PFC Converter Design with IR1150 One Cycle Control IC

Application Note AN-1077
PFC Converter Design with IR1150
One Cycle Control IC
By R. Brown, M. Soldano, International Rectifier
Table of Contents
Page
Introduction ..........................................................................................1
One Cycle Control for PFC Applications ..............................................2
IR1150 Detailed Description.................................................................3
PFC Converter Design Procedure........................................................4
Converter Specifications .................................................................4
Converter Input and Output Variables Defined ...............................4
Converter Schematic Diagram........................................................5
Maximum Input Power and Currents....................................................6
High Frequency Input Capacitor Requirements ...................................6
Boost Inductor Designs ........................................................................6
Output Capacitor Requirements .....................................................7
Control Section Design ...................................................................7
Output Voltage Divider....................................................................7
Output OVP Divider Design ............................................................8
Switching Frequency Selection.......................................................8
Current Loop and Over-current Protection......................................9
Soft Start Design.............................................................................11
Table of Contents continues on next page…
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AN-1077
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Voltage Feedback Loop .......................................................................12
Voltage Loop Compensation...........................................................14
Design Tips ..........................................................................................16
IC Decoupling Capacitor .................................................................16
Inductor Design...............................................................................16
Gate Drive Considerations..............................................................17
PCB Layout.....................................................................................17
Additional Noise Suppression Considerations ................................18
This Application Note describes the design methodology of a Continuous Conduction Mode
Power Factor Correction circuit utilizing a boost converter and featuring the IR1150S PFC IC. The
IR1150 is based on International Rectifier’s proprietary “One Cycle Control” technique for PFC
converter control. This application note presents a complete, step-by-step, design procedure
including converter specifications and necessary design tradeoffs.
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AN-1077
cover
Application Note AN-1077
PFC Converter Design with IR1150
One Cycle Control IC
R. Brown, M. Soldano, International Rectifier
This Application Note describes the design methodology of a Continuous Conduction Mode Power
Factor Correction circuit utilizing a boost converter and featuring the IR1150S PFC IC. The IR1150
is based on International Rectifier’s proprietary “One Cycle Control” technique for PFC converter
control. This application note presents a complete, step-by-step, design procedure including converter specifications and necessary design tradeoffs.
For a sinusoidal voltage this can be written as:
Topics Covered
•
•
•
•
•
¾
PF =
Power Factor Correction
One Cycle Control operation
IR1150 Detailed Description
Design procedure and example
Design Tips
Vrms
is the line voltage RMS value
I rms
is the line current RMS value
I rms1
For additional data, please visit our website at:
http://www.irf.com/product-info/smps/
http://www.irf.com/e/ir1150ppdus.html/
Keywords: PFC, Power Factor Correction, THD, One
Cycle Control, OCC
Power factor is defined as the ratio of real power
to apparent power, where real power is the time integral of the instantaneous power measured over a full
period and the apparent power is simply the product
of the rms voltage and rms current measured over the
entire period.
T
1
VIN I IN dt
T ∫0
Apparent Power = VinRMS ⋅ I inRMS
PF =
PREAL
PAPPARENT
φ
(1)
(4)
is the line current fundamental harmonic
is the displacement angle between voltage and current
In this case power factor can be split into distortion
factor and displacement factor:
kD =
Introduction
Real Power =
Vrms ⋅ I rms1 ⋅ cos( φ ) I rms1
=
cos( φ )
Vrms ⋅ I rms
I rms
I rms1
; kφ = cos( φ )
I rms
(5)
Phase shift between the voltage and current
waveforms is introduced by the reactive nature of the
input, either inductive or capacitive.
In a purely resistive load, the voltage and current
will be sine waves, in phase, true power will equal
apparent power and PF = 1.
I rms =
∞
∑I
n =1
2
rmsn
(6)
(2)
(3)
International Rectifier Technical Assistance Center:
THD =
2
2
I rms
− I rms
1
2
I rms1
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Application Note AN-1077
One Cycle Control for PFC
Applications
The operation of the one cycle control is analyzed
in detail in several papers [3][4][5].
The converter output voltage Vo is scaled down
thru the output divider and is presented at the input of
the error amplifier VFB. The error amplifier is used to
provide loop compensation and to generate the error
signal or modulation voltage Vm.
VFB
Vm
Figure 3 - Resettable integrator characteristic
VREF
Cz
Cp
Rgm
An important characteristic is that integration time
constant of the integrator must match the switching
period, so that at the end of each cycle the ramp will
match the integrated value.
Figure 1 - Error Amplifier
The core of the One Cycle control is a resettable
integrator. This block integrates the modulation voltage and is reset at the end of every switching cycle.
Figure 4 - PWM Signal Generation
Figure 2 - Core of the One Cycle Control
Since the voltage loop bandwidth is very small the
modulation voltage will vary very slowly and can be
considered constant during a switching cycle. This
means that the output of the integrator will be a linear
ramp. The slope of the integrator ramp is directly proportional to the output voltage of the error amplifier,
vm .
International Rectifier Technical Assistance Center:
The reference for the PWM comparator is obtained by subtracting the voltage across the current
sense resistor from the modulation voltage:
vm − GDC ⋅ vSNS
(8)
This is the required input configuration to the general OCC PWM in order to properly control the boost
converter with trailing edge modulation.
