ISL8391, ISL8392, ISL8393 ® Data Sheet June 2003 Low-Voltage, Single and Dual Supply, Quad SPST, Analog Switches Features • Pin Compatible Replacements for MAX391 - MAX393 The Intersil ISL8391–ISL8393 devices are CMOS, precision, quad analog switches designed to operate from a single +2V to +12V supply or from a ±2V to ±6V supply. Targeted applications include battery powered equipment that benefit from the devices’ low power consumption (<1µW), low leakage currents (2.5nA max), and fast switching speeds (tON = 60ns, tOFF = 30ns). A 4Ω maximum RON flatness ensures signal fidelity, while channel-to-channel mismatch is guaranteed to be less than 2Ω. The ISL8391, ISL8392, and ISL8393 are quad single-pole/single-throw (SPST) devices. The ISL8391 has four normally closed (NC) switches; the ISL8392 has four normally open (NO) switches; the ISL8393 has two NO and two NC switches and can be used as a dual SPDT, or a dual 2:1 multiplexer. Table 1 summarizes the performance of this family. For higher performance, pin compatible versions, see the ISL43143-5 data sheet. TABLE 1. FEATURES AT A GLANCE Number of Switches Configuration ±5V RON ±5V tON/tOFF 5V RON 5V tON/tOFF 3V RON 3V tON/tOFF Packages ISL8391 ISL8392 ISL8393 4 4 4 All NC All NO 2 NC/2 NO 20Ω 20Ω 20Ω 60ns/30ns 60ns/30ns 60ns/30ns 30Ω 30Ω 30Ω 85ns/25ns 85ns/25ns 85ns/25ns 83Ω 83Ω 83Ω 140ns/55ns 140ns/55ns 140ns/55ns 16 Ld SOIC (N) FN6039.1 • Four Separately Controlled SPST Switches • Pin Compatible with DG411, DG412, DG413 • ON Resistance (RON) . . . . . . . . . . . . 20Ω(Typ) 35Ω(Max) • RON Matching Between Channels. . . . . . . . . . . . . . . . . . <1Ω • Low Power Consumption (PD) . . . . . . . . . . . . . . . . . . . .<1µW • Low Leakage Current (Max at 85oC) . . . . . . . . . . . . 2.5nA • Fast Switching Action - tON . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60ns - tOFF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30ns • Minimum 2000V ESD Protection per Method 3015.7 • TTL, CMOS Compatible Applications • Battery Powered, Handheld, and Portable Equipment - Barcode Scanners - Laptops, Notebooks, Palmtops • Communications Systems - Radios - Base Stations - RF “Tee” Switches • Test Equipment - Ultrasound - CAT/PET SCAN - Electrocardiograph • Audio and Video Switching • General Purpose Circuits - +3V/+5V DACs and ADCs - Digital Filters - Operational Amplifier Gain Switching Networks - High Frequency Analog Switching - High Speed Multiplexing Related Literature • Technical Brief TB363 “Guidelines for Handling and Processing Moisture Sensitive Surface Mount Devices (SMDs)” • Application Note AN557 “Recommended Test Procedures for Analog Switches” 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright © Intersil Americas Inc. 2003. All Rights Reserved All other trademarks mentioned are the property of their respective owners. ISL8391, ISL8392, ISL8393 Pinouts (Note 1) ISL8391 (SOIC) TOP VIEW ISL8392 (SOIC) TOP VIEW 12 N.C. NC4 6 11 NC3 12 N.C. NO4 6 11 NO3 10 COM3 9 IN3 IN4 8 9 IN3 IN4 8 GND 5 COM4 7 10 COM3 COM4 7 13 V+ V- 4 13 V+ V- 4 GND 5 14 NO2 NO1 3 14 NC2 NC1 3 15 COM2 COM1 2 