INTERSIL ISL43640IU-T

ISL43640
®
Data Sheet
July 2003
FN6043.1
Low-Voltage, Single Supply, 4 to 1
Multiplexer, High Performance Analog
Switch
Features
The Intersil ISL43640 is a precision, bidirectional, analog
switch configured as a 4 channel multiplexer/demultiplexer.
The ISL43640 is designed to operate from a single +2V to
+12V supply. It is equiped with an inhibit pin to simultaneously
open all signal paths.
• ON Resistance (RON) Max, VS = 5V . . . . . . . . . . . . 120Ω
• Fully Specified at 3V, 5V, and 12V Supplies for 10%
Tolerances
ON resistance is 115Ω with a +5V supply, 45Ω with a +12V
supply, and 190Ω with a +3V supply. Each switch can handle
rail to rail analog signals. The off-leakage current is only 1nA
at 25oC or 2.5nA at 85oC. All digital inputs have 0.8V to 2.4V logic
thresholds ensuring TTL/CMOS logic compatibility when using a
single +5V supply. Some of the smallest packages are
available, alleviating board space limitations, and making
Intersil’s newest line of low-voltage switches an ideal solution.
45Ω
60ns/30ns
3V RON
190Ω
3V tON/tOFF
120ns/45ns
10 Ld MSOP, 16 Ld QFN 3x3
Packages
Related Literature
• Technical Brief TB363 “Guidelines for Handling and
Processing Moisture Sensitive Surface Mount Devices
(SMDs)”
• Application Note AN557 “Recommended Test Procedures
for Analog Switches”
• Application Note AN520 “CMOS Analog Multiplexers and
Switches; Specifications and Application Considerations.
• Application Note AN1034 “Analog Switch and Multiplexer
Applications”
1
• Guaranteed Break-Before-Make
• Communications Systems
- Radios
- Telecom Infrastructure
- ADSL, VDSL Modems
115Ω
4.5V tON/tOFF
• Low Off Leakage Current . . . . . . . . . . . . . . . . . . . . . 2.5nA
• Fast Switching Action (VS = 5V)
- tON . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60ns
- tOFF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30ns
• Battery Powered, Handheld, and Portable Equipment
25ns/24ns
4.5V RON
• Low Power Consumption (PD) . . . . . . . . . . . . . . . . . . . .<3µW
Applications
4:1 MUX
12V tON/tOFF
• Single Supply Operation. . . . . . . . . . . . . . . . . . . +2V to +12V
• Available in 10 Ld MSOP and 16 Ld QFN Packages
TABLE 1. FEATURES AT A GLANCE
12V RON
• Low Charge Injection . . . . . . . . . . . . . . . . . . . . . . 3pC (Max)
• TTL, CMOS Compatible
Table 1 summarizes the performance of this switch.
CONFIGURATION
• RON Matching Between Channels. . . . . . . . . . . . . . . . . . <2Ω
• Test Equipment
- Medical Ultrasound
- Electrocardiograph
- Magnetic Resonance Image
- CT and PET Scanners (MRI)
- ATE
• Audio and Video Switching
• Various Circuits
- +3V/+5V DACs and ADCs
- Sample and Hold Circuits
- Operational Amplifier Gain Switching Networks
- High Frequency Analog Switching
- High Speed Multiplexing
- Integrator Reset Circuits
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright © Intersil Americas Inc. 2003. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
ISL43640
(Note 1)
ADD1
13
12 ADD2
7 ADD1
N.C.
2
11 N.C.
6 ADD2
N.C.
3
10 N.C.
NO2
4
9
LOGIC
Truth Table
5
6
7
8
GND
1
INH
N.C.
NO1
8 NO0
1. Switches Shown for Logic “0” Inputs.
N.C.
Ordering Information
ISL43640
INH
ADD2
ADD1
SWITCH ON
1
X
X
NONE
0
0
0
NO0
0
0
1
NO1
0
1
0
NO2
0
1
1
NO3
Logic “0” ≤0.8V. Logic “1” ≥2.4V, with VS between 3.3V and
Pin Descriptions
PIN
FUNCTION
System Power Supply Input (+2V to +12V)
GND
Ground Connection
INH
Digital Control Input. Connect to GND for Normal
Operation. Connect to V+ to turn all switches off.
NO
14
NO1 3
NOTE:
COM
15
9 COM
GND 5
V+
16
NO3 2
INH 4
NOTE:
11V.
NO0
10 V+
NO2 1
COM
ISL43640 (QFN)
TOP VIEW
V+
ISL43640 (MSOP)
TOP VIEW
NO3
Pinouts
Analog Switch Common Pin
Analog Switch Normally Open Pin
ADD
Address Input Pin
N.C.
