NCP4200 D

NCP4200
Programmable Multi-Phase
Synchronous Buck
Converter with I2C
Interface
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The NCP4200 is an integrated power control IC with an I2C
interface. It combines a highly efficient, multi−phase, synchronous
buck switching regulator controller with an I2C interface, which
enables digital programming of key system parameters to optimize
system performance and provide feedback to the system.
It uses an internal 8−bit DAC to read a Voltage Identification (VID)
code directly from the processor, which is used to set the output
voltage between 0.375 V and 1.6 V.
This device uses a multi−mode PWM architecture to drive the
logic−level outputs at a programmable switching frequency that can
be optimized for VR size and efficiency. The NCP4200 can be
programmed to provide 2−, 3−, or 4−phase operation, allowing for the
construction of up to four complementary buck−switching stages. The
NCP4200 supports PSI, which is a Power Save Mode.
The NCP4200 includes an I2C interface which can be used to
program system set points such as voltage offset, load−line and phase
balance and output voltage. Key system performance data, such as
CPU current, CPU voltage, and power and fault conditions can also be
read back over the I2C from the NCP4200.
The NCP4200 operates over the industrial temperature range of
−40°C to +125°C and is available in a 40 Lead QFN package.
QFN40 6x6
CASE 488AR
1 40
MARKING DIAGRAM
NCP4200
AWLYYWWG
A
WL
YY
WW
G
PWRGD
PSI
VID0
VID1
VID2
VID3
VID4
VID5
VID6
VID7
PIN ASSIGNMENT
•
•
Applications
NCP4200
VCC
PWM1
PWM2
PWM3
PWM4
SW1
SW2
SW3
SW4
OD1
18
19
20
TOP VIEW
ORDERING INFORMATION
Device
• Desktop PC Power Supplies for VRM Modules
30
29
28
27
26
25
24
23
22
21
PIN 1
INDICATOR
14
15
16
17
•
1
2
3
4
5
6
7
8
9
10
11
12
13
•
•
•
VCC3
ALERT
FAULT
SDA
SCL
EN
GND
IMON
IREF
RT
RAMPADJ
TRDET
FBRTN
COMP
FB
CSREF
CSSUM
CSCOMP
ILIMITFS
ODN
•
Read−back of Monitored Values
Logic−Level PWM Outputs for Interface to External High
Power Drivers
Fast−Enhanced PWM for Excellent Load Transient Performance
Active Current Balancing Between All Output Phases
Built−In Power−Good/Crowbar Blanking Supports On−The−Fly
(OTF) VID Code Changes
Digitally Programmable 0.375 V to 1.6 V Output Supports Both
VR11 and VR11.1 Specifications
Programmable Short−Circuit Protection with Programmable
Latchoff Delay
Supports PSI – Power Saving Mode During Light Loads
40
39
38
37
36
35
34
33
32
31
Features
• Selectable 2−, 3−, or 4−Phase Operation at Up to 1.5 MHz per Phase
• I2C Interface − Enables Digital Programmability of Set Points and
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
NCP4200MNR2G
Package
Shipping†
QFN40
2500/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2012
July, 2012 − Rev. 5
1
Publication Order Number:
NCP4200/D
NCP4200
SCL SDA
ALERT 2
RAMPADJ
VCC
VCC3
10
11
30
1
SHUNT
REGULATOR
I2C
INTERFACE
LIMIT
REGISTERS
COMPARATOR
RT
4
5
3.3V
REGULATOR
20
ODN
39
PSI
21
OD1
29
PWM1
28
PWM2
RESET
27
PWM3
RESET
26
PWM4
25
SW1
24
SW2
23
22
SW3
SW4
FAULT 3
OSCILLATOR
STATUS
REGISTERS
UVLO
SHUTDOWN
850mV
GND 7
DIGITAL CONFIG
& VALUE
CONTROL
REGISTERS
SET
EN
RESET
–
EN 6
+
+
CMP
RESET
–
ADC
CURRENT
BALANCING
CIRCUIT
+
RESET
CMP
–
2 / 3 / 4−PHASE
DRIVER LOGIC
+
CMP
CONTROL
–
+
CMP
–
Overvoltage
Threshold
–
CSREF
+
PWRGD 40
CURRENT
LIMIT
CROWBAR
+
Undervoltage
Threshold
–
DELAY
CONTROL
CURRENT
MEASUREMENT
AND LIMIT
+
–
ILIMITFS 19
18
P
CSCOM
16
CSREF
17
CSSUM
8
IMON
15
FB
CONTROL
IREF 9
–
COM 14
+
TRDET 12
NCP4200
Voltage
Threshold
+
–
PRECISION
REFERENCE
13
FBRTN
CONTROL
38
37
36
35
34
VID4
33
32
31
VID5 VID6 VID7
Figure 1. Simplified Block Diagram
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2
+
–
BOOT VOLTAGE &
SOFT START CONTROL
VID DAC
VID0 VID1 VID2 VID3
+
–
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4.99kΩ
Figure 2. Application Circuit
220kΩ
121kΩ
I2C
Interface
1nF
ALERT
FAULT
348k Ω
RT
EN
GND
IMON
IREF
ALERT
FAULT
SDA
SCL
VCC3
POWER GOOD
PSI
NCP4200
SW1
SW2
SW3
SW4
OD1
VCC
PWM1
PWM2
PWM3
PWM4
Vin 12V
PWRGD
PSI
VID0
VID1
VID2
VID3
VID4
VID5
VID6
VID7
RAMPADJ
TRDET
FBRTN
COMP
FB
CSREF
CSSUM
CSCOMP
ILIMFS
3
ODN
4.7uF
1kΩ
1kΩ
1kΩ
1kΩ
4.7uF
4.7uF
4.7uF
4.7uF
ADP3121 10nF
2.2Ω 18nF
ADP3121 10nF
2.2Ω 18nF
ADP3121 10nF
2.2Ω 18nF
2
BST DRVH 8
IN
SW 7
3 OD PGND 6
4 VCC DRVL 5
1
2
BST DRVH 8
IN
SW 7
3 OD PGND 6
4 VCC DRVL 5
1
2
BST DRVH 8
IN
SW 7
3 OD PGND 6
4 VCC DRVL 5
1
2
BST DRVH 8
IN
SW 7
3 OD PGND 6
4 VCC DRVL 5
1
ADP3121 10nF
2.2Ω 18nF
150 nH
4.7uF
150 nH
4.7uF
150 nH
4.7uF
150 nH
4.7uF
10Ω
10Ω
10Ω
10Ω
Vss Sense
Vcc Sense
Vcc Core (RTN)
Vcc Core
NCP4200
NCP4200
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Value
Unit
VIN
−0.3 to 6.0
V
VFBRTN
−0.3 to 0.3
V
−0.3 to VIN +0.3
V
SW1 to SW4
−5 to +25
V
SW1 to SW4 (< 200 ns)
−10 to +25
V
Input Voltage Range (Note 1)
FBRTN
PWM2 to PWM4, RAMPADJ
All Other Inputs and Outputs
Storage Temperature Range
−0.3 to VIN + 0.3
V
−65 to +150
°C
TSTG
Operating Ambient Temperature Range
−40 to +125
°C
ESD Capability, Human Body Model (Note 2)
ESDHBM
2
kV
ESD Capability, Machine Body Model (Note 2)
ESDMM
100
V
TSLD
260
°C
Lead Temperature Soldering
Re−flow (SMD Styles Only, Pb−Free Versions (Note 3)
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Refer to Electrical Characteristics and Application Information for Safe Operating Area.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114)
ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)
Latchup Current Maximum Rating: ≤150 mA per JEDEC standard: JESD78
3. For information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
THERMAL CHARACTERISTICS
Parameter
Thermal Characteristics; QFN, 6mm x 6mm (Note 1)
Thermal Resistance, Junction−to−Air (Note 4)
4. Values based on copper area of 645
mm2
(or 1
in2)
Symbol
Value
Unit
RqJA
27
°C/W
of 1 oz copper thickness and FR4 PCB substrate.
OPERATING RANGES (Note 1)
Parameter
Symbol
Input Voltage (Note 5)
Min
Max
Unit
VIN
1.7
24
V
VOUT
0.375
1.8
V
Ambient Temperature
TA
−40
125
°C
Junction Temperature
TJ
−40
150
°C
Output Voltage (Adjustable Version Only)
5. Minimum VIN = 1.7 V or (VOUT + VDO), whichever is higher. Maximum Limit for VOUT = VOUT(NOM) – 10%.
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4
NCP4200
PIN FUNCTION DESCRIPTIONS
Pin No
Mnemonic
1
VCC3
3.3 V Power Supply Output. A capacitor from this pin to ground provided decoupling for the interval
3.3 V LDO.
Description
2
ALERT
ALERT Output. Open drain output that asserts low when the VR exceeds a programmable limit.
3
FAULT
FAULT Output. Open drain output that asserts low when a fault has occurred. The fault can be due to
VR or current limit, crowbar, or undervoltage. The trip points are loaded into registers.
4
SDA
Digital Input/Output. I2C serial data bidirectional pin. Requires pullup.
5
SCL
Digital Input. I2C serial bus clock open drain input. Requires pullup.
6
EN
Power Supply Enable Input. Pulling this pin to GND disables the PWM outputs and pulls the
PWRGD output low.
7
GND
Ground. All internal biasing and the logic output signals of the device are referenced to this ground.
8
IMON
Analog Filter Output. A capacitor from this pin to ground sets the default current monitor filter
frequency. The frequency can be modified using the serial interface.
9
IREF
Current Reference Input. An external resistor from this pin to ground sets the reference current for
IFB, IILIMITFS and ITH(X).
10
RT
11
RAMPADJ
12
TRDET
Transient Detect.
13
FBRTN
Feedback Return. VID DAC and error amplifier reference for remote sensing of the output voltage.
14
COMP
Error Amplifier Output and Compensation Point.
15
FB
16
CSREF
Current Sense Reference Voltage Input. The voltage on this pin is used as the reference for the
current sense amplifier and the power−good and crowbar functions. This pin should be connected to
the common point of the output inductors.
17
CSSUM
Current Sense Summing Node. External resistors from each switch node to this pin sum the average
inductor currents together to measure the total output current.
18
CSCOMP
Current Sense Compensation Point. A resistor and capacitor from this pin to CSSUM determines the
gain of the current sense amplifier and the positioning loop response time.
19
ILIMITFS
Current Sense and Limit Scaling Pin. An external resistor from this pin to CSCOMP sets the internal
current sensing signal for current limit and IMON. This value can be overwritten using the I2C
interface.
20
ODN
Output Disable Logic Output for phases 2−4. This pin is actively pulled low when the EN input is low
or when VCC is below its UVLO threshold to signal to the Driver IC that the driver high−side and
low−side outputs should go low.
21
OD1
Output Disable Logic Output for phase one. This pin is actively pulled low when the EN input is low
or when VCC is below its UVLO threshold to signal to the Driver IC that the driver high−side and
low−side outputs should go low.
22 to 25
SW4 to SW1
26 to 29
PWM4 to PWM1
30
VCC
31 to 38
VID7 to VID0
39
PSI
40
PWRGD
Frequency Setting Resistor Input. An external resistor connected between this pin and GND sets the
oscillator frequency of the device.
