Datasheet

TVS Diode Arrays (SPA™ Family of Products)
ESD and EMI Filter Devices - SP6001 Series
SP6001 Series 12pF 30kV EMI Filter Array
Pb GREEN
RoHS
The Littelfuse SP6001 SPA series integrates 4, 6 and 8
EMI filters (C-R-C) into a small, low-profile μDFN package
with each filter providing greater than -30dB attenuation at
1GHz. Additionally, each I/O is capable of shunting ±30kV
ESD strikes (IEC61000-4-2, contact discharge) away from
sensitive electronic components. The performance of this
small, slim design makes it extremely suitable for mobile
handsets, PDAs and notebook computers.
Features
t&4%*&$
±30kV contact, ±30kV air
t&.*mMUFSJOHPG
frequencies from
800MHz to 3GHz
Pinout
1
t(SFBUFSUIBOE#
attenuation (TYP) at 1GHz
4
μDFN-08
t4NBMMMPXQSPmMFç%'/
(JEDEC MO-229) package
(TYP 0.5mm height)
GND
5
8
Applications
SP6001-04UTG-1
1
6
GND
μDFN-12
12
t,FZQBEJOUFSGBDFGPS
portable electronics
t.PCJMFQIPOF
t-$%BOEDBNFSBEJTQMBZ
interfaces for handsets
t1PSUBCMFOBWJHBUJPO
device
t4NBSUQIPOF
t$POOFDUPSJOUFSGBDFTGPS
portable electronics
7
SP6001-06UTG-1
1
Application Examples
8
GND
μDFN-16
PCB Connector
for LCD Display
9
16
SP6001-04UTG-1
Baseband
D1
D2
SP6001-08UTG-1
IC
D3
D4
Functional Block Diagram
SP6001-04UTG-1
1
SP6001-06UTG-1
8
Cd
1
Cd
Cd
Cd
Camera Module
SP6001-08UTG-1
Baseband
D1
12
D2
D3
2
7
Cd
Cd
Cd
Cd
3
6
2
Cd
Cd
Cd
Cd
11
D4
D5
D6
10
3
IC
D7
D8
4
5
Cd
9
4
Cd
Cd
Cd
Cd
Cd
Cd
Cd
8
5
6
©2012 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
7
169
Revision: March 20, 2012
SP6001 Series
SP6001
Description
TVS Diode Arrays (SPA™ Family of Products)
ESD and EMI Filter Devices - SP6001 Series
Thermal Information
Absolute Maximum Ratings
Symbol
Parameter
TOP
Operating Temperature
Storage Temperature
TSTOR
Parameter
Value
Units
-40 to 85
°C
Storage Temperature Range
°C
Maximum Junction Temperature
Maximum Lead Temperature
(Soldering 20-40s)
-60 to 150
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress only rating and operation of the device
at these or any other conditions above those indicated in the operational sections of this
specification is not implied.
Rating
Units
-65 to 150
°C
150
°C
260
°C
Electrical Characteristics (TOP=25ºC)
Parameter
Symbol
Reverse Standoff Voltage
VRWM
Test Conditions
Min
Typ
Max
Units
6.0
V
7.0 (90%TYP)
7.8
8.5 (109%TYP)
V
0.1
1.0
μA
100
115 (115% TYP)
Ω
Breakdown Voltage
VBR
IR=1mA
Reverse Leakage Current
ILEAK
VRWM=5V
Resistance
RA
IR=10mA
Diode Capacitance1,2
CD
VR=2.5V,f=1MHz
Line Capacitance1,2
CL
VR=2.5V,f=1MHz
19 (79.2%TYP)
IEC61000-4-2 (Contact Discharge)
±30
kV
IEC61000-4-2 (Air Discharge)
±30
kV
ESD Withstand Voltage1
VESD
Cutoff Frequency3
Notes:
1
2
3
85 (85%TYP)
12
Above this frequency, appreciable
attenutation occurs
F-3dB
24
pF
29 (120.8%TYP)
115
pF
MHz
Parameter is guaranteed by design and/or device characterization.