No Internal Connection
2
PART NO.
(BRAND)
TEMP.
RANGE (oC)
PACKAGE
PKG. DWG. #
ISL43640IU
(640I)
-40 to 85
10 Ld MSOP
M10.118
ISL43640IU-T
(640I)
-40 to 85
10 Ld MSOP
Tape and Reel
M10.118
ISL43640IR
(640I)
-40 to 85
16 Ld QFN
L16.3X3
ISL43640IR-T
(640I)
-40 to 85
16 Ld QFN
Tape and Reel
L16.3X3
ISL43640
Absolute Maximum Ratings
Thermal Information
V+ to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to15V
Input Voltages
INH, NO, NC, ADD (Note 2) . . . . . . . . . . . . . -0.3 to ((V+) + 0.3V)
Output Voltages
COM (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to ((V+) + 0.3V)
Continuous Current (Any Terminal) . . . . . . . . . . . . . . . . . . . . . 30mA
Peak Current NO, NC, or COM
(Pulsed 1ms, 10% Duty Cycle, Max) . . . . . . . . . . . . . . . . . . 40mA
Thermal Resistance (Typical)
θJA (oC/W)
10 Ld MSOP Package (Note 3) . . . . . . . . . . . . . . . .
190
16 Ld QFN Package (Note 4). . . . . . . . . . . . . . . . . .
62
Maximum Junction Temperature (Plastic Package) . . . . . . . 150oC
Moisture Sensitivity (See Technical Brief TB363)
All Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Level 1
Maximum Storage Temperature Range. . . . . . . . . . . . -65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300oC
(MSOP - Lead Tips Only)
Operating Conditions
Temperature Range
ISL43640IX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
2. Signals on NC, NO, COM, ADD, or INH exceeding V+ or GND are clamped by internal diodes. Limit forward diode current to maximum current
ratings.
3. θJA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
4. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
Tech Brief TB379.
Electrical Specifications +5V Supply
PARAMETER
Test Conditions: V+ = +4.5V to +5.5V, GND = 0V, VINH = 2.4V, VINL = 0.8V (Note 5),
Unless Otherwise Specified
TEST CONDITIONS
TEMP
(oC)
(NOTE 6)
MIN
Full
0
-
V+
V
25
-
115
118
Ω
TYP
(NOTE 6)
MAX
UNITS
ANALOG SWITCH CHARACTERISTICS
Analog Signal Range, VANALOG
ON Resistance, RON
V+ = 4.5V, ICOM = 1.0mA, VNO or VNC = 3.5V,
(See Figure 5)
Full
-
-
150
Ω
RON Matching Between Channels,
∆RON
V+ = 4.5V, ICOM = 1.0mA, VNO or VNC = 3.5V, (Note 8)
25
-
1
3
Ω
Full
-
-
5
Ω
RON Flatness, RFLAT(ON)
V+ = 5.5V, ICOM = 1.0mA, VNO or VNC = 1.5V, 2.5V,
3.5V, (Note 9)
Ω
25
-
12
13
Full
-
13
18
Ω
25
-1
-
1
nA
Full
-2.5
-
2.5
nA
25
-1
-
1
nA
Full
-2.5
-
2.5
nA
25
-1
-
1
nA
Full
-5
-
5
nA
Input Voltage High, VINH
Full
2.4
1.4
-
V
Input Voltage Low, VINL
Full
-
1.3
0.8
V
V+ = 5.5V, VIN = 0V or V+
Full
-0.5
-
0.5
µA
V+ = 4.5V, VNO or VNC = 3V, RL =300Ω, CL = 35pF,
VIN = 0 to 3, (See Figure 1)
25
-
60
65
ns
Full
-
-
80
ns
25
-
30
35
ns
NO or NC OFF Leakage Current,
INO(OFF) or INC(OFF)
V+ = 5.5V, VCOM = 1V, 4.5V, VNO or VNC = 4.5V, 1V,
(Note 7)
COM OFF Leakage Current,