PWM Ramp Current Input. An external resistor from the converter input voltage to this pin sets the
internal PWM ramp.
Feedback Input. Error amplifier input for remote sensing of the output voltage. An external resistor
between this pin and the output voltage sets the no load offset point.
Current Balance Inputs. Inputs for measuring the current level in each phase. The SW pins of
unused phases should be left open.
Logic−Level PWM Outputs. Each output is connected to the input of an external MOSFET driver
such as the ADP3120A. Connecting the PWM4, and PWM3 outputs to VCC causes that phase to
turn off, allowing the NCP4200 to operate as a 2−phase controller.
Supply Voltage for the Device.
Voltage Identification DAC Inputs. These eight pins are pulled down to GND, providing a logic zero if
left open. When in normal operation mode, the DAC output programs the FB regulation voltage from
0.375 V to 1.6 V.
Power Save Interface. System signal to select single phase option.
Power−Good Output. Open−drain output that signals when the output voltage is outside of the proper
operating range.
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5
NCP4200
ELECTRICAL CHARACTERISTICS VIN = 5.0 V, FBRTN = GND for typical values TA = −40°C to 125°C, unless otherwise noted.
(Note 1 and 3).
Parameter
Symbol
Conditions
Min
Typ
Max
1.75
1.8
1.9
Unit
REFERENCE CURRENT
Reference Bias Voltage
VIREF
Reference Bias Current
IIREF
16
RIREF = 121 kW
V
mA
ERROR AMPLIFIER
Output Voltage Range (Note 1)
Accuracy
VCOMP
VFB
VFB(BOOT)
0
4.4
V
Relative to nominal DAC output,
referenced to FBRTN (Note 2)
−7.7
+7.7
mV
In startup
1.091
1.1
1.109
V
Load Line Positioning Accuracy
−77
−80
−83
mV
Load Line Range
−350
0
mV
0
100
%
+1.0
LSB
17.7
mA
Load Line Attenuation
Differential Non−linearity
Input Bias Current
−1.0
IFB
Offset Accuracy
IFBRTN
Output Current
ICOMP
GBW(ERR)
Slew Rate
BOOT Voltage Hold Time
14.2
VR Offset Register = 111111, VID = 1.0 V
VR Offset Register = 011111, VID = 1.0 V
FBRTN Current
Gain Bandwidth Product
IFB = IIREF
tBOOT
16
−193.75
193.75
70
mV
200
mA
FB forced to VOUT – 3%
500
mA
COMP = FB
20
MHz
COMP = FB
25
V/ms
Internal Timer
2.0
ms
VID INPUTS
Input Low Voltage
VIL(VID)
VID(X)
Input High Voltage
VIH(VID)
VID(X)
Input Current
IIN(VID)
0.3
0.8
V
−5.0
VID Transition Delay Time
(Note 1)
VID code change to FB change
No CPU Detection Turn−Off
Delay Time
VID code change to PWM going low
V
mA
200
ns
5
ms
OSCILLATOR
Frequency Range (Note 1)
Frequency Variation
Output Voltage
fOSC
fPHASE
VRT
RAMPADJ Output Voltage
VRAMPADJ
RAMPADJ Input Current Range
IRAMPADJ
0.25
6.0
MHz
kHz
TA = 25°C, RT = 460kW, 4−phase
TA = 25°C, RT = 220kW, 4−phase
TA = 25°C, RT = 120kW, 4−phase
220
260
500
850
290
RT = 500 kW to GND
1.93
2.03
2.13
V
RAMPADJ − FB, VFB = 1.0 V,
IRAMPADJ = −50 mA
−50
+50
mV
5.0
60
mA
CSSUM − CSREF (Note 3)
−0.7
+0.7
mV
CURRENT SENSE AMPLIFIER
Offset Voltage
VOS(CSA)
Input Bias Current, CSREF
IBIAS(CSREF)
CSREF = 1.0 V
−20
+20
mA
Input Bias Current, CSSUM
IBIAS(CSSUM)
CSREF = 1.0 V
−10
+10
nA
Gain Bandwidth Product
CSSUM = CSCOMP
10
MHz
Slew Rate
GBW(CSA)
CCSCOMP = 10 pF
10
V/ms
Input Common−Mode Range
CSSUM and CSREF
Output Voltage Range
Output Current
Current Limit Latchoff Delay Time
0
3.0
0.05
ICSCOMP
Internal Timer
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6
3.0
V
V
500
mA
8.0
ms
NCP4200
ELECTRICAL CHARACTERISTICS VIN = 5.0 V, FBRTN = GND for typical values TA = −40°C to 125°C, unless otherwise noted.
(Note 1 and 3).
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
0.3
V
PSI
Input Low Voltage
Input High Voltage
0.8
Input Current
V
−5.0
mA
Assertion Timing
Fsw = 300 kHz
3.3
ms
De−assertion Timing
Fsw = 300 kHz
825
ns
IOUT = −6 mA
150
TRDET
Output Low Voltage
VOL
300
mV
IMON
Clamp Voltage
Accuracy
10 x (CSREF − CSCOMP)/RILIM
1.0
1.15
V
−3.0
3.0
%
Output Current
Offset
−3.0
800
mA
3.0
mV
CURRENT LIMIT COMPARATOR
ILIM Bias Current
ILIM
CSREF − CSCOMP)/RILIM,
(CSREF − CSCOMP) = 150 mV,
RILIMC = 6 kW
25
mA
Current Limit Threshold Current
ICL
4/3 x IIREF
20
mA
CURRENT BALANCE AMPLIFIER
Common−Mode Range
Input Resistance
Input Current
Input Current Matching
VSW(X)CM
−600
RSW(X)
SW(X) = 0 V
14
18
ISW(X)
ΔISW(X)
SW(X) = 0 V
8
12
SW(X) = 0 V
−6.0
+200
mV
21
kW
28
mA
+6.0
%
Phase Balance Adjustment
Range Low
Phase Bal Registers = 00000
−25
%
Phase Balance Adjustment
Range High
Phase Bal Registers = 11111
+25
%
Internal Timer
Delay Time Register = 011
2.0
ms
Timer Range Low
Delay Time Register = 000
0.5
ms
Timer Range High
Delay Time Register = 111
4.0
ms
Internal Timer
Soft−Start Slope Register = 010
0.5
V/ms
Timer Range Low
Soft−Start Slope Register = 000
0.1
V/ms
Timer Range High
Soft−Start Slope Register = 111
1.5
V/ms
DELAY TIMER
SOFT−START
ENABLE INPUT
Input Low Voltage
VIL(EN)
Input High Voltage
VIH(EN)
Input Current
Delay Time
0.3
0.8
IIN(EN)
tDELAY(EN)
V
V
−1.0
mA
EN > 0.8V , Internal Delay
2.0
ms
IOD(SINK) = −400 mA
160
ODN / OD1 OUTPUTS
Output Low Voltage
VOL(OD1)
Output High Voltage
VOH(ODN/1)
IOD(SOURCE) = 400 mA
ODN/OD1 Pulldown Resistor
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7
4.0
500
mV
5.0
V
60
kW
NCP4200
ELECTRICAL CHARACTERISTICS VIN = 5.0 V, FBRTN = GND for typical values TA = −40°C to 125°C, unless otherwise noted.
(Note 1 and 3).
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
−600
−500
−400
mV
POWER−GOOD COMPARATOR
Undervoltage Threshold
VPWRGD(UV)
Relative to nominal DAC output
Undervoltage Adjustment Range
Low
PWRGD_LO Register = 000
−500
mV
Undervoltage Adjustment Range
High
PWRGD_LO Register = 111
−150
mV
Overvoltage Threshold
VPWRGD(OV)
Relative to DAC output, PWRGD_Hi = 00
200
300
400
mV
Overvoltage Adjustment Range
Low
PWRGD_Hi Register = 11
150
mV
Overvoltage Adjustment Range
High
PWRGD_Hi Register = 00
300
mV
IPWRGD(SINK) = −4 mA
150
Internal Timer
2.0
ms
250
ms
Output Low Voltage
VOL(PWRGD)
300
mV
Power Good Delay Time
During Soft−Start
VID Code Changing
100
VID Code Static
200
Crowbar Trip Point
VCROWBAR
200
Crowbar Adjustment Range
PWRGD_HI Register
150
Crowbar Reset Point
Relative to FBRTN
250
300
100
250
ms
400
ns
Crowbar Delay Time
tCROWBAR
300
ns
Relative to DAC output, PWRGD_Hi = 00
400
mV
300
mV
350
mV
Overvoltage to PWM going low
VID Code Changing
VID Code Static
PWM OUTPUTS
Output Low Voltage
IPWM(SINK) =
−400 mA
VOL(PWM)
Output High Voltage
IPWM(SOURCE)
= 400 mA
VOH(PWM)
160
4.0
500
5.0
mV
V
I2C INTERFACE
Logic High Input Voltage
VIH(SDA, SCL)
Logic Input Low Voltage
VIL(SDA, SCL)
2.1
0.8
Hysteresis
SDA Output Low Voltage
Input Current
V
500
VOL
ISDA = −6mA
IIH; IIL
Input Capacitance
CSCL, SDA
Clock Frequency
fSCL
−1.0
0.4
V
1.0
mA
5.0
SCL Falling Edge to SDA Valid
Time
V
mV
pF
400
kHz
1.0
ms
ALERT / FAULT OUTPUTS
Output Low Voltage
VOL
IOUT = −6 mA
0.4
V
Output High Leakage Current
IOH
VOH = 5.0 V
1.0
uA
2
V
ANALOG / DIGITAL CONVERTER
0
ADC Input Voltage Range
Total Unadjusted Error (TUE)
±1
%
Differential Non−linearity (DNL)
8 Bits
1.0
LSB
Conversion Time, Voltage
Channel
Averaging Enabled (32 averages)
80
ms
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8
NCP4200
ELECTRICAL CHARACTERISTICS VIN = 5.0 V, FBRTN = GND for typical values TA = −40°C to 125°C, unless otherwise noted.
(Note 1 and 3).