By providing a reference threshold dependant on
the input current and a ramp signal dependant on the
output voltage, the required control of the converter
duty cycle is realized to achieve output voltage regulation and power factor correction.
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Application Note AN-1077
This control technique does not require direct line
voltage sensing: the line voltage information is contained in the inductor current.
IR1150 Detailed Description
The IR1150 control IC is intended for boost converters for power factor correction operating at a fixed
frequency in continuous conduction mode. The IC
operates with essentially two loops, an inner current
loop and an outer voltage loop.
The inner current loop sustains the sinusoidal profile of the average input current based on the dependency of the pulse width modulator duty cycle on the
input line voltage, to determine the analogous input
line current. Thus, the current loop exploits the
imbedded input voltage signal to command the average input current following the input voltage. This is
true so long as operation in continuous conduction
mode is maintained.
There will be some amount of distortion of the current waveform as the line cycle migrates toward the
zero crossing and as the converter operates at very
light loads given that the inductor has a finite inductance. The resultant harmonic currents under these
operating conditions will be well within the Class D
specifications of EN61000-3-2, and therefore not an
issue.
The outer voltage loop controls the output voltage
of the boost converter and the output voltage error
amplifier produces a voltage at its output, which directly controls the slope of the integrator ramp, and
therefore the amplitude of the average input current.
The combination of the two control elements controls
the amplitude and shape of the input current so as to
be proportional to and in phase with the input voltage.
The IC employs protection circuits providing for
robust operation in the intended application and protection from system level over current, over voltage,
under voltage, and brownout conditions.
The UVLO circuit monitors the VCC pin and maintains the gate drive signal inactive until the VCC pin
voltage reaches the UVLO turn on threshold, VCC ON.
The Open Loop Protection (OLP) prevents the
controller to operate if the voltage on the feedback pin
hasn’t exceeded 20% of its nominal value. If for some
reason the voltage control loop is open, the IC will not
start, avoiding a potentially catastrophic failure.
International Rectifier Technical Assistance Center:
Figure 5 - Output Protections
As soon as the VCC voltage exceeds this threshold, provided that the VFB pin voltage is greater than
20%VREF, the gate drive will begin switching.
In the event that the voltage at the VCC pin should
drop below that of the UVLO turn off threshold, VCC
UVLO , the IC then turns off, gate drive is terminated,
and the turn on threshold must again be exceeded in
order to re start the process.
A dedicated programmable Over Voltage Protection pin (OVP) is available for to protect the output
from overvoltage. The PFC voltage feedback loop is
usually very slow. If the output voltage exceeds the
set OVP limit, the gate drive will be disabled, until the
output voltage will approach again its nominal value.
Finally an Output Under Voltage protection OUV is
provided: in case of overload or brown out, the converter will automatically limit the current: as a result
the output voltage will drop. If the drop exceeds 50%
of the nominal output voltage, the controller will shut
down and restart.
The oscillator is designed such that the switching
frequency of the IC is programmable via an external
resistor at the FREQ pin. The design incorporates
min/max restrictions such that the minimum and
maximum operating frequency shall fall within the
specified range of 50kHz to 200kHz.
It is generally possible to run the IC at a lower
switching frequency, but given the large value of the
programming resistor that may lead to inaccurate frequency trimming, outside the range of tolerance
specified on the Data Sheet.
An additional feature of the IR1150S is the ability
to force the IC into a “sleep” mode. In the sleep
mode, the internal blocks of the IC are disabled and
the IC draws a very low quiescent current of 200µA.
This is a desirable feature designed to reduce system
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Application Note AN-1077
power dissipation to an absolute minimum during a
standby mode, or to shut down the converter at the
discretion of the system designer. The sleep mode is
activated any time the OVP pin, (pin 4), is at a voltage
level lower than 0.62V (typ).
The gate drive output provides sufficient drive capability to efficiently drive MOS gated power switches
typical of the application.
Operating Temperature
Nominal DC Output Voltage
Maximum DC Output
Voltage
Minimum Output Holdup
Time
385V
425VDC
30msec @ 285VO
Converter Switching
Frequency
100kHz
Maximum Soft Start time
50msec
Converter Input and Output
Variables Defined
Figure 6 - IR1150S Pinout
PFC CONVERTER DESIGN
PROCEDURE
This section describes a typical design procedure
for a Continuous Conduction Mode boost converter
for power factor correction using the IR1150S control
IC. Additionally, some of the design tradeoffs typical
of PFC converter design are discussed.
A schematic diagram is presented as a reference
to a step by step design procedure for designing a
typical 300W PFC converter.
An IR1150S Demo Board [2] is available from International Rectifier which highlights the performance
of the IR1150 and was designed in accordance with
the design procedure presented in this application
note.
