MC74HC1G00 D

MC74HC1G00
Single 2-Input NAND Gate
The MC74HC1G00 is a high speed CMOS 2−input NAND gate
fabricated with silicon gate CMOS technology.
The internal circuit is composed of multiple stages, including a
buffer output which provides high noise immunity and stable output.
•
•
•
•
•
•
•
•
High Speed: tPD = 7 ns (Typ) at VCC = 5 V
Low Power Dissipation: ICC = 1 mA (Max) at TA = 25°C
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High Noise Immunity
MARKING
DIAGRAMS
Balanced Propagation Delays (tPLH = tPHL)
Symmetrical Output Impedance (IOH = IOL = 2 mA)
5
Chip Complexity: FETs = 40
These Devices are Pb−Free and are RoHS Compliant
NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
1
H1 MG
G
SC70−5/SC−88A/SOT−353
DF SUFFIX
CASE 419A
5
H1 MG
G
1
IN B
1
IN A
2
GND
5
3
VCC
4
SOT23−5/TSOP−5/SC59−5
DT SUFFIX
CASE 483
H1
M
G
OUT Y
= Specific Device Code
= Date Code
= Pb−Free Package
(Note: Microdot may be in either location)
Figure 1. Pinout (Top View)
PIN ASSIGNMENT
IN A
&
IN B
OUT Y
Figure 2. Logic Symbol
1
IN B
2
IN A
3
GND
4
OUT Y
5
VCC
FUNCTION TABLE
Output
Inputs
A
B
Y
L
L
H
H
L
H
L
H
H
H
H
L
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
© Semiconductor Components Industries, LLC, 2013
June, 2013 − Rev. 11
1
Publication Order Number:
MC74HC1G00/D
MC74HC1G00
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
VCC
DC Supply Voltage
*0.5 to )7.0
V
VIN
DC Input Voltage
*0.5 to VCC )0.5
V
VOUT
DC Output Voltage
*0.5 to VCC )0.5
V
IIK
DC Input Diode Current
$20
mA
IOK
DC Output Diode Current
$20
mA
IOUT
DC Output Sink Current
$12.5
mA
ICC
DC Supply Current per Supply Pin
$25
mA
TSTG
Storage Temperature Range
*65 to )150
_C
TL
Lead Temperature, 1 mm from Case for 10 Seconds
260
_C
TJ
Junction Temperature Under Bias
qJA
Thermal Resistance
PD
Power Dissipation in Still Air at 85_C
MSL
Moisture Sensitivity
FR
Flammability Rating
VESD
ESD Withstand Voltage
ILATCHUP
Latchup Performance
)150
_C
SC70−5/SC−88A (Note 1)
TSOP−5
350
230
_C/W
SC70−5/SC−88A
TSOP−5
150
200
mW
Level 1
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
u2000
u200
N/A
V
Above VCC and Below GND at 125_C (Note 5)
$500
mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
VCC
DC Supply Voltage
2.0
6.0
V
VIN
DC Input Voltage
0.0
VCC
V
VOUT
DC Output Voltage
0.0
VCC
V
TA
Operating Temperature Range
*55
)125
_C
tr , tf
Input Rise and Fall Time
0
0
0
0
1000
600
500
400
ns
VCC = 2.0 V
VCC = 3.0 V
VCC = 4.5 V
VCC = 6.0 V
47.9
100
178,700
20.4
110
79,600
9.4
120
37,000
4.2
130
17,800
2.0
140
8,900
1.0
TJ = 80_C
117.8
419,300
TJ = 90_C
1,032,200
90
TJ = 100_C
80
TJ = 110_C
Time, Years
TJ = 120_C
Time, Hours
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
TJ = 130_C
Junction
Temperature °C
NORMALIZED FAILURE RATE
DEVICE JUNCTION TEMPERATURE VERSUS
TIME TO 0.1% BOND FAILURES
1
1
10
100
1000
TIME, YEARS
Figure 3. Failure Rate vs. Time Junction Temperature
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2
MC74HC1G00
DC ELECTRICAL CHARACTERISTICS
VCC
Symbol
Parameter
Test Conditions
(V)
Min
1.5
2.1
3.15
4.20
VIH
Minimum High−Level
Input Voltage
2.0
3.0
4.5
6.0
VIL
Maximum Low−Level
Input Voltage
2.0
3.0
4.5
6.0
VOH
Minimum High−Level
Output Voltage
VIN = VIH or VIL
VIN = VIH or VIL
IOH = −20 mA
VIN = VIH or VIL
IOH = −2 mA
IOH = −2.6 mA
VOL
Maximum Low−Level
Output Voltage
VIN = VIH or VIL
VIN = VIH or VIL
IOL = 20 mA
TA = 25_C
Typ
TA v 85_C
Max
Min
*55_C v TA v 125_C
Max
Min
1.5
2.1
3.15
4.20
0.5
0.9
1.35
1.80
Max
1.5
2.1
3.15
4.20
0.5
0.9
1.35
1.80
V
0.5
0.9
1.35
1.80
2.0
3.0
4.5
6.0
