DLA 95158 www.vishay.com Vishay Solid Tantalum Surface Mount Chip Capacitors TANTAMOUNT™, Molded Case, DLA Approved, Low ESR FEATURES • Meets MIL-PRF-55365 and EIA535BAAC mechanical and performance requirements • Low ESR • Terminations: gold and tin / lead solder plated • Molded case available in 3 case codes • High ripple current carrying capability • High reliability Inspection: MIL-PRF-55365, group A inspection (exponential distribution); subgroups 1 and 3 with voltage aging a minimum of 10 h. PERFORMANCE / ELECTRICAL CHARACTERISTICS 100 % Surge Current Tested - Temperature: 25 °C - Applied voltage: rated voltage - Test cycles: 4 - Charge and discharge cycles: 4 s maximum - Total DC resistance: 0.6 maximum www.vishay.com/doc?40211 Operating Temperature: -55 °C to +125 °C (above 85 °C, voltage derating is required) Capacitance Range: 4.7 μF to 220 μF Capacitance Tolerance: ± 10 %, and ± 20 % Voltage Rating: 6 VDC to 50 VDC APPLICATIONS • Military / aerospace ORDERING INFORMATION 95158- 01 K H T DRAWING NUMBER DASH NUMBER CAPACITANCE TOLERANCE TERMINATION FINISH PACKAGING K = ± 10 % M = ± 20 % B = gold plated (10 microinch minimum) H = solder plated (100 microinch minimum) T = 7" (178 mm) reel DIMENSIONS in inches [millimeters] L W TW H Glue Pad TH MIN. Glue Pad CASE CODE P EIA SIZE L W H P TW TH MIN. C 6032-28 0.236 ± 0.012 [6.0 ± 0.30] 0.126 ± 0.012 [3.2 ± 0.30] 0.098 ± 0.012 [2.5 ± 0.30] 0.051 ± 0.012 [1.3 ± 0.30] 0.087 ± 0.004 [2.2 ± 0.10] 0.039 [1.0] D 7343-31 0.287 ± 0.012 [7.3 ± 0.30] 0.170 ± 0.012 [4.3 ± 0.30] 0.110 ± 0.012 [2.8 ± 0.30] 0.051 ± 0.012 [1.3 ± 0.30] 0.095 ± 0.004 [2.4 ± 0.10] 0.039 [1.0] E 7343-43 0.287 ± 0.012 [7.3 ± 0.30] 0.170 ± 0.012 [4.3 ± 0.30] 0.158 ± 0.012 [4.0 ± 0.30] 0.051 ± 0.012 [1.3 ± 0.30] 0.095 ± 0.004 [2.4 ± 0.10] 0.039 [1.0] Note • Glue pad (non-conductive, part of molded case) is dedicated for glue attachment (as user option). Revision: 12-May-16 Document Number: 40120 1 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 DLA 95158 www.vishay.com Vishay RATINGS AND CASE CODES μF 6V 10 V 16 V 20 V 25 V 4.7 35 V 50 V C E 6.8 E 10 D/E 15 22 33 D/E E D E E D 47 68 D D D 100 E D E E E D/E 150 E D/E 220 D/E E E MARKING Voltage Capacitance μF Polarity band (+) Date code 22 10 XX 2 Vishay marking C, D, E Cases Marking: Capacitor marking includes an anode (+) polarity band, capacitance in microfarads and the voltage rating. The Vishay identification is included if space permits. A manufacturing date code is marked on all capacitors. Call the factory for further explanation. Revision: 12-May-16 Document Number: 40120 2 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 DLA 95158 www.vishay.com Vishay STANDARD RATINGS MAX. DC LEAKAGE (μA) 0.93 -55 °C 4 6 6 0.175 6 8 8 0.125 1.15 165.0 8 12 12 0.100 1.22 165.0 8 12 12 0.100 1.28 PART NUMBER 68 D 95158-01(1)(2)(3) 3.3 19.8 33.0 150 E 95158-02(1)(2)(3) 7.2 43.2 72.0 220 D 95158-25(1)(2)(3) 13.2 132.0 220 E 95158-03(1)(2)(3) 13.2 132.0 +85 °C MAX. RIPPLE 100 kHz IRMS (A) +85 °C +125 °C CASE CODE +25 °C MAX. DF (%) MAX. ESR AT +25 °C 100 kHz () CAPACITANCE (μF) +125 °C +25 °C 6 VDC AT +85 °C; 4 VDC AT +125 °C 10 VDC AT +85 °C; 7 VDC AT +125 °C 47 D 95158-04(1)(2)(3) 3.8 22.8 38.0 4 6 6 0.200 0.87 68 E 95158-05(1)(2)(3) 5.4 32.4 54.0 4 6 6 0.150 1.05 100 D 95158-06(1)(2)(3) 10.0 100.0 125.0 8 12 12 0.100 1.22 100 E 95158-07(1)(2)(3) 8.0 48.0 80.0 6 8 8 0.100 1.28 150 E 95158-08(1)(2)(3) 15.0 150.0 187.5 8 12 12 0.100 1.28 150 D 95158-26(1)(2)(3) 15.0 150.0 187.5 8 12 12 0.100 1.22 220 E 95158-28(1)(2)(3) 15.0 150.0 187.5 8 12 12 0.100 1.28 16 VDC AT +85 °C; 10 VDC AT +125 °C 33 D 95158-09(1)(2)(3) 4.2 25.2 42.0 4 6 6 0.250 0.77 47 D 95158-10(1)(2)(3) 7.5 75.0 94.0 6 9 9 0.200 0.87 100 E 95158-11(1)(2)(3) 16.0 160.0 200.0 8 12 12 0.125 1.15 20 VDC AT +85 °C; 13 VDC AT +125 °C 15 D 95158-12(1)(2)(3) 2.4 14.4 24.0 4 6 6 0.275 0.74 22 D 95158-13(1)(2)(3) 3.5 21.0 35.0 4 6 6 0.275 0.74 47 E 95158-14(1)(2)(3) 7.5 45.0 75.0 4 6 6 0.150 1.05 68 E 95158-15(1)(2)(3) 13.6 136.0 170.0 6 9 9 0.150 1.05 25 VDC AT +85 °C; 17 VDC AT +125 °C 15 D 95158-16(1)(2)(3) 3.8 38.0 46.9 6 9 9 0.275 0.74 15 E 