POUT(MAX)
Maximum converter output power
delivered to load
PIN(MAX)
Maximum converter input power
drawn from AC source
ηMIN
Minimum worst case efficiency of
converter
IIN(RMS)MAX
Maximum rms value of input current
drawn from AC source
IIN(PK)MAX
Maximum peak value of input current drawn from AC source
IIN(AVG)MAX
Maximum average value of input
current drawn from AC source
VIN(RMS)MIN
Minimum rms value of input voltage
supplied by AC source
VIN(PK)MIN
Minimum peak value of input voltage supplied by AC source
Converter Specifications
AC Input Voltage (rms)
Input Line Frequency
85V(min) - 264V(max)
47-63Hz
Target Efficiency
92% min @ 90VAC / 300W
Power Factor (PF)
0.99 min @ 115VAC / 300W
Harmonic Distortion
4% max @ 115VAC / 300W
AC Inrush Current (peak)
35A max @ 230VAC / 300W
Maximum Ambient
50°C
International Rectifier Technical Assistance Center:
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Vin
Rth
D1
1
+
4
International Rectifier Technical Assistance Center:
F1
t
2
3
Cin
Rsf
Rs
Csf
Rf
4
3
2
1
VFB
OVP COMP
ISNS
FREQ VCC
COM GATE
IR1150S
L1
8
Cb5
5
6
7
+
D3
Cb4
Dg2
Rg1
Dg1
Cz
Rgm
Rg2
Cp
Rg3
Q1
D2
Rd
Cd
Rfb3
Rfb2
Rfb1
Q2
Rslp1
Rslp2
Rovp3
Rovp2
Rovp1
+
Vsleep
RTN
Cout
Vout
Application Note AN-1077
Converter Schematic Diagram
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Application Note AN-1077
Where:
Maximum Input Power and
Currents
Majority of the converter design is based on low
line current. That’s the worst case condition for efficiency and input currents.
k∆IL = Inductor current ripple factor (30% in this
design)
r = maximum high frequency voltage ripple factor
(∆VIN/VIN), typically between 3% – 9%, 6% used for
this design.
(Assume PF to be 0.99 or greater at low line)
Maximum input power can be calculated assuming
a nominal efficiency at low line:
PIN ( MAX ) =
PO( MAX )
η MIN
=
300W
= 326W
0.92
The maximum rms AC line current is calculated at
the minimum input AC voltage:
I IN ( RMS ) MAX =
I IN ( RMS ) MAX
PO ( MAX )
Assuming sinusoidal AC current, the peak value of
the AC current can be calculated:
I IN ( PK )MAX =
I IN ( AVG ) MAX =
Boost Inductor Design
Power switch duty cycle must be determined at
VIN(PK)MIN. This will represent the peak current for the
inductor, at the peak of the rectified line voltage at
minimum line voltage.
VIN ( PK )MIN = 2 × VIN ( RMS )MIN = 120V
VIN ( RMS ) MIN
1.414( 326W )
= 5 .4 A
85V
I IN ( AVG ) MAX =
2 × I IN( PK )MAX
π
2 × 5.4 A
π
= 3.4 A
High Frequency Input Capacitor
Requirements
C IN = 0.3
This capacitor can be considered part of the EMI
input filter: its main purpose is to bypass the high frequency component of the input current with the shortest possible loop.
2 ( PIN ( MAX ) )
The AC Line input average current can be calculated assuming sinusoidal waveform:
C IN = k ∆I L
High frequency capacitor is typically a high quality
film capacitor rated at beyond the worst case peak of
the line voltage. Care must be taken to avoid too
large a value as this will introduce current distortion.
η MIN (VIN ( RMS ) MIN ) PF
300W
=
= 3 .8 A
0.92(85V )0.998
I IN ( PK )MAX =
CIN = 0.330µF, 630V
I IN ( RMS ) MAX
2π × f SW × r × VIN ( RMS ) MIN
3.8 A
= 0.335µF
2π × 100kHz × 0.06 × 85V
International Rectifier Technical Assistance Center:
D=
VO
VIN ( PK ) MIN
VO
=
385V − 120V
= 0.69
385V
∆I L = 0.2 × I IN ( PK ) MAX = 0.2 × 5.4 A ≅ 1.1A
∆I L
1.1A
= 5.4 A +
≅ 6A
2
2
VIN ( PEAK ) MIN × D
120V × 0.69
=
= 752.7 µH
f SW × ∆I L
100kHz × 1.1A
I L( PK )MAX = I IN ( PK )MAX +
LBST
∆IL is based on the assumption of 20% ripple current. This is another area where design tradeoffs
must be considered.
A smaller value of ripple current would be beneficial in terms of reduced distortion, output capacitor
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Application Note AN-1077
ripple current at fSW , peak current in the power switch
and EMI
CONTROL SECTION DESIGN
However the trade-off here is an increased inductance value to support the reduced ripple current,
resulting in increased size and cost.
Output Voltage Divider
Care must be taken for a given core selection
within a given design that the core does not saturate
at peak current levels.
Conversely, a higher value of allowable ripple current, while resulting in a lower required inductor value,
will negatively impact performance in the areas previously pointed out.
Cost trade-offs are typical for core materials vs.
dissipation, temperature, and inductance roll off with
increasing current levels. Consult core manufacturer’s data books and application notes for detailed
inductor design considerations. Detailed inductor
design is beyond the scope of this application note.
Output Capacitor Requirements
Output Capacitor design in PFC converters is typically based on hold up time requirements. Typically,
with a proper design, ripple voltage and current in the
capacitor will not be an issue.
Typical values of capacitor for PFC applications
are 1µF to 2µF per watt of output power.
COUT ( MIN ) =
2 ⋅ PO ⋅ ∆t
2
2
VO − VO( MIN )
(9)
Output voltage of the converter is set by voltage
divider RFB1, RFB2, and RFB3.