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
4.70
5.25
5.75
V
20
25
mA
6.5
11
mA
SUPPLY
VCC (Note 1)
VCC
DC Supply Current
IVCC
VSYSTEM = 13.2 V, RSHUNT = 340 W
UVLO Turn−On Current
UVLO Threshold Voltage
VUVLO
UVLO Turn−Off Voltage
VCC rising
10
V
VCC falling
VCC3 Output Voltage
VCC3
4.1
IVCC3 = 1 mA, TA = −40°C to 0°C
IVCC3 = 1 mA, TA = 0°C to 125°C
3.0
3.0
3.3
3.3
V
3.7
3.6
V
1. Refer to Electrical Characteristics and Application Information for Safe Operating Area.
2. Performance guaranteed over the indicated operating temperature range by design and/or characterization tested at TJ = TA = 25°C. Low
duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
3. Values based on design and/or characterization.
TYPICAL CHARACTERISTICS
2500
Frequency (kHz)
2000
1500
PWM1
1000
500
0
0
100
200
300
400
500
600
700
RT (kW)
Figure 3. Master Clock Frequency vs. RT
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9
800
900
NCP4200
TEST CIRCUITS
8 BIT
VID CODE
+12 V
VCC3
ALERT
PWRGD
PSI
VID0
VID1
VID2
VID3
VID4
VID5
VID6
VID7
680 W
FAULT
SDA
SDL
EN
CSCOMP
ILIMITFS
ODN
NCP4200
CSSUM
GND
IMON
IREF
RT
RAMPADJ
TRDET
FBRTN
COMP
FB
CSREF
+1.25 V
680 W
+1m F
VCC
PWM1
PWM2
PWM3
PWM4
SW1
SW2
SW3
SW4
OD1
100 nF
121 kW
20 k W
10 k W
1kW
100 nF
Figure 4. Closed−Loop Output Voltage Accuracy
ADP4200
12 V
12 V
680 W
ADP4200
680 W
680 W
VCC
COMP
14
30
10 k W
CSCOMP
FB
15
18
39 k W
VCC
30
680 W
100 nF
CSSUM
–
17
1 kW
CSREF
CSREF
19
16
1V
GND
7
VOS =
1V
CSCOMP – 1 V
40
+
VID
DAC
GND
7
DV FB = FB DV = 80mV – FB DV = 0 mV
Figure 5. Current Sense Amplifier VOS
Figure 6. Positioning Voltage
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NCP4200
Description
limit latchoff as explained in the Current Limit section. The
current limit timer is set to 4 times the delay timer.
The delay timer is programmed using Bits <2:0> of the
Ton Delay command (0xD4). The delay can be programmed
between 0.5 msec and 4 msec. Table 1 provides the
programmable delay times.
The NCP4200 is a 4 Phase DC−DC regulator with an I2C
Interface. A typical application circuit is shown in Figure 2.
Startup Sequence
The NCP4200 follows the startup sequence shown in
Figure 7. After both the EN and UVLO conditions are met,
a programmable internal timer goes through one delay cycle
TD1. This delay cycle is programmed using Delay
Command, default delay = 2 ms, see Table 2 for
programmable values. The first six clock cycles of TD2 are
blanked from the PWM outputs and used for phase detection
as explained in the following section. Then the
programmable internal soft−start ramp is enabled (TD2) and
the output comes up to the boot voltage of 1.1 V. The boot
hold time is also set by Delay Command. This second delay
cycle is called TD3. During TD3 the processor VID pins
settle to the required VID code. When TD3 is over, the
NCP4200 reads the VID inputs and soft−starts either up or
down to the final VID voltage (TD4). After TD4 has been
completed and the PWRGD masking time (equal to VID
OTF masking) is finished, a third cycle of the internal timer
sets the PWRGD blanking (TD5).
The internal delay and soft−start times are programmable
using the serial interface, the Delay Command and the
Soft−Start Commands.
Table 1. Delay Codes
VTT I/O
(NCP4200 EN)
0.85 V
TD3
VBOOT
(1.1 V)
TD1
VCC_CORE
V VID
TD2
50 ms
CPU
VID INPUTS
VID INVALID
000
0.5
001
1
010
1.5
011
2 = default
100
2.5
101
3
110
3.5
111
4
The Soft−Start slope for the output voltage is set by an
internal timer. The default value is 0.5 V/msec, which can be
programmed through the I2C interface. After TD1 and the
phase detection cycle have been completed, the SS time
(TD2 in Figure 2) starts. The SS circuit uses the internal VID
DAC to increase the output voltage in 6.25 mV steps up to
the 1.1 V boot voltage.
Once the SS circuit has reached the boot voltage, the boot
voltage delay time (TD3) is started. The end of the boot
voltage delay time signals the beginning of the second
soft−start time (TD4). The SS voltage changes from the boot
voltage to the programmed VID DAC voltage (either higher
or lower) using 6.25 mV steps.
The soft−start slew rate is programmed using Bits <2:0>
of the Ton_Rise (0xD5) command code. Table 2 provides
the soft−start values.
TD4
VR READY
(NCP4200 PWRGD)
Delay (msec)
Soft−Start
UVLO
THRESHOLD
5.0 V
SUPPLY
Code
TD5
Table 2. Slew Rate Codes
VID VALID
Figure 7. Startup Sequence
Code
Slew Rate (V/msec)
000
0.1
001
0.3
Internal Delay Timer
010
0.5 = default
An internal timer sets the delay times for the start up
sequence, TD1, TD3 and TD5. The default time is 2 msec,
which can be changed using the I2C interface. This timer is
used for multiple delay timings (TD1, TD3 and TD5) during
the startup sequence. Also, it is used for timing the current
011
0.7
100
0.9
101
1.1
110
1.3
111
1.5
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NCP4200
phases in use. If all phases are in use, divide by 4. If 2 phases
are in use then divide by 2.
Figure 8 shows typical startup waveforms for the
NCP4200.
Output Voltage Differential Sensing
The NCP4200 combines differential sensing with a high
accuracy VID DAC and reference, and a low offset error
amplifier. This maintains a worst−case specification of
±9 mV differential sensing error over its full operating
output voltage and temperature range. The output voltage is
sensed between the FB pin and FBRTN pin. FB is connected
through a resistor, RB, to the regulation point, usually the
remote sense pin of the microprocessor. FBRTN is
connected directly to the remote sense ground point. The
internal VID DAC and precision reference are referenced to
FBRTN, which has a minimal current of 70 mA to allow
accurate remote sensing. The internal error amplifier
compares the output of the DAC to the FB pin to regulate the
output voltage.
Figure 8. Typical Startup Waveforms
Output Current Sensing
The NCP4200 provides a dedicated Current Sense
Amplifier (CSA) to monitor the total output current for
proper voltage positioning vs. load current, for the IMON
output and for current limit detection. Sensing the load
current at the output gives the total real time current being
delivered to the load, which is an inherently more accurate
method than peak current detection or sampling the current
across a sense element such as the low−side MOSFET. This
amplifier can be configured in several ways, depending on
the objectives of the system, as follows:
• Output inductor DCR sensing without a thermistor for
lower cost.
• Output inductor DCR sensing with a thermistor for
improved accuracy with inductor temperature tracking.
• Sense resistors for highest accuracy measurements.
The positive input of the CSA is connected to the CSREF
pin, which is connected to the average output voltage. The
inputs to the amplifier are summed together through
resistors from the sensing element, such as the switch node
side of the output inductors, to the inverting input CSSUM.
The feedback resistor between CSCOMP and CSSUM sets
the gain of the amplifier and a filter capacitor is placed in
parallel with this resistor. The gain of the amplifier is
programmable by adjusting the feedback resistor. This
difference signal is used internally to offset the VID DAC
for voltage positioning. This difference signal can be
adjusted between 50% and 150% of the external value using
the I2C Load−line Calibration (0xDE) and Load−line Set
(0xDF) commands. The difference between CSREF and
CSCOMP is used as a differential input for the current limit
comparator.
To provide the best accuracy for sensing current, the CSA
is designed to have a low offset input voltage. Also, the
sensing gain is determined by external resistors to make it
extremely accurate.
Phase Detection
During startup, the number of operational phases and their
phase relationship is determined by the internal circuitry that
monitors the PWM outputs. Normally, the NCP4200
operates as a 4−phase PWM controller.
To operate as a 3−Phase Controller: connect PWM4 to VCC.
To operate as a 2−Phase Controller: connect PWM3 and
PWM4 to VCC.
To operate as a single phase controller: connect PMW2,
PWM3, and PWM4 to VCC.
Prior to soft−start, while EN is high the PWM4, PWM3
and PWM2 pins sink approximately 100 mA each. An
internal comparator checks each pin’s voltage vs. a threshold
of 3.0 V. If the pin is tied to VCC, it is above the threshold.
Otherwise, an internal current sink pulls the pin to GND,
which is below the threshold. PWM1 is low during the phase
detection interval that occurs during the first six clock cycles
of TD2. After this time, if the remaining PWM outputs are
not pulled to VCC, the 100 mA current sink is removed, and
they function as normal PWM outputs. If they are pulled to
VCC, the 100 mA current source is removed, and the outputs
are put into a high impedance state.
The PWM outputs are logic−level devices intended for
driving fast response external gate drivers such as the
ADP3121. Because each phase is monitored independently,
operation approaching 100% duty cycle is possible. In
addition, more than one output can be on at the same time to
allow overlapping phases.
Master Clock Frequency
The clock frequency of the NCP4200 is set with an
external resistor connected from the RT pin to ground. The
frequency follows the graph in Figure 3. To determine the
frequency per phase, the clock is divided by the number of
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NCP4200
The CPU current can also be monitored over the I2C
Interface. The current limit and the load−line can be adjusted
from the circuit component values over the I2C Interface.
longer than the delay time during the startup sequence. The
current limit delay time only starts after TD5 has completed.
If there is a current limit during startup, the NCP4200 will
go through TD1 to TD5 and then start the latchoff time.
Because the controller continues to cycle the phases during
the latchoff delay time, if the short is removed before the
timer is complete, the controller can return to normal
operation.
The latchoff function can be reset by either removing/
reapplying the supply voltage to the NCP4200, or by
toggling the EN pin low for a short time.
During startup when the output voltage is below 200 mV,
a secondary current limit is active. This is necessary because
the voltage swing of CSCOMP cannot go below ground.
This secondary current limit limits the internal COMP
voltage to the PWM comparators to 1.5 V. This limits the
voltage drop across the low−side MOSFETs through the
current balance circuitry. Typical overcurrent latchoff
waveforms are shown in Figure 9.
Current Limit Set−Point
The current limit threshold on the NCP4200 is
programmed by a resistor between the ILIMFS pin and the
CSCOMP pin. The ILIMFS current, IILIMFS, is compared
with an internal current reference of 20 mA. If IILIMFS
exceeds 20 mA then the output current has exceeded the limit
and the current limit protection is tripped.
I ILIMFS +
V ILIMFS * V CSCOMP
R ILIMFS
(eq. 1)
Where VILIMFS = VCSREF
I ILIMFS +
V CSREF * V CSCOMP
R ILIMFS
R
V CSREF * V CSCOMP + CS
R PH
(eq. 2)
RL
I LOAD
Assuming that:
R CS
R PH
R L + 1 mW
(eq. 3)
i.e. the external circuit is set up for a 1 mW load−line then
the RILIMFS is calculated as follows:
I ILIMFS +
1 mW I LOAD
R ILIMITFS
(eq. 4)
Assuming we want a current limit of 150 A that means that
ILIMFS must equal 25 mA at that load.
25 mA +
1 mW 150 A
+ 6 kW
R ILIMITFS
(eq. 5)
Solving this equation for RLIMITFS we get 6 kW.
Figure 9. Overcurrent Latchoff Waveforms
The current limit threshold can be modified from the
resistor programmed value by using the I2C interface using
Bits <4:0> of the Current Limit Threshold command
(0xE2). The limit is programmable between 50% of the
external limit and 146.7% of the external limit. The
resolution is 3.3%. Table 3 gives some examples codes.