15 COM2 COM1 2 16 IN2 IN1 1 16 IN2 IN1 1 ISL8393 (SOIC) TOP VIEW IN1 1 COM1 2 NO1 3 V- 4 16 IN2 15 COM2 14 NC2 13 V+ GND 5 12 N.C. NO4 6 11 NC3 COM4 7 IN4 8 10 COM3 9 IN3 NOTE: 1. Switches Shown for Logic “0” Input. Truth Table ISL8391 LOGIC Ordering Information ISL8392 ISL8393 SW 1, 2, 3, 4 SW 1, 2, 3, 4 SW 1, 4 SW 2, 3 0 On Off Off On 1 Off On On Off NOTE: Logic “0” ≤ 0.8V. Logic “1” ≥ 2.4V. FUNCTION V+ Positive Power Supply Input V- Negative Power Supply Input. Connect to GND for Single Supply Configurations. GND Ground Connection IN Digital Control Input COM TEMP. RANGE (oC) PACKAGE ISL8391IB -40 to 85 16 Ld SOIC (N) M16.15 ISL8392IB -40 to 85 16 Ld SOIC (N) M16.15 ISL8393IB -40 to 85 16 Ld SOIC (N) M16.15 PKG. DWG. # NOTES: Pin Descriptions PIN PART NO. (BRAND) (NOTE 2) Analog Switch Common Pin NO Analog Switch Normally Open Pin NC Analog Switch Normally Closed Pin N.C. No Internal Connection 2 2. Most surface mount devices are available on tape and reel; add “-T” to suffix. ISL8391, ISL8392, ISL8393 Absolute Maximum Ratings Thermal Information V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to15V V+ to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to15V V- to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -15 to 0.3V All Other Pins (Note 3) . . . . . . . . . . . . . ((V-) - 0.3V) to ((V+) + 0.3V) Continuous Current (Any Terminal) . . . . . . . . . . . . . . . . . . . . . 30mA Peak Current, IN, NO, NC, or COM (Pulsed 1ms, 10% Duty Cycle, Max) . . . . . . . . . . . . . . . . . 100mA ESD Rating (Per MIL-STD-883 Method 3015). . . . . . . . . . . . . .>2kV Thermal Resistance (Typical, Note 4) θJA (oC/W) 16 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . 115 Maximum Junction Temperature (Plastic Package) . . . . . . . 150oC Moisture Sensitivity (See Technical Brief TB363) All Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Level 1 Maximum Storage Temperature Range. . . . . . . . . . . . -65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300oC (Lead Tips Only) Operating Conditions Temperature Range ISL839XIX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTES: 3. Signals on NC, NO, COM, or IN exceeding V+ or V- are clamped by internal diodes. Limit forward diode current to maximum current ratings. 4. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. Electrical Specifications: ±5V Supply Test Conditions: VSUPPLY = ±4.5V to ±5.5V, GND = 0V, VINH = 2.4V, VINL = 0.8V (Note 5), Unless Otherwise Specified TEMP (oC) (NOTE 6) MIN TYP Full V- - V+ V 25 - 20 35 Ω Full - - 45 Ω 25 - 0.3 2 Ω Full - - 4 Ω 25 - - 4 Ω Full - - 6 Ω 25 -0.1 - 0.1 nA Full -2.5 - 2.5 nA 25 -0.1 - 0.1 nA Full -2.5 - 2.5 nA 25 -0.2 - 0.2 nA Full -5 - 5 nA Input Voltage High, VINH Full 2.4 - - V Input Voltage Low, VINL Full - - 0.8 V VS = ±5.5V, VIN = 0V or V+ Full -0.5 - 0.5 µA VS = ±4.5V, VNO or VNC = ±3V, RL = 300Ω, CL = 35pF, VIN = 0 to 3V, (See Figure 1) 25 - 60 130 ns Full - - 175 ns 25 - 30 75 ns Full - - 100 ns 25 5 10 - ns PARAMETER TEST CONDITIONS (NOTE 6) MAX UNITS ANALOG SWITCH CHARACTERISTICS Analog Signal Range, VANALOG VS = ±4.5V, ICOM = 10mA, VNO or VNC = ±3.5V, (See Figure 5) ON Resistance, RON RON Matching Between Channels, ∆RON VS = ±5V, ICOM = 10mA, VNO or VNC = ±3V RON Flatness, RFLAT(ON) VS = ±5V, ICOM = 10mA, VNO or VNC = ±3V, 0V, (Note 8) NO or NC OFF Leakage Current, INO(OFF) or INC(OFF) VS = ±5.5V, VCOM = ±4.5V, VNO or VNC = +4.5V, (Note 7) COM OFF Leakage Current, ICOM(OFF) VS = ±5.5V, VCOM = ±4.5V, VNO or VNC = +4.5V, (Note 7) COM ON Leakage Current, ICOM(ON) VS = ±5.5V, VCOM = VNO or VNC = ±4.5V, (Note 7) DIGITAL INPUT CHARACTERISTICS Input Current, IINH, IINL DYNAMIC CHARACTERISTICS Turn-ON Time, tON VS = ±4.5V, VNO or VNC = ±3V, RL = 300Ω, CL = 35pF, VIN = 0 to 3V, (See Figure 1) Turn-OFF Time, tOFF VS = ±5.5V, VNO or VNC = ±3V, RL = 300Ω, CL = 35pF, VIN = 0 to 3V, (See Figure 3) Break-Before-Make Time Delay (ISL8393), tD 3 ISL8391, ISL8392, ISL8393 Electrical Specifications: ±5V Supply PARAMETER Test Conditions: VSUPPLY = ±4.5V to ±5.5V, GND = 0V, VINH = 2.4V, VINL = 0.8V (Note 5), Unless Otherwise Specified (Continued) TEST CONDITIONS TEMP (oC) (NOTE 6) MIN TYP (NOTE 6) MAX UNITS Charge Injection, Q CL = 1.0nF, VG = 0V, RG = 0Ω, (See Figure 2) 25 - - 5 pC COM ON Capacitance, CCOM(ON) f = 1MHz, VNO or VNC = VCOM = 0V, (See Figure 7) 25 - 34 - pF OFF Isolation RL = 50Ω, CL = 15pF, f = 1MHz, VNO or VNC = 1VRMS, (See Figures 4 and 6) 25 - 71 - dB 25 - -89 - dB Full ±2 - ±6 V 25 -1 0.01 1 µA Full -1 - 1 µA 25 -1 0.01 1 µA Full -1 - 1 µA Crosstalk, (Note 9) POWER SUPPLY CHARACTERISTICS Power Supply Range VS = ±5.5V, VIN = 0V or V+, Switch On or Off Positive Supply Current, I+ Negative Supply Current, I- NOTES: 5. VIN = Input voltage to perform proper function. 6. The algebraic convention, whereby the most negative value is a minimum and the most positive a maximum, is used in this data sheet. 7. Leakage parameter is 100% tested at high temp, and guaranteed by correlation at 25oC. 8. Flatness is defined as the delta between the maximum and minimum RON values over the specified voltage range. Flatness specifications are guaranteed only with specified voltages. 9. Between any two switches. Electrical Specifications: 5V Supply PARAMETER Test Conditions: V+ = +4.5V to +5.5V, V- = GND = 0V, VINH = 2.4V, VINL = 0.8V (Note 5), Unless Otherwise Specified TEST CONDITIONS TEMP (oC) MIN (NOTE 6) TYP Full 0 - V+ V 25 - 30 60 Ω Full - - 75 Ω 25 - 0.8 2 Ω Full - - 4 Ω 25 - - 6 Ω Full - - 8 Ω 25 -0.1 - 0.1 nA Full -2.5 - 2.5 nA 25 -0.1 - 0.1 nA Full -2.5 - 2.5 nA 25 -0.2 - 0.2 nA Full -5.0 - 5.0 nA 25 - 85 170 ns Full - - 240 ns 25 - 25 50 ns Full - - 100 ns MAX (NOTE 6) UNITS ANALOG SWITCH CHARACTERISTICS Analog Signal Range, VANALOG ON Resistance, RON V+ = 4.5V, ICOM = 1.0mA, VNO or VNC = 3.5V, (See Figure 5) RON Matching Between Channels, ∆RON V+ = 5V, ICOM = 1.0mA, VNO or VNC = 3V RON Flatness, RFLAT(ON) V+ = 5V, ICOM = 1.0mA, VNO or VNC = 1V, 3V, (Note 8) NO or NC OFF Leakage Current, INO(OFF) or INC(OFF) V+ = 5.5V, VCOM = 1V, 4.5V, VNO or VNC = 4.5V, 1V, (Note 7) COM OFF Leakage Current, ICOM(OFF) V+ = 5.5V, VCOM = 1V, 4.5V, VNO or VNC = 4.5V, 1V, (Note 7) COM ON Leakage