The total impedance of this divider string should
be selected high enough in value so as to reduce
power dissipation in divider. This is of particular concern in terms of meeting stringent standby power
specifications, and beneficial in optimizing overall
system efficiency.
Practical limits do exist however on the maximum
impedance of the divider string. The resistor values
must not be selected so high as to introduce excessive additional voltage error to the output voltage error
amplifier resulting from input bias currents of the amplifier.
A reasonable compromise for divider string overall
impedance is a target of approximately 1MΩ.
RFB1 and RFB2 are typically split equally in value to
create the upper resistor in the divider to keep the
maximum voltage across each resistor within the voltage rating of these devices, (typically 250V).
Divider resistors are selected with a ±1% tolerance
in order to minimize output voltage set point error.
The resistor tolerances will stack up in addition to
tolerance of the error amplifier reference and the error
introduced to the error amplifier due to input bias currents and input offset voltage.
RFB1 = RFB2 = 499KΩ, 1% tolerance.
COUT ( MIN ) =
2 ⋅ 300W ⋅ 30ms
= 269µF
( 385V )2 − ( 285V )2
Minimum capacitor value must be derated for capacitor tolerance, -20% in this case, in order to guarantee minimum capacitance requirement is satisfied,
thus assuring minimum hold up time.
C OUT =
C OUT ( MIN )
1 − ∆CTOL
=
269µF
= 336µF
1 − 0.2
Standard value of 330µF is used in this case.
International Rectifier Technical Assistance Center:
This is a standard 1% value.
RFB 3 =
RFB 3 =
VREF ( RFB1 + RFB 2 )
( Vout VREF )
(10)
7.0V ( 998K )
= 18.48KΩ
( 385V - 7.0V )
(use standard value RFB3 = 18.5kΩ)
Calculate new VO value based on actual resistor
values
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Application Note AN-1077
VOUT =
VOUT =
( RFB1 + RFB 2 + RFB 3 ) ⋅ VREF
RFB 3
(11)
( 998 K + 18.5K) ⋅ 7.0V
= 384.6V
18.5K
Calculate power dissipation of divider resistors
PRFB1 = PRFB 2
PRFB1 = PRFB 2 =
(V − VREF )2
= out
2(RFB1 + RFB 2 )
(12)
(385V − 7V )2 = 70mW
VFB
VOVP 7.49V
450mV
VREF 7.0V
normal
2 × 998kΩ
OVP
normal
Having OVP function on a separate pin allows
programming the threshold to the desired value:
Output OVP Divider Design
Use caution in OVP set point with regard to setting
threshold too high. Output capacitors are typically
rated at 450V and caution should be exercised so as
not to allow VO to exceed their maximum voltage rating. Output capacitor surge voltage ratings are intended as a guard band in terms of abnormal
operating conditions and shouldn’t be use as target
spec for OVP.
An over voltage threshold of 425V is an adequate
design target.
The same issues, with regard to power dissipation
and total impedance of the divider string in the output
voltage feedback divider, apply to the OVP divider.
Power dissipation of the individual resistors is calculated using the same method as was used in the output voltage feedback divider, as are the resistor
values.
The IR1150S over voltage comparator has a dedicated internal reference voltage, the value of which is
a fixed percentage of the output error amplifier reference.
V( REF )OVP = 1.07 ⋅ VREF = 7.49V
When the OVP threshold is triggered, the IC will
disable the gate drive signal. The comparator has a
built in hysteresys of 450mV typ. (see data sheet ‘protection section’).
(13)
If the same divider string is used as for the voltage
feedback, the resulting OVP voltage threshold will be
set at 7% higher than the nominal output voltage.
VOVP = 1.07 ⋅ VOut = 412V
International Rectifier Technical Assistance Center:
VOVP =
( ROVP1 + ROVP 2 + ROVP 3 ) ⋅ V( REF )OVP
ROVP 3
(14)
To design OVP the divider for an over voltage
level of 425V as per target specifications of the converter:
ROVP1 = ROVP2 = 499kΩ, 1%
ROVP 3 =
ROVP3 =
VREF ( OVP )( ROVP1 + ROVP 2 )
VOVP V( REF )OVP
(15)
7.49V ( 998K )
= 17.9 KΩ
( 425V 7.49V )
Verify the new VOVP value based on actual resistor
value
VOVP =
( 998 K + 17.9 K )7.49V
= 425V
17.9 K
Power dissipation of ROVP1 and ROVP2 will be the
same as RFB1 and RFB2 given that they are the same
values.
Switching Frequency Selection
Switching frequency is user programmable with
the IR1150 and is accomplished by selecting the
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Application Note AN-1077
value for Rf. As such, selection of switching frequency is at the discretion of the user with consideration to overall converter design, with particular
consideration of EMI and efficiency requirements.
There are essentially two levels of current limitation provided by the IR1150. There is a “soft” current
limit, which is essentially a duty cycle limiting fold back
type: the converter duty cycle is limited to the point
where output power is limited and the output voltage
begins to decrease.
There is also a “peak” current limit feature which
immediately terminates the present drive pulse once
the peak limit threshold, ≈ -1.0V, is exceeded.
The current sense resistor is selected based at
minimum input voltage and maximum output power in
order to guarantee normal operation under this condition.
