Data Sheet

PMEG3002AEL
30 V, 0.2 A very low VF MEGA Schottky barrier rectifier in
leadless ultra small SOD882 package
Rev. 02 — 15 January 2010
Product data sheet
1. Product profile
1.1 General description
Planar Maximum Efficiency General Application (MEGA) Schottky barrier diode with an
integrated guard ring for stress protection encapsulated in a SOD882 leadless ultra small
plastic package.
1.2 Features
„
„
„
„
„
Forward current: 0.2 A
Reverse voltage: 30 V
Very low forward voltage
Leadless ultra small plastic package
Power dissipation comparable to SOT23
1.3 Applications
„
„
„
„
„
„
Ultra high-speed switching
Voltage clamping
Protection circuits
Low voltage rectification
High efficiency DC-to-DC conversion
Low power consumption applications
1.4 Quick reference data
Table 1.
Quick reference data
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
IF
forward current
-
-
0.2
A
VR
reverse voltage
-
-
30
V
PMEG3002AEL
NXP Semiconductors
0.2 A very low VF MEGA Schottky barrier rectifier
2. Pinning information
Table 2.
Discrete pinning
Pin
Description
1
cathode
2
anode
Simplified outline
Symbol
[1]
1
1
2
2
sym001
Bottom view
Top view
001aaa332
[1]
The marking bar indicates the cathode.
3. Ordering information
Table 3.
Ordering information
Type number
PMEG3002AEL
Package
Name
Description
Version
-
leadless ultra small plastic package; 2 terminals;
body 1.0 × 0.6 × 0.5 mm
SOD882
4. Marking
Table 4.
Marking
Type number
Marking code
PMEG3002AEL
F3
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Max
Unit
VR
continuous reverse voltage
-
30
V
IF
continuous forward current
-
0.2
A
IFRM
repetitive peak forward current tp ≤ 1 ms; δ ≤ 0.25
-
1
A
IFSM
non-repetitive peak forward
current
-
3
A
Tj
junction temperature
[1]
-
150
°C
Tamb
operating ambient temperature
[1]
−65
+150
°C
Tstg
storage temperature
−65
+150
°C
tp = 8 ms square
wave
PMEG3002AEL_2
Product data sheet
Min
© NXP B.V. 2010. All rights reserved.
Rev. 02 — 15 January 2010
2 of 8
PMEG3002AEL
NXP Semiconductors
0.2 A very low VF MEGA Schottky barrier rectifier
[1]
For Schottky barrier diodes thermal run-away has to be considered, as in some applications the reverse
power losses PR are a significant part of the total power losses. Nomograms for determining the reverse
power losses PR and IF(AV) rating will be available on request.
6. Thermal characteristics
Table 6.
Thermal characteristics
Symbol
Parameter
Conditions
Rth(j-a)
thermal resistance from junction to
ambient
in free air
[1][2]
Typ
Unit
500
K/W
[1]
Refer to SOD882 standard mounting conditions (footprint), FR4 with 60 μm copper strip line.
[2]
For Schottky barrier diodes thermal run-away has to be considered, as in some applications the reverse
power losses PR are a significant part of the total power losses. Nomograms for determining the reverse
power losses PR and IF(AV) rating will be available on request.
7. Characteristics
Table 7.
Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol
Parameter
Conditions
VF
continuous forward
voltage
see Figure 1;
Min
Typ
Max
Unit
IF = 0.1 mA
-
125
190
mV
IF = 1 mA
-
185
250
mV
IF = 10 mA
-
250
300
mV
IF = 100 mA
-
350
400
mV
-
420
480
mV
VR = 10 V
-
2.5
10
μA
VR = 30 V
-
10
50
μA
-
17
25
pF
IF = 200 mA
IR
Cd
[1]
continuous reverse
current
diode capacitance
see Figure 2;
VR = 1 V; f = 1 MHz;
see Figure 3
Pulse test: tp ≤ 300 μs; δ ≤ 0.02.
PMEG3002AEL_2
Product data sheet
[1]
© NXP B.V. 2010. All rights reserved.
