TVS Diode Arrays (SPA™ Family of Products) General Purpose ESD Protection - SP1010 Series SP1010 Series 3.5pF 8kV Unidirectional TVS Array RoHS Pb GREEN Zener diodes fabricated in a proprietary silicon avalanche technology protect each I/O pin to provide a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (Level 4, ±8kV contact discharge) without performance degradation. Their very low loading capacitance also makes them ideal for protection highspeed signal pins. Pinout Features t&4%*&$L7 contact, ±15kV air I/O (1) I/O (4) GND GND t-JHIUOJOH*&$ 1A (tp=8/20μs) I/O (3) t-PXDBQBDJUBODFPGQ' (TYP) per I/O I/O (2) μDFN-6 (1.25x1.0x0.5mm) 5 t&'5QSPUFDUJPO IEC61000-4-4, 40A (5/50ns) t-PXMFBLBHFDVSSFOUPG 1μA (MAX) at 5V Applications Functional Block Diagram 6 t5JOZç%'/+&%&$.0 229) package (1.25mm x 1.0mm x 0.5mm) 4 t/PUFCPPL t1PSUBCMFNFEJDBMEFWJDF t/FUCPPL t.11.1 t6MUSBNPCJMF1$ t%JHJUBMDBNFSB t.PCJMFQIPOF t1PSUBCMFOBWJHBUJPO device 1 2 3 Application Example Keyboard Controller Input Outside World D1 D2 D3 D4 SP1010-04UTG Shield Ground Signal Ground Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. ©2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. 55 Revision: March 20, 2012 SP1010 Series SP1010 Description TVS Diode Arrays (SPA™ Family of Products) General Purpose ESD Protection - SP1010 Series Absolute Maximum Ratings Symbol Parameter Value Units 1.0 A Operating Temperature -40 to 85 °C Storage Temperature -60 to 150 °C IPP Peak Pulse Current (tp=8/20μs) TOP TSTOR CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Thermal Information Parameter Rating Units -65 to 150 °C Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 20-40s) 260 °C Storage Temperature Range Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions Min Typ Max Units VR IR = 1mA 7.0 7.8 8.5 V Reverse Standoff Voltage VRWM IR≤1μA 6 V Reverse Leakage Current ILEAK VR = 5V 1 μA ESD Withstand Voltage1 VESD Reverse Voltage Drop Diode Capacitance1 0.1 IEC61000-4-2 (Contact Discharge) ±8 kV IEC61000-4-2 (Air Discharge) ±15 kV CD Reverse Bias = 0V 6 Reverse Bias = 2.5V 3.5 7 pF pF Note: 1. Parameter is guaranteed by design and/or device characterization. Capacitance vs. Reverse Bias Insertion Loss (S21) I/O to GND 5 7.0 0 -5 5.0 Attenuation (dB) Capacitance (pF) 6.0 4.0 3.0 -10 -15 2.0 -20 1.0 -25 -30 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 10 5.0 SP1010 Series 100 1000 10000 Frequency (MHz) DC Bias (V) 56 Revision: March 20, 2012 ©2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. TVS Diode Arrays (SPA™ Family of Products) General Purpose ESD Protection - SP1010 Series Soldering Parameters - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) - Temperature (tL) tP TP Critical Zone TL to TP Ramp-up TL TS(max) tL SP1010 Pre Heat Pb – Free assembly Temperature Reflow Condition Ramp-do Ramp-down Preheat TS(min) tS 217°C 60 – 150 seconds 25 Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C time to peak temperature Time Package Dimensions — μDFN-6 (1.25x1.0x0.5mm) Bottom View Top View ℮ A D 0.05 C 6 5 4 4 5 6 0.05 C L μDFN-6 (1.25x1.0x0.5mm) JEDEC MO-229 Symbol Pin 1 chamfer 0.10 x 45’ E Pin 1 Index Area Package 1 2 3 3 2 1 B Millimeters Max A 0.45 0.55 0.018 0.022 A1 0.00 0.05 0.000 0.002 A3 Side View 0.05 C A3 A1 A Seating plane C b Inches Min Min 0.127 REF Max 0.005 REF b 0.15 0.25 0.006 0.010 D 1.20 1.30 0.047 0.051 D2 - - - - E 0.95 1.05 0.037 0.041 E2 - - - - 0.10 M C A B e 0.05 M C L 0.4 REF 0.25 0.016 REF 0.35 0.010 0.014 Recommanded Soldering Pad for μDFN-6L 1.25 x1.0x0.5 mm 1.1 0.4 0.3 1.1 0.4 0.1 0.3 Total:+/- 0.01mm ©2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. 57 Revision: March 20, 2012 SP1010 Series TVS Diode Arrays (SPA™ Family of Products) General Purpose ESD Protection - SP1010 Series Product Characteristics Part Numbering System SP 1010 – 04 U T G Silicon Protection Array (SPATM) Family of TVS Diode Arrays Lead Plating Pre-Plated Frame Lead Material Copper Alloy T= Tape & Reel Lead Coplanarity 0.0004 inches (0.102mm) Package U: μDFN-6 Substitute Material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 G= Green Series Number of Channels Notes : Part Marking System 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. H 4 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. Package surface matte finish VDI 11-13. Product Series H = SP1010 H4 Number of Channels Ordering Information Part Number Package Marking Min. Order Qty. SP1010-04UTG μDFN-6 (1.25x1.0x0.5mm) H4 3000 Symbol t W E P2 D Embossed Carrier Tape & Reel Specification — μDFN-6 (1.25x1.0x0.5mm) Min Max Min Max 1.65 1.85 0.06 0.07 F 3.45 3.55 0.14 0.14 D1 0.50 0.65 0.02 0.03 D F B0 10P0 P0 A0 Inches E P0 D1 Millimeters 1.50 MIN 3.90 4.10 40.0 +/- 0.20 0.06 MIN 0.15 0.16 1.57 +/- 0.01 W 7.90 8.30 0.31 0.33 P2 1.95 2.05 0.08 0.08 A0 1.09 1.19 0.04 0.05 B0 1.42 1.52 0.06 0.06 K0 0.71 0.81 0.03 0.03 0.25 TYP 0.01 TYP K0 t SP1010 Series 58 Revision: March 20, 2012 ©2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information.