The current amplifier has a DC gain GDC=2.5, is
internally compensated and bandwidth limited above
280kHz. The operation of the OCC control IC is based
on peak current mode, therefore the switch current
can be used in alternative to the inductor current as
an input to the ISNS pin.
The range for the current sense voltage VSNS is
between 0V and -1V, and care must be taken when
using a current transformer, to meet this range.
Figure 7 - Oscillator Frequency vs.
Programming Resistor Rf
Vm
A chart plotting Rf value vs. frequency is provided
to determine the appropriate resistor value for the
desired switching frequency.
Typical design tradeoffs relative to switching frequency must be carefully considered when selecting
an optimum switching frequency for a particular converter design. Some key considerations would be;
Optimized inductor size, power dissipation, and
cost EMI requirements, (EN55011, lower limit of
150kHz)
Switching loss in the power switch increase with
switching frequency
For the design example of this application note,
we will select the switching frequency to be 100kHz, a
good tradeoff between EMI performance, optimized
inductor, and power switch losses.
Current Loop and Overcurrent
Protection
The current sense pin ISNS is the input to the current sense amplifier and the overcurrent protection
comparator.
International Rectifier Technical Assistance Center:
GDCRSIS
Vm
Vm - GDCRSIS
Vm
time
VGATE
time
Ton
Ts
Figure 8 - Ramp relation with duty cycle
The current sense resistor determines the point of
soft over-current, that is the point at which input current will be limited and the output voltage will drop.
The worst case is at low line when the current is
the highest and also the boost factor of the converter
is higher. The current sense resistor RS must be designed so that at the lowest input line and largest load,
the converter will be able to maintain the output voltage.
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Application Note AN-1077
The required duty cycle at the peak of the sinusoid
for desired output voltage at minimum input voltage is
given by:
D=
D=
Vout − VIN ( PK )MIN
Vout
(16)
385V − 120V
= 0.69
385V
But when Vm saturates to its maximum, an additional increase in current will limit the duty cycle,
therefore causing the output voltage to drop.
It can be seen from Figure 8 that duty cycle is determined at each cycle as the ratio:
VSNS (max) =
vm( SAT )( 1 − D )
GDC
(17)
(18)
The required voltage across the current sense resistor to set the “soft” current limit at minimum input
voltage is:
VSNS (max) =
VSNS (max) =
VCOMP( EFF ) ⋅ ( 1 − D )
GDC
(19)
6.05V ⋅ (1 − 0.69)
= 0.75V
2.5
The vm saturation voltage VCOMP(EFF) and the current amplifier DC gain are taken directly from the data
sheet (page 4).
Now the value of the sense resistor can be calculated from the max peak inductor current derated with
an overload factor (KOVL=10%)
I IN ( PK )OVL = [ I IN ( PK ) max +
∆I L
] K OVL (20)
2
International Rectifier Technical Assistance Center:
1.1
]( 1.1 ) = 6.55 A
2
From this maximum current level and the required
voltage on the current sense pin, we now calculate the
resistor value.
RS =
When the input voltage is lowered (or the load increased) the voltage loop responds by increasing the
modulation voltage Vm.
vm − GDC ⋅ VSNS Ton
=
=D
vm
TS
I IN ( PK )OVL = [ 5.4 A +
VSNS (max)
I IN ( PK )OVL
=
0.75V
= 0.115Ω
6.55 A
A standard value of 100mΩ can be used: power
dissipation in the resistor is now calculated based on
worst case rms input current at minimum input voltage:
2
PRS = I IN ( RMS ) MAX ⋅ RS
(21)
PRS = 3.82 ( 0.100Ω ) = 1.45W
Proper derating guidelines dictate a selected value
of RS = 0.10Ω, 3W (non inductive resistor).
Although the One Cycle Control already provides
a cycle by cycle peak current limiting, an additional
fast over-current comparator is present for increased
protection. If the threshold is reached the current
pulse will be terminated.
The system will enter into “peak” current limit
should the peak input current exceed;
I PK _ LMT =
− 1.0V
0.100Ω
= 10 A
Current Sense Filtering
The current amplifier is internally compensated
with a pole at approximately 280 kHz in order to attenuate the high frequency switching noise often associated with peak current mode control.
Blanking time is also provided in order to avoid
spurious triggering of the overcurrent protection due
to the boost diode reverse recovery spike.
Additional external filtering is typically employed in
systems operating with peak current mode control,
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Application Note AN-1077
and may be incorporated with a simple RC filter
scheme as shown in schematic diagram.
f PSF =
1
(22)
2π ⋅ RSF ⋅ C SF
t SS =
2
3
4
Rsf
Csf
COM GATE
FREQ VCC
ISNS
VFB
OVP COMP
CZ =
8
7
6
Rs
Figure 9 – Current Sense Resistor and Filtering
A corner frequency around 1-1.5MHz is recommended. Typical values for the RC filter are:
(23)
t SS ⋅ iOVEA
VCOMP( EFF )
(24)
iOVEA and VCOMP(EFF) are taken from the datasheet.
5
Rf
iEA−OUT ( MAX )
Since Cp is generally much smaller than CZ, its
effect can be neglected.