Total line capacitance is two times the diode capacitance (CD).
50Ω source and 50Ω load termination
Insertion Loss (S21)
CH1 S
21
log MAG
Analog Crosstalk (S41)
5 dB/
REF 0 dB
1 _:-5.8807 dB
CH1 S
Cor
Cor
Del
Smo
Smo
1
x2
Start
log MAG
10 dB/
REF 0 dB
1
x2
START
Stop 6 000.000.000MHz
3.000 000MHz
3.000 000 MHz
Stop 6 000.000 000 MHz
Product Characteristics
Lead Plating
Pre-Plated Frame
Lead Material
Copper Alloy
Lead Coplanarity
0.0004 inches (0.102mm)
Substitute Material
Silicon
Body Material
Molded Epoxy
Flammability
UL 94 V-0
SP6001 Series
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
170
Revision: March 20, 2012
©2012 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
TVS Diode Arrays (SPA™ Family of Products)
ESD and EMI Filter Devices - SP6001 Series
Line Capacitance vs. DC Bias
Soldering Parameters
40
30
- Time (min to max) (ts)
60 – 180 secs
3°C/second max
10
TS(max) to TL - Ramp-up Rate
3°C/second max
- Temperature (TL) (Liquidus)
Reflow
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
Package Dimensions — μDFN-08
μDFN-08
D
JEDEC MO-229
Min
Max
Min
Max
0.450
0.550
0.018
0.022
A1
0.000
0.050
0.000
0.002
0.006
0.010
D
1.600
1.800
0.063
0.071
D2
1.100
1.300
0.043
0.051
E
1.250
1.450
0.049
0.057
E2
0.300
0.500
0.012
0.020
A
A1
0.250
e
b
0.400 BSC
K
0.200
L
0.150
0.350
0.008
0.000
0.006
0.014
0.01
0.02
A1
0.00
0.05
0.00
0.002
TS(min)
tS
25
time to peak temperature
0.00 REF
0.00
3.20
3.40
0.12
0.13
D2
2.70
2.90
0.10
0.11
E
1.25
1.45
0.04
0.05
E2
0.30
0.50
0.01
0.01
0.40 BSC
D2
0.01 BSC
0.00
0.35
0.00
Max
A
0.450
0.550
0.018
0.022
A1
0.000
0.050
0.000
0.002
e
171
Revision: March 20, 2012
b
0.127 REF
Min
Max
0.005 REF
b
0.150
0.250
0.006
0.010
D
2.400
2.600
0.094
0.102
D2
1.900
2.100
0.075
0.083
E
1.250
1.450
0.049
0.057
E2
0.300
0.500
0.012
0.020
e
0.01
Inches
Min
A3
0.00
D
©2012 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
Time
Millimeters
A
0.25
D
A3
0.127 REF
0.15
Ramp-do
Ramp-down
Preheat
E
0.55
L
tL
L
L
b
TL
TS(max)
Inches
0.45
0.20
Critical Zone
TL to TP
Ramp-up
μDFN-12
A
e
tP
JEDEC MO-229
Max
K
260°C
K
E
A1
K
E2
D2
8 minutes Max.
