AOS Semiconductor Product Reliability Report AOL1432/AOL1432L, rev B Plastic Encapsulated Device ALPHA & OMEGA Semiconductor, Inc 495 Mercury Drive Sunnyvale, CA 94085 U.S. Tel: (408) 830-9742 www.aosmd.com Oct 17, 2007 1 This AOS product reliability report summarizes the qualification result for AOL1432. Accelerated environmental tests are performed on a specific sample size, and then followed by electrical test at end point. Review of final electrical test result confirms that AOL1432 passes AOS quality and reliability requirements. The released product will be categorized by the process family and be monitored on a quarterly basis for continuously improving the product quality. Table of Contents: I. II. III. IV. V. Product Description Package and Die information Environmental Stress Test Summary and Result Reliability Evaluation Quality Assurance Information I. Product Description: The AOL1432 uses advanced trench technology and design to provide excellent RDS(ON) with low gate charge. This device is suitable for use in PWM, load switching and general purpose applications. Standard product AOL1432 is Pb-free (meets ROHS & Sony 259 specifications). Absolute Maximum Ratings TA=25°C unless otherwise noted Parameter Symbol Maximum Units Drain-Source Voltage VDS 25 V Gate-Source Voltage VGS ±20 V Continuous Drain Current TA=25°C TA=100°C Pulsed Drain Current Continuous Drain Current ID 31 IDM 100 TA=25°C TA=70°C Avalanche Current Repetitive avalanche energy L=0.3mH TA=25°C Power Dissipation 44 TA=100°C TA=25°C Power Dissipation TA=70°C Junction and Storage Temperature Range Thermal Characteristics Parameter Maximum Junction-toAmbient Maximum Junction-toAmbient Maximum Junction-to-Lead A 21 IDSM 17 IAR 25 EAR 94 mJ 30 PD W 15 6 PDSM W 4 TJ, TSTG -55 to 175 Symbol T ≤ 10s SteadyState SteadyState A RθJA RθJL °C Typ Max Units 14.2 20 °C/W 48 60 °C/W 3.5 5 °C/W 2 II. Die / Package Information: Process Package Type Lead Frame Die Attach Bond wire Mold Material Filler % (Spherical/Flake) Flammability Rating Backside Metallization Moisture Level AOL1432 Standard sub-micron Low voltage N channel process Ultra SO-8TM Copper Soft solder S: AL, 12mils; G: Au 1.3mils Epoxy resin with silica filler 90/10 UL-94 V-0 Ti / Ni / Ag Up to Level 1 * AOL1432L (Green Compound) Standard sub-micron Low voltage N channel process Ultra SO-8TM Copper Soft solder S: AL, 12mils; G: Au 1.3mils Epoxy resin with silica filler 100/0 UL-94 V-0 Ti / Ni / Ag Up to Level 1* Note * based on info provided by assembler and mold compound supplier III. Result of Reliability Stress for AOL1432 (Standard) & AOL1432L (Green) Test Item Test Condition Time Point Lot Attribution Total Sample size Solder Reflow Precondition Standard: 1hr PCT+3 cycle reflow@260°c Green: 168hr 85°c /85%RH +3 cycle reflow@260°c Temp = 150°c , Vgs=100% of Vgsmax 0hr Standard: 10 lots 1540 pcs 0 168 / 500 hrs 8 lots 656 pcs 0 1000 hrs (Note A*) 168 / 500 hrs 8 lots 1000 hrs (Note A*) 130 +/- 2°c , 85%RH, 33.3 psi, Vgs = 80% of Vgs max 100 hrs Standard: 10 lots 121°c , 29.7psi, RH=100% 96 hrs HTGB HTRB HAST Pressure Pot Temp = 150°c , Vds=80% of Vdsmax (Note B**) Standard: 10 lots (Note B**) Temperature Cycle -65°c to 150°c , air to air, High Temperature Storage Temp = 150°c 250 / 500 cycles Standard: 8 lots (Note B**) 500/1000 hrs Standard : 5 lots (Note B**) Number of Failures 77+5 pcs / lot 656 pcs 0 77+5 pcs / lot 550 pcs 0 50+5 pcs / lot 550 pcs 0 50+5 pcs / lot 440 pcs 0 50+5 pcs / lot 410 pcs 0 77+5 pcs / lot 3 III. Result of Reliability Stress for AOL1432 (Standard) & AOL1432L (Green) Continues DPA Internal Vision Cross-section X-ray CSAM NA 5 5 5 5 5 5 0 NA 5 5 0 Bond Integrity Room Temp 150°c bake 150°c bake 0hr 250hr 500hr 40 40 40 40 wires 40 wires 40 wires 0 Solderability 245°c 5 sec 15 15 leads 0 Note A: The HTGB and HTRB reliability data presents total of available AOL1432 and AOL1432L burn-in data up to the published date. Note B: The pressure pot, temperature cycle and HAST reliability data for AOL1432 and AOL1432L comes from the AOS generic package qualification data. IV. Reliability Evaluation FIT rate (per billion): 3 MTTF = 38051years In general, 500 hrs of HTGB, 150 deg C accelerated stress testing is equivalent to 15 years of lifetime at 55deg C operating conditions (by applying the Arrhenius equation with an activation energy of 0.7eV and 60% of upper confidence level on the failure rate calculation). AOS reliability group also routinely monitors the product reliability up to 1000 hr at and performs the necessary failure analysis on the units failed for reliability test(s). The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in sample size of the selected product (AOL1432). Failure Rate Determination is based on JEDEC Standard JESD 85. FIT means one failure per billion hours. Failure Rate = Chi2 x 109 / [2 (N) (H) (Af)] = 1.83 x 109 / [2 (2×164) (500) (258) + 2 (6×164) (1000) (258)] = 3 9 MTTF = 10 / FIT =3.33 x 108hrs =38051years Chi² = Chi Squared Distribution, determined by the number of failures and confidence interval N = Total Number of units from HTRB and HTGB tests H = Duration of HTRB/HTGB testing Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C) Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)] Acceleration Factor ratio list: Af 55 deg C 70 deg C 85 deg C 100 deg C 115 deg C 130 deg C 150 deg C 258 87 32 13 5.64 2.59 1 Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16 Tj u = The use junction temperature in degree (Kelvin), K = C+273.16 k = Boltzmann’s constant, 8.617164 X 10 -5eV / K 4 V. Quality Assurance Information Acceptable Quality Level for outgoing inspection: 0.1% for electrical and visual. Guaranteed Outgoing Defect Rate: < 25 ppm Quality Sample Plan: conform to Mil-Std-105D 5