Current, ICOM(ON) V+ = 5.5V, VCOM = 1V, 4.5V, (Note 7) DYNAMIC CHARACTERISTICS Turn-ON Time, tON V+ = 5V, VNO or VNC = 3V, RL = 300Ω, CL = 35pF, VIN = 0 to 3V, (See Figure 1) V+ = 5V, VNO or VNC = 3V, RL = 300Ω, CL = 35pF, VIN = 0 to 3V, (See Figure 1) Turn-OFF Time, tOFF 4 ISL8391, ISL8392, ISL8393 Electrical Specifications: 5V Supply PARAMETER Test Conditions: V+ = +4.5V to +5.5V, V- = GND = 0V, VINH = 2.4V, VINL = 0.8V (Note 5), Unless Otherwise Specified (Continued) TEST CONDITIONS TEMP (oC) MIN (NOTE 6) TYP MAX (NOTE 6) UNITS Break-Before-Make Time Delay (ISL8393), tD V+ = 5.5V, VNO or VNC = 3V, RL = 300Ω, CL = 35pF, VIN = 0 to 3V, (See Figure 3) 25 10 - - ns Charge Injection, Q CL = 1.0nF, VG = 0V, RG = 0Ω, (See Figure 2) 25 - 1 5 pC 25 -1 0.01 1 µA Full -1 - 1 µA 25 -1 0.01 1 µA Full -1 - 1 µA POWER SUPPLY CHARACTERISTICS Positive Supply Current, I+ V+ = 5.5V, VIN = 0V or V+, Switch On or Off Negative Supply Current, I- Electrical Specifications - 3.3V Supply PARAMETER Test Conditions: V+ = +3.0V to +3.6V, V- = GND = 0V, VINH = 2.4V, VINL = 0.8V (Note 5), Unless Otherwise Specified TEST CONDITIONS TEMP (oC) MIN (NOTE 6) TYP MAX (NOTE 6) UNITS Full 0 - V+ V 25 - 83 175 Ω Full - - 275 Ω 25 - 140 400 ns Full - - 500 ns 25 - 55 125 ns Full - - 175 ns ANALOG SWITCH CHARACTERISTICS Analog Signal Range, VANALOG ON Resistance, RON V+ = 3V, ICOM = 1.0mA, VNO or VNC = 1.5V, (See Figure 5) DYNAMIC CHARACTERISTICS Turn-ON Time, tON V+ = 3.3V, VNO or VNC = 1.5V, RL = 300Ω, CL = 35pF, VIN = 0 to V+, (See Figure 1) V+ = 3.3V, VNO or VNC = 1.5V, RL = 300Ω, CL = 35pF, VIN = 0 to V+, (See Figure 1) Turn-OFF Time, tOFF Break-Before-Make Time Delay (ISL8393), tD V+ = 3.6V, VNO or VNC = 1.5V, RL = 300Ω, CL = 35pF, VIN = 0 to 3V, (See Figure 3) 25 20 - - ns Charge Injection, Q CL = 1.0nF, VG = 0V, RG = 0Ω, (See Figure 2) 25 - 1 5 pC 25 -1 0.01 1 µA Full -1 - 1 µA 25 -1 0.01 1 µA Full -1 - 1 µA POWER SUPPLY CHARACTERISTICS Positive Supply Current, I+ V+ = 3.6V, VIN = 0V or V+, Switch On or Off Negative Supply Current, I- 5 ISL8391, ISL8392, ISL8393 Test Circuits and Waveforms 3V LOGIC INPUT V+ tr < 20ns tf < 20ns 50% 0V C tOFF COM VOUT IN 90% SWITCH OUTPUT VOUT NO or NC VNX SWITCH VNX INPUT C SWITCH INPUT 90% RL 300Ω GND LOGIC INPUT 0V tON C V- Logic input waveform is inverted for switches that have the opposite logic sense. CL 35pF Repeat test for all switches. CL includes fixture and stray capacitance. RL V OUT = V (NO or NC) -----------------------------R L + R ( ON ) FIGURE 1B. TEST CIRCUIT FIGURE 1A. MEASUREMENT POINTS FIGURE 1. SWITCHING TIMES V+ SWITCH OUTPUT VOUT ∆VOUT RG C VOUT COM NO COM NC 3V LOGIC INPUT ON ON OFF 0V VG Q = ∆VOUT x CL C V- Logic input waveform is inverted for switches that have the opposite logic sense. FIGURE 2A. MEASUREMENT POINTS IN CL LOGIC INPUT Repeat test for all switches. CL includes fixture and stray capacitance. NOTE: When testing the NC pin of a device use the NC as VOUT. When testing the NO pin of a device use the COM as VOUT. FIGURE 2B. TEST CIRCUIT FIGURE 2. CHARGE INJECTION 6 GND ISL8391, ISL8392, ISL8393 Test Circuits and Waveforms (Continued) V+ C 3V LOGIC INPUT C 0V VOUT1 NO1 VNX COM1 VOUT2 RL1 300Ω NC2 90% 90% SWITCH OUTPUT VOUT1 COM2 IN1 0V RL2 300Ω IN2 90% SWITCH OUTPUT VOUT2 CL1 35pF 0V CL2 35pF 90% LOGIC INPUT GND tD tD C V- CL includes fixture and stray capacitance. Reconfigure accordingly to test SW3 and SW4. FIGURE 3A. MEASUREMENT POINTS FIGURE 3B. TEST CIRCUIT FIGURE 3. BREAK-BEFORE-MAKE TIME (ISL8393 ONLY) V+ V+ C C RON = V1/1mA SIGNAL GENERATOR NO OR NC NO OR NC VNX IN 0V OR 2.4V 1mA COM ANALYZER 0.8V OR 2.4V IN V1 COM GND GND RL C C V- V- Repeat test for all switches. Repeat test for all switches. FIGURE 4. OFF ISOLATION TEST CIRCUIT 7 FIGURE 5. RON TEST CIRCUIT ISL8391, ISL8392, ISL8393 Test Circuits and Waveforms (Continued) V+ V+ C SIGNAL GENERATOR NO1 OR NC1 NO OR NC 50Ω COM1 IN IN1 0V OR 2.4V IN2 0V OR 2.4V 0V OR 2.4V IMPEDANCE ANALYZER COM COM2 ANALYZER NO CONNECTION NO2 OR NC2 GND GND RL VC V- FIGURE 6. CROSSTALK TEST CIRCUIT Detailed Description The ISL8391–ISL8393 quad analog switches offer precise switching capability from a bipolar ±2V to ±6V or a single 2V to 12V supply with low on-resistance (20Ω) and high speed switching (tON = 60ns, tOFF = 30ns). The devices are especially well suited to portable battery powered equipment thanks to the low operating supply voltage (2V), low power consumption (1µW), low leakage currents (2.5nA max). High frequency applications also benefit from the wide bandwidth, and the very high OFF isolation and crosstalk rejection. FIGURE 7. CAPACITANCE TEST CIRCUIT unaffected by this approach, but the switch resistance may increase, especially at low supply voltages. OPTIONAL PROTECTION DIODE V+ OPTIONAL PROTECTION RESISTOR INX VNO OR NC VCOM Supply Sequencing And Overvoltage Protection As with any CMOS device, proper power supply sequencing is required to protect the device from excessive input currents which might permanently damage the IC. All I/O pins contain ESD protection diodes from the pin to V+ and to V- (see Figure 8). To prevent forward biasing these diodes, V+ and V- must be applied before any input signals, and input signal voltages must remain between V+ and V-. If these conditions cannot be guaranteed, then one of the following two protection methods should be employed. Logic inputs can easily be protected by adding a 1kΩ resistor in series with the input (see Figure 8). The resistor limits the input current below the threshold that produces permanent damage, and the sub-microamp input current produces an insignificant voltage drop during normal operation. Adding a series resistor to the switch input defeats the purpose of using a low RON switch, so two small signal diodes can be added in series with the supply pins to provide overvoltage protection for all pins (see Figure 8). These additional diodes limit the analog signal from 1V below V+ to 1V above V-. The low leakage current performance is 8 VOPTIONAL PROTECTION DIODE FIGURE 8. OVERVOLTAGE PROTECTION Power-Supply Considerations The ISL839X construction is typical of most CMOS analog switches, in that they have three supply pins: V+, V-, and GND. V+ and V- drive