95158-17(1)(2)(3) 3.0 18.0 30.0 4 6 6 0.200 0.91 22 E 95158-18(1)(2)(3) 4.4 26.4 44.0 4 6 6 0.225 0.86 33 E 95158-19(1)(2)(3) 6.6 39.6 66.0 4 6 6 0.175 0.97 0.43 35 VDC AT +85 °C; 23 VDC AT +125 °C 4.7 C 95158-29(1)(2)(3) 1.7 10.2 17.0 6 9 9 0.600 6.8 E 95158-20(1)(2)(3) 1.9 11.4 19.0 4 6 6 0.300 0.74 10 D 95158-27(1)(2)(3) 3.5 35.0 42.0 4 6 6 0.300 0.71 10 E 95158-21(1)(2)(3) 2.8 16.8 28.0 4 6 6 0.250 0.81 15 E 95158-22(1)(2)(3) 5.3 53.0 65.6 6 9 9 0.225 0.86 22 E 95158-23(1)(2)(3) 7.7 77.0 96.3 6 9 9 0.300 0.74 6 6 0.300 0.74 50 VDC AT +85 °C; 33 VDC AT +125 °C 4.7 E 95158-24(1)(2)(3) 1.9 11.4 19.0 4 Note • Part number definitions: (1) Tolerance: K, M (2) Termination finish: B, H (3) Packaging: T Revision: 12-May-16 Document Number: 40120 3 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Molded Guide www.vishay.com Vishay Sprague Guide for Molded Tantalum Capacitors INTRODUCTION Tantalum electrolytic capacitors are the preferred choice in applications where volumetric efficiency, stable electrical parameters, high reliability, and long service life are primary considerations. The stability and resistance to elevated temperatures of the tantalum / tantalum oxide / manganese dioxide system make solid tantalum capacitors an appropriate choice for today's surface mount assembly technology. Vishay Sprague has been a pioneer and leader in this field, producing a large variety of tantalum capacitor types for consumer, industrial, automotive, military, and aerospace electronic applications. Tantalum is not found in its pure state. Rather, it is commonly found in a number of oxide minerals, often in combination with Columbium ore. This combination is known as “tantalite” when its contents are more than one-half tantalum. Important sources of tantalite include Australia, Brazil, Canada, China, and several African countries. Synthetic tantalite concentrates produced from tin slags in Thailand, Malaysia, and Brazil are also a significant raw material for tantalum production. Electronic applications, and particularly capacitors, consume the largest share of world tantalum production. Other important applications for tantalum include cutting tools (tantalum carbide), high temperature super alloys, chemical processing equipment, medical implants, and military ordnance. Vishay Sprague is a major user of tantalum materials in the form of powder and wire for capacitor elements and rod and sheet for high temperature vacuum processing. THE BASICS OF TANTALUM CAPACITORS Most metals form crystalline oxides which are non-protecting, such as rust on iron or black oxide on copper. A few metals form dense, stable, tightly adhering, electrically insulating oxides. These are the so-called “valve”metals and include titanium, zirconium, niobium, tantalum, hafnium, and aluminum. Only a few of these permit the accurate control of oxide thickness by electrochemical means. Of these, the most valuable for the electronics industry are aluminum and tantalum. Capacitors are basic to all kinds of electrical equipment, from radios and television sets to missile controls and automobile ignitions. Their function is to store an electrical charge for later use. Capacitors consist of two conducting surfaces, usually metal plates, whose function is to conduct electricity. They are separated by an insulating material or dielectric. The dielectric used in all tantalum electrolytic capacitors is tantalum pentoxide. Tantalum pentoxide compound possesses high-dielectric strength and a high-dielectric constant. As capacitors are being manufactured, a film of tantalum pentoxide is applied to their electrodes by means of an electrolytic process. The film is applied in various thicknesses and at various voltages and although transparent to begin with, it takes on different colors as light refracts through it. This coloring occurs on the tantalum electrodes of all types of tantalum capacitors. Revision: 11-Apr-16 Rating for rating, tantalum capacitors tend to have as much as three times better capacitance / volume efficiency than aluminum electrolytic capacitors. An approximation of the capacitance / volume efficiency