ICOM(OFF)
V+ = 5.5V, VCOM = 4.5V, 1V, VNO or VNC = 1V, 4.5V,
(Note 7)
COM ON Leakage Current,
ICOM(ON)
V+ = 5.5V, VCOM = 1V, 4.5V, or VNO or VNC = 1V,
4.5V, or Floating, (Note 7)
DIGITAL INPUT CHARACTERISTICS
Input Current, IINH, IINL
DYNAMIC CHARACTERISTICS
Inhibit Turn-ON Time, tON
Inhibit Turn-OFF Time, tOFF
V+ = 4.5V, VNO or VNC = 3V, RL =300Ω, CL = 35pF,
VIN = 0 to 3, (See Figure 1)
Address Transition Time, tTRANS
V+ = 4.5V, VNO or VNC = 3V, RL =300Ω, CL = 35pF,
VIN = 0 to 3, (See Figure 1)
Break-Before-Make Time Delay, tD
3
V+ = 5.5V, RL = 300Ω, CL = 35pF, VNO = VNC = 3V,
VIN = 0 to 3, (See Figure 3)
Full
-
-
40
ns
25
-
61
70
ns
Full
-
-
85
ns
Full
5
16
-
ns
ISL43640
Electrical Specifications +5V Supply
PARAMETER
Test Conditions: V+ = +4.5V to +5.5V, GND = 0V, VINH = 2.4V, VINL = 0.8V (Note 5),
Unless Otherwise Specified (Continued)
TEST CONDITIONS
TEMP
(oC)
(NOTE 6)
MIN
TYP
(NOTE 6)
MAX
UNITS
Charge Injection, Q
CL = 1.0nF, VG = 0V, RG = 0Ω, (See Figure 2)
25
-
0.3
1
pC
OFF Isolation
RL = 50Ω, CL = 5pF, f = 1MHz, (See Figure 4)
25
-
75
-
dB
NO or NC OFF Capacitance, COFF f = 1MHz, VNO or VNC = VCOM = 0V, (See Figure 6)
25
-
4
-
pF
COM OFF Capacitance,
CCOM(OFF)
f = 1MHz, VNO or VNC = VCOM = 0V, (See Figure 6)
25
-
11
-
pF
COM ON Capacitance, CCOM(ON)
f = 1MHz, VNO or VNC = VCOM = 0V, (See Figure 6)
25
-
20
-
pF
Full
2
12
V
Full
-1
1
µA
POWER SUPPLY CHARACTERISTICS
Power Supply Range
Positive Supply Current, I+
V+ = 5.5V, VIN = 0V or V+, all channels on or off
0.0001
NOTES:
5. VIN = input voltage to perform proper function.
6. The algebraic convention, whereby the most negative value is a minimum and the most positive a maximum, is used in this data sheet.
7. Leakage parameter is 100% tested at high temp, and guaranteed by correlation at 25oC.
8. ∆RON = RON (MAX) - RON (MIN).
9. Flatness is defined as the difference between the maximum and minimum value of on-resistance over the specified analog signal range.
Electrical Specifications +3V Supply
PARAMETER
Test Conditions: V+ = +2.7V to +3.6V, GND = 0V, VAH = 2.4V, VAL= 0.8V (Note 5),
Unless Otherwise Specified
TEST CONDITIONS
TEMP
(oC)
(NOTE 6)
MIN
Full
0
-
V+
V
25
-
190
220
Ω
TYP
(NOTE 6)
MAX
UNITS
ANALOG SWITCH CHARACTERISTICS
Analog Signal Range, VANALOG
ON Resistance, RON
V+ = 3.0V, ICOM = 1.0mA, VNO or VNC = 1.5V,
(See Figure 5)
Full
-
-
250
Ω
RON Matching Between Channels,
∆RON
V+ = 3.0V, ICOM = 1.0mA, VNO or VNC = 1.5V, (Note 8)
25
-
1
3
Ω
Full
-
-
5
Ω
RON Flatness, RFLAT(ON)
V+ = 3.0V, ICOM = 1.0mA, VNO or VNC = 0.5V, 1.5V,
(Note 9)
Ω
25
-
48
90
Full
-
-
90
Ω
25
-1
-
1
nA
Full
-2.5
-
2.5
nA
25
-1
-
1
nA
Full
-2.5
-
2.5
nA
25
-1
-
1
nA
Full
-5
-
5
nA
Input Voltage High, VINH
Full
2.0
1.0
-
V
Input Voltage Low, VINL
Full
-
0.8
0.5
V
