electromagnetic emission Decision Tables and Graphs Following the recommendations given above, the driver setting selection should be based on (1) proper signal integrity and (2) minimal electromagnetic emission. Since electromagnetic emission increases with stronger driver settings, the weakest driver and slew rate settings should be selected that are able to force the rise/fall times required for the desired signal integrity. This chapter offers decision numbers in table and graphical format for proper driver settings at maximum clock or data rates expected to be driven. The rise/fall times occupy 1/6th of the clock period each, see Fig. 163 on top. Alternatively, the rise/fall times occupy 1/4th of the clock period each, see Fig. 163 on bottom. U 90% T/6 T T/6 10% t U 90% T/4 T T/4 10% t Figure 163: Assumed rise/fall timing conditions related to signal period Please note that all values given in this chapter are proposals for system application designers using Infineon microcontrollers in 0.25µm CMOS technology. They are based on timing measurements performed on center lot devices. Thus all values are subject to approx. 10% offset depending on fabrication process variation. Additionally, pad supply voltages different from nominal conditions impact the resulting timing. The finally selected driver setting should include this offset. It has to be added to all numbers given in the tables and graphs. Application Note AP16099 123 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Fig. 164 shows an example of a decision graph. Figure 164: Assumed rise/fall timing conditions related to signal period The clock/data rate is given in [MHz] for capacitive loads of 20, 30, 40, 50 pF and driver selections of weak, medium, strong soft/medium/sharp. In Fig. 164, the resulting maximum data rates are marked with red circles as 17 MHz at 20 pF load, 13 MHz at 30 pF load, 12.5 MHz at 40 pF load, and 12 MHz at 50 pF load. If a pin is intended to toggle a 35 pF load at 15 MHz, the strong-soft setting is not sufficient. Instead strong-medium must be selected. Strong-sharp is, of course, also capable of driving a 35 pF load at 15 MHz, but should be avoided due to unnecessary high electromagnetic emission. The rise/fall times occupy 1/6th of the clock period each, see Fig. 163 on top. This relation should be acceptable for most interface signals and protocols. Tables 7 and 8 give an overview of the maximal toggle rates in [MHz] for all driver settings (WEA=weak, MED=medium, SSO=strong-soft, SME=strong-medium, SSH=strong-sharp) connected to capacitive loads of 20, 30, 40, and 50 pF. Each ambient temperature is marked by its own color. According to the microcontroller specification or marking, one of the following maximum temperatures should apply: 125°C, 110°C, 85°C, 70°C. The other temperatures, 25°C and -40°C, are given for reference only. Since the CLKOUT driver is stronger than the GPIO driver, values for