of other types of capacitors may be inferred from the following table, which shows the dielectric constant ranges of the various materials used in each type. Note that tantalum pentoxide has a dielectric constant of 26, some three times greater than that of aluminum oxide. This, in addition to the fact that extremely thin films can be deposited during the electrolytic process mentioned earlier, makes the tantalum capacitor extremely efficient with respect to the number of microfarads available per unit volume. The capacitance of any capacitor is determined by the surface area of the two conducting plates, the distance between the plates, and the dielectric constant of the insulating material between the plates. COMPARISON OF CAPACITOR DIELECTRIC CONSTANTS DIELECTRIC Air or vacuum Paper Plastic Mineral oil Silicone oil Quartz Glass Porcelain Mica Aluminum oxide Tantalum pentoxide Ceramic e DIELECTRIC CONSTANT 1.0 2.0 to 6.0 2.1 to 6.0 2.2 to 2.3 2.7 to 2.8 3.8 to 4.4 4.8 to 8.0 5.1 to 5.9 5.4 to 8.7 8.4 26 12 to 400K In the tantalum electrolytic capacitor, the distance between the plates is very small since it is only the thickness of the tantalum pentoxide film. As the dielectric constant of the tantalum pentoxide is high, the capacitance of a tantalum capacitor is high if the area of the plates is large: where eA C = ------t C = capacitance e = dielectric constant A = surface area of the dielectric t = thickness of the dielectric Tantalum capacitors contain either liquid or solid electrolytes. In solid electrolyte capacitors, a dry material (manganese dioxide) forms the cathode plate. A tantalum lead is embedded in or welded to the pellet, which is in turn connected to a termination or lead wire. The drawings show the construction details of the surface mount types of tantalum capacitors shown in this catalog. Document Number: 40074 1 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Molded Guide www.vishay.com Vishay Sprague SOLID ELECTROLYTE TANTALUM CAPACITORS TANTALUM CAPACITORS FOR ALL DESIGN CONSIDERATIONS Solid electrolyte capacitors contain manganese dioxide, which is formed on the tantalum pentoxide dielectric layer by impregnating the pellet with a solution of manganous nitrate. The pellet is then heated in an oven, and the manganous nitrate is converted to manganese dioxide. Solid electrolyte designs are the least expensive for a given rating and are used in many applications where their very small size for a given unit of capacitance is of importance. They will typically withstand up to about 10 % of the rated DC working voltage in a reverse direction. Also important are their good low temperature performance characteristics and freedom from corrosive electrolytes. The pellet is next coated with graphite, followed by a layer of metallic silver, which provides a conductive surface between the pellet and the Leadframe. Vishay Sprague patented the original solid electrolyte capacitors and was the first to market them in 1956. Vishay Sprague has the broadest line of tantalum capacitors and has continued its position of leadership in this field. Data sheets covering the various types and styles of Vishay Sprague capacitors for consumer and entertainment electronics, industry, and military applications are available where detailed performance characteristics must be specified. Molded Chip tantalum capacitor encases the element in plastic resins, such as epoxy materials. After assembly, the capacitors are tested and inspected to assure long life and reliability. It offers excellent reliability and high stability for consumer and commercial electronics with the added feature of low cost Surface mount designs of “Solid Tantalum” capacitors use lead frames or lead frameless designs as shown in the accompanying drawings. MOLDED CHIP CAPACITOR, ALL TYPES EXCEPT 893D / TF3 / T86 Epoxy Encapsulation Silver Adhesive Anode Polarity Bar MnO2/Carbon/ Silver Coating Solderable Leadframe Cathode Sintered Termination Tantalum Solderable Anode Termination MOLDED CHIP CAPACITOR WITH BUILT-IN FUSE, TYPES 893D / TF3 / T86 Epoxy Encapsulation Silver Adhesive Anode Polarity