An inherent per phase current limit protects individual
phases if one or more phases stop functioning because of a
faulty component. This limit is based on the maximum
normal mode COMP voltage.
Output Current Monitor
IMON is an analog output from the NCP4200 representing
the total current being delivered to the load. It outputs an
accurate current that is directly proportional to the current
set by the ILIMFS resistor.
Table 3. Current Limit
Code
Current Limit (% of External Limit)
0 0000
50%
0 0001
53.3%
1 0000
100% = default
1 0001
103.3%
1 1110
143.3%
1 1111
146.7%
I IMON + 10
I ILIMFS
(eq. 6)
The current is then run through a parallel RC connected
from the IMON pin to the FBRTN pin to generate an
accurately scaled and filtered voltage as per the
specification. The size of the resistor is used to set the IMON
scaling.
The scaling is set such that IMON = 900 mV at the TDC
current of the processor. This means that the RIMON resistor
should be chosen as follows.
Current Limit, Short−Circuit and Latchoff Protection
If the current limit is reached and TD5 has completed, an
internal latchoff delay time will start, and the controller will
shut down if the fault is not removed. This delay is four times
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NCP4200
Current Control Mode and Thermal Balance
From the Current Limit Set−point paragraph we know the
following:
The NCP4200 has individual inputs (SW1 to SW4) for
each phase that are used for monitoring the per phase
current. This information is combined with an internal ramp
to create a current balancing feedback system that has been
optimized for initial current balance accuracy and dynamic
thermal balancing during operation. This current balance
information is independent of the average output current
information used for positioning. The magnitude of the
internal ramp can be set to optimize the transient response
of the system. It also monitors the supply voltage for
feed−forward control for changes in the supply. A resistor
connected from the power input voltage to the RAMPADJ
pin determines the slope of the internal PWM ramp.
The balance between the phases can be programmed using
the I2C Phase Bal SW(x) commands (0xE3 to 0xE6). This
allows each phase to be adjusted if there is a difference in
temperature due to layout and airflow considerations. The
phase balance can be adjusted from a default gain of 5 (Bits
4:0 = 10000). The minimum gain programmable is 3.75
(Bits 4:0 = 00000) and the max gain is 6.25 (Bits 4:0 =
11111).
1 mW I LOAD
I ILIMFS +
R LIMIFS
(eq. 7)
I IMON + 10
1 mW I LOAD
R LIMFS
For a 150 A current limit RLIMFS = 6 kW. Assuming the
TDC = 135 A then VMON should equal 900 mV when
ILOAD = 135 A.
When ILOAD = 135 A, IMON equals:
I IMON + 10
1 mW 135 A
+ 225 mA
6 kW
V IMON + 900 mV + 225 mA
R MON
(eq. 8)
This gives a value of 4 kW for RMON.
If the TDC and OCP limit for the processor have to be
changed the because the ILIMITFS resistor sets up both the
current limit and also the current out of the IMON pin, as
explained earlier.
The IMON pin also includes an active clamp to limit the
IMON voltage to 1.15 V MAX while maintaining accuracy
at 900 mV full scale.
Voltage Control Mode
A high gain, high bandwidth, voltage mode error
amplifier is used for the voltage mode control loop. The
control input voltage to the positive input is set via the VID
logic according to the voltages listed in Table 10. The VID
code is set using the VID Input pins or it can be programmed
over the I2C using the VOUT_Command. By default, the
NCP4200 outputs a voltage corresponding to the VID
Inputs. To output a voltage following the VOUT_Command
the user first needs to program the required VID Code. Then
the VID_EN Bits need to be enabled. The following is the
sequence:
1. Program the required VID Code to the
VOUT_Command code (0x21).
2. Set the VID_EN bit (Bit 3) in the VR Config 1 A
(0xD2) and on the VR Config 1B (0xD3).
This voltage is also offset by the droop voltage for
active positioning of the output voltage as a
function of current, commonly known as active
voltage positioning. The output of the amplifier is
the COMP pin, which sets the termination voltage
for the internal PWM ramps.
The negative input (FB) is tied to the output sense
location with Resistor RB and is used for sensing
and controlling the output voltage at this point. A
current source (equal to IREF) from the FB pin
flowing through RB is used for setting the no load
offset voltage from the VID voltage. The no load
voltage is negative with respect to the VID DAC
for Intel CPU’s.
Active Impedance Control Mode
For controlling the dynamic output voltage droop as a
function of output current, the CSA gain and load−line
programming can be scaled to be equal to the droop
impedance of the regulator times the output current. This
droop voltage is then used to set the input control voltage to
the system. The droop voltage is subtracted from the DAC
reference input voltage directly to tell the error amplifier
where the output voltage should be. This allows enhanced
feed forward response.
Load Line Setting
The load−line is programmable over the I2C interface on
the NCP4200. It is programmed using the Load−line
Calibration (0xDE) and Load−line Set (0xDF) commands.
The load−line can be adjusted between 0% and 100% of the
external RCSA. In this example RCSA = 1 mW RO needs to
0.8 mW therefore programming the Load−line Calibration +
Load−line Set register to give a combined percentage of
80% will set the RO to 0.8 mW.
Table 4. Load−line Commands
Code
Load−line (as a percentage of RCSA)
0 0000
0%
0 0001
3.226%
1 0000
51.6% = default
1 0001
53.3%
1 1110
96.7%
1 1111
100%
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NCP4200
The value of RB can be found using the following
equation:
RB +
V VID * V ONL
I FB
Table 6. Transition Rate Codes
(eq. 9)
An offset voltage can be added to the control voltage over
the serial interface. This is done using Bits <5:0> of the
VOUT_TRIM (0xDB) and VOUT_CAL (0xDC)
Commands. The max offset that can be applied is
±193.75 mV (even if the sum of the offsets > 193.75 mV).
The LSB size is 6.25 mV. A positive offset is applied when
Bit 5 = 0. A negative offset is applied when Bit 5 = 1.
Table 5. Offset Codes
VOUT_
TRIM
CODE
Code
Transition Rate (V/msec)
000
1
001
3
010
5 = default
011
7
100
9
101
11
110
13
111
15
Enhanced Transients Mode
TRIM
OFFSET
VOLTAGE
VOUT_
CAL
CODE
CAL
OFFSET
VOLTAGE
00 1000
50 mV
00 0010
12.5 mV
62.5 mV
10 0001
−6.25 mV
10 1110
−87.5 mV
−93.75 mV
00 1111
93.75 mV
10 0001
−6.25 mV
87.5 mV
The NCP4200 incorporates enhanced transient response
for both load step up and load release. For load step up it
senses the output of the error amp to determine if a load step
up has occurred and then sequences on the appropriate
number of phases to ramp up the output current.
For load release, it also senses the output of the error amp
and uses the load release information to trigger the TRDET
pin, which is then used to adjust the error amp feedback for
optimal positioning. This is especially important during
high frequency load steps.
Additional information is used during load transients to
ensure proper sequencing and balancing of phases during
high frequency load steps as well as minimizing the stress on
components such as the input filter and MOSFETs.
TOTAL
OFFSET
VOLTAGE
Dynamic VID
The NCP4200 has the ability to respond to dynamically
changing VID inputs while the controller is running. This
allows the output voltage to change while the supply is
running and supplying current to the load. This is commonly
referred to as Dynamic VID (DVID). A DVID can occur
under either light or heavy load conditions. The processor
signals the controller by changing the VID inputs (or by
programming a new VOUT_Command) in a single or
multiple steps from the start code to the finish code. This
change can be positive or negative.
When a VID bit changes state, the NCP4200 detects the
change and ignores the DAC inputs for a minimum of 200
ns. This time prevents a false code due to logic skew while
the VID inputs are changing. Additionally, the first VID
change initiates the PWRGD and CROWBAR blanking
functions for a minimum of 100 ms to prevent a false
PWRGD or CROWBAR event. Each VID change resets the
internal timer.
If a VID off code is detected the NCP4200 will wait for
5 msec to ensure that the code is correct before initiating a
shutdown of the controller.
The NCP4200 also uses the TON_Transition command
code (0xD6) to limit the DVID slew rates. These can be
encountered when the system does a large single VID step
for power state changes, thus the DVID slew rate needs to
be limited to prevent large inrush currents.
The transition slew rate is programmed using Bits <2:0>
of the Ton_Transition (0xD6) command code. Table 6
provides the soft−start values.
Reference Current
The IREF pin is used to set an internal current reference.
This reference current sets IFB. A resistor to ground
programs the current based on the 1.8 V output.
I REF +
1.8 V
R IREF
(eq. 10)
Typically, RIREF is set to 121 kW to program IREF = 15 mA.
I FB + I REF + 15 mA
(eq. 11)
Power Good Monitoring
The power good comparator monitors the output voltage
via the CSREF pin. The PWRGD pin is an open−drain
output whose high level (when connected to a pullup
resistor) indicates that the output voltage is within the
nominal limits. The nominal limits specified in the
specifications above based on the VID voltage setting.
PWRGD goes low if the output voltage is outside of this
specified range, if the VID DAC inputs are in no CPU mode,
or whenever the EN pin is pulled low. PWRGD is blanked
during a DVID event for a period of 100 ms to prevent false
signals during the time the output is changing.
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NCP4200
The PWRGD circuitry also incorporates an initial turn−on
delay time (TD5). Prior to the SS voltage reaching the
programmed VID DAC voltage and the PWRGD masking
time finishing, the PWRGD pin is held low. Once the SS
circuit reaches the programmed DAC voltage, the internal
timer operates.
The default range for the PWRGD comparator is +300 mV
and −500 mV. However these values can be adjusted over the
I2C Interface. The high limit is programmed using Bits <1:0>
of Command Code 0xE0 and the low limit is programmed
using Bits <2:0> of Command code 0xE1. The following is
a table of the programmable values.
The actual phases enabled, depends upon how many
phases are enabled for normal operation. For example if 4
phases are enabled normally and 2 during PSI, then Phase 1
and Phase 3 will be enabled during PSI.
Output Crowbar
As part of the protection for the load and output
components of the supply, the PWM outputs are driven low
(turning on the low−side MOSFETs) when the output
voltage exceeds the upper crowbar threshold. This crowbar
action stops once the output voltage falls below the release
threshold of approximately 300 mV. The value for the
crowbar limit follows the programmable PWRGD high
limit.
Turning on the low−side MOSFETs pulls down the output
as the reverse current builds up in the inductors. If the output
overvoltage is due to a short in the high−side MOSFET, this
action current limits the input supply, or blows its fuse
protecting the microprocessor from being destroyed.
Table 7. PWRGD High Limits
Code
PWRGD High Limits
00
+300mV (default)
01
+250 mV
10
+200 mV
11
+150 mV
Output Enable and UVLO
Table 8. PWRGD Low Limits
Code
PWRGD Low Limits
000
−500mV (default)
001
−450 mV
010
−400 mV
011
−350 mV
100
−300 mV
101
−250 mV
110
−200 mV
111
−150 mV
For the NCP4200 to begin switching the input, supply
current to the controller must be higher than the UVLO
threshold and the EN pin must be higher than its 0.8 V
threshold. This initiates a system startup sequence. If either
UVLO or EN is less than their respective thresholds, the
NCP4200 is disabled. This holds the PWM outputs at
ground and forces PWRGD, ODN and OD1 signals low.