both driver types are provided in Tables 7 and 8. In Table 7, the rise/fall times are assumed to occupy 1/6th of the clock period, in Table 8, the rise/fall times are assumed to occupy 1/4th of the clock period. Fig. 165-192 show the values of Tables 7 and 8 in the graphical representation explained in Fig. 164, separated by ambient temperatures and driver types. In the respective titles, “16% Edges” stands for rise/fall times occupying 1/6th of the clock period; “25% Edges” stands for rise/fall times occupying 1/4th of the clock period. Application Note AP16099 124 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family CLKOUT 150°C GPIO SSH SME SSO MED WEA 20 49.02 27.78 11.34 6.83 1.33 30 39.22 23.47 10.10 5.56 1.03 40 33.33 21.65 9.16 5.05 0.84 50 29.66 20.23 8.96 4.80 0.68 SSH SME SSO MED WEA 20 30.30 15.02 10.82 6.97 1.38 30 23.81 13.06 9.36 5.77 1.04 40 18.16 11.00 7.88 4.69 0.85 50 15.72 10.22 7.58 4.31 0.68 SSH SME SSO MED WEA 20 53.76 30.30 12.36 7.50 1.48 30 42.80 25.22 10.83 6.03 1.13 40 36.30 23.15 9.83 5.45 0.91 50 32.08 21.58 9.57 5.14 0.74 SSH SME SSO MED WEA 20 32.81 16.06 11.65 7.45 1.52 30 25.61 13.84 10.08 6.15 1.15 40 19.76 11.89 8.56 5.08 0.93 50 17.08 11.07 8.23 4.67 0.74 SSH SME SSO MED WEA 20 57.08 32.05 13.07 7.97 1.59 30 45.28 26.40 11.32 6.36 1.20 40 38.34 24.15 10.28 5.72 0.96 50 33.73 22.48 9.97 5.37 0.78 SSH SME SSO MED WEA 20 34.52 16.75 12.19 7.78 1.62 30 26.83 14.35 10.57 6.40 1.22 40 20.86 12.49 9.03 5.33 0.98 50 18.02 11.64 8.68 4.93 0.78 SSH SME SSO MED WEA 20 63.61 35.46 14.46 8.90 1.81 30 50.13 28.63 12.24 6.98 1.34 40 42.31 26.04 11.13 6.23 1.06 50 36.89 24.16 10.73 5.80 0.85 SSH SME SSO MED WEA 20 37.81 18.06 13.21 8.38 1.82 30 29.13 15.30 11.47 6.87 1.37 40 23.00 13.52 9.94 5.83 1.09 50 19.83 12.74 9.55 5.41 0.87 SSH SME SSO MED WEA 20 68.31 37.88 15.44 9.57 1.97 30 53.58 30.16 12.87 7.42 1.44 40 45.11 27.32 11.71 6.58 1.12 50 39.09 25.30 11.24 6.10 0.91 SSH SME SSO MED WEA 20 40.10 18.95 13.91 8.78 1.97 30 30.72 15.93 12.00 7.18 1.48 40 24.51 14.20 10.57 6.18 1.17 50 21.10 13.51 10.16 5.76 0.92 SSH SME SSO MED WEA 20 87.72 47.62 19.38 12.35 2.69 30 67.20 35.92 15.22 9.13 1.85 40 56.31 32.05 13.88 7.94 1.39 50 47.62 29.45 13.12 7.18 1.13 SSH SME SSO MED WEA 20 49.02 22.22 16.55 10.29 2.60 30 36.71 18.18 13.92 8.33 1.94 40 30.53 16.73 12.92 7.51 1.50 50 26.12 16.49 12.58 7.10 1.16 SSH SME SSO MED WEA 20 148.81 75.76 30.08 21.26 5.70 30 96.56 49.59 20.67 12.95 3.17 40 80.59 42.74 18.91 11.04 2.11 50 67.44 38.59 17.30 9.55 1.72 SSH SME SSO MED WEA 20 69.91 29.61 22.79 13.67 4.85 30 51.11 22.82 18.12 10.84 3.51 40 45.82 22.55 18.36 10.44 2.51 50 39.82 23.43 18.95 10.16 1.82 125°C 110°C 85°C 70°C 25°C -40°C Table 7: Maximum toggle rates [MHz] for all driver settings at loads 20 … 50 pF; 16% Edges Application Note AP16099 125 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family CLKOUT 150°C GPIO SSH SME SSO MED WEA 20 73.53 41.67 17.01 10.25 2.00 