V+ = 3.6V, VIN = 0V or V+
Full
-0.5
-
0.5
µA
V+ = 2.7V, VNO or VNC = 1.5V, RL =300Ω, CL = 35pF,
VIN = 0 to 3, (See Figure 1)
25
-
144
155
ns
Full
-
-
175
ns
25
-
53
60
ns
NO or NC OFF Leakage Current,
INO(OFF) or INC(OFF)
V+ = 3.6V, VCOM = 1V, 3V, VNO or VNC = 3V, 1V,
(Note 7)
COM OFF Leakage Current,
ICOM(OFF)
V+ = 3.6V, VCOM = 3V, 1V, VNO or VNC = 1V, 3V,
(Note 7)
COM ON Leakage Current,
ICOM(ON)
V+ = 3.6V, VCOM = 1V, 3V, or VNO or VNC = 1V, 3V,
or floating, (Note 7)
DIGITAL INPUT CHARACTERISTICS
Input Current, IINH, IINL
DYNAMIC CHARACTERISTICS
Inhibit Turn-ON Time, tON
Inhibit Turn-OFF Time, tOFF
V+ = 2.7V, VNO or VNC = 1.5V, RL =300Ω, CL = 35pF,
VIN = 0 to 3, (See Figure 1)
Address Transition Time, tTRANS
V+ = 2.7V, VNO or VNC = 1.5V, RL =300Ω, CL = 35pF,
VIN = 0 to 3, (See Figure 1)
Break-Before-Make Time Delay, tD
4
V+ = 3.6V, RL = 300Ω, CL = 35pF, VNO or VNC = 1.5V,
VIN = 0 to 3, (See Figure 3)
Full
-
-
65
ns
25
-
145
160
ns
Full
-
-
190
ns
Full
15
35
-
ns
ISL43640
Electrical Specifications +3V Supply
PARAMETER
Test Conditions: V+ = +2.7V to +3.6V, GND = 0V, VAH = 2.4V, VAL= 0.8V (Note 5),
Unless Otherwise Specified (Continued)
TEST CONDITIONS
TEMP
(oC)
(NOTE 6)
MIN
TYP
(NOTE 6)
MAX
UNITS
Charge Injection, Q
CL = 1.0nF, VG = 0V, RG = 0Ω, (See Figure 2)
25
-
0.5
1
pC
OFF Isolation
RL = 50Ω, CL = 5pF, f = 1MHz, (See Figure 4)
25
-
75
-
dB
NO or NC OFF Capacitance, COFF f = 1MHz, VNO or VNC = VCOM = 0V, (See Figure 6)
25
-
4
-
pF
COM OFF Capacitance,
CCOM(OFF)
f = 1MHz, VNO or VNC = VCOM = 0V, (See Figure 6)
25
-
11
-
pF
COM ON Capacitance, CCOM(ON)
f = 1MHz, VNO or VNC = VCOM = 0V, (See Figure 6)
25
-
20
-
pF
Full
-1
0.0001
1
µA
POWER SUPPLY CHARACTERISTICS
Positive Supply Current, I+
V+ = 3.6V, VIN = 0V or V+, all channels on or off
Electrical Specifications + 12V Supply
PARAMETER
Test Conditions: V+ = +10.8V to +13.2V, GND = 0V, VINH = 4V, VINL = 0.8V (Note 5),
Unless Otherwise Specified
TEST CONDITIONS
TEMP
(oC)
(NOTE 6)
MIN
Full
TYP
(NOTE 6)
MAX
UNITS
ANALOG SWITCH CHARACTERISTICS
Analog Signal Range, VANALOG
0
-
V+
V
ON Resistance, RON
V+ = 12.0V, ICOM = 1.0mA, VNO or VNC = 9V,
(See Figure 5)
25
-
45
50
Ω
Full
-
-
70
Ω
RON Matching Between Channels,
∆RON
V+ = 12.0V, ICOM = 1.0mA, VNO or VNC = 9V, (Note 8)
25
-
0.5
3
Ω
Full
-
-
5
Ω
RON Flatness, RFLAT(ON)
V+ = 13.2V, ICOM = 1.0mA, VNO or VNC = 3V, 6V, 9V,
(Note 9)
Ω
25
-
5
6
Full
-
-
10
Ω
25
-1
-
1
nA
Full
-2.5
-
2.5
nA
25
-1
-
1
nA
Full
-2.5
-
2.5
nA
25
-1
-
1
nA
Full
-5
-
5
nA
Input Voltage High, VINH
Full
2.9
2.5
-
V
Input Voltage Low, VINL
Full
-
2.3
0.8
V
V+ = 13V, VIN = 0V or V+
Full
-0.5
-
0.5
µA
V+ = 10.8V, VNO or VNC = 10V, RL =300Ω, CL = 35pF,
VIN = 0 to 4, (See Figure 1)
25
-
25
30
ns
Full
-
25
-
NO or NC OFF Leakage Current,
INO(OFF) or INC(OFF)
