TVS Diode Arrays (SPA® DJPEFT) ESD and EMI Filter Devices - SP6002 Series SP6002 Series 15pF 15kV EMI Filter Array RoHS Pb GREEN The Littelfuse SP6002 SPA series integrates 4, 6 and 8 EMI filters (C-R-C) into a small, low-profile μDFN package with each filter providing greater than -30dB attenuation at 800MHz. Additionally, each I/O is capable of shunting ±15kV ESD strikes (IEC61000-4-2, contact discharge) away from sensitive electronic components. The performance of this small, slim design makes it extremely suitable for mobile handsets, PDAs and notebook computers. Features t&4%*&$ ±15kV contact, ±30kV air t&.*mMUFSJOHPG frequencies from 800MHz to 3GHz Pinout 1 4 GND μDFN-08 8 t4NBMMMPXQSPmMFç%'/ (JEDEC MO-229) package (TYP 0.5mm height) t(SFBUFSUIBOE# attenuation (TYP) at 800MHz 5 Applications SP6002-04UTG-1 1 6 t,FZQBEJOUFSGBDFGPS portable electronics t.PCJMFQIPOF 7 t-$%BOEDBNFSBEJTQMBZ interfaces for handsets t1PSUBCMFOBWJHBUJPO device GND μDFN-12 12 t4NBSUQIPOF SP6002-06UTG-1 1 t$POOFDUPSJOUFSGBDFTGPS portable electronics 8 GND μDFN-16 16 9 Application Example SP6002-08UTG-1 LCD Module Controller Input Functional Block Diagram 4 1 8 1 Cd Cd Cd Cd 2 7 2 Cd Cd Cd Cd 3 6 3 12 1 11 2 10 3 Cd Cd Cd Cd 5 9 4 5 GND 15 1 8 D1 D2 D3 D4 SP6002-04UTG (μDFN) 13 Cd Cd 8 5 7 6 Signal Ground 12 Cd Cd Cd Cd 6 16 14 4 Cd Cd Cd Cd 5 Cd Cd Cd Cd Cd Cd 4 SP6002-08UTG-1 SP6002-06UTG-1 Outside World SP6002-04UTG-1 11 Cd Cd Cd Cd 10 7 Cd Cd 8 9 Cd Cd ©2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com for current information. Revision: November 29, 2012 SP6002 Series SP6002 Description TVS Diode Arrays (SPA® DJPEFT) ESD and EMI Filter Devices - SP6002 Series Thermal Information Absolute Maximum Ratings Symbol TOP Parameter Operating Temperature Storage Temperature TSTOR Value Units -UP °C - to 150 Parameter Rating Storage Temperature Range °C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Units - to 150 °C Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 20-40s) 260 °C Electrical Characteristics (TOP=25ºC) Parameter Symbol Reverse Standoff Voltage VRWM Test Conditions Min Typ Max Units 5.0 V Breakdown Voltage VBR IR=1mA 7.0 Reverse Leakage Current I-&", VRWM=5V 0.1 1.0 μA RA IR=10mA 100 120 Ω CD VR=2.5V,f=1MHz CL VR=2.5V,f=1MHz 24 IEC61000-4-2 (Contact Discharge) ±15 kV IEC61000-4-2 (Air Discharge) ±30 kV Resistance Diode Capacitance Line Capacitance 1,2 1,2 ESD Withstand Voltage1 Cutoff Frequency3 VESD F-3dB 80 V 15 30 Above this frequency, appreciable attenutation occurs pF 36 pF 100 MHz Notes: 1 Parameter is guaranteed by design and/or device characterization. 2 3 Total line capacitance is two times the diode capacitance (CD). 50Ω source and 50Ω load termination Insertion Loss (S21) Analog Crosstalk (S41) 0 0 -5 -10 -20 -15 -40 Inseron Loss(dB) Inseron Loss(dB) -20 -25 -30 -35 -40 -60 -80 -45 -50 -100 -55 -120 -60 10 SP6002 Series 100 Frequency (MHz) 10 1000 Revision: November 29, 2012 100 Frequency (MHz) 1000 ©2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. TVS Diode Arrays (SPA® DJPEFT) ESD and EMI Filter Devices - SP6002 Series Soldering Parameters Line Capacitance vs. DC Bias 50 Capacitance (pF) 40 Pre Heat 30 20 10 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 DC Bias (V) Product Characteristics Pre-Plated Frame Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substitute Material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs TS(max) to TL - Ramp-up Rate 3°C/second max - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C tP TP Notes : Critical Zone TL to TP Ramp-up Temperature Lead Plating 150°C 3°C/second max 0 0.5 - Temperature Min (Ts(min)) Average ramp up rate (Liquidus) Temp (TL) to peak Reflow 0.0 Pb – Free assembly TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) 