30 58.82 35.21 15.15 8.33 1.54 40 50.00 32.47 13.74 7.58 1.26 50 44.48 30.34 13.44 7.20 1.02 SSH SME SSO MED WEA 20 45.45 22.52 16.23 10.46 2.07 30 35.71 19.59 14.04 8.65 1.56 40 27.23 16.50 11.82 7.04 1.27 50 23.58 15.34 11.36 6.46 1.02 SSH SME SSO MED WEA 20 80.65 45.45 18.55 11.25 2.22 30 64.20 37.83 16.24 9.04 1.69 40 54.44 34.72 14.74 8.17 1.36 50 48.11 32.37 14.35 7.72 1.10 SSH SME SSO MED WEA 20 49.21 24.08 17.47 11.18 2.28 30 38.41 20.76 15.12 9.22 1.72 40 29.63 17.83 12.84 7.61 1.39 50 25.63 16.60 12.35 7.01 1.11 SSH SME SSO MED WEA 20 85.62 48.08 19.61 11.95 2.38 30 67.93 39.60 16.98 9.53 1.80 40 57.51 36.23 15.41 8.57 1.44 50 50.59 33.72 14.96 8.06 1.16 SSH SME SSO MED WEA 20 51.78 25.13 18.28 11.66 2.43 30 40.24 21.53 15.85 9.60 1.83 40 31.29 18.74 13.55 8.00 1.48 50 27.03 17.46 13.02 7.39 1.18 SSH SME SSO MED WEA 20 95.42 53.19 21.69 13.35 2.71 30 75.20 42.95 18.36 10.48 2.01 40 63.46 39.06 16.69 9.34 1.58 50 55.34 36.24 16.10 8.70 1.28 SSH SME SSO MED WEA 20 56.72 27.09 19.82 12.57 2.74 30 43.70 22.95 17.21 10.30 2.06 40 34.50 20.27 14.91 8.75 1.64 50 29.74 19.11 14.33 8.12 1.30 SSH SME SSO MED WEA 20 102.46 56.82 23.16 14.35 2.95 30 80.37 45.24 19.31 11.14 2.16 40 67.67 40.98 17.56 9.87 1.68 50 58.64 37.94 16.86 9.14 1.36 SSH SME SSO MED WEA 20 60.15 28.42 20.87 13.18 2.96 30 46.08 23.90 18.00 10.78 2.22 40 36.77 21.30 15.86 9.26 1.76 50 31.65 20.26 15.24 8.63 1.39 SSH SME SSO MED WEA 20 30 131.58 100.81 71.43 53.88 29.07 22.83 18.52 13.70 4.03 2.78 40 84.46 48.08 20.82 11.90 2.08 50 71.43 44.17 19.69 10.78 1.69 SSH SME SSO MED WEA 20 73.53 33.33 24.83 15.43 3.91 30 55.07 27.26 20.89 12.50 2.91 40 45.79 25.10 19.38 11.26 2.25 50 39.18 24.73 18.87 10.65 1.74 SSH SME SSO MED WEA 20 30 40 50 223.21 144.84 120.89 101.17 113.64 74.39 64.10 57.89 45.13 31.00 28.37 25.96 31.89 19.43 16.57 14.33 8.55 4.76 3.17 2.58 SSH SME SSO MED WEA 20 104.87 44.42 34.18 20.50 7.28 30 76.67 34.23 27.18 16.26 5.26 40 68.73 33.82 27.54 15.66 3.77 50 59.73 35.15 28.43 15.24 2.73 125°C 110°C 85°C 70°C 25°C -40°C Table 8: Maximum toggle rates [MHz] for all driver settings at loads 20..50pF; 25% edges Application Note AP16099 126 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Frequency Limits CLKOUT at 150°C with 16% Edges 50 45 Frequency [MHz] 40 45.00-50.00 40.00-45.00 35.00-40.00 30.00-35.00 25.00-30.00 20.00-25.00 15.00-20.00 10.00-15.00 5.00-10.00 0.00-5.00 35 30 25 20 15 10 5 0 SSH 50 SME Driver SSO 40 MED WEA 30 Cload [pF] 20 Figure 165: Driver selection decision graph for CLKOUT at TA=150°C; edges occupy 1/6 period Frequency Limits CLKOUT at 150°C with 25% Edges 80 70 Frequency [MHz] 60 70.00-80.00 60.00-70.00 50.00-60.00 40.00-50.00 30.00-40.00 20.00-30.00 10.00-20.00 0.00-10.00 50 40 30 20 10 0 SSH 50 SME Driver SSO 40 MED WEA 30 Cload [pF] 20 Figure 166: Driver selection decision graph for CLKOUT at TA=150°C; edges occupy 1/4 period Application Note AP16099 127 