IR1150S
1
CZ ⋅ VCOMP( EFF )
CZ =
50ms × 40µA
= 0.33µF
6.05V
t ss =
0.33µF ⋅ 6.05V
= 50ms
40µA
This represents the time needed by the controller
to reach full duty cycle capability in the startup phase.
The peak current will be limited during this period of
time.
RSF = 100Ω (also provides additional current limiting into current sense pin during inrush and transients)
CSF = 1000pF
These component values offer a decent compromise in terms of filtering, (fP ≈ 1.59MHz), while maintaining the integrity of the current sense signal thus
maintaining peak current mode control.
It should be noted that the input impedance of the
current amplifier is approximately 2.2KΩ. The 100Ω
resistor will form a divider with this 2.2KΩ resistor thus
affecting the actual threshold for the soft current limit.
The actual voltage at the current limit amplifier input
will in effect be approximately 96% of the voltage
across the current sense resistor.
Soft Start Design
Soft start is controlled by the rate of rise of the error amplifier output voltage, which is a function of the
compensation capacitors Cz and Cp, and the maximum available output current of the error amplifier.
Soft start time is determined by the following
equation:
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Application Note AN-1077
v̂o
VOLTAGE FEEDBACK LOOP
îchg
VIN
r = RL
CO
RL
VO
POWER STAGE
G(s)
d
Figure 11 - Small Signal low frequency model
for the boost power stage
VREF
vm
OCC Modulator
H3(s)
ERROR
AMPLIFIER
H2(s)
Definitions:
VFB
RL : Load Resistance
Output Divider
H1(s)
CO : Output (bulk) capacitor
Figure 10 - Voltage Loop
v̂m : Modulation Voltage – this is the output of the Voltage
The open loop gain is given by the product:
Error Amplifier
T ( s ) = G( s ) ⋅ H1( s ) ⋅ H 2 ( s ) ⋅ H 3 ( s ) (25)
GDC : DC gain of the current amplifier – it is set internally
the IC at 2.5V/V
Vin : Peak value of input voltage (i.e. VinRMS max ⋅ 2 )
OUTPUT DIVIDER: H1( s )
The output divider scales the output voltage to be
compared with the reference voltage in the error amplifier.
Therefore:
VOUT =
( RFB1 + RFB 2 + RFB 3 )VREF
RFB 3
H1( s ) =
VREF
Vo
(26)
For a constant power load the actual RL is negative. This is the typical case when the PFC load is a
DC-DC stage: if the input voltage of that stage is reduced it will react by increasing the current, in order to
maintain the output power constant.
In this case RL will cancel with r and will yield:
v̂o
1
=
îchg sCo
(27)
This stage simply attenuates the output voltage
signal, by a fixed amount:
H1 = 0.018 = −34.8dB
POWER STAGE: H 3 ( s ) ⋅ G( s )
(28)
When a purely resistive load is present we have:
v̂o
RL / 2
=
îchg 1 + sC RL
o
2
(29)
We will not consider the resistive load case here,
since in the majority of cases the PFC load is the input of another DC-DC converter.
The low frequency small signal equivalent circuit
for the boost power stage is shown in Figure 11. An
explanation of this model can be found in [7][8].
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Application Note AN-1077
In order to derive
îchg
v̂m
we need to look at the
v̂o
V2
1
= 2 in
⋅
v̂m Vo ⋅ RS ⋅ GDC sCo
OCC PWM modulator. The control law is:
GDC ⋅ RS ⋅ îg =
Where
M( d ) =
The control to output for the constant power load
case is:
v̂m
M( d )
(30)
v̂o
v̂g
(35)
The power stage gain varies as expected with the
input voltage.
ERROR AMPLIFIER: H 2 ( s )
v̂ g = Vin + v̂in
(31)
The output voltage error amplifier in the IR1150
control IC is a transconductance type amplifier.
Substituting and eliminating the small signal cross
terms:
îg
v̂m
=
Vin
Vo RS GDC
(32)
40
Gain
20
0
Figure 13 - Error Amplifier
20
The transfer function is:
40
0.1
1
10
3
100
1 .10
frequency
4
1 .10
5
6
1 .10
1 .10
Figure 12 - Power Stage Gain @ 90V (red) and
265V (blue)
The output average current can be calculated from
the input current:
î ⋅ V
p̂
îg = in = chg o
Vin
Vin
îchg
v̂m
=
2
in
V
Vo2 RS GDC
(33)
H 2( s ) =
g m ⋅ ( 1 + sRgmC Z )
s( C Z + C P + sRgmC Z C P )
The compensation network shown on the schematic diagram adds a zero and a pole in the transfer
function at:
International Rectifier Technical Assistance Center:
1
2π ⋅ Rgm ⋅ C Z
(37)
1
Cz ⋅ Cp
2π ⋅ Rgm
Cz + Cp
(38)
fZ0 =
f P0 =
(34)
(36)
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Application Note AN-1077
GVA − H 1 = −6.2dB
Voltage Loop Compensation
Typical of PFC converters is the requirement to
keep the voltage loop bandwidth less than ½ the line
frequency in order to avoid distortion of the line current resulting from the voltage loop attempting to
regulate out the 120Hz ripple on the output.
There is of course, the associated tradeoff between system transient response and input current
distortion, where stability of the voltage loop is generally easily achieved.