In the application circuit (see Figure 2), the OD1 pin
should be connected to the OD inputs of the external drivers
for the phases that are always on. The ODN pin should be
connected to the OD inputs of the external drivers on the
phases that are shut down during low power operation.
Grounding the driver OD inputs disables the drivers such
that both DRVH and DRVL are grounded. This feature is
important in preventing the discharge of the output
capacitors when the controller is shut off. If the driver
outputs are not disabled, a negative voltage can be generated
during output due to the high current discharge of the output
capacitors through the inductors.
Power State Indicator
The PSI pin is an input used to determine the operating
state of the load. If this input is pulled low, the load is in a low
power state and the controller asserts the ODN pin low,
which can be used to disable phases and maintain better
efficiency at lighter loads.
The sequencing into and out of low power operation is
maintained to minimize output deviations as well as
providing full power load transients immediately after
exiting a low power state.
The user can program how many phases are enabled when
PSI is asserted. By default only phase 1 is enabled. The
number of phases enabled can be changed over the I2C
Interface. However extreme care should be taken to ensure
that OD1 is connected to all phases enabled during PSI. The
number of phases enabled during PSI is programmed using
Bits 6 and 7 of the MFR Config Command (0xD1).
Voltage Monitoring
The NCP4200 can monitor the voltage on the EN pin and
reports this back in a register. The ADC range for the voltage
measurements is 0 V to 2.0 V. Voltages greater than 2.0 V can
be monitored using a resistor divider network. Voltage
measurements are 10 bits wide.
Shunt Resistor
The NCP4200 uses a shunt to generate 5.0 V from the
12 V supply range. A trade−off can be made between the
power dissipated in the shunt resistor and the UVLO
threshold.
Figure 10 shows the typical resistor value needed to
realize certain UVLO voltages. It also gives the maximum
power dissipated in the shunt resistor for these UVLO
voltages.
Table 9. # Phases Enabled During PSI
Code
PWRGD High Limits
00
1−Phase (default)
01
2−Phases
10
1−Phase
11
1−Phase
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NCP4200
the data line high during the tenth clock pulse to assert a stop
condition. In read mode, the master device overrides the
acknowledge bit by pulling the data line high during the low
period before the ninth clock pulse; this is known as No
Acknowledge. The master takes the data line low during the
low period before the tenth clock pulse, and then high during
the tenth clock pulse to assert a stop condition.
Any number of bytes of data can be transferred over the
serial bus in one operation, but it is not possible to mix read
and write in one operation because the type of operation is
determined at the beginning and cannot subsequently be
changed without starting a new operation.
In the NCP4200, write operations contain one, two or
three bytes, and read operations contain one or two bytes.
The command code or register address determines the
number of bytes to be read or written, See the Register Map
for more information.
To write data to one of the device data registers or read
data from it, the address pointer register must be set so that
the correct data register is addressed (i.e. command code),
and then data can be written to that register or read from it.
The first byte of a read or write operation always contains an
address that is stored in the address pointer register. If data
is to be written to the device, the write operation contains a
second data byte that is written to the register selected by the
address pointer register.
This write byte operation is shown in Figure 12. The
device address is sent over the bus, and then R/W is set to 0.
This is followed by two data bytes. The first data byte is the
address of the internal data register to be written to, which
is stored in the address pointer register. The second data byte
is the data to be written to the internal data register.
1. The read byte operation is shown in Figure 13.
First the command code needs to be written to the
NCP4200 so that the required data is sent back.
This is done by performing a write to the
NCP4200 as before, but only the data byte
containing the register address is sent, because no
data is written to the register. A repeated start is
then issued and a read operation is then performed
consisting of the serial bus address; R/W bit set to
1, followed by the data byte read from the data
register.
2. It is not possible to read or write a data byte from a
data register without first writing to the address
pointer register, even if the address pointer register
is already at the correct value.
3. In addition to supporting the send byte, the
NCP4200 also supports the read byte, write byte,
read word and write word protocols.
0.325
400
0.3
350
0.275
300
0.25
250
0.225
200
0.2
0.175
150
8
9
10
11
12
13
14
15
16
Rshunt
ICC (UVLO)
Pshunt
2−0603 Limit
2−0805 Limit
Figure 10. Typical Shunt Resistor Value and Power
Dissipation for Different UVLO Voltage
The maximum power dissipated is calculated using
Equation:
P MAX +
ǒVIN(MAX) * VCC(MIN)Ǔ
R SHUNT
2
(eq. 12)
where:
VIN(MAX) is the maximum voltage from the 12 V input supply
(if the 12 V input supply is 12 V ±5%, VIN(MAX) = 12.6 V;
if the 12 V input supply is 12 V ±10%, VIN(MAX) = 13.2 V).
VCC(MIN) is the minimum VCC voltage of the NCP4200. This
is specified as 4.75 V.
RSHUNT is the shunt resistor value.
The CECC standard specification for power rating in
surface−mount resistors is: 0603 = 0.1 W, 0805 = 0.125 W,
1206 = 0.25 W.
I2C Interface
Control of the NCP4200 is carried out using the I2C
Interface. The NCP4200 is connected to this bus as a slave
device, under the control of a master controller.
Data is sent over the serial bus in sequences of nine clock
pulses: eight bits of data followed by an acknowledge bit
from the slave device. Transitions on the data line must
occur during the low period of the clock signal and remain
stable during the high period, because a low−to−high
transition when the clock is high might be interpreted as a
stop signal. The number of data bytes that can be transmitted
over the serial bus in a single read or write operation is
limited only by what the master and slave devices can
handle.
When all data bytes have been read or written, stop
conditions are established. In write mode, the master pulls
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17
NCP4200
1
9
1
9
SCL
SDA
1
0
1
0
0
A1
R/W
A0
START BY
MASTER
D6
D7
D5
D4
D3
D2
D1
D0
ACK. BY STOP BY
NCP4200 MASTER
ACK. BY
NCP4200
FRAME 1
SERIAL BUS ADDRESS BYTE
FRAME 2
COMMAND CODE
Figure 11. Send Byte
1
9
1
9
SCL
SDA
1
1
0
0
0
A1
R/W
A0
START BY
MASTER
D7
D6
D5
D4
D3
D2
D1
D0
ACK. BY
NCP4200
ACK. BY
NCP4200
FRAME 1
SERIAL BUS ADDRESS BYTE
FRAME 2
COMMAND CODE
1
9
SCL (CONTINUED)
D7
SDA (CONTINUED)
D6
D5
D4
D3
D2
D1
D0
ACK. BY
NCP4200
STOP BY
MASTER
FRAME 3
DATA BYTE
Figure 12. Write Byte
1
9
1
9
SCL
SDA
1
1
0
0
0
A1
A0
R/W
START BY
MASTER
D7
D6
D5
D4
D3
D2
D1
D0
ACK. BY
NCP4200
ACK. BY
NCP4200
FRAME 1
SERIAL BUS ADDRESS BYTE
FRAME 2
COMMAND CODE
1
9
1
9
SCL
SDA
1
1
0
0
0
A1
A0
R/W
D7
D6
D5
D4
D3
D2
ACK. BY
NCP4200
REPEATED
START BY
MASTER
D1
D0
NO ACK. BY STOP BY
MASTER MASTER
FRAME 1
SERIAL BUS ADDRESS BYTE
FRAME 2
DATA BYTE FROM NCP4200
Figure 13. Read Byte
Write Operations
1. The master device asserts a start condition on
SDA.
2. The master sends the 7−bit slave address followed
by the write bit (low).
3. The addressed slave device asserts ACK on SDA.
4. The master sends a command code.
5. The slave asserts ACK on SDA.
6. The master asserts a stop condition on SDA and
the transaction ends.
The following abbreviations are used in the diagrams:
S—START
P—STOP
R—READ
W—WRITE
A—ACKNOWLEDGE
A—NO ACKNOWLEDGE
The NCP4200 uses the following I2C write protocols.
Send Byte
In this operation, the master device sends a single
command byte to a slave device as follows:
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18
NCP4200
Block Write
For the NCP4200, the send byte protocol is used to clear
faults. This operation is shown in Figure 14.
1
2
3
SLAVE
S
W A
ADDRESS
4
5 6
COMMAND
CODE
A P
In this operation, the master device sends a command byte
and a byte count followed by the stated number of data bytes
to the slave device as follows:
1. The master device asserts a START condition on
SDA.
2. The master sends the 7−bit slave address followed
by the write bit (low).
3. The addressed slave device asserts ACK on SDA.
4. The master sends a command code
5. The slave asserts ACK on SDA
6. The master sends the byte count N
7. The slave asserts ACK on SDA
8. The master sends the first data byte
9. The slave asserts ACK on SDA
10. The master sends the second data byte.
11. The slave asserts ACK on SDA
12. The master sends the remainder of the data byes
13. The slave asserts an ACK on SDA after each data
byte.
14. After the last data byte the master asserts a STOP
condition on SDA
Figure 14. Send Byte Command
If the master is required to read data from the register
immediately after setting up the address, it can assert a repeat
start condition immediately after the final ACK and carry
out a single byte read without asserting an intermediate stop
condition.
Write Byte
In this operation, the master device sends a command byte
and one data byte to the slave device as follows:
1. The master device asserts a start condition on
SDA.
2. The master sends the 7−bit slave address followed
by the write bit (low).
3. The addressed slave device asserts ACK on SDA.
4. The master sends a command code.
5. The slave asserts ACK on SDA.
6. The master sends a data byte.
7. The slave asserts ACK on SDA.
8. The master asserts a stop condition on SDA and
the transaction ends.
The byte write operation is shown in Figure 15.
1
2
3
SLAVE
S
W A
ADDRESS
4
5
COMMAND
CODE
6
7
1
3
4
10
8
5
COMMAND
CODE
11
DATA
BYTE 2
A
6
A
...
...
7
12
13
DATA
BYTE N
A
8
9
DATA
A
BYTE 1
BYTE COUNT
A
=N
14
P
Figure 17. Block Write to a Register
A DATA A P
Read Operations
The NCP4200 uses the following I2C read protocols.
Figure 15. Single Byte Write to a Register
Read Byte
Write Word
In this operation, the master device receives a single byte
from a slave device as follows:
1. The master device asserts a start condition on
SDA.
2. The master sends the 7−bit slave address followed
by the write bit (low).
3. The addressed slave device asserts ACK on SDA.
4. The master sends a command code.
5. The slave asserted ACK on SDA.
6. The master sends a repeated start condition on
SDA.
7. The master sends the 7 bit slave address followed
by the read bit (high).
8. The slave asserts ACK on SDA.
9. The slave sends the Data Byte.
10. The master asserts NO ACK on SDA.
11. The master asserts a stop condition on SDA and
the transaction ends.
In this operation, the master device sends a command byte
and two data bytes to the slave device as follows:
1. The master device asserts a start condition on
SDA.
2. The master sends the 7−bit slave address followed
by the write bit (low).