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Frequency Limits CLKOUT at 125°C with 16% Edges 60 55 50 55.00-60.00 50.00-55.00 45.00-50.00 40.00-45.00 35.00-40.00 30.00-35.00 25.00-30.00 20.00-25.00 15.00-20.00 10.00-15.00 5.00-10.00 0.00-5.00 Frequency [MHz] 45 40 35 30 25 20 15 10 5 0 SSH 50 SME Driver SSO 40 MED WEA 30 Cload [pF] 20 Figure 167: Driver selection decision graph for CLKOUT at TA=125°C; edges occupy 1/6 period Frequency Limits CLKOUT at 125°C with 25% Edges 90 80 Frequency [MHz] 70 80.00-90.00 70.00-80.00 60.00-70.00 50.00-60.00 40.00-50.00 30.00-40.00 20.00-30.00 10.00-20.00 0.00-10.00 60 50 40 30 20 10 0 SSH 50 SME Driver SSO 40 MED WEA 30 Cload [pF] 20 Figure 168: Driver selection decision graph for CLKOUT at TA=125°C; edges occupy 1/4 period Application Note AP16099 128 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Frequency Limits CLKOUT at 110°C with 16% Edges 60 55 50 55.00-60.00 50.00-55.00 45.00-50.00 40.00-45.00 35.00-40.00 30.00-35.00 25.00-30.00 20.00-25.00 15.00-20.00 10.00-15.00 5.00-10.00 0.00-5.00 Frequency [MHz] 45 40 35 30 25 20 15 10 5 0 SSH 50 SME Driver SSO 40 MED WEA 30 Cload [pF] 20 Figure 169: Driver selection decision graph for CLKOUT at TA=110°C; edges occupy 1/6 period Frequency Limits CLKOUT at 110°C with 25% Edges 90 80 Frequency [MHz] 70 80.00-90.00 70.00-80.00 60.00-70.00 50.00-60.00 40.00-50.00 30.00-40.00 20.00-30.00 10.00-20.00 0.00-10.00 60 50 40 30 20 10 0 SSH 50 SME Driver SSO 40 MED WEA 30 Cload [pF] 20 Figure 170: Driver selection decision graph for CLKOUT at TA=110°C; edges occupy 1/4 period Application Note AP16099 129 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Frequency Limits CLKOUT at 85°C with 16% Edges 60 55 50 55.00-60.00 50.00-55.00 45.00-50.00 40.00-45.00 35.00-40.00 30.00-35.00 25.00-30.00 20.00-25.00 15.00-20.00 10.00-15.00 5.00-10.00 0.00-5.00 Frequency [MHz] 45 40 35 30 25 20 15 10 5 0 SSH 50 SME Driver SSO 40 MED WEA 30 Cload [pF] 20 Figure 171: Driver selection decision graph for CLKOUT at TA=85°C; edges occupy 1/6 period Frequency Limits CLKOUT at 85°C with 25% Edges 100 90 Frequency [MHz] 80 90.00-100.00 80.00-90.00 70.00-80.00 60.00-70.00 50.00-60.00 40.00-50.00 30.00-40.00 20.00-30.00 10.00-20.00 0.00-10.00 70 60 50 40 30 20 10 0 SSH 50 SME Driver SSO 40 MED WEA 30 Cload [pF] 20 Figure 172: Driver selection decision graph for CLKOUT at TA=85°C; edges occupy 1/4 period Application Note AP16099 130 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Frequency [MHz] Frequency Limits CLKOUT at 70°C with 16% Edges 70 65 60 55 50 45 40 35 30 25 20 15 10 5 0 65.00-70.00 60.00-65.00 55.00-60.00 50.00-55.00 45.00-50.00 40.00-45.00 35.00-40.00 30.00-35.00 25.00-30.00 20.00-25.00 15.00-20.00 10.00-15.00 5.00-10.00 0.00-5.00 SSH 50 SME Driver SSO 40 MED WEA 30 Cload [pF] 20 Figure 173: Driver selection decision graph for CLKOUT at TA=70°C; edges occupy 1/6 period Frequency Limits CLKOUT at 70°C with 25% Edges 110 100 Frequency [MHz] 