83B PBSS2515MB SO T8 15 V, 0.5 A NPN low VCEsat (BISS) transistor Rev. 1 — 26 January 2012 Product data sheet 1. Product profile 1.1 General description NPN low VCEsat Breakthrough In Small Signal (BISS) transistor in a leadless ultra small SOT883B Surface-Mounted Device (SMD) plastic package. PNP complement: PBSS3515MB. 1.2 Features and benefits Leadless ultra small SMD plastic package High efficiency due to less heat generation Low package height of 0.37 mm AEC-Q101 qualified Low collector-emitter saturation voltage VCEsat Reduced Printed-Circuit Board (PCB) requirements High collector current capability IC and ICM 1.3 Applications DC-to-DC conversion LCD backlighting Supply line switching Driver in low supply voltage applications (e.g. lamps and LEDs) Battery charger 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit VCEO collector-emitter voltage open base - - 15 V IC collector current - - 500 mA ICM peak collector current single pulse; tp ≤ 1 ms - - 1 A RCEsat collector-emitter saturation resistance IC = 500 mA; IB = 50 mA; pulsed; tp ≤ 300 µs; δ ≤ 0.02 ; Tamb = 25 °C - 360 500 mΩ PBSS2515MB NXP Semiconductors 15 V, 0.5 A NPN low VCEsat (BISS) transistor 2. Pinning information Table 2. Pinning information Pin Symbol Description Simplified outline 1 B base 2 E emitter 1 3 C collector 2 Graphic symbol 3 3 1 Transparent top view SOT883B 2 sym021 3. Ordering information Table 3. Ordering information Type number Package PBSS2515MB Name Description Version - Leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.37 mm SOT883B 4. Marking Table 4. Marking codes Type number Marking code[1] PBSS2515MB 0001 0001 [1] For SOT883B binary marking code description, see Figure 1. 4.1 Binary marking code description PIN 1 INDICATION READING DIRECTION READING EXAMPLE: 0111 1011 MARKING CODE (EXAMPLE) READING DIRECTION 006aac673 Fig 1. PBSS2515MB Product data sheet SOD883B binary marking code decription All information provided in this document is subject to legal disclaimers. Rev. 1 — 26 January 2012 © NXP B.V. 2012. All rights reserved. 2 of 12 PBSS2515MB NXP Semiconductors 15 V, 0.5 A NPN low VCEsat (BISS) transistor 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VCBO collector-base voltage open emitter - 15 V VCEO collector-emitter voltage open base - 15 V open collector - 6 V - 500 mA - 1 A VEBO emitter-base voltage IC collector current ICM peak collector current single pulse; tp ≤ 1 ms IBM peak base current single pulse; tp ≤ 1 ms total power dissipation Tamb ≤ 25 °C Ptot - 100 mA [1][2] - 250 mW [3][2] - 590 mW Tj junction temperature - 150 °C Tamb ambient temperature -55 150 °C Tstg storage temperature -65 150 °C [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [2] Reflow soldering is the only recommended soldering method. [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2. PBSS2515MB Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 26 January 2012 © NXP B.V. 2012. All rights reserved. 3 of 12 PBSS2515MB NXP Semiconductors 15 V, 0.5 A NPN low VCEsat (BISS) transistor 6. Thermal characteristics Table 6. Thermal characteristics Symbol Parameter Conditions thermal resistance from junction to ambient Rth(j-a) in free air Min Typ Max Unit [1][2] - - 500 K/W [3][2] - - 212 K/W [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Reflow soldering is the only recommented soldering method. [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2. 006aab603 103 duty cycle = 1 Zth(j-a) (K/W) 0.75 0.5 0.33 102 0.2 0.1 0.05 0.02 10 0.01 0 1 10−5 10−4 10−3 10−2 10−1 1 10 102 103 tp (s) FR4 PCB, standard footprint Fig 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values 006aac985 103 Zth(j-a) (K/W) duty cycle = 1 0.75 102 0.5 0.33 0.2 0.1 0.05 10 0.02 0 1 10-5 0.01 10-4 10-3 10-2 10-1 1 10 102 103 tp (s) FR4 PCB, mounting pad for collector 1 cm2 Fig 3. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values PBSS2515MB Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 26 January 2012 © NXP B.V. 2012. All rights reserved. 4 of 12 PBSS2515MB NXP Semiconductors 15 V, 0.5 A NPN low VCEsat (BISS) transistor 7. Characteristics Table 7. Characteristics Symbol Parameter Conditions Min Typ Max Unit ICBO collector-base cut-off current VCB = 15 V; IE = 0 A; Tamb = 25 °C - - 100 nA VCB = 15 V; IE = 0 A; Tj = 150 °C - - 50 µA nA IEBO emitter-base cut-off current VEB = 5 V; IC = 0 A; Tamb = 25 °C - - 100 hFE DC current gain VCE = 2 V; IC = 10 mA; Tamb = 25 °C 200 - - VCE = 2 V; IC = 100 mA; pulsed; tp ≤ 300 µs; δ ≤ 0.02 ; Tamb = 25 °C 150 - - VCE = 2 V; IC = 500 mA; pulsed; tp ≤ 300 µs; δ ≤ 0.02 ; Tamb = 25 °C 90 - - IC = 10 mA; IB = 0.5 mA; Tamb = 25 °C - - 25 mV IC = 200 mA; IB = 10 mA; pulsed; tp ≤ 300 µs; δ ≤ 0.02 ; Tamb = 25 °C - - 150 mV IC = 500 mA; IB = 50 mA; pulsed; tp ≤ 300 µs; δ ≤ 0.02 ; Tamb = 25 °C - - 250 mV VCEsat collector-emitter saturation voltage RCEsat collector-emitter saturation resistance IC = 500 mA; IB = 50 mA; pulsed; tp ≤ 300 µs; δ ≤ 0.02 ; Tamb = 25 °C - 360 500 mΩ VBEsat base-emitter saturation IC = 500 mA; IB = 50 mA; pulsed; voltage tp ≤ 300 µs; δ ≤ 0.02 ; Tamb = 25 °C - - 1.1 V VBEon base-emitter turn-on voltage VCE = 2 V; IC = 100 mA; pulsed; tp ≤ 300 µs; δ ≤ 0.02 ; Tamb = 25 °C - - 0.9 V fT transition frequency VCE = 5 V; IC = 100 mA; f = 100 MHz; Tamb = 25 °C 250 420 - MHz Cc collector capacitance VCB = 10 V; IE = 0 A; ie = 0 A; f = 1 MHz; Tamb = 25 °C - 4.4 6 pF PBSS2515MB Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 26 January 2012 © NXP B.V. 2012. All rights reserved. 5 of 12 PBSS2515MB NXP Semiconductors 15 V, 0.5 A NPN low VCEsat (BISS) transistor mle098 600 (1) hFE mle100 1200 VBE (mV) 1000 (1) 400 800 (2) (2) 600 200 (3) (3) 400 0 10−1 Fig 4. 1 10 102 IC (mA) 103 200 10−1 1 VCE = 2 V VCE = 2 V (1) Tamb = 150 °C (1) Tamb = -55 °C (2) Tamb = 25 °C (2) Tamb = 25 °C (3) Tamb = −55 °C (3) Tamb = 150 °C DC current gain as a function of collector current; typical values mle102 103 Fig 5. 10 102 IC (mA) 103 Base-emitter voltage as a function of collector current; typical values mle101 1200 VBEsat (mV) VCEsat (mV) 1000 (1) 102 800 (1) (2) 600 (2) (3) 10 (3) 400 1 10−1 1 10 102 IC (mA) 103 200 10−1 IC/IB = 20 Fig 6. 1 (1) Tamb = 150 °C (1) Tamb = 150 °C (2) Tamb = 25 °C (3) Tamb = -55 °C (3) Tamb = -55 °C Collector-emitter saturation voltage as a function of collector current; typical values Product data sheet 102 IC (mA) 103 IC/IB = 20 (2) Tamb = 25 °C PBSS2515MB 10 Fig 7. Base-emitter saturation voltage as a function of collector current; typical values All information provided in this document is subject to legal disclaimers. Rev. 1 — 26 January 2012 © NXP B.V. 2012. All rights reserved. 6 of 12 PBSS2515MB NXP Semiconductors 15 V, 0.5 A NPN low VCEsat (BISS) transistor 006aac991 1.0 IB (mA) = 7.0 IC (A) 6.3 5.6 0.8 mle103 102 RCEsat (Ω) 4.9 4.2 10 3.5 0.6 2.8 (1) (2) 2.1 0.4 (3) 1 1.4 0.2 0.7 0 0 0.5 1.0 1.5 2.0 10−1 10−1 1 VCE (V) 10 102 IC (mA) 103 IC/IB = 20 Tamb = 25 °C (1) Tamb = 150 °C (2) Tamb = 25 °C (3) Tamb = -55 °C Fig 8. Collector current as a function of collector-emitter voltage; typical values Fig 9. Collector-emitter equivalent on-resistance as a function of collector current; typical values 8. Test information 8.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors and is suitable for use in automotive applications. PBSS2515MB Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 26 January 2012 © NXP B.V. 2012. All rights reserved. 