the internal CMOS switches and set their analog voltage limits, so there are no connections between the analog signal path and GND. Unlike switches with a 13V maximum supply voltage, the ISL839X 15V maximum supply voltage provides plenty of room for the 10% tolerance of 12V supplies (±6V or 12V single supply), as well as room for overshoot and noise spikes. This family of switches performs equally well when operated with bipolar or single voltage supplies, and bipolar supplies need not be symmetrical. The minimum recommended supply voltage is 2V or ±2V. It is important to note that the input signal range, switching times, and ON-resistance degrade at lower supply voltages. Refer to the electrical ISL8391, ISL8392, ISL8393 specification tables and Typical Performance Curves for details. V+ and GND power the internal logic (thus setting the digital switching point) and level shifters. The level shifters convert the logic levels to switched V+ and V- signals to drive the analog switch gate terminals, so switch parameters especially RON - are strong functions of both supplies. Logic-Level Thresholds V+ and GND power the internal logic stages, so V- has no affect on logic thresholds. This switch family is TTL compatible (0.8V and 2.4V) over a V+ supply range of 2.5V to 10V. At 12V the VIH level is about 2.7V, so for best results use a logic family that provides a VOH greater than 3V. The digital input stages draw supply current whenever the digital input voltage is not at one of the supply rails. Driving the digital input signals from GND to V+ with a fast transition time minimizes power dissipation. High-Frequency Performance In 50Ω systems, signal response is reasonably flat even past 200MHz (see Figure 15), with a small signal -3dB bandwidth in excess of 300MHz, and a large signal bandwidth exceeding 300MHz. An off switch acts like a capacitor and passes higher frequencies with less attenuation, resulting in signal feedthrough from a switch’s input to its output. OFF Isolation is the resistance to this feedthrough, while Crosstalk indicates the amount of feedthrough from one switch to another. Figure 16 details the high OFF Isolation and Crosstalk rejection provided by this family. At 10MHz, OFF isolation is about 50dB in 50Ω systems, decreasing approximately 20dB per decade as frequency increases. Higher load impedances decrease OFF Isolation and Crosstalk rejection due to the voltage divider action of the switch OFF impedance and the load impedance. Leakage Considerations Reverse ESD protection diodes are internally connected between each analog-signal pin and both V+ and V-. One of these diodes conducts if any analog signal exceeds V+ or V-. Virtually all the analog leakage current comes from the ESD diodes to V+ or V-. Although the ESD diodes on a given signal pin are identical and therefore fairly well balanced, they are reverse biased differently. Each is biased by either V+ or V- and the analog signal. This means their leakages will vary as the signal varies. The difference in the two diode leakages to the V+ and V- pins constitutes the