Do not exceed
μDFN-16
Min
0.15
Time 25°C to peak Temperature (TP)
JEDEC MO-229
Max
b
6°C/second max
Package Dimensions — μDFN-12
Min
A3
Ramp-down Rate
0.016 BSC
Millimeters
A
20 – 40 seconds
TP
Package Dimensions — μDFN-16
D
Time within 5°C of actual peak
Temperature (tp)
0.005 REF
0.150
L
e
0.127 REF
b
K
E2
D2
60 – 150 seconds
260+0/-5 °C
Inches
A
A3
217°C
Peak Temperature (TP)
Temperature
E
Millimeters
- Temperature (tL)
5.0
E2
0.5
DC Bias (V)
A3
200°C
20
0.0
A3
150°C
- Temperature Max (Ts(max))
Average ramp up rate (Liquidus) Temp
(TL) to peak
0
e
- Temperature Min (Ts(min))
A1
Capacitance (pF)
Pre Heat
Pb – Free assembly
0.400 BSC
K
0.200
L
0.150
0.350
0.016 BSC
0.008
0.000
0.006
0.014
SP6001 Series
SP6001
Reflow Condition
50
TVS Diode Arrays (SPA™ Family of Products)
ESD and EMI Filter Devices - SP6001 Series
Embossed Carrier Tape & Reel Specification – μDFN-12
P2
P2
o/ D
t
E
E
t
AO
P
F
oD
/
Millimetres
E
Max
Min
Max
1.65
1.85
0.065
0.073
F
3.45
3.55
0.136
0.140
D1
1.00
-
0.040
-
1.50 min
P
3.90
10P
P
Inches
Min
D
K0
BO
D1
KO
F
W
W
A0
BO
D
Embossed Carrier Tape & Reel Specification – μDFN-08
Millimetres
0.059 min
4.10
40.0 +/- 0.20
Min
Max
Min
Max
E
1.65
1.85
0.065
0.073
F
3.45
3.55
0.136
0.140
D1
0.55
0.65
0.021
0.025
0.161
D
1.575 +/- 0.008
P
0.154
1.50 min
3.90
10P
40.0 +/- 0.20
0.161
1.575 +/- 0.008
7.70
8.30
0.303
0.327
1.95
2.05
0.077
0.081
W
7.90
8.30
0.311
0.327
0.069
P2
1.95
2.05
0.077
0.081
1.33
1.53
0.052
0.060
1.55
1.75
0.061
B0
1.90
2.1
0.075
0.083
A0
K0
0.95
1.15
0.037
0.045
B0
2.63
2.83
0.103
0.111
K0
0.58
0.78
0.023
0.031
0.30 max
0.012 max
t
Embossed Carrier Tape & Reel Specification – μDFN-16
+
+
+
+
+
E
μDFN-08 (1.7x1.35mm)
μDFN-12 (2.5x1.35mm)
μDFN-16 (3.3x1.35mm)
04 = 4 Channel μDFN-08
06 = 6 Channel μDFN-12
08 = 8 Channel μDFN-16
+
Ø 1.00 ± 0.05
T
G= Green
T= Tape & Reel
Package
Silicon Protection Array (SPATM)
Family of TVS Diode Arrays
Series
Number of Channels
F
+
0.009 max
SP 6001 ** U T G -1
P1
+
0.22 max
Part Numbering System
D0
P0
P2
+
0.154
W
t
W
0.059 min
4.10
P2
A0
+
Inches
Part Marking System
12º MAX
12º MAX
A0
J * *
B0
K0
Millimetres
Min
SP6001 Series
Inches
Max
Min
Max
A0
1.55
1.75
0.06
0.06
B0
3.50
3.70
0.13
0.14
D0
1.40
1.60
0.05
0.06
E
1.65
1.85
0.06
0.07
F
5.45
5.55
0.21
0.21
K0
0.85
1.05
0.03
0.04
P0
3.90
4.10
0.15
0.16
P1
1.95
2.05
0.07
0.08
P2
3.90
4.10
0.15
0.16
T
0.26
0.30
0.01
0.01
W
11.90
12.30
0.46
0.48
Product Series
J = SP6001
Assembly Site
4 = μDFN-08
6 = μDFN-12
8 = μDFN-16
Ordering Information
Part Number
Package
Size
(mm)
Marking
Min. Order
Qty.
SP6001-04UTG-1
μDFN-08
1.7x1.35
J*4
3000
SP6001-06UTG-1
μDFN-12
2.5x1.35
J*6
3000
SP6001-08UTG-1
μDFN-16
3.3x1.35
J*8
3000
172
Revision: March 20, 2012
©2012 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.