Bar Solderable Cathode Termination MnO2/Carbon/Silver Coating Sintered Tantalum Pellet Fusible Wire Lead Frame Revision: 11-Apr-16 Solderable Anode Termination Document Number: 40074 2 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Molded Guide www.vishay.com Vishay Sprague COMMERCIAL PRODUCTS SOLID TANTALUM CAPACITORS - MOLDED CASE SERIES 793DX-CTC3CTC4 293D 593D TR3 TP3 TL3 High performance, automotive grade Very low DCL PRODUCT IMAGE Surface mount TANTAMOUNT™, molded case TYPE FEATURES Standard industrial grade CECC approved Low ESR TEMPERATURE RANGE CAPACITANCE RANGE VOLTAGE RANGE CAPACITANCE TOLERANCE -55 °C to +125 °C 0.1 μF to 1000 μF 0.1 μF to 100 μF 1 μF to 470 μF 0.47 μF to 1000 μF 0.1 μF to 470 μF 0.1 μF to 470 μF 4 V to 75 V 4 V to 50 V 4 V to 50 V 4 V to 75 V 4 V to 50 V 4 V to 50 V ± 10 %, ± 20 % LEAKAGE CURRENT DISSIPATION FACTOR CASE CODES TERMINATION Low ESR 0.005 CV or 0.25 μA, whichever is greater 0.01 CV or 0.5 μA, whichever is greater 4 % to 30 % 4 % to 6 % A, B, C, D, E, V A, B, C, D 4 % to 15 % 4 % to 30 % 4 % to 15 % 4 % to 15 % A, B, C, D, E A, B, C, D, E, V, W A, B, C, D, E 100 % matte tin standard, tin / lead available A, B, C, D, E SOLID TANTALUM CAPACITORS - MOLDED CASE SERIES TH3 TH4 TH5 893D TF3 PRODUCT IMAGE FEATURES High temperature +150 °C, automotive grade Surface mount TANTAMOUNT™, molded case High temperature Very high temperature +175 °C, Built-in fuse +200 °C automotive grade TEMPERATURE RANGE -55 °C to +150 °C -55 °C to +175 °C -55 °C to +200 °C 0.33 μF to 220 μF 10 μF to 47 μF 4.7 μF to 100 μF 0.47 μF to 680 μF 0.47 μF to 470 μF 6.3 V to 50 V 6.3 V to 35 V 5 V to 24 V 4 V to 50 V 4 V to 50 V TYPE CAPACITANCE RANGE VOLTAGE RANGE CAPACITANCE TOLERANCE LEAKAGE CURRENT DISSIPATION FACTOR CASE CODES TERMINATION Revision: 11-Apr-16 Built-in fuse, low ESR -55 °C to +125 °C ± 10 %, ± 20 % 0.01 CV or 0.5 μA, whichever is greater 4 % to 8 % 4.5 % to 6 % 6 % to 10 % 6 % to 15 % 6 % to 15 % A, B, C, D, E 100 % matte tin standard, tin / lead and gold plated available B, C, D E C, D, E C, D, E 100 % matte tin Gold plated 100 % matte tin standard Document Number: 40074 3 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Molded Guide www.vishay.com Vishay Sprague HIGH RELIABILITY PRODUCTS SOLID TANTALUM CAPACITORS - MOLDED CASE SERIES TM3 T83 T86 CWR11 95158 PRODUCT IMAGE TYPE TANTAMOUNT™, molded case, Hi-Rel. FEATURES High reliability, for Medical Instruments TANTAMOUNT™, molded case, Hi-Rel. COTS High reliability, standard and low ESR TEMPERATURE RANGE CAPACITANCE RANGE VOLTAGE RANGE MIL-PRF-55365/8 qualified Low ESR -55 °C to +125 °C 1 μF to 220 μF 4 V to 20 V CAPACITANCE TOLERANCE LEAKAGE CURRENT High reliability, built-in fuse, standard and low ESR TANTAMOUNT™, molded case, DLA approved 0.1 μF to 470 μF 0.47 μF to 330 μF 4 V to 63 V 4.7 μF to 220 μF 4 V to 50 V ± 10 %, ± 20 % 0.005 CV or 0.25 μA, whichever is greater 0.1 μF to 100 μF ± 5 %, ± 10 %, ± 20 % ± 10 %, ± 20 % 0.01 CV or 0.5 μA, whichever is greater DISSIPATION FACTOR 4 % to 8 % 4 % to 15 % 6 % to 16 % 4 % to 6 % 4 % to 12 % CASE CODES A, B, C, D, E A, B, C, D, E C, D, E A, B, C, D C, D, E TERMINATION 100 % matte tin; tin / lead 100 % matte tin; tin / lead; tin / lead solder fused 100 % matte tin Tin / lead; tin / lead solder fused Tin / lead solder plated; gold plated Revision: 11-Apr-16 Document Number: 40074 4 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Molded Guide www.vishay.com Vishay Sprague PLASTIC TAPE AND REEL PACKAGING in inches [millimeters] 0.157 ± 0.004 [4.0 ± 0.10] Tape thickness Deformation between embossments 0.014 [0.35] MAX. 0.059 + 0.004 - 0.0 [1.5 + 0.10 - 0.0] Top cover tape B1 MAX. (Note 6) Center lines of cavity 0.069 ± 0.004 [1.75 ± 0.10] Embossment 0.030 [0.75] MIN. (Note 3) B0 Top cover tape For tape feeder reference only including draft. Concentric around B0 (Note 5) 0.079 ± 0.002 [2.0 ± 0.05] A0 K0 0.004 [0.1] MAX. 10 pitches cumulative tolerance on tape ± 0.008 [0.200] 20° F W Maxim um component rotation 0.030 [0.75] MIN. (Note 4) (Side or front sectional view) P1 USER DIRECTION OF FEED Maximum cavity size (Note 1) D1 MIN. for components 0.079 x 0.047 [2.0 x 1.2] and larger . (Note 5) Cathode (-) Anode (+) Direction of Feed 20° maximum component rotation Typical component cavity center line B0 A0 (Top view) Typical component center line Tape and Reel Specifications: all case sizes are available on plastic embossed tape per EIA-481. Standard reel diameter is 7" [178 mm], 13" [330 mm] reels are available and recommended as the most cost effective packaging method. 