analog-signalpath leakage current. All analog leakage current flows between each pin and one of the supply terminals, not to the other switch terminal. This is why both sides of a given switch can show leakage currents of the same or opposite polarity. There is no connection between the analog signal paths and GND. Typical Performance Curves TA = 25oC, Unless Otherwise Specified 25 20 15 60 85oC 50 25oC 40 -40oC 30 62.5 V- = 0V 50 85oC 25oC 37.5 25 -40oC 12.5 0 3 4 5 6 7 8 V+ (V) 9 10 11 FIGURE 9. ON RESISTANCE vs SUPPLY VOLTAGE 9 12 ICOM = 1mA 70 RON (Ω) RON (Ω) 10 80 VCOM = (V+) - 1V ICOM = 1mA V- = -5V 85oC 25oC -40oC V+ = 2.7V V- = 0V 20 60 50 85oC 40 25oC 30 V+ = 3.3V -40oC V- = 0V 20 35 30 25 20 15 V+ = 5V 85oC V- = 0V 25oC -40oC 0 1 2 3 VCOM (V) 4 FIGURE 10. ON RESISTANCE vs SWITCH VOLTAGE 5 ISL8391, ISL8392, ISL8393 Typical Performance Curves TA = 25oC, Unless Otherwise Specified (Continued) 45 ICOM = 1mA 40 35 25oC 30 25 10 -40oC 20 35 VS = ±3V 30 25 5 V+ = 3.3V 85oC 25oC 20 Q (pC) RON (Ω) 15 VS = ±2V 85oC -40oC 15 0 V+ = 5V 10 25 20 VS = ±5V 85oC 25oC VS = ±5V -5 15 -40oC 10 -10 5 -5 -4 -3 -2 -1 0 1 2 3 4 -5 5 -2.5 0 VCOM (V) VCOM (V) 5 FIGURE 11. ON RESISTANCE vs SWITCH VOLTAGE FIGURE 12. CHARGE INJECTION vs SWITCH VOLTAGE 250 125 -40oC 200 VCOM = (V+) - 1V V- = -5V 25oC 85oC -40oC V- = 0V 250 25oC 0 50 V- = 0V 10 0 3 25oC 20 -40oC 2 85oC 30 100 50 -40oC 40 85oC 150 85oC 25 0 300 200 25oC 50 tOFF (ns) 50 4 5 6 7 8 9 10 11 V+ (V) FIGURE 13. TURN - ON TIME vs SUPPLY VOLTAGE 10 12 VCOM = (V+) - 1V V- = -5V -40oC 75 25oC 100 25oC 100 150 tON (ns) 2.5 -40oC 2 3 4 5 6 7 8 9 10 11 V+ (V) FIGURE 14. TURN - OFF TIME vs SUPPLY VOLTAGE 12 ISL8391, ISL8392, ISL8393 -10 VS = ±5V VIN = 0.2VP-P 3 10 V+ = 3V to 12V or -20 VS = ±2V to ±5V RL = 50Ω -30 GAIN 0 20 30 VIN = 0.2VP-P PHASE VIN = 5VP-P 0 45 90 135 180 RL = 50Ω 1 10 100 FREQUENCY (MHz) FIGURE 15. FREQUENCY RESPONSE Die Characteristics SUBSTRATE POTENTIAL (POWERED UP): VTRANSISTOR COUNT: ISL8391: 209 ISL8392: 209 ISL8393: 209 PROCESS: Si Gate CMOS 11 600 CROSSTALK (dB) -3 -40 40 -50 50 -60 60 ISOLATION -70 70 -80 80 CROSSTALK -90 90 -100 100 -110 1k 10k 100k 1M 10M 110 100M 500M FREQUENCY (Hz) FIGURE 16. CROSSTALK AND OFF ISOLATION OFF ISOLATION (dB) VIN = 5VP-P PHASE (DEGREES) NORMALIZED GAIN (dB) Typical Performance Curves TA = 25oC, Unless Otherwise Specified (Continued) ISL8391, ISL8392, ISL8393 Small Outline Plastic Packages (SOIC) M16.15 (JEDEC MS-012-AC ISSUE C) 16 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE N INCHES INDEX AREA H 0.25(0.010) M B M SYMBOL E -B- 1 2 3 L SEATING PLANE -A- h x 45o A D -C- e B 0.25(0.010) M C 0.10(0.004) C A M B S MILLIMETERS MAX MIN MAX NOTES A 0.053 0.069 1.35 1.75 - A1 0.004 0.010 0.10 0.25 - B 0.014 0.019 0.35 0.49 9 C 0.007 0.010 0.19 0.25 - D 0.386 0.394 9.80 10.00 3 E 0.150 0.157 3.80 4.00 4 e µα A1 MIN 0.050 BSC 1.27 BSC - H 0.228 0.244 5.80 6.20 - h 0.010 0.020 0.25 0.50 5 L 0.016 0.050 0.40 1.27 6 8o 0o N α 16 0o 16 7 8o Rev. 1 02/02 NOTES: 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch) 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 12