Peak EMI Reducing Solution

ASM3P2108A
Peak EMI Reducing Solution
Features
• FCC approved method of EMI attenuation.
• Generates a 1X low EMI spread spectrum clock of
the input frequency.
• Input frequency range: 25MHz to 45MHz.
• Internal loop filter minimizes external components
and board space.
• Frequency deviation: - 1.3%( Typ) @ 32MHz.
• Low cycle-to-cycle jitter.
• 5.0V ± 5% operating voltage range.
• TTL or CMOS compatible outputs.
• Available in 8-pin SOIC Package.
Product Description
The ASM3P2108A is a versatile spread spectrum
frequency modulator designed specifically for input clock
frequencies from 25MHz to 45MHz. The ASM3P2108A
can generate an EMI reduced clock from crystal, ceramic
resonator, or system clock.
The ASM3P2108A reduces electromagnetic interference
(EMI) at the clock source, allowing system wide reduction
of EMI of down stream clock and data dependent signals.
The ASM3P2108A allows significant system cost savings
Block Diagram
by reducing the number of circuit board layers ferrite
beads, shielding and other passive components that are
traditionally required to pass EMI regulations.
The ASM3P2108A uses the most efficient and optimized
modulation profile approved by the FCC and is
implemented in a proprietary all digital method.
The ASM3P2108A modulates the output of a single PLL
in order to “spread” the bandwidth of a synthesized clock,
and more importantly, decreases the peak amplitudes of
its harmonics. This results in significantly lower system
EMI compared to the typical narrow band signal produced
by oscillators and most frequency generators. Lowering
EMI by increasing a signal’s bandwidth is called ‘spread
spectrum clock generation.’
Applications
The ASM3P2108A is targeted towards EMI management
for high speed digital applications such as PC peripheral
devices, consumer electronics and embedded controller
systems.
VDD
PLL
Modulation
XIN
Crystal
Oscillator
XOUT
Frequency
Divider
Feedback
Divider
Phase
Detector
Loop
Filter
VCO
Output
Divider
CLOCKOUT
GND
©2010 SCILLC. All rights reserved.
OCTOBER 2010 – Rev. 2
Publication Order Number:
ASM3P2108/D
ASM3P2108A
Pin Configuration
8 NC
XIN / CLKIN 1
XOUT 2
ASM3P2108A
GND 3
NC 4
7 NC
6 VDD
5 CLOCKOUT
Pin Description
Pin#
Pin Name
Type
Description
1
XIN / CLKIN
I
Crystal connection or external reference frequency input. This pin has dual functions. It
can be connected to either an external crystal or an external reference clock.
2
XOUT
O
Crystal connection. If using an external reference, this pin must be left unconnected.
3
GND
P
Ground to entire chip.
4
NC
-
No connect.
5
CLOCKOUT
O
Spread spectrum low EMI output.
6
VDD
P
Power supply for the entire chip (5V).
7
NC
-
No connect.
8
NC
-
No connect.
Absolute Maximum Ratings
Symbol
VDD, VIN
TSTG
Parameter
Rating
Unit
Voltage on any pin with respect to Ground
-0.5 to +7.0
V
Storage temperature
-65 to +125
°C
TA
Operating temperature
0 to 70
°C
Ts
Max. Soldering Temperature (10 sec)
260
°C
TJ
Junction Temperature
150
°C
2
KV
TDV
Static Discharge Voltage
(As per JEDEC STD22- A114-B)
Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect
device reliability.
Operating Conditions
Symbol
VDD
Parameter
Min
Max
Unit
Supply Voltage with respect to VSS
4.75
5.25
V
TA
Operating temperature
-40
+85
°C
CL
Load Capacitance
15
pF
CIN
Input Capacitance
7
pF
Rev. 1 | Page 2 of 5 | www.onsemi.com
ASM3P2108A
DC Electrical Characteristics
Symbol
Parameter
Min
Typ
Max
Unit
VIL
Input low voltage
GND – 0.3
0.8
V
VIH
Input high voltage
2.0
VDD + 0.3
V
IIL
Input low current
44
µA
IIH
Input high current
66
µA
IXOL
XOUT output low current (@ 0.4, VDD = 5V)
3
mA
IXOH
XOUT output high current (@2.5V, VDD = 5V)
3
mA
VOL
Output low voltage (VDD = 5V, IOL = 20mA)
VOH
2.5
IDD
Output high voltage (VDD = 5V, IOH = 20mA)
Dynamic supply current normal mode
(5V, 32MHz and 15pF loading)
Static supply current standby mode
VDD
Operating voltage
4.75
tON
Power up time (first locked clock cycle after power up)
ICC
ZOUT
0.4
V
fIN
MODOUT
Parameter
25
Output frequency
25
tLH*
tHL*
Output fall time (measured at 2.0V to 0.8V)
fd
Min
Input frequency
Input Frequency = 25MHz
Frequency Deviation
Input Frequency = 45MHz
Output rise time (measured at 0.8V to 2.0V)
tJC
Jitter (cycle to cycle)
tD
Output duty cycle
45
* VDD = +5V, Input Frequency = 32MHz, tLH and tHL are measured into a capacitive load of 15pF
Rev. 1 | Page 3 of 5 | www.onsemi.com
40
mA
40
µA
5.0
Clock out impedance
AC Electrical Characteristics
Symbol
V
5.25
V
0.18
mS
50
Ω
Typ
Max
Unit
45
MHz
45
MHz
-1.98
-0.60
440
pS
300
pS
50
%
±360
pS
55
%
ASM3P2108A
Package Information
8-Pin SOIC Package
H
E
D
A2
A
θ
C
D
e
A1
L
B
Dimensions
Symbol
Inches
Millimeters
Min
Max
Min
Max
A1
0.004
0.010
0.10
0.25
A
0.053
0.069
1.35
1.75
A2
0.049
0.059
1.25
1.50
B
0.012
0.020
0.31
0.51
C
0.007
0.010
0.18
0.25
D
0.193 BSC
4.90 BSC
E
0.154 BSC
3.91 BSC
e
0.050 BSC
1.27 BSC
H
0.236 BSC
6.00 BSC
L
0.016
0.050
θ
0°
8°
0.41
1.27
0°
8°
Rev. 1 | Page 4 of 5 | www.onsemi.com
ASM3P2108A
Ordering Codes
Part Number
ASM3P2108AF-08SR
Marking
AEG
Package
Temperature
8-PIN SOIC, TAPE AND REEL, Pb Free
0°C to +70°C
A “microdot” placed at the end of last row of marking or just below the last row toward the center of package indicates Pb-free.
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