3.937 [100.0] 0.039 [1.0] MAX. Tape 0.039 [1.0] MAX. 0.9843 [250.0] Camber (top view) Allowable camber to be 0.039/3.937 [1/100] non-cumulative over 9.843 [250.0] The most efficient packaging quantities are full reel increments on a given reel diameter. The quantities shown allow for the sealed empty pockets required to be in conformance with EIA-481. Reel size and packaging orientation must be specified in the Vishay Sprague part number. Notes • Metric dimensions will govern. Dimensions in inches are rounded and for reference only. (1) A , B , K , are determined by the maximum dimensions to the ends of the terminals extending from the component body and / or the body 0 0 0 dimensions of the component. The clearance between the ends of the terminals or body of the component to the sides and depth of the cavity (A0, B0, K0) must be within 0.002" (0.05 mm) minimum and 0.020" (0.50 mm) maximum. The clearance allowed must also prevent rotation of the component within the cavity of not more than 20°. (2) Tape with components shall pass around radius “R” without damage. The minimum trailer length may require additional length to provide “R” minimum for 12 mm embossed tape for reels with hub diameters approaching N minimum. (3) This dimension is the flat area from the edge of the sprocket hole to either outward deformation of the carrier tape between the embossed cavities or to the edge of the cavity whichever is less. (4) This dimension is the flat area from the edge of the carrier tape opposite the sprocket holes to either the outward deformation of the carrier tape between the embossed cavity or to the edge of the cavity whichever is less. (5) The embossed hole location shall be measured from the sprocket hole controlling the location of the embossement. Dimensions of embossement location shall be applied independent of each other. (6) B dimension is a reference dimension tape feeder clearance only. 1 CASE TAPE B1 CODE SIZE (MAX.) MOLDED CHIP CAPACITORS; ALL TYPES A 0.165 8 mm [4.2] B C D 0.32 E 12 mm [8.2] V W Revision: 11-Apr-16 D1 (MIN.) F K0 (MAX.) P1 W 0.039 [1.0] 0.138 ± 0.002 [3.5 ± 0.05] 0.094 [2.4] 0.157 ± 0.004 [4.0 ± 1.0] 0.315 ± 0.012 [8.0 ± 0.30] 0.059 [1.5] 0.217 ± 0.00 [5.5 ± 0.05] 0.177 [4.5] 0.315 ± 0.004 [8.0 ± 1.0] 0.472 ± 0.012 [12.0 ± 0.30] Document Number: 40074 5 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Molded Guide www.vishay.com Vishay Sprague RECOMMENDED REFLOW PROFILES Capacitors should withstand reflow profile as per J-STD-020 standard TEMPERATURE (°C) Tp TL Ts max. TC - 5 °C tp Max. ramp-up rate = 3 °C/s Max. ramp-down rate = 6 °C/s tL Preheat area Ts min. ts 25 Time 25 °C to peak TIME (s) PROFILE FEATURE Preheat / soak Temperature min. (Ts min.) Temperature max. (Ts max.) Time (ts) from (Ts min. to Ts max.) Ramp-up Ramp-up rate (TL to Tp) Liquidous temperature (TL) Time (tL) maintained above TL Peak package body temperature (Tp) Time (tp) within 5 °C of the specified classification temperature (TC) Time 25 °C to peak temperature Ramp-down Ramp-down rate (Tp to TL) SnPb EUTECTIC ASSEMBLY LEAD (Pb)-FREE ASSEMBLY 100 °C 150 °C 60 s to 120 s 150 °C 200 °C 60 s to 120 s 3 °C/s max. 3 °C/s max. 183 °C 217 °C 60 s to 150 s 60 s to 150 s Depends on case size - see table below 20 s 30 s 6 min max. 8 min max. 6 °C/s max. 6 °C/s max. PEAK PACKAGE BODY TEMPERATURE (Tp) PEAK PACKAGE BODY TEMPERATURE (Tp) SnPb EUTECTIC PROCESS LEAD (Pb)-FREE PROCESS CASE CODE A, B, C, V 235 °C 260 °C D, E, W 220 °C 250 °C PAD DIMENSIONS in inches [millimeters] B D C A A (MIN.) MOLDED CHIP CAPACITORS, ALL TYPES A 0.071 [1.80] B 0.118 [3.00] C 0.118 [3.00] D 0.157 [4.00] E 0.157 [4.00] V 0.157 [4.00] W 0.185 [4.70] CASE CODE