The goals of the voltage loop compensation are
the limitation of the open loop gain bandwidth to less
than ½ the AC line frequency and the amount of second harmonic ripple injected in the COMP pin from
the error amplifier.
First we need to calculate the amount of second
harmonic ripple on the output capacitor:
VOPK =
VOPK =
Pin
2π ⋅ f 2 nd ⋅ CO ⋅ Vout
(39)
The amount of 120Hz ripple needs to be small
compared with the value of the error amplifier output
voltage swing.
A percentage around 1% is typical and will minimize distortion:
GVA =
VCOMP( EFF ) ⋅ 0.01
2 ⋅VOPK
H 2( s ) ≅
g m ⋅ ( 1 + sRgm C Z )
(41)
sC Z
Since CZ has already been determined for the soft
start, only Rgm needs to be calculated by forcing:
H 2 ( j 2π ⋅ f 2 nd ) = −6.2dB
2
 G − H1  
1
 − 
R gm =  VA
g
2
π
⋅
f
2 nd ⋅ C Z
m

 
(42)



2
(43)
Substituting:
Rgm = 8.9kΩ
330W
= 3.4V
2π ⋅120 ⋅ 330µF ⋅ 385V
GVA =
The second pole is usually placed at a much
higher frequency than 120Hz, so the error amplifier
transfer function can be approximated to:
(40)
The second pole frequency should be chosen
higher than the cross over frequency and significantly
lower than the switching frequency in order to attenuate noise: typical value is 1/6 to 1/10 of the switching
frequency:
f P0 =
1
1
(44)
≅
Cz ⋅ Cp 2π ⋅ Rgm ⋅ Cp
2π ⋅ Rgm
Cz + Cp
Cp =
1
= 1nF
2π ⋅ 8.9kΩ ⋅17 kHz
6.05V ⋅ 0.01
= 0.089 = −41dB
2 ⋅ 3.4V
As calculated from (26) the attenuation of the output divider is already:
H1 = 0.018 = −34.8dB
The gain of the error amplifier @ 120Hz needs to
be:
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40
100
20
50
Gain
GEA
Application Note AN-1077
0
20
50
40
0.1
1
10
3
4
100
1 .10
frequency
5
1 .10
100
6
1 .10
1 .10
0.1
Figure 14 - Error Amplifier Gain
1
10
3
4
100
1 .10
frequency
1 .10
5
1 .10
6
1 .10
Figure 16 - Loop Gain @ 90V (blue), 265V (red)
Crossover frequency is between 10Hz and 30Hz,
depending on the input AC line value, as required.
0
10
20
0
30
20
40
40
50
60
60
Phase
Phase
0
70
80
80
100
120
90
0.1
1
10
3
100
1 .10
Frequency
4
1 .10
5
1 .10
6
1 .10
140
160
Figure 15 - Error Amplifier Phase
Finally the loop gain can be drawn:
International Rectifier Technical Assistance Center:
180
0.1
1
10
100
1 .10
frequency
3
4
.
1 .10
5
1 .10
1 .10
6
Figure 17 - Loop Phase
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Application Note AN-1077
Design Tips
IC Decoupling Capacitor
The PFC converter is a harsh environment for the
controller in terms of noise and as such, certain precautions must be considered with regard to proper
noise decoupling.
The key element to proper bypassing of the IC is
the physical location of the bypass capacitor and its
connections to the power terminals of the control IC.
Inductor Design
There is more to consider than merely inductor
value when it comes to designing the boost choke.
The mechanical design of the choke can have a
significant impact on system level noise due to associated parasitic elements.
The parasitic inter-winding capacitance associated
with the boost inductor can resonate and generate
high frequency ringing.
In order for the capacitor to provide adequate filtering, it must be located as close as physically possible to the VCC and COM pins and connected thru the
shortest available path.
Note the location (Figure 18) of the bypass capacitor directly above the SO8 IC which will provide for the
shortest possible traces from the capacitor to the VCC
and COM pins. This is crucial in providing the tightest
decoupling path possible and minimizing any possible
noise pickup due to excessive trace lengths.
Figure 19 - Ringing on turn on
Figure 18 - Proper connection of decoupling
capacitor
The value of the decoupling capacitor will depend
on several factors, including but not limited to switching frequency, power MOS gate drive capacitance and
external gate resistance.
As a general rule a 470nF ceramic capacitor is
recommended. This assumes a larger electrolytic
capacitor is still present to provide low frequency filtering.
International Rectifier Technical Assistance Center:
Figure 20 - Single layer choke
Figure 19 shows the power MOSFET turn on current when a multi layer, non optimized boost choke is
used. The presence of a high frequency ringing
(around 8-10MHz) can be noted. In Figure 20 a single
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Application Note AN-1077
layer inductor with the same value, but lower interwinding capacitance is used.
If not controlled this ringing can produce unacceptable voltages to the sensitive pins of the control
IC, which can disrupt proper circuit operation.
Although an internal blanking circuit is present to
limit the effects of the diode reverse recovery peak on
the current loop, it is recommended to add an RC cell
on the current sense resistor to increase noise immunity of the control IC.
Another extremely good reason to control the ringing is to limit the Electro Magnetic Interferences (EMI),
especially in the radiate range
Gate Drive Considerations
The gate driver of the IR1150S is capable of extremely rapid rise and fall times in addition to the 1.5A
peak source and sink current capability. These rapid
rise and fall capabilities, while providing for an extremely desirable MosFet drive capacity, can also
create noise issues if not properly controlled.