90 100.00-110.00 90.00-100.00 80.00-90.00 70.00-80.00 60.00-70.00 50.00-60.00 40.00-50.00 30.00-40.00 20.00-30.00 10.00-20.00 0.00-10.00 80 70 60 50 40 30 20 10 0 SSH 50 SME Driver SSO 40 MED WEA 30 Cload [pF] 20 Figure 174: Driver selection decision graph for CLKOUT at TA=70°C; edges occupy 1/4 period Application Note AP16099 131 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Frequency Limits CLKOUT at 25°C with 16% Edges 90 80 Frequency [MHz] 70 80.00-90.00 70.00-80.00 60.00-70.00 50.00-60.00 40.00-50.00 30.00-40.00 20.00-30.00 10.00-20.00 0.00-10.00 60 50 40 30 20 10 0 SSH 50 SME Driver SSO 40 MED WEA 30 Cload [pF] 20 Figure 175: Driver selection decision graph for CLKOUT at TA=25°C; edges occupy 1/6 period Frequency [MHz] Frequency Limits CLKOUT at 25°C with 25% Edges 140 130 120 110 100 90 80 70 60 50 40 30 20 10 0 130.00-140.00 120.00-130.00 110.00-120.00 100.00-110.00 90.00-100.00 80.00-90.00 70.00-80.00 60.00-70.00 50.00-60.00 40.00-50.00 30.00-40.00 20.00-30.00 10.00-20.00 0.00-10.00 SSH 50 SME Driver SSO 40 MED WEA 30 Cload [pF] 20 Figure 176: Driver selection decision graph for CLKOUT at TA=25°C; edges occupy 1/4 period Application Note AP16099 132 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Frequency [MHz] Frequency Limits CLKOUT at -40°C with 16% Edges 150 140 130 120 110 100 90 80 70 60 50 40 30 20 10 0 SSH 50 SME Driver SSO 40 MED WEA 30 140.00-150.00 130.00-140.00 120.00-130.00 110.00-120.00 100.00-110.00 90.00-100.00 80.00-90.00 70.00-80.00 60.00-70.00 50.00-60.00 40.00-50.00 30.00-40.00 20.00-30.00 10.00-20.00 0.00-10.00 Cload [pF] 20 Figure 177: Driver selection decision graph for CLKOUT at TA=-40°C; edges occupy 1/6 period Frequency Limits CLKOUT at -40°C with 25% Edges 240 220 200 220.00-240.00 200.00-220.00 180.00-200.00 160.00-180.00 140.00-160.00 120.00-140.00 100.00-120.00 80.00-100.00 60.00-80.00 40.00-60.00 20.00-40.00 0.00-20.00 Frequency [MHz] 180 160 140 120 100 80 60 40 20 0 SSH 50 SME Driver SSO 40 MED WEA 30 Cload [pF] 20 Figure 178: Driver selection decision graph for CLKOUT at TA=-40°C; edges occupy 1/4 period Application Note AP16099 133 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Frequency Limits GPIO at 150°C with 16% Edges 35 Frequency [MHz] 30 25 30.00-35.00 25.00-30.00 20.00-25.00 15.00-20.00 10.00-15.00 5.00-10.00 0.00-5.00 20 15 10 5 0 SSH 50 SME Driver SSO 40 MED WEA 30 Cload [pF] 20 Figure 179: Driver selection decision graph for GPIO at TA=150°C; edges occupy 1/6 period Frequency Limits GPIO at 150°C with 25% Edges 50 45 Frequency [MHz] 40 45.00-50.00 40.00-45.00 35.00-40.00 30.00-35.00 25.00-30.00 20.00-25.00 15.00-20.00 10.00-15.00 5.00-10.00 0.00-5.00 35 30 25 20 15 10 5 0 SSH 50 SME Driver SSO 40 MED WEA 30 Cload [pF] 20 Figure 180: Driver selection decision graph for GPIO at TA=150°C; edges occupy 1/4 period Application Note AP16099 134 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Frequency Limits GPIO at 125°C