3. The addressed slave device asserts ACK on SDA.
4. The master sends a command code.
5. The slave asserts ACK on SDA.
6. The master sends the first data byte.
7. The slave asserts ACK on SDA.
8. The master sends the second data byte.
9. The slave asserts ACK on SDA.
10. The master asserts a stop condition on SDA and
the transaction ends.
The word write operation is shown in Figure 16.
1
2
SLAVE
S
W A
ADDRESS
2
3
SLAVE
S
W A
ADDRESS
4
COMMAND
CODE
5
6
7
8
9 10
1
DATA
DATA
A
A
A P
(LSB)
(MSB)
S
Figure 16. Single Word Write to a Register
2
3
SLAVE
W A
ADDRESS
4
COMMAND
CODE
5
6
A S
7
8
9
10 11
SLAVE
R A DATA A
ADDRESS
Figure 18. Single Byte Read from a Register
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19
P
NCP4200
Read Word
5. The master sends the 7−bit slave address followed
by the read bit (high).
6. The slave asserts ACK on SDA.
7. The slave sends the byte count N.
8. The master asserts ACK on SDA.
9. The slave sends the first data byte.
10. The master asserts ACK on SDA.
11. The slave sends the remainder of the data byes, the
master asserts an ACK on SDA after each data
byte.
12. After the last data byte the master asserts a No
ACK on SDA.
13. The master asserts a STOP condition on SDA.
In this operation, the master device receives two data
bytes from a slave device as follows:
1. The master device asserts a start condition on
SDA.
2. The master sends the 7−bit slave address followed
by the write bit (low).
3. The addressed slave device asserts ACK on SDA.
4. The master sends a command code.
5. The slave asserted ACK on SDA.
6. The master sends a repeated start condition on
SDA.
7. The master sends the 7 bit slave address followed
by the read bit (high)
8. The slave asserts ACK on SDA.
9. The slave sends the first Data Byte (low Data
Byte).
10. The master asserts ACK on SDA.
11. The slave sends the second Data Byte (high Data
Byte).
12. The masters asserts a No ACK on SDA.
13. The master asserts a stop condition on SDA and
the transaction ends.
1
S
2
3
SLAVE
W A
ADDRESS
4
5
COMMAND
CODE
6
A S
7
8
9
1
3
4
5
6
7
8
9
A
DATA
BYTE 1
10
A
...
...
11
12 13
DATA
BYTE N
A P
Figure 20. Block Write to a Command Coder
I2C Timeout
The NCP4200 includes a I2C timeout feature. If there is
no I2C activity for 35 ms, the NCP4200 assumes that the bus
is locked and releases the bus. This prevents the device from
locking or holding the bus expecting data. Some I2C
controllers cannot handle the I2C timeout feature, so it can
be disabled.
Configuration Register 1 (0xD1)
Bit 3 BUS_TO_EN = 1; Bus timeout enabled.
Bit 3 TODIS = 0; Bus timeout disabled (default).
10
SLAVE
DATA
R A
A
ADDRESS
(LSB)
11
2
SLAVE
SLAVE
BYTE COUNT
S
W A S
R A
ADDRESS
ADDRESS
=N
12 13
DATA
A P
(MSB)
Figure 19. Word Read from a Command Code
Block Read
In this operation, the master device sends a command
byte, the slave sends a byte count followed by the stated
number of data bytes to the master device as follows:
1. The master device asserts a START condition on
SDA.
2. The master sends the 7−bit slave address followed
by the write bit (low).
3. The addressed slave device asserts ACK on SDA.
4. The master sends a REPEATED START condition
on SDA.
Virus Protection
To prevent rogue programs or viruses from accessing
critical NCP4200 register settings, the lock bit can be set.
Setting Bit 0 of the Lock/Reset sets the lock bit and locks
critical registers. In this mode, certain registers can no
longer be written to until the NCP4200 is powered down and
powered up again. For more information on which registers
are locked see the Register Map.
Table 10. VR11.1 and VR11 x VID CODES for the NCP4200
OUTPUT
VID7
VID6
VID5
VID4
VID3
VID2
VID1
VID0
OFF
0
0
0
0
0
0
0
0
OFF
0
0
0
0
0
0
0
1
1.60000
0
0
0
0
0
0
1
0
1.59375
0
0
0
0
0
0
1
1
1.58750
0
0
0
0
0
1
0
0
1.58125
0
0
0
0
0
1
0
1
1.57500
0
0
0
0
0
1
1
0
1.56875
0
0
0
0
0
1
1
1
1.56250
0
0
0
0
1
0
0
0
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20
NCP4200
Table 10. VR11.1 and VR11 x VID CODES for the NCP4200
OUTPUT
VID7
VID6
VID5
VID4
VID3
VID2
VID1
VID0
1.55625
0
0
0
0
1
0
0
1
1.55000
0
0
0
0
1
0
1
0
1.54375
0
0
0
0
1
0
1
1
1.53750
0
0
0
0
1
1
0
0
1.53125
0
0
0
0
1
1
0
1
1.52500
0
0
0
0
1
1
1
0
1.51875
0
0
0
0
1
1
1
1
1.51250
0
0
0
1
0
0
0
0
1.50625
0
0
0
1
0
0
0
1
1.50000
0
0
0
1
0
0
1
0
1.49375
0
0
0
1
0
0
1
1
1.48750
0
0
0
1
0
1
0
0
1.48125
0
0
0
1
0
1
0
1
1.47500
0
0
0
1
0
1
1
0
1.46875
0
0
0
1
0
1
1
1
1.46250
0
0
0
1
1
0
0
0
1.45625
0
0
0
1
1
0
0
1
1.45000
0
0
0
1
1
0
1
0
1.44375
0
0
0
1
1
0
1
1
1.43750
0
0
0
1
1
1
0
0
1.43125
0
0
0
1
1
1
0
1
1.42500
0
0
0
1
1
1
1
0
1.41875
0
0
0
1
1
1
1
1
1.41250
0
0
1
0
0
0
0
0
1.40625
0
0
1
0
0
0
0
1
1.40000
0
0
1
0
0
0
1
0
1.39375
0
0
1
0
0
0
1
1
1.38750
0
0
1
0
0
1
0
0
1.38125
0
0
1
0
0
1
0
1
1.37500
0
0
1
0
0
1
1
0
1.36875
0
0
1
0
0
1
1
1
1.36250
0
0
1
0
1
0
0
0
1.35625
0
0
1
0
1
0
0
1
1.35000
0
0
1
0
1
0
1
0
1.34375
0
0
1
0
1
0
1
1
1.33750
0
0
1
0
1
1
0
0
1.33125
0
0
1
0
1
1
0
1
1.32500
0
0
1
0
1
1
1
0
1.31875
0
0
1
0
1
1
1
1
1.31250
0
0
1
1
0
0
0
0
1.30625
0
0
1
1
0
0
0
1
1.30000
0
0
1
1
0
0
1
0
1.29375
0
0
1
1
0
0
1
1
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NCP4200
Table 10. VR11.1 and VR11 x VID CODES for the NCP4200
OUTPUT
VID7
VID6
VID5
VID4
VID3
VID2
VID1
VID0
1.28750
0
0
1
1
0
1
0
0
1.28125
0
0
1
1
0
1
0
1
1.27500
0
0
1
1
0
1
1
0
1.26875
0
0
1
1
0
1
1
1
1.26250
0
0
1
1
1
0
0
0
1.25625
0
0
1
1
1
0
0
1
1.25000
0
0
1
1
1
0
1
0
1.24375
0
0
1
1
1
0
1
1
1.23750
0
0
1
1
1
1
0
0
1.23125
0
0
1
1
1
1
0
1
1.22500
0
0
1
1
1
1
1
0
1.21875
0
0
1
1
1
1
1
1
1.21250
0
1
0
0
0
0
0
0
1.20625
0
1
0
0
0
0
0
1
1.20000
0
1
0
0
0
0
1
0
1.19375
0
1
0
0
0
0
1
1
1.18750
0
1
0
0
0
1
0
0
1.18125
0
1
0
0
0
1
0
1
1.17500
0
1
0
0
0
1
1
0
1.16875
0
1
0
0
0
1
1
1
1.16250
0
1
0
0
1
0
0
0
1.15625
0
1
0
0
1
0
0
1
1.15000
0
1
0
0
1
0
1
0
1.14375
0
1
0
0
1
0
1
1
1.13750
0
1
0
0
1
1
0
0
1.13125
0
1
0
0
1
1
0
1
1.12500
0
1
0
0
1
1
1
0
1.11875
0
1
0
0
1
1
1
1
1.11250
0
1
0
1
0
0
0
0
1.10625
0
1
0
1
0
0
0
1
1.10000
0
1
0
1
0
0
1
0
1.09375
0
1
0
1
0
0
1
1
1.08750
0
1
0
1
0
1
0
0
1.08125
0
1
0
1
0
1
0
1
1.07500
0
1
0
1
0
1
1
0
1.06875
0
1
0
1
0
1
1
1
1.06250
0
1
0
1
1
0
0
0
1.05625
0
1
0
1
1
0
0
1
1.05000
0
1
0
1
1
0
1
0
1.04375
0
1
0
1
1
0
1
1
1.03750
0
1
0
1
1
1
0
0
1.03125
0
1
0
1
1
1
0
1
1.02500
0
1
0
1
1
1
1
0
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22
NCP4200
Table 10. VR11.1 and VR11 x VID CODES for the NCP4200
OUTPUT
VID7
VID6
VID5
VID4
VID3
VID2
VID1
VID0
1.01875
0
1
0
1
1
1
1
1
1.01250
0
1
1
0
0
0
0
0
1.00625
0
1
1
0
0
0
0
1
1.00000
0
1
1
0
0
0
1
0
0.99375
0
1
1
0
0
0
1
1
0.98750
0
1
1
0
0
1
0
0
0.98125
0
1
1
0
0
1
0
1
0.97500
0
1
1
0
0
1
1
0
0.96875
0
1
1
0
0
1
1
1
0.96250
0
1
1
0
1
0
0
0
0.95625
0
1
1
0
1
0
0
1
0.95000
0
1
1
0
1
0
1
0
0.94375
0
1
1
0
1
0
1
1
0.93750
0
1
1
0
1
1
0
0
0.93125
0
1
1
0
1
1
0
1
0.92500
0
1
1
0
1
1
1
0
0.91875
0
1
1
0
1
1
1
1
0.91250
0
1
1
1
0
0
0
0
0.90625
0
1
1
1
0
0
0
1
0.90000
0
1
1
1
0
0
1
0
0.89375
0
1
1
1
0
0
1
1
0.88750
0
1
1
1
0
1
0
0
0.88125
0
1
1
1
0
1
0
1
0.87500
0
1
1
1
0
1
1
0
0.86875
0
1
1
1
0
1
1
1
0.86250
0
1
1
1
1
0
0
0
0.85625
0
1
1
1
1
0
0
1
0.85000
0
1
1
1
1
0
1
0
0.84375
0
1
1
1
1
0
1
1
0.83750
0
1
1
1
1
1
0
0
0.83125
0
1
1
1
1
1
0
1
0.82500
0
1
1
1
1
1
1
0
0.81875
0
1
1
1
1
1
1
1
0.81250
1
0
0
0
0
0
0
0
0.80625
1
0
0
0
0
0
0
1
0.80000
1
0
0
0
0
0
1
0
0.79375
1
0
0
0
0
0
1
1
0.78750
1
0
0
0
0
1
0
0
0.78125
1
0
0
0
0
1
0
1
0.77500
1
0
0
0
0
1
1
0
0.76875
1
0
0
0
0
1
1
1
0.76250
1
0
0
0
1
0
0
0
0.75625
1
0
0
0
1
0
0
1
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23
NCP4200
Table 10. VR11.1 and VR11 x VID CODES for the NCP4200
OUTPUT
VID7
VID6
VID5
VID4
VID3
VID2
VID1
VID0
0.75000
1
0
0
0
1
0
1
0
0.74375
1
0
0
0
1
0
1
1
0.73750
1
0
0
0
1
1
0
0
0.73125
1
0
0
0
1
1
0
1
0.72500
1
0
0
0
1
1
1
0
0.71875
1
0
0
0
1
1
1
1
0.71250
1
0
0
1
0
0
0
0
0.70625
1
0
0
1
0
0
0
1
0.70000
1
0
0
1
0
0
1
0
0.69375
1
0
0
1
0
0
1
1
0.68750
1
0
0
1
0
1
0
0