1. All dimensions are in millimeters tS 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 25 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. time to peak temperature 5. Package surface matte finish VDI 11-13. Time Part Numbering System SP 6002 – ** U T G -1 TVS Diode Arrays (SPA® %JPEFT) G= Green T= Tape & Reel Series Package Number of Channels 04 = 4 Channel μDFN-08 06 = 6 Channel μDFN-12 08 = 8 Channel μDFN-16 μDFN-08 (1.7x1.35mm) μDFN-12 (2.5x1.35mm) μDFN-16 (3.3x1.35mm) Ordering Information Part Number Package Size Marking Min. Order Qty. SP6002-04UTG-1 μDFN-08 1.7x1.35mm C12 3000 SP6002-06UTG-1 μDFN-12 2.5x1.35mm C126 3000 SP6002-08UTG-1 μDFN-16 3.3x1.35mm C128YYWW 3000 ©2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com for current information. Revision: November 29, 2012 SP6002 Series SP6002 Reflow Condition TVS Diode Arrays (SPA® DJPEFT) ESD and EMI Filter Devices - SP6002 Series Package Dimensions — μDFN-08 8 7 μDFN-08 8X D 0.10 M C A B 6 JEDEC MO-229 b Millimeters e 5 Pin 1 Locator 1 2 3 4 Pin 1 Marking E C0.2 Min Max Min Max A 0.45 0.55 0.018 0.022 A1 0.00 0.05 0.000 0.002 E2 r GND PA D A3 8 1 2 3 4 7 K 6 5 D2 Top View L Bottom View 0. 10 C 0. 08 C A1 A Side View Inches 0.152 REF 0.006 REF b 0.15 0.25 0.006 0.010 D 1.60 1.80 0.063 0.071 D2 1.10 1.30 0.043 0.051 E 1.25 1.45 0.049 0.057 E2 0.30 0.50 0.012 0.020 e 0.400 BSC K 0.20 L 0.15 0.016 BSC 0.008 0.35 0.006 0.014 A3 Package Dimensions — μDFN-12 12X 0.10 M C A B D 12 E 11 10 9 8 7 Pin 1 Locator e 1 12 2 3 4 2 3 C0.2 Pin 1 Marking 1 5 4 9 8 D2 Bottom View 0.10 C 0. 05 C SP6002 Series Side View A A3 Revision: November 29, 2012 JEDEC MO-229 Millimeters E2 6 GND PAD 10 11 5 7 L Inches Min Max A 0.45 0.55 0.018 0.022 A1 0.00 0.05 0.000 0.002 A3 6 Top View A1 μDFN-12 b 0.102 REF Min Max 0.004 REF b 0.15 0.25 0.006 0.010 D 2.40 2.60 0.095 0.103 D2 1.90 2.10 0.075 0.083 E 1.25 1.45 0.050 0.058 E2 0.30 0.50 0.012 0.020 e 0.400 BSC L 0.15 0.35 0.016 BSC 0.006 0.014 ©2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. TVS Diode Arrays (SPA® DJPEFT) ESD and EMI Filter Devices - SP6002 Series Package Dimensions — μDFN-16 μDFN-16 16 15 14 13 27Y 12 11 10 0.10 M C A B e 9 Pin 1 Locator E 1 2 16 2 3 4 5 3 4 6 7 15 5 7 6 14 12 13 8 11 10 D2 Top View Millimeters b E2 8 GND PA D C0.2 Pin 1 Marking 1 JEDEC MO-229 9 0. 10 C 0. 05 C Max Min Max A 0.45 0.55 0.018 0.022 A1 0.00 0.05 0.00 0.002 A3 L Bottom View 0.102 REF b 0.15 0.25 0.006 0.010 3.20 3.40 0.126 0.134 D2 2.70 2.90 0.106 0.114 E 1.25 1.45 0.049 0.057 E2 0.30 0.50 0.012 0.020 0.40 BSC L A3 0.04 REF D e A A1 Inches Min 0.15 0.35 0.016 BSC 0.006 0.014 Side View ø179.90 ø70.55 ø155.37 2.00±0.05 ø13.22 ø1.55± 0.01 0.00 4.00±0.10 W 3.50±0.10 8.00± 0.30 0.10 4.00±0.10 1.75±0.10 22.12 Embossed Carrier Tape & Reel Specification — μDFN-08 1.46 ø1.00± 0.25 0.00 K0 1.85±0.10 B0 1.11 24.32 ø58.11 ø15.57 A0 T=0.20±0.03 1.47±0.05 0.65±0.05 9.04 ©2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com for current information. Revision: November 29, 2012 SP6002 Series SP6002 D TVS Diode Arrays (SPA® DJPEFT) ESD and EMI Filter Devices - SP6002 Series 0.10 ø13.22 3.50±0.05 8.00±0.20 ø70.55 1.75±0.10 ø155.37 ø1.50± 2.00±0.05 4.00±0.10 4.00±0.10 ø179.90 22.12 Embossed Carrier Tape & Reel Specification — μDFN-12 ø1.00± 0.05 1.46 0.20±0.05 12º MAX 0.80±0.10 2.80±0.10 B0 ø58.11 ø15.57 K0 24.32 12º MAX A0 1.11 9.04 1.55±0.10 W ø179.90 ø70.55 K0 3.55±0.05 1.46 T=0.20±0.05 B0 1.11 9.04 ø58.11 ø15.57 24.32 0.70±0.05 ø1.00± 0.25 0.00 A0 ø155.37 ø1.50± 0.01 0.00 22.12 2.00±0.05 ø13.22 4.00±0.10 3.50±0.10 8.00± 0.30 0.10 4.00±0.10 1.75±0.10 Embossed Carrier Tape & Reel Specification — μDFN-16 SP6002 Series Revision: November 29, 2012 ©2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information.