LITTELFUSE SP3011

SPA™ Silicon Protection Array Products
Ultra-Low Capacitance Diode Array for USB 3.0 ESD Protection
HF
RoHS
Pb
GREEN
SP3011 Lead-Free/Green Series
Description
The SP3011 integrates six channels of ultra-low capacitance
rail-to-rail diodes and an additional zener diode to provide
protection for USB 3.0 ports that may experience
destructive electrostatic discharges (ESD). This high
density array can safely absorb repetitive ESD strikes at the
maximum level specified in the IEC61000-4-2 international
standard (Level 4, ±8kV contact discharge) without
performance degradation. It’s extremely low loading
capacitance makes it ideal for protecting any high-speed
signal pins.
Pinout
Features
t &4%*&$œL7
contact, ±15kV air
t -PXMFBLBHFDVSSFOUPG
ç"5:1
BU7
t &'5*&$"
(5/50ns)
t 4NBMMGPSNGBDUPSV%'/
package saves board
space
t -JHIUOJOH*&$
"çT
t -PXDBQBDJUBODFPGQ'
(TYP) per I/O
Functional Block Diagram
Pin 11
Pin 12
Pin 13
Pin 14
Applications
Pin 8
Pin 9
t/PUFCPPLT
t%FTLUPQT
t&YUFSOBM4UPSBHF
t6MUSBNPCJMF1$
t%JHJUBM$BNDPSEFS
t4NBSUQIPOF
t.11.11MBZFS
t4FU5PQ#PY%73173
GND
(Pin 10)
-JGF4VQQPSU/PUF
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
©2010 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
85
Revised: May 10, 2010
SP3011 Lead-Free/Green Series
Lead-Free/Green SP3011
*Pins 1, 2, 3, 4, 5, 6, 7 are not internally connected but should be connected to the
opposite pin with the PCB trace.
SPA™ Silicon Protection Array Products
Ultra-Low Capacitance Diode Array for USB 3.0 ESD Protection
Absolute Maximum Ratings
Symbol
Parameter
Value
Units
3.0
"
Operating Temperature
-40 to 85
°C
Storage Temperature
-60 to 150
°C
IPP
Peak Current (tpçT
TOP
T4503
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of
the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Electrical Characteristics (TOP=25ºC)
Symbol
Test Conditions
3FWFSTF4UBOEPGG7PMUBHF
Parameter
V38.
I3õ˜"
3FWFSTF-FBLBHF$VSSFOU
I-&",
V37"OZ*0UP(/%
0.1
IPP"Up˜T'XE
11.0
V
IPP"Up˜T'XE
12.5
V
(VC2-VC1) / (IPP2-IPP1)
1.5
Ω
Clamp Voltage1
VC
%ZOBNJD3FTJTUBODF
3%:/
&4%8JUITUBOE7PMUBHF1
VESD
1
Diode Capacitance
C*0(/%
Min
Typ
Max
Units
6.0
V
0.5
˜"
IEC61000-4-2 (Contact)
±8
kV
*&$"JS
±15
kV
3FWFSTF#JBT7
0.4
Q'
/PUFT1 Parameter is guaranteed by design and/or device characterization.