0.68125
1
0
0
1
0
1
0
1
0.67500
1
0
0
1
0
1
1
0
0.66875
1
0
0
1
0
1
1
1
0.66250
1
0
0
1
1
0
0
0
0.65625
1
0
0
1
1
0
0
1
0.65000
1
0
0
1
1
0
1
0
0.64375
1
0
0
1
1
0
1
1
0.63750
1
0
0
1
1
1
0
0
0.63125
1
0
0
1
1
1
0
1
0.62500
1
0
0
1
1
1
1
0
0.61875
1
0
0
1
1
1
1
1
0.61250
1
0
1
0
0
0
0
0
0.60625
1
0
1
0
0
0
0
1
0.60000
1
0
1
0
0
0
1
0
0.59375
1
0
1
0
0
0
1
1
0.58750
1
0
1
0
0
1
0
0
0.58125
1
0
1
0
0
1
0
1
0.57500
1
0
1
0
0
1
1
0
0.56875
1
0
1
0
0
1
1
1
0.56250
1
0
1
0
1
0
0
0
0.55625
1
0
1
0
1
0
0
1
0.55000
1
0
1
0
1
0
1
0
0.54375
1
0
1
0
1
0
1
1
0.53750
1
0
1
0
1
1
0
0
0.53125
1
0
1
0
1
1
0
1
0.52500
1
0
1
0
1
1
1
0
0.51875
1
0
1
0
1
1
1
1
0.51250
1
0
1
1
0
0
0
0
0.50625
1
0
1
1
0
0
0
1
0.50000
1
0
1
1
0
0
1
0
OFF
1
1
1
1
1
1
1
0
OFF
1
1
1
1
1
1
1
1
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24
NCP4200
Table 11. I2C Commands for the NCP4200
Cmd
Code
R/W
Default
0x01
R/W
0x80
Operation
1
0x02
R/W
0x17
ON_OFF_Config
1
Description
#
Bytes
Comment
00xx xxxx – Immediate Off
01xx xxxx – Soft Off
1000 xxxx – On (slew rate set by soft−start) − Default
1001 10xx – Margin Low (Act on Fault)
1010 10xx – Margin High (Act on Fault)
Configures how the controller is turned on and off.
Bit
Default
7:5
000
Comment
4
1
This bit is read only. Switching starts when
commanded by the Control Pin and the
Operation Command, as set in Bits 3:0.
3
0
0: Unit ignores OPERATION commands over
the I2C interface
1: Unit responds to OPERATION command,
powerup may also depend upon Control input,
as described in Bit 2
2
1
0: Unit ignores EN pin
1: Unit responds EN pin, powerup may also
depend upon the Operation Register, as
described for Bit 3
1
1
Control Pin polarity
0 = Active Low
1 = Active High
0
1
This bit is read only.
1: means that when the controller is disabled it
will either immediately turn off or soft off (as set
in the Operation Command)
Reserved for Future Use
0x03
W
NA
Clear_Faults
0
Writing any value to this command code will clear all Status Bits
immediately. The SMBus ALERT is deasserted on this command. If
the fault is still present the fault bit shall immediately be asserted
again.
0x10
R/W
0x00
Write Protect
1
The Write_Protect command is used to control writing to the I2C
device. There is also a lock bit in the Manufacture Specific Registers
that once set will disable writes to all commands until the power to the
NCP4200 is cycled.
Data Byte
0x19
R
0x20
R
0x21
0x25
0xB0
Capability
1
Comment
1000 0000
Disables all writes except to the Write_Protect
Command
0100 0000
Disables all writes except to the Write_Protect
and Operation Commands
0010 0000
Disables all writes except to the Write_Protect,
Operation, ON_OFF_Config and
VOUT_COMMAND Commands
0000 0000
Enables writes to all commands
0001 0000
Disables all writes except to
WRITE_PROTECT, PAGE and all
MFR−SPECIFIC Commands
This command allows the host to get some information on the I2C
device.
Bit
Default
7
1
PEC (Packet Error Checking is supported)
Comment
6:5
01
Max supported bus speed is 400 kHz
4
1
NCP4200 has an SMBus ALERT pin and ARA
is supported
3:0
000
Reserved for future use
0x20
VOUT_MODE
1
The NCP4200 supports VID mode for programming the output
voltage.
R/W
0x00
VOUT_COMMAND
2
Sets the output voltage using VID.
R/W
0x0020
VOUT_MARGIN_HIGH
2
Sets the output voltage when operation command is set to Margin
High. Programmed in VID Mode.
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25
NCP4200
Cmd
Code
R/W
Default
0x26
R/W
0x00B2
VOUT_MARGIN_LOW
2
Sets the output voltage when operation command is set to Margin
Low. Programmed in VID Mode.
0x38
R/W
0x0001
IOUT_CAL_GAIN
2
Sets the ratio of voltage sensed to current output. Scale is Linear and
is expressed in 1/W
0x39
R/W
0x0000
IOUT_CAL_OFFSET
2
This offset is used to null out any offsets in the output current sensing
circuitry. Units are Amps
0x4A
R/W
0x0064
IOUT_OC_WARN_LIMIT
2
This sets the high current limit. Once this limit is exceeded
IOUT_OC_WARN_LIMIT bit is set in the Status_IOUT register and an
ALERT is generated. This limit is set in Amps.
0x68
R/W
0x012C
POUT_OP_FAULT_LIMIT
2
This sets the output power over power fault limit. Once exceeded Bit
1 of the Status IOUT Command gets set and the FAULT output gets
asserted (if not masked).
0x6A
R/W
0x012C
POUT_OP_WARN
LIMIT
2
This sets the output power over power warn limit. Once exceeded Bit
0 of the Status IOUT Command gets set and the ALERT output gets
asserted (if not masked)
0x78
R
0x00
STATUS BYTE
1
Bit
Name
7
BUSY
A fault was declared because the NCP4200
was busy and unable to respond.
6
OFF
This bit is set whenever the NCP4200 is not
switching.
5
VOUT_OV
This bit gets set whenever the NCP4200 goes
into OVP mode.
4
IOUT_OC
This bit gets set whenever the NCP4200
latches off due to an overcurrent event.
3
Res
0x79
R
0x0000
Description
STATUS WORD
#
Bytes
2
Comment
Description
2
Res
1
CML
0
None of the
Above
Byte
Bit
Low
7
Res
Low
6
OFF
Low
5
VOUT_OV
This bit gets set whenever the
NCP4200 goes into OVP mode.
Low
4
IOUT_OC
This bit gets set whenever the
NCP4200 latches off due to an
overcurrent event.
Low
3
Res
Low
2
Res
Low
1
CML
High
0
None of the
Above
A fault has occurred which is not
one of the above.
High
7
VOUT
This bit gets set whenever the
measured output voltage goes
outside its power good limits or
an OVP event has taken place,
i.e. any bit in Status VOUT is set.
High
6
IOUT/POUT
This bit gets set whenever the
measured output current or
power exceeds its warning limit
or goes into OCP. i.e. any bit in
Status IOUT is set.
High
5
Res
High
4
MFR
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26
A Communications, memory or logic fault has
occurred.
A fault has occurred which is not one of the
above.
Name
Description
This bit is set whenever the
NCP4200 is not switching.
A Communications, memory or
logic fault has occurred.
A manufacturer specific warning
or fault has occurred.
NCP4200
Cmd
Code
0x7A
0x7B
0x7E
R/W
R
R
R
Default
0x00
0x00
0x00
Description
STATUS VOUT
STATUS IOUT
STATUS CML
#
Bytes
1
1
1
Comment
High
3
POWER_
GOOD
The Power−Good signal is
deasserted. Same as
Power−Good in General Status.
High
2
Res
High
1
OTHER
High
0
Res
Bit
Name
7
VOUT_
OVER
VOLTAGE
FAULT
This bit gets set whenever OVP event takes
place.
6
VOUT_
OVER
VOLTAGE
WARNING
This bit gets set whenever the measured output
voltage goes above its power−good limit.
5
VOUT_
UNDER
VOLTAGE
WARNING
This bit gets set whenever the measured output
voltage goes below its power−good limit.
4
VOUT_
UNDER
VOLTAGE
FAULT
Not applicable.
3
Res
2
Res
1
Res
A Status bit in Status Other is
asserted.
Description
0
Res
Bit
Name
Description
7
IOUT
Overcurrent
Fault
This bit gets set if the NCP4200 latches off due
to an OCP Event.
6
Res
5
IOUT
Overcurrent
Warning
4
Res
3
Res
This bit gets set if IOUT exceeds its programmed
high warning limit.
2
Res
1
POUT Over
Power
Warning
This bit gets set if the measured POUT exceeds
the FAULT Limit.
0
POUT Over
Power
Warning
Fault
This bit gets set if the measured POUT exceeds
the Warn Limit.
Bit
Desc
7
Supported
Invalid or Unsupported Command Received.
6
Supported
Invalid or Unsupported Data Received.
5
Supported
PEC Failed.
4
Not
supported
Memory Fault Detected.
3
Not
supported
Processor Fault Detected.
2
Not
supported
1
Supported
A communication fault other than the ones listed
has occurred.
0
Not
supported
Other memory or Logic Fault has occurred.
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27
Name
NCP4200
Cmd
Code
R/W
Default
0x80
R
0x00
0x88
R
0x00
Description
STATUS_ALERT
#
Bytes
1
Comment
Bit
Name
7
Res
6
Res
5
Res
4
Res
Description
3
Res
2
VMON
WARN
Gets asserted when VMON exceeds it
programmed WARN limits.
1
VMON
FAULT
Gets asserted when VMON exceeds it
programmed FAULT limits.
0
Res
2
0x8B
R
0x00
READ_VOUT
2
Read−back output voltage. Voltage is read back in VID Mode.
0x8C
R
0x00
READ_IOUT
2
Read−back output current. Current is read back in Linear Mode
(Amps).