with 16% Edges 40 35 Frequency [MHz] 30 35.00-40.00 30.00-35.00 25.00-30.00 20.00-25.00 15.00-20.00 10.00-15.00 5.00-10.00 0.00-5.00 25 20 15 10 5 0 SSH 50 SME Driver SSO 40 MED WEA 30 Cload [pF] 20 Figure 181: Driver selection decision graph for GPIO at TA=125°C; edges occupy 1/6 period Frequency Limits GPIO at 125°C with 25% Edges 50 45 Frequency [MHz] 40 45.00-50.00 40.00-45.00 35.00-40.00 30.00-35.00 25.00-30.00 20.00-25.00 15.00-20.00 10.00-15.00 5.00-10.00 0.00-5.00 35 30 25 20 15 10 5 0 SSH 50 SME Driver SSO 40 MED WEA 30 Cload [pF] 20 Figure 182: Driver selection decision graph for GPIO at TA=125°C; edges occupy 1/4 period Application Note AP16099 135 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Frequency Limits GPIO at 110°C with 16% Edges 40 35 Frequency [MHz] 30 35.00-40.00 30.00-35.00 25.00-30.00 20.00-25.00 15.00-20.00 10.00-15.00 5.00-10.00 0.00-5.00 25 20 15 10 5 0 SSH 50 SME Driver SSO 40 MED WEA 30 Cload [pF] 20 Figure 183: Driver selection decision graph for GPIO at TA=110°C; edges occupy 1/6 period Frequency Limits GPIO at 110°C with 25% Edges 55 50 Frequency [MHz] 45 50.00-55.00 45.00-50.00 40.00-45.00 35.00-40.00 30.00-35.00 25.00-30.00 20.00-25.00 15.00-20.00 10.00-15.00 5.00-10.00 0.00-5.00 40 35 30 25 20 15 10 5 0 SSH 50 SME Driver SSO 40 MED WEA 30 Cload [pF] 20 Figure 184: Driver selection decision graph for GPIO at TA=110°C; edges occupy 1/4 period Application Note AP16099 136 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Frequency Limits GPIO at 85°C with 16% Edges 40 35 Frequency [MHz] 30 35.00-40.00 30.00-35.00 25.00-30.00 20.00-25.00 15.00-20.00 10.00-15.00 5.00-10.00 0.00-5.00 25 20 15 10 5 0 SSH 50 SME Driver SSO 40 MED WEA 30 Cload [pF] 20 Figure 185: Driver selection decision graph for GPIO at TA=85°C; edges occupy 1/6 period Frequency Limits GPIO at 85°C with 25% Edges 60 55 50 55.00-60.00 50.00-55.00 45.00-50.00 40.00-45.00 35.00-40.00 30.00-35.00 25.00-30.00 20.00-25.00 15.00-20.00 10.00-15.00 5.00-10.00 0.00-5.00 Frequency [MHz] 45 40 35 30 25 20 15 10 5 0 SSH 50 SME Driver SSO 40 MED WEA 30 Cload [pF] 20 Figure 186: Driver selection decision graph for GPIO at TA=85°C; edges occupy 1/4 period Application Note AP16099 137 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Frequency Limits GPIO at 70°C with 16% Edges 40 35 Frequency [MHz] 30 35.00-40.00 30.00-35.00 25.00-30.00 20.00-25.00 15.00-20.00 10.00-15.00 5.00-10.00 0.00-5.00 25 20 15 10 5 0 SSH 50 SME Driver SSO 40 MED WEA 30 Cload [pF] 20 Figure 187: Driver selection decision graph for GPIO at TA=70°C; edges occupy 1/6 period Frequency Limits GPIO at 70°C with 25% Edges 60 55 50 55.00-60.00 50.00-55.00 45.00-50.00 40.00-45.00 35.00-40.00 30.00-35.00 25.00-30.00 20.00-25.00 15.00-20.00 10.00-15.00 5.00-10.00 0.00-5.00 Frequency [MHz] 45 40 35 30 25 20 15 10 5 0 SSH 50 SME Driver SSO 40 MED WEA 30 Cload [pF] 20 Figure 188: Driver selection decision graph for GPIO at TA=70°C; edges