1.9
2.9
4.4
5.9
2.0
3.0
4.5
6.0
1.9
2.9
4.4
5.9
1.9
2.9
4.4
5.9
4.5
6.0
4.18
5.68
4.31
5.80
4.13
5.63
4.08
5.58
Unit
V
V
2.0
3.0
4.5
6.0
0.0
0.0
0.0
0.0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
VIN = VIH or VIL
IOL = 2 mA
IOL = 2.6 mA
4.5
6.0
0.17
0.18
0.26
0.26
0.33
0.33
0.40
0.40
V
IIN
Maximum Input
Leakage Current
VIN = 6.0 V or GND
6.0
$0.1
$1.0
$1.0
mA
ICC
Maximum Quiescent
Supply Current
VIN = VCC or GND
6.0
1.0
10
40
mA
AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 6.0 ns)
TA = 25_C
Symbol
Parameter
Test Conditions
tPLH,
tPHL
Maximum
Propagation Delay,
Input A or B to Y
tTLH,
tTHL
Output Transition
Time
CIN
Maximum Input
Capacitance
CPD
Power Dissipation Capacitance (Note 6)
Min
Typ
TA v 85_C
Max
Min
*55_C v TA v 125_C
Max
Min
Max
Unit
ns
VCC = 5.0 V
CL = 15 pF
3.5
15
20
25
VCC = 2.0 V
VCC = 3.0 V
VCC = 4.5 V
VCC = 6.0 V
CL = 50 pF
19
10.5
7.5
6.5
100
27
20
17
125
35
25
21
155
90
35
26
VCC = 5.0 V
CL = 15 pF
3
10
15
20
VCC = 2.0 V
VCC = 3.0 V
VCC = 4.5 V
VCC = 6.0 V
CL = 50 pF
25
16
11
9
125
35
25
21
155
45
31
26
200
60
38
32
5
10
10
10
ns
pF
Typical @ 25_C, VCC = 5.0 V
10
pF
6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic
power consumption; PD = CPD VCC2 fin + ICC VCC.
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3
MC74HC1G00
VCC
INPUT
A or B 90%
50%
10%
tf
tr
VCC
CL*
GND
tPLH
OUTPUT Y
OUTPUT
INPUT
tPHL
90%
50%
10%
tTLH
*Includes all probe and jig capacitance.
A 1−MHz square input wave is recommended for
propagation delay tests.
tTHL
Figure 4. Switching Waveforms
Figure 5. Test Circuit
DEVICE ORDERING INFORMATION
Device Nomenclature
Logic
Circuit
Indicator
Temp
Range
Identifier
MC
MC74HC1G00DFT2G
MC74HC1G00DTT1G
Device Order
Number
MC74HC1G00DFT1G
Technology
Device
Function
Package
Suffix
Tape and
Reel
Suffix
74
HC1G
00
DF
MC
74
HC1G
00
MC
74
HC1G
00
Package
Type
Tape and
Reel Size†
T1
SC70−5/SC−88A/
SOT−353
(Pb−Free)
178 mm (7 in)
3000 Unit
DF
T2
SC70−5/SC−88A/
SOT−353
(Pb−Free)
178 mm (7 in)
3000 Unit
DT
T1
SOT23−5/TSOP−5/
SC59−5
(Pb−Free)
178 mm (7 in)
3000 Unit
NLV74HC1G00DFT1G*
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
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4
MC74HC1G00
PACKAGE DIMENSIONS
SC−88A (SC−70−5/SOT−353)
CASE 419A−02
ISSUE L
A
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
G
5
4
−B−
S
1
2
DIM
A
B
C
D
G
H
J
K
N
S
3
D 5 PL
0.2 (0.008)
B
M
M
N
J
C
K
H
SOLDER FOOTPRINT
0.50
0.0197
0.65
0.025
0.65
0.025
0.40
0.0157
1.9
0.0748
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5
SCALE 20:1
mm Ǔ
ǒinches
INCHES
MIN
MAX
0.071
0.087
0.045
0.053
0.031
0.043
0.004
0.012
0.026 BSC
--0.004
0.004
0.010
0.004
0.012
0.008 REF
0.079
0.087
MILLIMETERS
MIN
MAX
1.80
2.20
1.15
1.35
0.80
1.10
0.10
0.30
0.65 BSC
--0.10
0.10
0.25
0.10
0.30
0.20 REF
2.00
2.20
MC74HC1G00
PACKAGE DIMENSIONS
TSOP−5
CASE 483−02
ISSUE K
D 5X
NOTE 5
2X
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE. DIMENSION A.
5. OPTIONAL CONSTRUCTION: AN ADDITIONAL
TRIMMED LEAD IS ALLOWED IN THIS LOCATION.
TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2
FROM BODY.
0.20 C A B
0.10 T
M
2X
0.20 T
B
5
1
4
2
B
S
3
K
DETAIL Z
G
A
A
TOP VIEW
DIM
A
B
C
D
G
H
J
K
M
S
DETAIL Z
J
C
0.05
H
SIDE VIEW
C
SEATING
PLANE
END VIEW
MILLIMETERS
MIN
MAX
3.00 BSC
1.50 BSC
0.90
1.10
0.25
0.50
0.95 BSC
0.01
0.10
0.10
0.26
0.20
0.60
0_
10 _
2.50
3.00
SOLDERING FOOTPRINT*
0.95
0.037
1.9
0.074
2.4
0.094
1.0
0.039
0.7
0.028
SCALE 10:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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MC74HC1G00/D