Revision: 11-Apr-16 B (NOM.) C (NOM.) D (NOM.) 0.067 [1.70] 0.071 [1.80] 0.094 [2.40] 0.098 [2.50] 0.098 [2.50] 0.098 [2.50] 0.098 [2.50] 0.053 [1.35] 0.065 [1.65] 0.118 [3.00] 0.150 [3.80] 0.150 [3.80] 0.150 [3.80] 0.150 [3.80] 0.187 [4.75] 0.207 [5.25] 0.307 [7.80] 0.346 [8.80] 0.346 [8.80] 0.346 [8.80] 0.346 [8.80] Document Number: 40074 6 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Molded Guide www.vishay.com Vishay Sprague GUIDE TO APPLICATION 1. AC Ripple Current: the maximum allowable ripple current shall be determined from the formula: I R MS = P -----------R ESR shown. It is important that the equivalent IRMS value be established when calculating permissible operating levels. (Power dissipation calculated using +25 °C temperature rise). 6. Printed Circuit Board Materials: molded capacitors are compatible with commonly used printed circuit board materials (alumina substrates, FR4, FR5, G10, PTFE-fluorocarbon and porcelanized steel). 7. Attachment: 7.1 Solder Paste: the recommended thickness of the solder paste after application is 0.007" ± 0.001" [0.178 mm ± 0.025 mm]. Care should be exercised in selecting the solder paste. The metal purity should be as high as practical. The flux (in the paste) must be active enough to remove the oxides formed on the metallization prior to the exposure to soldering heat. In practice this can be aided by extending the solder preheat time at temperatures below the liquidous state of the solder. 7.2 Soldering: capacitors can be attached by conventional soldering techniques; vapor phase, convection reflow, infrared reflow, wave soldering, and hot plate methods. The soldering profile charts show recommended time / temperature conditions for soldering. Preheating is recommended. The recommended maximum ramp rate is 2 °C per s. Attachment with a soldering iron is not recommended due to the difficulty of controlling temperature and time at temperature. The soldering iron must never come in contact with the capacitor. where, P= power dissipation in W at +25 °C as given in the tables in the product datasheets (Power Dissipation). RESR = the capacitor equivalent series resistance at the specified frequency 2. AC Ripple Voltage: the maximum allowable ripple voltage shall be determined from the formula: V RMS = I R MS x Z or, from the formula: P V R MS = Z -----------R ESR where, P= power dissipation in W at +25 °C as given in the tables in the product datasheets (Power Dissipation). RESR = the capacitor equivalent series resistance at the specified frequency Z= 2.1 2.2 the capacitor impedance at the specified frequency The sum of the peak AC voltage plus the applied DC voltage shall not exceed the DC voltage rating of the capacitor. The sum of the negative peak AC voltage plus the applied DC voltage shall not allow a voltage reversal exceeding 10 % of the DC working voltage at +25 °C. 3. Reverse Voltage: solid tantalum capacitors are not intended for use with reverse voltage applied. However, they have been shown to be capable of withstanding momentary reverse voltage peaks of up to 10 % of the DC rating at 25 °C and 5 % of the DC rating at +85 °C. 4. Temperature Derating: if these capacitors are to be operated at temperatures above +25 °C, the permissible RMS ripple current shall be calculated using the derating factors as shown: TEMPERATURE (°C) +25 +85 +125 +150 (1) +175 (1) +200 (1) DERATING FACTOR 1.0 0.9 0.4 0.3 0.2 0.1 Note (1) Applicable for dedicated high temperature product series 5. Power Dissipation: power dissipation will be affected by the heat sinking capability of the mounting surface. Non-sinusoidal ripple current may produce heating effects which differ from those Revision: 11-Apr-16 7.2.1 Backward and Forward Compatibility: capacitors with SnPb or 100 % tin termination finishes can be soldered using SnPb or lead (Pb)-free soldering processes. 8. Cleaning (Flux Removal) After Soldering: molded capacitors are compatible with all commonly used solvents such as TES, TMS, Prelete, Chlorethane, Terpene and aqueous cleaning media. However, CFC / ODS products are not used in the production of these devices and are not recommended. Solvents containing methylene chloride or other epoxy solvents should be avoided since these will attack the epoxy encapsulation material. 