Rev. 02 — 15 January 2010
3 of 8
PMEG3002AEL
NXP Semiconductors
0.2 A very low VF MEGA Schottky barrier rectifier
001aaa351
103
001aaa352
102
IR
(mA)
IF
(mA)
10
(1)
102
(2)
(1)
(2)
(3)
(4)
1
(3)
10
10−1
1
10−2
(4)
10−3
10−1
0
0.1
0.2
0.3
0.4
0
0.5
10
VF (V)
30
VR (V)
(1) Tj = 150 °C
(1) Tj = 150 °C
(2) Tj = 125 °C
(2) Tj = 125 °C
(3) Tj = 85 °C
(3) Tj = 85 °C
(4) Tj = 25 °C
Fig 1.
20
(4) Tj = 25 °C
Forward current as a function of forward
voltage; typical values
Fig 2.
Reverse current as a function of reverse
voltage; typical values
001aaa353
40
Cd
(pF)
30
20
10
0
0
10
20
30
VR (V)
Tamb = 25 °C; f = 1 MHz
Fig 3.
Diode capacitance as a function of reverse voltage; typical values
PMEG3002AEL_2
Product data sheet
© NXP B.V. 2010. All rights reserved.
Rev. 02 — 15 January 2010
4 of 8
PMEG3002AEL
NXP Semiconductors
0.2 A very low VF MEGA Schottky barrier rectifier
8. Package outline
Leadless ultra small plastic package; 2 terminals; body 1.0 x 0.6 x 0.5 mm
L
SOD882
L
1
2
b
e1
A
A1
E
D
(2)
0
0.5
1 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A (1)
A1
max.
b
D
E
e1
L
mm
0.50
0.46
0.03
0.55
0.47
0.62
0.55
1.02
0.95
0.65
0.30
0.22
Notes
1. Including plating thickness
2. The marking bar indicates the cathode
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
JEITA
ISSUE DATE
03-04-16
03-04-17
SOD882
Fig 4.
EUROPEAN
PROJECTION
Package outline
PMEG3002AEL_2
Product data sheet
© NXP B.V. 2010. All rights reserved.
Rev. 02 — 15 January 2010
5 of 8
PMEG3002AEL
NXP Semiconductors
0.2 A very low VF MEGA Schottky barrier rectifier
9. Revision history
Table 8.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PMEG3002AEL_2
20100115
Product data sheet
-
PMEG3002AEL_1
Modifications:
PMEG3002AEL_1
•
This data sheet was changed to reflect the new company name NXP Semiconductors,
including new legal definitions and disclaimers. No changes were made to the technical
content.
20040224
Product data
PMEG3002AEL_2
Product data sheet
-
-
© NXP B.V. 2010. All rights reserved.
Rev. 02 — 15 January 2010
6 of 8
PMEG3002AEL
NXP Semiconductors
0.2 A very low VF MEGA Schottky barrier rectifier
10. Legal information
10.1 Data sheet status
Document status[1][2]
Product status[3]
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
Definition
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
10.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
10.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
10.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
11. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
PMEG3002AEL_2
Product data sheet
© NXP B.V. 2010. All rights reserved.
Rev. 02 — 15 January 2010
7 of 8
PMEG3002AEL
NXP Semiconductors
0.2 A very low VF MEGA Schottky barrier rectifier
12. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
9
10
10.1
10.2
10.3
10.4
11
12
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . .
General description . . . . . . . . . . . . . . . . . . . . .
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . .
Quick reference data . . . . . . . . . . . . . . . . . . . .
Pinning information . . . . . . . . . . . . . . . . . . . . . .
Ordering information . . . . . . . . . . . . . . . . . . . . .
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . .
Thermal characteristics . . . . . . . . . . . . . . . . . .
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . .
Package outline . . . . . . . . . . . . . . . . . . . . . . . . .
Revision history . . . . . . . . . . . . . . . . . . . . . . . . .
Legal information. . . . . . . . . . . . . . . . . . . . . . . .
Data sheet status . . . . . . . . . . . . . . . . . . . . . . .
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information. . . . . . . . . . . . . . . . . . . . . .
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1
1
1
1
1
2
2
2
2
3
3
5
6
7
7
7
7
7
7
8
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 15 January 2010
Document identifier: PMEG3002AEL_2