V+ = 13.0V, VCOM = 1V, 12V, VNO or VNC = 12V, 1V,
(Note 7)
COM OFF Leakage Current,
ICOM(OFF)
V+ = 13.0V, VCOM = 12V, 1V, VNO or VNC = 1V, 12V,
(Note 7)
COM ON Leakage Current,
ICOM(ON)
V+ = 13.0V, VCOM = 1V, 12V, or VNO or VNC = 1V,
12V, or floating, (Note 7)
DIGITAL INPUT CHARACTERISTICS
Input Current, IINH, IINL
DYNAMIC CHARACTERISTICS
Inhibit Turn-ON Time, tON
Inhibit Turn-OFF Time, tOFF
V+ = 10.8V, VNO or VNC = 10V, RL =300Ω, CL = 35pF,
VIN = 0 to 4, (See Figure 1)
Address Transition Time, tTRANS
V+ = 10.8V, VNO or VNC = 10V, RL =300Ω, CL = 35pF,
VIN = 0 to 4, (See Figure 1)
Break-Before-Make Time Delay, tD
V+ = 13.2V, RL = 300Ω, CL = 35pF, VNO or VNC = 10V,
VIN = 0 to 4, (See Figure 3)
35
ns
24
28
ns
30
ns
35
50
ns
55
ns
Full
-
25
-
Full
-
Full
3
9
ns
Charge Injection, Q
CL = 1.0nF, VG = 0V, RG = 0Ω, (See Figure 2)
25
-
1.2
3
pC
OFF Isolation
RL = 50Ω, CL = 5pF, f = 1MHz, (See Figure 4)
25
-
75
-
dB
NO or NC OFF Capacitance, COFF f = 1MHz, VNO or VNC = VCOM = 0V, (See Figure 6)
25
-
4
-
pF
COM OFF Capacitance,
CCOM(OFF)
f = 1MHz, VNO or VNC = VCOM = 0V, (See Figure 6)
25
-
11
-
pF
COM ON Capacitance, CCOM(ON)
f = 1MHz, VNO or VNC = VCOM = 0V, (See Figure 6)
25
-
20
-
pF
Full
-1
0.0001
1
µA
POWER SUPPLY CHARACTERISTICS
Positive Supply Current, I+
V+ = 13.0V, VIN = 0V or V+, all channels on or off
5
ISL43640
Test Circuits and Waveforms
3V
LOGIC
INPUT
50%
V+
C
tr < 20ns
tf < 20ns
C
0V
V+
tON
NO0
NO1-NO3
90%
SWITCH
OUTPUT
VOUT
INH
90%
VOUT
COM
ADD1,
GND ADD2
0V
CL
35pF
RL
300Ω
LOGIC
INPUT
tOFF
Logic input waveform is inverted for switches that have the opposite
logic sense.
Repeat test for other switches. CL includes fixture and stray
capacitance.
RL
-----------------------------V OUT = V
(NO or NC) R + R
L
( ON )
FIGURE 1B. TEST CIRCUIT
FIGURE 1A. MEASUREMENT POINTS
LOGIC
INPUT
50%
V+
C
tr < 20ns
tf < 20ns
3V
C
0V
V+
tTRANS
NO0
NO1-NO3
90%
SWITCH
OUTPUT
VOUT
ADD1
ADD2
90%
COM
GND
INH
CL
35pF
RL
300Ω
LOGIC
INPUT
0V
VOUT
tTRANS
Logic input waveform is inverted for switches that have the opposite
logic sense.
Repeat test for other switches. CL includes fixture and stray
capacitance.
RL
-----------------------------V OUT = V
(NO or NC) R + R
L
( ON )
FIGURE 1D. ADDRESS TEST CIRCUIT
FIGURE 1C. ADDRESS MEASUREMENT POINTS
FIGURE 1. SWITCHING TIMES
V+
C
3V
LOGIC
INPUT
OFF
OFF
ON
SWITCH
OUTPUT
VOUT
∆VOUT
VOUT
RG
0V
VG
NO or NC
COM
ADD1
ADD2
INH
GND
CL
LOGIC
INPUT
Q = ∆VOUT x CL
FIGURE 2B. TEST CIRCUIT
FIGURE 2A. MEASUREMENT POINTS
FIGURE 2. CHARGE INJECTION
6
ISL43640
Test Circuits and Waveforms (Continued)
V+
tr < 20ns
tf < 20ns
3V
C
C
LOGIC
INPUT
VOUT
0V
NO0-NO3
V+
COM
RL
300Ω
ADD1
ADD2
80%
SWITCH
OUTPUT
VOUT
LOGIC
INPUT
GND
0V
INH
tD
Repeat test for other switches. CL includes fixture and stray
capacitance.