8.1 When using ultrasonic cleaning, the board may resonate if the output power is too high. This vibration can cause cracking or a decrease in the adherence of the termination. DO NOT EXCEED 9W/l at 40 kHz for 2 min. 9. Recommended Mounting Pad Geometries: proper mounting pad geometries are essential for successful solder connections. These dimensions are highly process sensitive and should be designed to minimize component rework due to unacceptable solder joints. The dimensional configurations shown are the recommended pad geometries for both wave and reflow soldering techniques. These dimensions are intended to be a starting point for circuit board designers and may be fine tuned if necessary based upon the peculiarities of the soldering process and / or circuit board design. Document Number: 40074 7 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Typical Performance Characteristics www.vishay.com Vishay Sprague Solid Tantalum Chip Capacitors MIL-PRF-55365 Qualified and DLA Approved ELECTRICAL PERFORMANCE CHARACTERISTICS ITEM PERFORMANCE CHARACTERISTICS Category temperature range -55 °C to +85 °C (to +125 °C with voltage derating) Capacitance tolerance ± 20 %, ± 10 %, tested via bridge method, at 25 °C, 120 Hz Dissipation factor Limit per Standard Ratings table. Tested via bridge method, at 25 °C, 120 Hz ESR Limit per Standard Ratings table. Tested via bridge method, at 25 °C, 100 kHz Leakage current After application of rated voltage applied to capacitors for 5 min using a steady source of power with 1 k resistor in series with the capacitor under test, leakage current at 25 °C is not more than described in Standard Ratings table of appropriate datasheet. Note that the leakage current varies with temperature and applied voltage. See graph below for the appropriate adjustment factor. Reverse voltage Capacitors are capable of withstanding peak voltages in the reverse direction equal to: 10 % of the DC rating at +25 °C 5 % of the DC rating at +85 °C 1 % of the DC rating at +125 °C Vishay does not recommend intentional or repetitive application of reverse voltage. Ripple current For maximum ripple current values calculation (at 25 °C) refer to “Guide to Application” part of product guide which is linked with relevant datasheet. If capacitors are to be used at temperatures above +25 °C, the permissible ripple current (or voltage) shall be calculated using the derating factors: 1.0 at +25 °C 0.9 at +85 °C 0.4 at +125 °C Maximum operating and surge voltages vs. temperature +85 °C +125 °C RATED VOLTAGE (V) SURGE VOLTAGE (V) CATEGORY VOLTAGE (V) 4.0 5.3 2.7 6.3 8.0 4.0 10 13.3 6.7 15 / 16 20 10 20 26.7 13.3 25 33.3 16.7 35 46.7 23.3 50 66.7 33.3 Notes • All information presented in this document reflects typical performance characteristics Revision: 24-Mar-15 Document Number: 40211 1 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Typical Performance Characteristics www.vishay.com Vishay Sprague TYPICAL LEAKAGE CURRENT - TEMPERATURE FACTOR 100 Leakage Current Factor +125 °C 10 +85 °C +55 °C +25 °C 1.0 0 °C 0.1 -55 °C 0.01 0.001 0 10 20 30 40 50 60 70 80 90 100 Percent of Rated Voltage Notes • At +25 °C, the leakage current shall not exceed the value listed in the Standard Ratings table. • At +85 °C, the leakage current shall not exceed 10 times the value listed in the Standard Ratings table. • At +125 °C, the leakage current shall not exceed 12 times the value listed in the Standard Ratings table. ENVIRONMENTAL PERFORMANCE CHARACTERISTICS ITEM CONDITION POST TEST PERFORMANCE Moisture resistance MIL-STD-202, method 106, 20 cycles Capacitance change Dissipation factor Leakage current Within ± 15 % of initial value Shall not exceed 150 % of initial limit Shall not exceed 200 % of initial limit Visual examination: there shall be no evidence of harmful corrosion, mechanical damage, or obliteration of marking (if applicable) Stability at low and high temperatures MIL-PRF-55365 Step Test Temperature (°C) 1 +25 ± 3 