SP3011 Lead-Free/Green Series
86
Revised: May 10, 2010
©2010 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
SPA™ Silicon Protection Array Products
Ultra-Low Capacitance Diode Array for USB 3.0 ESD Protection
Capacitance vs. Bias Voltage
Insertion Loss (S21) I/O to GND
0.5
0
-5
Attenuation (dB)
Capacitance (pF)
0.4
0.3
0.2
0.1
-10
-15
-20
-25
0.0
0.0
-30
1.0
2.0
3.0
4.0
10
5.0
100
Bias Voltage (V)
1000
10000
Frequency (MHz)
Clamping Voltage vs. IPP
Pulse Waveform
16.0
110%
100%
14.0
90%
80%
70%
10.0
Clamp Voltage (VC)
12.0
8.0
6.0
60%
50%
40%
30%
4.0
20%
2.0
10%
1.0
1.5
2.0
2.5
0.0
3.0
Peak Pulse Current - IPP (A)
©2010 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
5.0
10.0
15.0
20.0
25.0
30.0
87
Revised: May 10, 2010
SP3011 Lead-Free/Green Series
Lead-Free/Green SP3011
0%
0.0
SPA™ Silicon Protection Array Products
Ultra-Low Capacitance Diode Array for USB 3.0 ESD Protection
Application Example
USB Port
USB Controller
VBUS
SSTX+
Outside
World
SSTX-
IC
SSRX+
SSRXGND
SP3011-06UTG
D+
D-
Signal GND
Soldering Parameters
Reflow Condition
- Temperature Min (Ts(min))
Pre Heat
1Co'SFFBTTFNCMZ
150°C
- Temperature Max (Ts(max))
200°C
- Time (min to max) (ts)
60 – 180 secs
Average ramp up rate (Liquidus) Temp
(TL) to peak
3°C/second max
TS(max) to TL - Ramp-up Rate
3°C/second max
Reflow
- Temperature (TL) (Liquidus)
217°C
- Temperature (tL)
60 – 150 seconds
Peak Temperature (TP)
250+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)
20 – 40 seconds
Ramp-down Rate
6°C/second max
Time 25°C to peak Temperature (TP)
NJOVUFT.BY
Do not exceed
260°C
SP3011 Lead-Free/Green Series
88
Revised: May 10, 2010
©2010 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
SPA™ Silicon Protection Array Products
Ultra-Low Capacitance Diode Array for USB 3.0 ESD Protection
Product Characteristics
Part Numbering System
SP 3011 – 06 U T G
Silicon
Protection
Array
G= Green
T= Tape & Reel
Series
Package
Number of
Channels
uDFN-14 (3.5x1.35mm)
-06 = 6 Channels
Lead Plating
1SF1MBUFE'SBNF
Lead Material
$PQQFS"MMPZ
Lead Coplanarity
0.0004 inches (0.102mm)
Subsitute Material
Silicon
Body Material
.PMEFE&QPYZ
Flammability
UL94-V-0
/PUFT
"MMEJNFOTJPOTBSFJONJMMJNFUFST
Part Marking System
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
"MMTQFDJmDBUJPOTDPNQMZUP+&%&$41&$.0*TTVF"
RH6
5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
6. Package surface matte finish VDI 11-13.
Number of
Product Series
Channels
R = SP3011
Assembly Site
Ordering Information
Package
Marking
Min. Order Qty.
V%'/
3)
3000
Lead-Free/Green SP3011
Part Number
4165(
©2010 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
89
Revised: May 10, 2010
SP3011 Lead-Free/Green Series
SPA™ Silicon Protection Array Products
Ultra-Low Capacitance Diode Array for USB 3.0 ESD Protection
Embossed Carrier Tape & Reel Specification – uDFN-14
P1
P0
Symbol
Millimeters
A0
1.58 +/- 0.10
B0
3.73 +/- 0.10
D0
P2
E
F
W
D1
D0
0.60 + 0.05
D1
Ø 0.60 + 0.05
E
1.75 +/- 0.10
F
5.50 +/- 0.05
K0
0.68 +/- 0.10
P0
2.00 +/- 0.05
P1
4.00 +/- 0.10
P2
4.00 +/- 0.10
T
0.28 +/- 0.02
W
12.00 + 0.30 /- 0.10
T
A0
K0
B0
Package Dimensions - uDFN-14 (3.5x1.35x0.5mm)
Top View
uDFN-14 (3.5x1.35x0.5mm)
A
D
Symbol
1 2 3 4
B
Nom
Max
Min
Nom
Max
A
0.45
0.50
0.55
0.018
0.020
0.022
A1
0.00
0.02
0.05
0.000
0.001
0.002
Seating
Plane
A1 A2
A
C
3FG
A2
Side View
3FG
b
0.15
0.20
0.25
0.006
0.008
0.012
D
3.40
3.50
3.60
0.134
0.138
0.142
D2
-
-
-
-
-
-
E
1.25
1.35
1.45
0.050
0.054
0.058
E1
-
-
-
-
-
-
e
b
Inches
Min
E
PIN 1 Index Area
Millimeters
L
0.500 BSC
0.25
0.30
0.020 BSC
0.35
0.010
0.012
0.014
Bottom View
Pin 1 Identification
Chamfer 0.10X45º
/PUFT
%JNFOTJPOBOEUPMFSBODJOHDPNGPSNUP"4.&:.
$POUSPMMJOHEJNFOTJPOT.JMMJNFUFS$POWFSUFE*ODIEJNFOTJPOTBSFOPUOFDFTTBSJMZ
exact.
SP3011 Lead-Free/Green Series
90
Revised: May 10, 2010
©2010 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.