ASM3P2180A Peak Reducing EMI Solution significant system cost savings by reducing the number Features • Generates a 1x EMI optimized clock output. of circuit board layers, and shielding that are traditionally • Input frequency: 6MHz - 10MHz required to pass EMI regulations. ASM3P2180A 18MHz - 30MHz modulates the output of a single PLL in order to • Output frequency: 6MHz - 10MHz “spread” the bandwidth of a synthesized clock, thereby 18MHz - 30MHz decreasing the peak amplitudes of its harmonics. This • Two selectable down spread options. results in significantly lower system EMI compared to • Selectable frequency range. the typical narrow band signal produced by oscillators • Integrated loop filter components. and most clock generators. Lowering EMI by increasing • Operates with a 3.3V supply. a signal’s bandwidth is called spread spectrum clock • CMOS design. generation. ASM3P2180A uses the most efficient and • 8-pin SOIC packages. optimized modulation profile approved by the FCC and is implemented by using a proprietary all-digital method. Product Description The ASM3P2180A is a versatile spread spectrum Applications frequency modulator designed specifically for a wide The ASM3P2180A is targeted towards notebook LCD range of clock frequencies. ASM3P2180A reduces displays, other displays using an LVDS interface, PC electromagnetic interference (EMI) at the clock source, peripheral devices and embedded systems. allowing system wide reduction of EMI of down stream clock and data dependent signals. ASM3P2180A allows Block Diagram VDD FS Modulation CLKIN / XIN XOUT SS% Crystal Oscillator CLKOUT PLL GND ©2010 SCILLC. All rights reserved. OCTOBER 2010 – Rev. 3 Publication Order Number: ASM3P2180/D ASM3P2180A Pin Diagram CLKIN / XIN 1 8 XOUT 2 3P2180A NC 7 FS GND 3 6 VDD SS% 4 5 CLKOUT Pin Description Pin# Pin Name Type Description 1 CLKIN / XIN I Crystal connection or external reference clock input. 2 XOUT O Connection for an external crystal. If using an external reference, this pin must be left unconnected. 3 GND P Ground to entire chip. 4 SS% I Spread Selection Input. Has an internal pull-up resistor. 5 CLKOUT O Modulated Clock Output. 6 VDD P Power supply for the entire chip. 7 FS I Frequency selection bit. This pin selects the frequency range of operation. (Refer to the Frequency Range Selection Table). Has an internal pull-up resistor. 8 NC - No connect. Frequency Range Selection FS Frequency Range (MHz) 0 6-10 1 18-30 Spread Selection table SS% 0 1 Frequency (MHz) FS=0 FS=1 6 18 8 24 10 30 Deviation (%) (typ) -2 -1.5 -1 6 8 18 24 -4 -3 10 30 -2 Rev. 2 | Page 2 of 6 | www.onsemi.com ASM3P2180A Absolute Maximum Ratings Symbol VDD, VIN TSTG Rating Unit Voltage on any pin with respect to Ground Parameter -0.5 to +4.6 V Storage temperature -65 to +125 °C Ts Max. Soldering Temperature (10 sec) 260 °C TJ Junction Temperature 150 °C TDV Static Discharge Voltage (As per JEDEC STD22- A114-B) 2 KV Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect device reliability. Operating Conditions Parameter VDD TA Description Min Max Unit Supply Voltage 2.8 3.7 V Operating Temperature (Ambient Temperature) -40 +85 °C CL Load Capacitance 15 pF CIN Input Capacitance 7 pF DC Electrical Characteristics Symbol Parameter Min Typ Max Unit V VIL Input low voltage GND – 0.3 0.8 VIH Input high voltage 2.0 VDD + 0.3 V IIL Input low current (pull-up resistors on inputs SS%, FS) -27 µA IIH Input high current 18 µA IXOL XOUT output low current (@ 0.4V, VDD = 3.3V) 3 mA IXOH XOUT output high current (@2.5V, VDD = 3.3V) 4 mA VOL Output low voltage (VDD = 3.3V, IOL = 4mA) VOH 2.5 IDD * Output high voltage (VDD = 3.3V, IOH = 4mA) Dynamic supply current normal mode (3.3V and 10pF loading) Static supply current standby mode VDD Operating voltage 2.8 tON Power up time (first locked clock cycle after power up) ICC ZOUT Clock output impedance *CLKIN pin pulled to GND Rev. 2 | Page 3 of 6 | www.onsemi.com 0.4 10 V V 15 3.3 25 mA 7 mA 3.7 V 0.18 mS 50 Ω ASM3P2180A AC Electrical Characteristics Symbol CLKIN CLKOUT Parameter Input frequency Output frequency Min Typ Max FS=0 6 10 FS=1 18 30 FS=0 6 10 FS=1 18 30 Unit MHz MHz tLH* Output rise time (measured at 0.8V to 2.0V) 1.2 1.3 1.4 nS tHL* Output fall time (measured at 2.0V to 0.8V) 0.8 0.9 1.0 nS tJC Jitter (cycle to cycle) tD Output duty cycle ±325 45 50 *tLH and tHL are measured into a capacitive load of 15pF Typical Test Circuit +3.3V Crystal XIN VDD C1 0.1uF XOUT C2 CLKOUT GND CLOAD Rev. 2 | Page 4 of 6 | www.onsemi.com Spread spectrum output (EMI suppressed) pS 55 % ASM3P2180A Package Information 8-Pin SOIC Package H E D A2 A θ C D e A1 L B Dimensions Symbol Inches Min Max Millimeters Min Max A1 0.004 0.010 0.10 0.25 A 0.053 0.069 1.35 1.75 A2 0.049 0.059 1.25 1.50 B 0.012 0.020 0.31 0.51 C 0.007 0.010 0.18 0.25 D 0.193 BSC 4.90 BSC E 0.154 BSC 3.91 BSC e 0.050 BSC 1.27 BSC H 0.236 BSC 6.00 BSC L 0.016 0.050 θ 0° 8° 0.41 1.27 0° 8° Rev. 2 | Page 5 of 6 | www.onsemi.com ASM3P2180A Ordering Codes Part Number Marking Package Type Temperature ASM3P2180AF-08ST ACT 8-pin SOIC, tube, Pb Free 0°C to +70°C ASM3P2180AF-08SR ACT 8-pin SOIC, tape and reel, Pb Free 0°C to +70°C A “microdot” placed at the end of last row of marking or just below the last row toward the center of package indicates Pb-free. are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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