Often times it is difficult to meet EMI requirements
when drive speeds are too fast resulting in fast rising
dI/dt and dV/dt edges.
This not only taxes the EMI filter, but can introduce additional noise that the controller is forced to
deal with. The waveforms of Figure 21 and Figure 22
below illustrate the gate drive voltage of the IR1150S
vs. the power MosFet drain current for an
IRFP27N60K power switch.
Figure 21 - IR1150S Gate Drive voltage
International Rectifier Technical Assistance Center:
Figure 22 - IR1150S Gate Drive voltage
The rise time must be carefully controlled by virtue
of proper selection of gate drive resistors for a specific
application. Parasitic elements, both capacitive and
inductive, printed circuit board layout, thermal design,
system efficiency, and power switch selection are but
some of the criteria which is to be considered when
selecting the proper drive impedance for a given design. Improper attention to proper gate drive design
will most certainly result in performance and noise
issues.
PCB Layout
Proper routing of critical circuit paths is elemental
in optimum circuit performance and minimal system
noise. Parasitic inductance resulting from long trace
length in the power path can introduce noise spikes
which can deteriorate performance to unacceptable
levels. In addition to creating unwanted system noise,
these spikes can decrease reliability of power devices
and if severe enough, can be destructive to the point
of catastrophic failure of the devices. At the very
least, uncontrolled parasitic elements as a consequence of inadequate attention to printed circuit board
layout will force the designer to control the additional
noise and voltage spikes with additional circuitry, adding cost and decreasing efficiency. It is therefore desirable to pay particular attention to optimizing the
PCB layout in terms trace routing, placement, and
length, in the critical circuit paths. Proper grounding
and utilization of ground planes are helpful within the
control section while minimized trace lengths are deUSA ++1 310 252 7105 Europe ++44 (0)208 645 8015 17 of 18
Application Note AN-1077
sirable in the high voltage and current switching paths
of the power section.
Additional Noise Suppression
Considerations
The PFC boost diode reverse recovery characteristic is an enormous contributor to system noise both
conducted and radiated. This will tax the EMI filter in
addition to basic circuit functionality and reliability.
There are other considerations besides noise, efficiency for example. The power switch must absorb all
the reverse recovery current during its turn on period
and therefore must also dissipate the resultant additional power. Consequently, there is additional burden on system level overall efficiency as well as the
increased noise levels. SiC diodes provide an excellent solution to address these issues as reverse recovery time is virtually zero, thus there are essentially
no reverse recovery currents to be dealt with. While
the SiC appears to be the salvation of the PFC boost
converter, there are considerations such as surge
current capabilities that must be addressed before the
SiC diode becomes the mainstay of PFC converter
design.
[8]
[9]
[10]
[11]
[12]
[13]
Aerospace and Electronic Systems, Vol 26, No. 3, May 1990,
pp 490-505
R.B. Ridley, “Average small-signal analysis of the boost
power factor correction circuit” VPEC Seminar Proceedings,
1989, pp 108-120
Chen Zhou, M.M. Jovanovic, “ Design Trade-offs in
continuous current-mode controlled boost power-factor
correction circuits” High-Frequency Power Conversion
Conference Proceedings, pp.209-220, 1992
R.Brown, M.Soldano, “One Cycle Control IC Simplifies PFC
Designs”, APEC ’05 Conference Proceedings
R.
Brown,
B.Lu, M.Soldano, “Bridgeless PFC
implementation using One Cycle Control Technique”,
Apec’05 Conference Proceedings.
K.M.Smedley, U.S. Patent 5,278,490 “One Cycle Controlled
Switching Circuit”
L.Dixon, “High Power Factor Preregulator for OffLinePower Supplies”, Unitrode Design Seminars Manual,
SEM-700, 1990
Rev.2.3 – June 2005
In the meantime, a simple RC snubber across the
boost diode goes a long way in reducing the noise
due to reverse recovery. When properly designed,
the snubber will be less dissipative then allowing the
full reverse recovery current absorbed by the power
switch.
References
[1]
[2]
[3]
[4]
[5]
[6]
[7]
IR1150S Data Sheet – International Rectifier Corp., 2005
IRAC1150-300W – CCM Boost Converter for PFC Demo
Board Documentation, International Rectifier Corp. 2005.
K.M.Smedley, S.Cuk, “One-Cycle Control of Switching
Converters”
Z. Lai, K.M. Smedley, “A Family of Continuous Conduction
Model Power Factor Correction Controllers Based on the
General Pulse Width Modulator”, IEEE Trans. On Power
Electronics, Vol.13, No.2, 1988
L.M.Smith, Z.Lai, K.M.Smedley, “A New PWM Controller
with One-Cycle Response”, IEEE APEC’97 Conference
Proceedings, Vol.2, pp.970-976
K.M. Smedley, S. Cuk, “Dynamics of One-Cycle Control
Cuk Converters”, IEEE Trans. On Power Electronics,vol.10,
No.6, Nov. 1995
V.Vorperian, “Simplified analysis of PWM converters using
the model of e PWM switch: parts I and II” IEEE Trans. On
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