2 -55 + 0 / - 6 3 +25 ± 3 4 +85 + 4 / - 0 5 +125 + 4 / - 0 6 +25 ± 3 Delta cap limit at -55 °C is ± 10 % (20 % for CWR15) of initial value Delta cap limit at 85 °C is ± 10 % (15 % for CWR15) of initial value Delta cap limit at 125 °C is ± 15 % (20 % for CWR15) of initial value Delta cap at step 3 and final step 25 °C is ± 5 % (10 % for CWR15) of initial value DCL at 85 °C: 10 x initial specified value DCL at 125 °C: 12 x initial specified value DCL at 25 °C: initial specified value at rated voltage DF change: refer to performance specification sheet for applicable capacitor style Surge voltage MIL-PRF-55365 1000 successive test cycles at 85 °C of applicable surge voltage (as specified in the table above), in series with a 33 resistor at the rate of 30 s ON, 30 s OFF Capacitance change Dissipation factor Leakage current Within ± 5 % of initial value Initial specified limit Initial specified limit Life test at +85 °C MIL-STD-202, method 108 2000 h application of rated voltage at 85 °C Capacitance change Dissipation factor Leakage current Within ± 5 % (10 % for CWR15) of initial value Initial specified limit Shall not exceed 200 % of initial limit There shall be no evidence of harmful corrosion or obliteration of marking (if applicable), mechanical damage, intermittent shorts, or permanent shorts or opens Life test at +125 °C MIL-STD-202, method 108 2000 h application 2/3 of rated voltage at 125 °C Capacitance change Dissipation factor Leakage current Within ± 5 % (10 % for CWR15) of initial value Initial specified limit Shall not exceed 200 % of initial limit There shall be no evidence of harmful corrosion or obliteration of marking (if applicable), mechanical damage, intermittent shorts, or permanent shorts or opens Revision: 24-Mar-15 Document Number: 40211 2 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Typical Performance Characteristics www.vishay.com Vishay Sprague MECHANICAL PERFORMANCE CHARACTERISTICS ITEM CONDITION POST TEST PERFORMANCE Vibration MIL-STD-202, method 204, condition D, 10 Hz to 2000 Hz, 20 g peak, in 2 directions, 4 hours in each, at rated voltage Measurements during vibration: During the last cycle of each plane, electrical measurements shall be made to determine the intermittent open or short circuits. Intermittent contact and arcing shall also be determined. Measurements after vibration: not applicable Visual examination after test: there shall be no evidence of mechanical damage Thermal shock (mounted) MIL-STD-202, method 107 -65 °C / +125 °C, for 10 cycles, 30 min at each temperature Capacitance change Dissipation factor Leakage current Within ± 5 % of initial value Initial specified limit Initial specified limit Visual examination: there shall be no evidence of harmful corrosion, mechanical damage, or obliteration of marking (if applicable) Resistance to soldering heat MIL-STD-202, method 210, condition J (convection reflow, 235 °C ± 5 °C), one heat cycle Capacitance change Dissipation factor Leakage current Within ± 5 % of initial value Initial specified limit Initial specified limit Visual examination: there shall be no evidence of mechanical damage MIL-STD-202, method 208, ANSI/J-STD-002, test B (dip- and look, 245 °C ± 5 °C). Preconditioning per category C (steam aging, 8 hours). Does not apply to gold terminations. Solder coating of all capacitors shall meet specified requirements. Resistance to solvents MIL-STD-202, method 215 There shall be no mechanical or visual damage to capacitors post-conditioning. Body marking shall remain legible and shall not smear. Flammability Encapsulation materials meet UL 94 V-0 with an oxygen index of 32 % Solderability Revision: 24-Mar-15 There shall be no mechanical or visual damage to capacitors post-conditioning. Document Number: 40211 3 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Legal Disclaimer Notice www.vishay.com Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. 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We confirm that all the products identified as being compliant to IEC 61249-2-21 conform to JEDEC JS709A standards. Revision: 02-Oct-12 1 Document Number: 91000