occupy 1/4 period Application Note AP16099 138 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Frequency Limits GPIO at 25°C with 16% Edges 50 45 Frequency [MHz] 40 45.00-50.00 40.00-45.00 35.00-40.00 30.00-35.00 25.00-30.00 20.00-25.00 15.00-20.00 10.00-15.00 5.00-10.00 0.00-5.00 35 30 25 20 15 10 5 0 SSH 50 SME Driver SSO 40 MED WEA 30 Cload [pF] 20 Figure 189: Driver selection decision graph for GPIO at TA=25°C; edges occupy 1/6 period Frequency [MHz] Frequency Limits GPIO at 25°C with 25% Edges 75 70 65 60 55 50 45 40 35 30 25 20 15 10 5 0 SSH 50 SME Driver SSO 40 MED WEA 30 70.00-75.00 65.00-70.00 60.00-65.00 55.00-60.00 50.00-55.00 45.00-50.00 40.00-45.00 35.00-40.00 30.00-35.00 25.00-30.00 20.00-25.00 15.00-20.00 10.00-15.00 5.00-10.00 0.00-5.00 Cload [pF] 20 Figure 190: Driver selection decision graph for GPIO at TA=25°C; edges occupy 1/4 period Application Note AP16099 139 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family Frequency [MHz] Frequency Limits GPIO at -40°C with 16% Edges 70 65 60 55 50 45 40 35 30 25 20 15 10 5 0 65.00-70.00 60.00-65.00 55.00-60.00 50.00-55.00 45.00-50.00 40.00-45.00 35.00-40.00 30.00-35.00 25.00-30.00 20.00-25.00 15.00-20.00 10.00-15.00 5.00-10.00 0.00-5.00 SSH 50 SME Driver SSO 40 MED WEA 30 Cload [pF] 20 Figure 191: Driver selection decision graph for GPIO at TA=-40°C; edges occupy 1/6 period Frequency Limits GPIO at -40°C with 25% Edges 120 110 100 110.00-120.00 100.00-110.00 90.00-100.00 80.00-90.00 70.00-80.00 60.00-70.00 50.00-60.00 40.00-50.00 30.00-40.00 20.00-30.00 10.00-20.00 0.00-10.00 Frequency [MHz] 90 80 70 60 50 40 30 20 10 0 SSH 50 SME Driver SSO 40 MED WEA 30 Cload [pF] 20 Figure 192: Driver selection decision graph for GPIO at TA=-40°C; edges occupy 1/4 period Application Note AP16099 140 V1.1, 2006-09 AP16099 Scalable Output Drivers of XC166 Family 8 Glossary CLKOUT System Clock Output Strong output driver for the system clock. Cload Ideal capacitive load connected to an output driver. Load Capacitor di/dt Dynamic current over time EMC Electromagnetic Compatibility The ability of an electrical device to function satisfactorily in its electromagnetic environment (“Immunity”) without having an impermissible effect on its environment (“Emission”). EME Electromagnetic Emission Æ EMC GND Ground Ground reference of the power supply. GPIO General Purpose Input/Output Standard output driver with no special electric specification. PI Power Integrity Good PI means a clean power supply system which is not polluted by switching noise. SI Signal Integrity Good SI means proper signal waveform to fulfill the required data communication. TA Ambient Temperature Temperature in the direct environment of the IC. VDD Power supply voltage in general. VDDC Core supply voltage = 2.5V nominal. VDDP Pad supply voltage = 5.0V nominal. VSS Æ GND Application Note AP16099 141 V1.1, 2006-09 http://www.infineon.com Published by Infineon Technologies AG