FIGURE 3A. MEASUREMENT POINTS
FIGURE 3B. TEST CIRCUIT
FIGURE 3. BREAK-BEFORE-MAKE TIME
V+
V+
C
C
SIGNAL
GENERATOR
RON = V1/1mA
NO or NC
NO or NC
VNX
0V or V+
1mA
ADDX
0V or V+
V1
ADDX
0V or V+
ANALYZER
COM
GND
INH
COM
RL
FIGURE 4. OFF ISOLATION TEST CIRCUIT
INH
FIGURE 5. RON TEST CIRCUIT
V+
C
NO or NC
0V or V+
ADDX
IMPEDANCE
ANALYZER
COM
GND
INH
FIGURE 6. CAPACITANCE TEST CIRCUIT
7
GND
CL
35pF
ISL43640
Detailed Description
Power-Supply Considerations
The ISL43640 operates from a single 2V to 12V supply with
low on-resistance (115Ω) and high speed operation
(tON = 60ns, tOFF = 30ns) with a +5V supply. The ISL43640
is especially well suited to portable battery powered
equipment thanks to the low operating supply voltage (2.0V),
low power consumption (3µW), low leakage currents (5nA
max), and the tiny MSOP and QFN packaging. High frequency
applications also benefit from the wide bandwidth, and the
very high off isolation (75dB).
The ISL43640 construction is typical of most CMOS analog
switches, except that they have only two supply pins: V+ and
GND. V+ and GND drive the internal CMOS switches and
set their analog voltage limits. Unlike switches with a 13V
maximum supply voltage, the ISL43640’s 15V maximum
supply voltage provides plenty of room for the 10% tolerance
of 12V supplies, as well as room for overshoot and noise
spikes.
Supply Sequencing And Overvoltage Protection
With any CMOS device, proper power supply sequencing is
required to protect the device from excessive input currents
which might permanently damage the IC. All I/O pins contain
ESD protection diodes from the pin to V+ and GND (see
Figure 7). To prevent forward biasing these diodes, V+ must
be applied before any input signals, and input signal
voltages must remain between V+ and GND. If these
conditions cannot be guaranteed, then one of the following
two protection methods should be employed.
Logic inputs can easily be protected by adding a 1kΩ
resistor in series with the input (see Figure 7). The resistor
limits the input current below the threshold that produces
permanent damage, and the sub-microamp input current
produces an insignificant voltage drop during normal
operation.
This method is not applicable for the signal path inputs.
Adding a series resistor to the switch input defeats the
purpose of using a low RON switch, so two small signal
diodes can be added in series with the supply pins to provide
overvoltage protection for all pins (see Figure 7). These
additional diodes limit the analog signal from 1V below V+ to
1V above GND. The low leakage current performance is
unaffected by this approach, but the switch resistance may
increase, especially at low supply voltages.
OPTIONAL
PROTECTION
RESISTOR
FOR LOGIC
INPUTS
1kΩ
1kΩ
OPTIONAL PROTECTION
DIODE
ADDX
V+
The minimum recommended supply voltage is 2.0V. It is
important to note that the input signal range, switching times,
and on-resistance degrade at lower supply voltages. Refer
to the electrical specification tables and Typical Performance
curves for details.
V+ and GND also power the internal logic and level shifters.
The level shifters convert the input logic levels to switched
V+ and GND signals to drive the analog switch gate
terminals.
The device cannot be operated with bipolar supplies,
because the input switching point becomes negative in this
configuration.
Logic-Level Thresholds
The ISL43640 is TTL compatible (0.8V and 2.4V) over a
supply range of 3V to 11V (see Figure 10). At 12V the VIH
level is about 2.5V. This is still below the TTL guaranteed
high output minimum level of 2.8V, but noise margin is
reduced. For best results with a 12V supply, use a logic
family the provides a VOH greater than 3V.
The digital input stages draw supply current whenever the
digital input voltage is not at one of the supply rails (see
Figure 11). Driving the digital input signals from GND to V+
with a fast transition time minimizes power dissipation.The
ISL43640 has been designed to minimize the supply current
whenever the digital input voltage is not driven to the supply
rails (0V to V+). For example driving the device with 3V logic
(0V to 3V) while operating with a 5V supply the device draws
only 10µA of current (see Figure 11 for VIN = 3V). Similiar
devices of competitors can draw 8 times this amount of
current.
High-Frequency Performance
IN
VNO or NC
VCOM
GND
OPTIONAL PROTECTION
DIODE
FIGURE 7. OVERVOLTAGE PROTECTION
8
In 50Ω systems, signal response is reasonably flat even past
100MHz (see Figure 16). Figure 16 also illustrates that the
frequency response is very consistent over a wide V+ range,
and for varying analog signal levels.