0x8D
R
0x00
0x96
R
0x00
0x99
R
0x9A
0x9B
2
READ_POUT
2
0x4101
MFR_ID
1
0x4101
Read−back Output Power, read back in Linear Mode in W’s.
R
0x0002
MFR_MODEL
2
0x0002
R
0x0301
MFR_REVISION
1
0x0301
Table 12. Manufacturer Specific Command Codes for the NCP4200
Cmd
Code
R/W
Default
0xDO
R/W
0x00
0xD1
R/W
0x07
Description
Lock/Reset
Mfr Config
#
Bytes
1
1
Comment
Bit
Name
1
Reset
Resets all registers to their POR Value. Has
no effect if Lock bit is set.
Description
0
Lock
Logic 1 locks all limit values to their current
settings. Once this bit is set, all lockable
registers become read−only and cannot be
modified until the NCP4200 is powered down
and powered up again. This prevents rogue
programs such as viruses from modifying
critical system limit settings. (Lockable).
Bit
Name
Description
7:6
PSI
These bits sets the number of phases turned
on during PSI.
00 = CL set for 1 Phase (default)
01 = CL set for 2 Phases
10 = CL set for 1 Phase
11 = CL set for 1 Phase
5
Res
4
Res
3
BUS_TO_EN
Bus Timeout Enable. When the BUS_TO_EN
bit is set to 1, the I2C Timeout feature is
enabled. In this state if, at any point during an
I2C transaction involving the NCP4200,
activity ceases for more than 35 ms, the
NCP4200 assumes the bus is locked and
releases the bus. This allows the NCP4200 to
be used with I2C controllers that cannot
handle I2C timeouts. (Lockable).
2
FAULT_EN
Enable the FAULT pin, Default = 1.
1
ALERT_EN
Enable the ALERT pin.
0
ENABLE_
MONITOR
When the ENABLE_MONITOR bit is set to 1,
the NCP4200 starts conversions with the ADC
and monitors the voltages.
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NCP4200
Cmd
Code
R/W
Default
0xD2
R/W
0x52
Description
VR Config. 1A
#
Bytes
1
Comment
Bit
Name
6:4
Phase
Enable Bits
Description
3
VID_EN
When the VID_EN bit is set to 1, the VID
code in the VOUT_COMMAND register sets
the output voltage. When VID_EN is set to 0,
the output voltage follows the VID input pins.
2
LOOP_EN
When the LOOP_EN bit is set to 1 in both
registers, the control loop test function is
enabled. This allows measurement of the
control loop AC gain and phase response with
appropriate instrumentation. The control loop
signal insertion pin is IMON. The control loop
output pin is COMP.
1
CLIM_EN
When CLIM_EN is set to 1, the current limit
time out latchoff functions normally. When this
bit is set to 0 in both registers, the current limit
latchoff is disabled. In this state, the part can
be in current limit indefinitely.
0
Res
000 = Phase 1
100 = Phase 2
010 = Phase 3
110 = Phase 4
0xD3
R/W
0x52
VR Config. 1B
1
This register is for security reasons. It has the same format as
register 0xD2. Bits need to be set in both registers for the function to
take effect.
0xD4
R/W
0x03
Ton Delay
1
This resister sets TD1, TD3 and TD5 delays for the soft−start
sequence. The current limit latchoff timer is 4 times the programmed
delay time:
000 = 0.5 ms
001 = 1 ms
010 = 1.5 ms
011 = 2 ms = default
100 = 2.5 ms
101 = 3 ms
110 = 3.5 ms
111 = 4 ms
0xD5
R/W
0x02
Ton Rise
1
This register sets the soft−start voltage slew rate, and hence TD2
and TD4, of the soft−start sequence:
000 = 0.1 V/ms
001 = 0.3 V/ms
010 = 0.5 V/ms = default
011 = 0.7 V/ms
100 = 0.9 V/ms
101 = 1.1 V/ms
110 = 1.3 V/ms
111 = 1.5 V/ms
0xD6
R/W
0x01
Ton Transition
1
This register sets the slew rate during dynamic VID.
0xD8
R
0x00
EN/VTT Voltage
2
This is a 16 bit value that reports back the voltage on the VTT Pin.
Voltage is reported using Linear Mode.
0xDA
R
0x00
VMON Voltage
1
This is a 16 bit value that reports back the voltage measured
between FB and FBRTN. Voltage is reported using Linear Mode.
0xDB
R/W
0x00
VOUT_TRIM
1
Offset Command Code for VOUT, max ±200 mV.
0xDC
R/W
0x00
VOUT_CAL
1
Offset Command Code for VOUT, max ±200 mV.
0xDE
R/W
0x10
Load−line Calibration
1
This value sets the internal load−line attenuation DAC calibration
value. The maximum load−line is controlled externally by setting the
gain of the current sense amplifier as explained in the applications
section. This maximum load−line can then be adjusted from 100% to
0% in 30 steps. Each LSB represents a 3.226% change in the
load−line.
00000 = No load−line
10000 = 51.6% of external load−line
11111 = 100% of external load−line
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29
NCP4200
Cmd
Code
R/W
Default
0xDF
R/W
0x00
Load−line Set
1
This value sets the internal load−line attenuation DAC value. The
maximum load−line is controlled externally by setting the gain of the
current sense amplifier as explained in the applications section. This
maximum load−line can then be adjusted from 100% to 0% in 30
steps. Each LSB represents a 3.226% change in the load−line.
00000 = No load−line
10000 = 51.613% of external load−line
11111 = 100% of external load−line
0xE0
R/W
0x00
PWRGD Hi Threshold
1
This value sets the PWRGD Hi Threshold and the CROWBAR
Threshold:
Code = 00, PWRGD HI = 300 mV (default)
Code = 01, PWRGD HI = 250 mV
Code = 10, PWRGD HI = 200 mV
Code = 11, PWRGD HI = 150 mV
0xE1
R/W
0x00
PWRGD Lo Threshold
1
This value sets the PWRGD Lo Threshold:
Code = 000, PWRGD Lo = −500 mV (default)
Code = 001, PWRGD Lo = −450 mV
Code = 010, PWRGD Lo = −400 mV
Code = 011, PWRGD Lo = −350 mV
Code = 100, PWRGD Lo = −300 mV
Code = 101, PWRGD Lo = −250 mV
Code = 110, PWRGD Lo = −200 mV
Code = 111, PWRGD Lo = −150 mV
0xE2
R/W
0x10
Current Limit Threshold
1
This value sets the internal current limit adjustment value. The default
current limit is programmed using a resistor to ground on the LIMIT
pin. The value of this register adjusts this value by a percentage
between 50% and 146.7%. Each LSB represents a 3.33% change in
the current limit threshold.
11111 = 146.7% of external current limit
10000 = 100% of external current limit (default)
00000 = 50% of external current limit
0xE3
R/W
0x10
Phase Bal SW1
1
These values adjust the gain of the internal phase balance amplifiers.
The nominal gain is set to 5. These registers can adjust the gain by
±25% from 3.75 to 6.25.
Code = 00000, Gain of 3.75
Code = 10000, Gain of 5 (default)
Code = 11111, Gain of 6.25
0xE4
R/W
0x10
Phase Bal SW2
1
These values adjust the gain of the internal phase balance amplifiers.
The nominal gain is set to 5. These registers can adjust the gain by
±25% from 3.75 to 6.25.
Code = 00000, Gain of 3.75
Code = 10000, Gain of 5 (default)
Code = 11111, Gain of 6.25
0xE5
R/W
0x10
Phase Bal SW3
1
These values adjust the gain of the internal phase balance amplifiers.
The nominal gain is set to 5. These registers can adjust the gain by
±25% from 3.75 to 6.25.
Code = 00000, Gain of 3.75
Code = 10000, Gain of 5 (default)
Code = 11111, Gain of 6.25
0xE6
R/W
0x10
Phase Bal SW4
1
These values adjust the gain of the internal phase balance amplifiers.
The nominal gain is set to 5. These registers can adjust the gain by
±25% from 3.75 to 6.25.
Code = 00000, Gain of 3.75
Code = 10000, Gain of 5 (default)
Code = 11111, Gain of 6.25
0xF5
R/W
0x0002
VMON FAULT Limit
2
0xF6
R/W
0x0002
VMON Warn Limit
2
VMON Warn Limit
0xF9
R/W
0x00
Mask ALERT
1
Bit
Name
7
Mask VOUT
Masks any ALERT caused by bits in Status
VOUT Register.
6
Mask IOUT
Masks any ALERT caused by bits in Status
IOUT Register.
5
Res
4
Res
Description
#
Bytes
Comment
VMON FAULT Limit
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30
Description
NCP4200
Cmd
Code
0xFA
0xFB
0xFC
R/W
R/W
R
R
Default
0x00
0x00
0x00
Description
Mask FAULT
General Status
Phase Status
#
Bytes
1
1
1
Comment
3
Mask CML
2
VMON
1
Res
0
Mask POUT
Masks any ALERT caused by bits in Status
CML Register.
Masks any ALERT caused by VMON
exceeding its high or low limit.
Masks any ALERT caused by POUT
exceeding its programmed limit.
Bit
Name
7
Mask VOUT
Masks any FAULT caused by bits in Status
VOUT Register.
6
Mask IOUT
Masks any FAULT caused by bits in Status
IOUT Register.
5
Res
4
Res
3
Mask CML
2
VMON
1
Res
0
Mask POUT
Bit
Name
7
FAULT
6
ALERT
5
POWER_
GOOD
Description
Masks any FAULT caused by bits in Status
CML Register.
Masks any ALERT caused by VMON
exceeding its high or low limit.
Masks any FAULT caused by POUT
exceeding its programmed limit.
Description
Replaced by Bit 3 of the Status Word
Command
4
RDY
Bit
Name
5
Phase 4
This bit is set to 1 when Phase 4 is enabled.
4
Phase 3
This bit is set to 1 when Phase 3 is enabled.
3
Phase 2
This bit is set to 1 when Phase 2 is enabled.
2
PSI
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31
Description
This bit is set to 1 when PSI is asserted.
NCP4200
PACKAGE DIMENSIONS
QFN40 6x6, 0.5P
CASE 488AR
ISSUE A
PIN ONE
LOCATION
2X
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSIONS: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30mm FROM TERMINAL
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A B
D
ÉÉÉ
ÉÉÉ
ÉÉÉ
E
DIM
A
A1
A3
b
D
D2
E
E2
e
L
K
0.15 C
2X
TOP VIEW
0.15 C
(A3)
0.10 C
A
40X
0.08 C
SIDE VIEW A1
C
D2
L
40X
11
SEATING
PLANE
SOLDERING FOOTPRINT*
K
20
40X
6.30
21
10
EXPOSED PAD
4.20
40X
E2
b
0.10 C A B
40X
0.05 C
MILLIMETERS
MIN
MAX
0.80
1.00
0.00
0.05
0.20 REF
0.18
0.30
6.00 BSC
4.00
4.20
6.00 BSC
4.00
4.20
0.50 BSC
0.30
0.50
0.20
−−−
0.65
1
30
1
40
31
e
4.20 6.30
36X
BOTTOM VIEW
40X
0.30
36X
0.50 PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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NCP4200/D