7 of 12 PBSS2515MB NXP Semiconductors 15 V, 0.5 A NPN low VCEsat (BISS) transistor 9. Package outline 0.65 0.55 0.40 0.34 0.35 0.20 0.12 1 0.04 max 2 0.30 0.22 1.05 0.65 0.95 0.30 0.22 3 0.55 0.47 Dimensions in mm 11-11-02 Fig 10. Package outline SOT883B 10. Soldering Footprint information for reflow soldering SOT883B 1.3 0.7 R0.05 (8x) 0.9 0.6 0.7 0.25 (2x) 0.3 (2x) 0.3 0.4 (2x) 0.4 solder land solder land plus solder paste solder paste deposit solder resist occupied area Dimensions in mm sot883b_fr Fig 11. Reflow soldering footprint for SOT883B PBSS2515MB Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 26 January 2012 © NXP B.V. 2012. All rights reserved. 8 of 12 PBSS2515MB NXP Semiconductors 15 V, 0.5 A NPN low VCEsat (BISS) transistor 11. Revision history Table 8. Revision history Document ID Release date Data sheet status Change notice Supersedes PBSS2515MB v.1 20120126 Product data sheet - - PBSS2515MB Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 26 January 2012 © NXP B.V. 2012. All rights reserved. 9 of 12 PBSS2515MB NXP Semiconductors 15 V, 0.5 A NPN low VCEsat (BISS) transistor 12. Legal information 12.1 Data sheet status Document status [1] [2] Product status [3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term 'short data sheet' is explained in section "Definitions". [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 12.2 Definitions Preview — The document is a preview version only. The document is still subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 12.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. PBSS2515MB Product data sheet Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use in automotive applications — This NXP Semiconductors product has been qualified for use in automotive applications. Unless otherwise agreed in writing, the product is not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the All information provided in this document is subject to legal disclaimers. Rev. 1 — 26 January 2012 © NXP B.V. 2012. All rights reserved. 10 of 12 PBSS2515MB NXP Semiconductors 15 V, 0.5 A NPN low VCEsat (BISS) transistor Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 12.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV, FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE, ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse, QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET, TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V. HD Radio and HD Radio logo — are trademarks of iBiquity Digital Corporation. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. 13. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] PBSS2515MB Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 26 January 2012 © NXP B.V. 2012. All rights reserved. 11 of 12 PBSS2515MB NXP Semiconductors 15 V, 0.5 A NPN low VCEsat (BISS) transistor 14. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 9 10 11 12 12.1 12.2 12.3 12.4 13 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1 General description . . . . . . . . . . . . . . . . . . . . . .1 Features and benefits . . . . . . . . . . . . . . . . . . . . .1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Quick reference data . . . . . . . . . . . . . . . . . . . . .1 Pinning information . . . . . . . . . . . . . . . . . . . . . . .2 Ordering information . . . . . . . . . . . . . . . . . . . . . .2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .3 Thermal characteristics . . . . . . . . . . . . . . . . . . .4 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .5 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . .8 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . .9 Legal information. . . . . . . . . . . . . . . . . . . . . . . .10 Data sheet status . . . . . . . . . . . . . . . . . . . . . . .10 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Contact information. . . . . . . . . . . . . . . . . . . . . . 11 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2012. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 26 January 2012 Document identifier: PBSS2515MB