SPA™ Silicon Protection Array Products Ultra-Low Capacitance Diode Array for USB 3.0 ESD Protection HF RoHS Pb GREEN SP3011 Lead-Free/Green Series Description The SP3011 integrates six channels of ultra-low capacitance rail-to-rail diodes and an additional zener diode to provide protection for USB 3.0 ports that may experience destructive electrostatic discharges (ESD). This high density array can safely absorb repetitive ESD strikes at the maximum level specified in the IEC61000-4-2 international standard (Level 4, ±8kV contact discharge) without performance degradation. It’s extremely low loading capacitance makes it ideal for protecting any high-speed signal pins. Pinout Features t &4%*&$L7 contact, ±15kV air t -PXMFBLBHFDVSSFOUPG ç"5:1 BU7 t &'5*&$" (5/50ns) t 4NBMMGPSNGBDUPSV%'/ package saves board space t -JHIUOJOH*&$ "çT t -PXDBQBDJUBODFPGQ' (TYP) per I/O Functional Block Diagram Pin 11 Pin 12 Pin 13 Pin 14 Applications Pin 8 Pin 9 t/PUFCPPLT t%FTLUPQT t&YUFSOBM4UPSBHF t6MUSBNPCJMF1$ t%JHJUBM$BNDPSEFS t4NBSUQIPOF t.11.11MBZFS t4FU5PQ#PY%73173 GND (Pin 10) -JGF4VQQPSU/PUF Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 85 Revised: May 10, 2010 SP3011 Lead-Free/Green Series Lead-Free/Green SP3011 *Pins 1, 2, 3, 4, 5, 6, 7 are not internally connected but should be connected to the opposite pin with the PCB trace. SPA™ Silicon Protection Array Products Ultra-Low Capacitance Diode Array for USB 3.0 ESD Protection Absolute Maximum Ratings Symbol Parameter Value Units 3.0 " Operating Temperature -40 to 85 °C Storage Temperature -60 to 150 °C IPP Peak Current (tpçT TOP T4503 CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP=25ºC) Symbol Test Conditions 3FWFSTF4UBOEPGG7PMUBHF Parameter V38. I3õ" 3FWFSTF-FBLBHF$VSSFOU I-&", V37"OZ*0UP(/% 0.1 IPP"UpT'XE 11.0 V IPP"UpT'XE 12.5 V (VC2-VC1) / (IPP2-IPP1) 1.5 Ω Clamp Voltage1 VC %ZOBNJD3FTJTUBODF 3%:/ &4%8JUITUBOE7PMUBHF1 VESD 1 Diode Capacitance C*0(/% Min Typ Max Units 6.0 V 0.5 " IEC61000-4-2 (Contact) ±8 kV *&$"JS ±15 kV 3FWFSTF#JBT7 0.4 Q' /PUFT1 Parameter is guaranteed by design and/or device characterization. SP3011 Lead-Free/Green Series 86 Revised: May 10, 2010 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products Ultra-Low Capacitance Diode Array for USB 3.0 ESD Protection Capacitance vs. Bias Voltage Insertion Loss (S21) I/O to GND 0.5 0 -5 Attenuation (dB) Capacitance (pF) 0.4 0.3 0.2 0.1 -10 -15 -20 -25 0.0 0.0 -30 1.0 2.0 3.0 4.0 10 5.0 100 Bias Voltage (V) 1000 10000 Frequency (MHz) Clamping Voltage vs. IPP Pulse Waveform 16.0 110% 100% 14.0 90% 80% 70% 10.0 Clamp Voltage (VC) 12.0 8.0 6.0 60% 50% 40% 30% 4.0 20% 2.0 10% 1.0 1.5 2.0 2.5 0.0 3.0 Peak Pulse Current - IPP (A) ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 5.0 10.0 15.0 20.0 25.0 30.0 87 Revised: May 10, 2010 SP3011 Lead-Free/Green Series Lead-Free/Green SP3011 0% 0.0 SPA™ Silicon Protection Array Products Ultra-Low Capacitance Diode Array for USB 3.0 ESD Protection Application Example USB Port USB Controller VBUS SSTX+ Outside World SSTX- IC SSRX+ SSRXGND SP3011-06UTG D+ D- Signal GND Soldering Parameters Reflow Condition - Temperature Min (Ts(min)) Pre Heat 1Co'SFFBTTFNCMZ 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 250+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) NJOVUFT.BY Do not exceed 260°C SP3011 Lead-Free/Green Series 88 Revised: May 10, 2010 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products Ultra-Low Capacitance Diode Array for USB 3.0 ESD Protection Product Characteristics Part Numbering System SP 3011 – 06 U T G Silicon Protection Array G= Green T= Tape & Reel Series Package Number of Channels uDFN-14 (3.5x1.35mm) -06 = 6 Channels Lead Plating 1SF1MBUFE'SBNF Lead Material $PQQFS"MMPZ Lead Coplanarity 0.0004 inches (0.102mm) Subsitute Material Silicon Body Material .PMEFE&QPYZ Flammability UL94-V-0 /PUFT "MMEJNFOTJPOTBSFJONJMMJNFUFST Part Marking System 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. "MMTQFDJmDBUJPOTDPNQMZUP+&%&$41&$.0*TTVF" RH6 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. Package surface matte finish VDI 11-13. Number of Product Series Channels R = SP3011 Assembly Site Ordering Information Package Marking Min. Order Qty. V%'/ 3) 3000 Lead-Free/Green SP3011 Part Number 4165( ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 89 Revised: May 10, 2010 SP3011 Lead-Free/Green Series SPA™ Silicon Protection Array Products Ultra-Low Capacitance Diode Array for USB 3.0 ESD Protection Embossed Carrier Tape & Reel Specification – uDFN-14 P1 P0 Symbol Millimeters A0 1.58 +/- 0.10 B0 3.73 +/- 0.10 D0 P2 E F W D1 D0 0.60 + 0.05 D1 Ø 0.60 + 0.05 E 1.75 +/- 0.10 F 5.50 +/- 0.05 K0 0.68 +/- 0.10 P0 2.00 +/- 0.05 P1 4.00 +/- 0.10 P2 4.00 +/- 0.10 T 0.28 +/- 0.02 W 12.00 + 0.30 /- 0.10 T A0 K0 B0 Package Dimensions - uDFN-14 (3.5x1.35x0.5mm) Top View uDFN-14 (3.5x1.35x0.5mm) A D Symbol 1 2 3 4 B Nom Max Min Nom Max A 0.45 0.50 0.55 0.018 0.020 0.022 A1 0.00 0.02 0.05 0.000 0.001 0.002 Seating Plane A1 A2 A C 3FG A2 Side View 3FG b 0.15 0.20 0.25 0.006 0.008 0.012 D 3.40 3.50 3.60 0.134 0.138 0.142 D2 - - - - - - E 1.25 1.35 1.45 0.050 0.054 0.058 E1 - - - - - - e b Inches Min E PIN 1 Index Area Millimeters L 0.500 BSC 0.25 0.30 0.020 BSC 0.35 0.010 0.012 0.014 Bottom View Pin 1 Identification Chamfer 0.10X45º /PUFT %JNFOTJPOBOEUPMFSBODJOHDPNGPSNUP"4.&:. $POUSPMMJOHEJNFOTJPOT.JMMJNFUFS$POWFSUFE*ODIEJNFOTJPOTBSFOPUOFDFTTBSJMZ exact. SP3011 Lead-Free/Green Series 90 Revised: May 10, 2010 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information.