An OFF switch acts like a capacitor and passes higher
frequencies with less attenuation, resulting in signal feed
through from a switch’s input to its output. Off Isolation is the
resistance to this feed through. Figure 17 details the high Off
Isolation rejection provided by this family. At 10MHz, Off
Isolation is about 55dB in 50Ω systems, decreasing
approximately 20dB per decade as frequency increases.
Higher load impedances decrease Off Isolation due to the
ISL43640
voltage divider action of the switch OFF impedance and the
load impedance.
Leakage Considerations
Reverse ESD protection diodes are internally connected
between each analog-signal pin and both V+ and GND. One of
these diodes conducts if any analog signal exceeds V+ or
GND.
Virtually all the analog leakage current comes from the ESD
diodes to V+ or GND. Although the ESD diodes on a given
signal pin are identical and therefore fairly well balanced,
they are reverse biased differently. Each is biased by either
V+ or GND and the analog signal. This means their leakages
will vary as the signal varies. The difference in the two diode
leakages to the V+ and GND pins constitutes the analogsignal-path leakage current. All analog leakage current flows
between each pin and one of the supply terminals, not to the
other switch terminal. This is why both sides of a given
switch can show leakage currents of the same or opposite
polarity. There is no connection between the analog signal
paths and V+ or GND.
Typical Performance Curves TA = 25oC, Unless Otherwise Specified
500
225
VCOM = (V+) - 1V
V+ = 3.3V
200
ICOM = 1mA
85oC
175
400
ICOM = 1mA
25oC
150
-40oC
100
300
RON (Ω)
RON (Ω)
125
85oC
200
0
3
4
5
6
7
8
V+ (V)
9
10
11
12
13
-40oC
25oC
V+ = 12V
4
2
6
VCOM (V)
8
10
3.0
70
-40oC
V+ = +5V
2.5
60
2.0
25oC
85oC
1.5
50
1.0
40
0.5
ICC (µA)
VINH AND VINL (V)
12
FIGURE 9. ON RESISTANCE vs SWITCH VOLTAGE
FIGURE 8. ON RESISTANCE vs SUPPLY VOLTAGE
VINH
V+ = 5V
25oC
60
80
70 85oC
60
50
40 -40oC
30
0
-40oC
2
85oC
120
100
80
25oC
100
75
140
3.0
VINL
-40oC
2.5
30
20
2.0
25oC
1.5
10
1.0
85oC
0
0.5
2
3
4
5
6
7
8
V+ (V)
9
10
11
12
13
FIGURE 10. DIGITAL SWITCHING POINT vs SUPPLY VOLTAGE
9
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
VIN(ADD) (V)
FIGURE 11. SUPPLY CURRENT vs DIGITAL ADDRESS INPUT
VOLTAGE
ISL43640
Typical Performance Curves TA = 25oC, Unless Otherwise Specified (Continued)
120
350
VCOM = (V+) - 1V
VCOM = (V+) - 1V
110
300
100
90
250
tOFF (ns)
tON (ns)
80
200
85oC
150
70
60
85oC
50
25oC
100
-40oC
50
25oC
40
30
-40oC
20
10
0
2
3
4
5
6
7
V+ (V)
8
9
10
11
12
2
FIGURE 12. TURN - ON TIME vs SUPPLY VOLTAGE
3
4
5
6
7
V+ (V)
8
9
10
11
12
FIGURE 13. TURN - OFF TIME vs SUPPLY VOLTAGE
3
350
VCOM = (V+) - 1V
2
300
V+ = 12V
1
V+ = 5V
250
0
V+ = 3.3V
Q (pC)
tTRANS (ns)
200
85oC
150
-1
-2
25oC
100
-3
-40oC
50
-4
0
-5
2
3
4
5
6
7
8
9
10
11
0
12
2
4
6
V+ (V)
FIGURE 14. ADDRESS TRANS TIME vs SUPPLY VOLTAGE
10
12
FIGURE 15. CHARGE INJECTION vs SWITCH VOLTAGE
10
VIN = 0.2VP-P (V+ = 3V)
+3
V+ = 3V to 12V
20
VIN = 2.5VP-P (V+ = 3V)
30
GAIN
VIN = 0.2VP-P (V+ = 13V)
-3
VIN = 5VP-P (V+ = 13V)
0
PHASE
45
90
135
180
RL = 50Ω
1
10
100
FREQUENCY (MHz)
FIGURE 16. FREQUENCY RESPONSE
10
600
OFF ISOLATION (dB)
0
PHASE (DEGREES)
NORMALIZED GAIN (dB)
8
VCOM (V)
40
50
60
ISOLATION
70
80
90
100
110
1k
10k
100k
1M
10M
FREQUENCY (Hz)
FIGURE 17. OFF ISOLATION
100M 500M
ISL43640
Die Characteristics
SUBSTRATE POTENTIAL (POWERED UP):
GND
TRANSISTOR COUNT:
193
PROCESS:
Si Gate CMOS
11
ISL43640
Mini Small Outline Plastic Packages (MSOP)
N
M10.118 (JEDEC MO-187BA)
10 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE
E1
INCHES
E
-B-
INDEX
AREA
1 2
0.20 (0.008)
A B C
TOP VIEW
4X θ
0.25
(0.010)
R1
R
GAUGE
PLANE
SEATING
PLANE -CA
4X θ
A2
A1
b
-H-
0.10 (0.004)
L
SEATING
PLANE
C
0.20 (0.008)
C
C
a
SIDE VIEW
CL
E1
0.20 (0.008)
C D
-B-
END VIEW
NOTES:
1. These package dimensions are within allowable dimensions of
JEDEC MO-187BA.
2. Dimensioning and tolerancing per ANSI Y14.5M-1994.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs and are measured at Datum Plane. Mold flash, protrusion
and gate burrs shall not exceed 0.15mm (0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions
and are measured at Datum Plane. - H - Interlead flash and
protrusions shall not exceed 0.15mm (0.006 inch) per side.
5. Formed leads shall be planar with respect to one another within
0.10mm (.004) at seating Plane.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08mm (0.003 inch) total in excess
of “b” dimension at maximum material condition. Minimum space
between protrusion and adjacent lead is 0.07mm (0.0027 inch).
and - B -
MAX
MIN
MAX
NOTES
0.037
0.043
0.94
1.10
-
A1
0.002
0.006
0.05
0.15
-
A2
0.030
0.037
0.75
0.95
-
b
0.007
0.011
0.18
0.27
9
c
0.004
0.008
0.09
0.20
-
D
0.116
0.120
2.95
3.05
3
E1
0.116
0.120
2.95
3.05
4
0.020 BSC
to be determined at Datum plane
11. Controlling dimension: MILLIMETER. Converted inch dimensions are for reference only
12
0.50 BSC
-
E
0.187
0.199
4.75
5.05
-
L
0.016
0.028
0.40
0.70
6
0.037 REF
N
-A-
10. Datums -A -H- .
MIN
A
L1
e
D
SYMBOL
e
L1
MILLIMETERS
0.95 REF
10
R
0.003
R1
-
10
-
0.07
0.003
-
θ
5o
15o
α
0o
6o
7
-
-
0.07
-
-
5o
15o
-
0o
6o
Rev. 0 12/02
ISL43640
Quad Flat No-Lead Plastic Package (QFN)
L16.3x3
16 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
(COMPLIANT TO JEDEC MO-220VEED-2 ISSUE C)
MILLIMETERS
SYMBOL
MIN
NOMINAL
MAX
NOTES
A
0.80
0.90
1.00
-
A1
-
-
0.05
-
A2
-
-
1.00
A3
b
0.18
D
0.23
9
0.30
5, 8
3.00 BSC
D1
D2
9
0.20 REF
-
2.75 BSC
1.35
1.50
9
1.65
7, 8
E
3.00 BSC
-
E1
2.75 BSC
9
E2
1.35
e
1.50
1.65
7, 8
0.50 BSC
-
k
0.25
-
-
-
L
0.30
0.40
0.50
8
L1
-
-
0.15
10
N
16
2
Nd
4
3
Ne
4
3
P
-
-
0.60
9
θ
-
-
12
9
Rev. 0 10/02
NOTES:
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
2. N is the number of terminals.
3. Nd and Ne refer to the number of terminals on each D and E.
4. All dimensions are in millimeters. Angles are in degrees.
5. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
7. Dimensions D2 and E2 are for the exposed pads which provide
improved electrical and thermal performance.
8. Nominal dimensions are provided to assist with PCB Land Pattern
Design efforts, see Intersil Technical Brief TB389.
9. Features and dimensions A2, A3, D1, E1, P & θ are present when
Anvil singulation method is used and not present for saw
singulation.
10. Depending on the method of lead termination at the edge of the
package, a maximum 0.15mm pull back (L1) maybe present. L
minus L1 to be equal to or greater than 0.3mm.
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
13