2-Input NAND Schmitt-Trigger

MC74VHC1G132
2-Input NAND
Schmitt-Trigger
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MARKING
DIAGRAMS
5
5
1
M
The MC74VHC1G132 is a single gate CMOS Schmitt NAND
trigger fabricated with silicon gate CMOS technology. It achieves high
speed operation similar to equivalent Bipolar Schottky TTL while
maintaining CMOS low power dissipation.
The internal circuit is composed of three stages, including a buffer
output which provides high noise immunity and stable output.
The MC74VHC1G132 input structure provides protection when
voltages up to 7 V are applied, regardless of the supply voltage. This
allows the MC74VHC1G132 to be used to interface 5 V circuits to 3 V
circuits.
The MC74VHC1G132 can be used to enhance noise immunity or to
square up slowly changing waveforms.
SC−88A / SOT−353 / SC−70
DF SUFFIX
CASE 419A
1
Features
•
•
•
•
•
•
•
•
High Speed: tPD = 3.6 ns (Typ) at VCC = 5 V
Low Power Dissipation: ICC = 1.0 mA (Max) at TA = 25°C
Power Down Protection Provided on Inputs
Balanced Propagation Delays
Pin and Function Compatible with Other Standard Logic Families
Chip Complexity: FETs = 68; Equivalent Gates = 16
NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
These Devices are Pb−Free and are RoHS Compliant
IN B
1
IN A
2
GND
5
4
3
5
5
&
VD M G
G
1
TSOP−5 / SOT−23 / SC−59
DT SUFFIX
CASE 483
VD
M
G
1
= Device Code
= Date Code*
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or position may vary
depending upon manufacturing location.
PIN ASSIGNMENT
VCC
1
OUT Y
IN B
2
IN A
3
GND
4
OUT Y
5
VCC
FUNCTION TABLE
Figure 1. Pinout (Top View)
IN A
IN B
VD M G
G
Inputs
OUT Y
Output
A
B
Y
L
L
H
H
L
H
L
H
H
H
H
L
Figure 2. Logic Symbol
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
© Semiconductor Components Industries, LLC, 2013
July, 2013 − Rev. 21
1
Publication Order Number:
MC74VHC1G132/D
MC74VHC1G132
MAXIMUM RATINGS
Symbol
Parameter
VCC
DC Supply Voltage
VIN
DC Input Voltage
VOUT
DC Output Voltage
Value
Unit
*0.5 to )7.0
V
−0.5 to +7.0
V
*0.5 to VCC )0.5
V
IIK
DC Input Diode Current
−20
mA
IOK
DC Output Diode Current
$20
mA
IOUT
DC Output Sink Current
$12.5
mA
ICC
DC Supply Current per Supply Pin
$25
mA
*65 to )150
°C
TSTG
Storage Temperature Range
TL
Lead Temperature, 1 mm from Case for 10 Seconds
TJ
Junction Temperature Under Bias
qJA
Thermal Resistance
PD
Power Dissipation in Still Air at 85°C
MSL
Moisture Sensitivity
FR
Flammability Rating
VESD
Latchup Performance
°C
°C
SC70−5/SC−88A (Note 1)
TSOP−5
350
230
°C/W
SC70−5/SC−88A
TSOP−5
150
200
mW
Level 1
Oxygen Index: 28 to 34
ESD Withstand Voltage
ILATCHUP
260
)150
UL 94 V−0 @ 0.125 in
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
u2000
u200
N/A
V
Above VCC and Below GND at 125°C (Note 5)
$500
mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
VCC
DC Supply Voltage
2.0
5.5
V
VIN
DC Input Voltage
0.0
5.5
V
DC Output Voltage
0.0
VCC
V
Operating Temperature Range
VCC = 3.3 V ± 0.3 V
VCC = 5.0 V ± 0.5 V
80
1,032,200
117.8
90
419,300
47.9
100
178,700
20.4
110
79,600
9.4
120
37,000
4.2
130
17,800
2.0
140
8,900
1.0
°C
No Limit
No Limit
ns/V
TJ = 80 ° C
Time, Years
)125
−
−
TJ = 90 ° C
Time, Hours
*55
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
TJ = 110° C
Junction
Temperature °C
NORMALIZED FAILURE RATE
Device Junction Temperature versus
Time to 0.1% Bond Failures
TJ = 120° C
Input Rise and Fall Time
TJ = 130 ° C
TA
tr , tf
TJ = 100 ° C
VOUT
1
1
10
100
1000
TIME, YEARS
Figure 3. Failure Rate vs. Time Junction Temperature
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2
MC74VHC1G132
DC ELECTRICAL CHARACTERISTICS
Symbol
Parameter
Test Conditions
TA = 25°C
TA ≤ 85°C
−55 ≤ TA ≤ 125°C
VCC
(V)
Min
Typ
Max
Min
Max
Min
Max
Unit
VT+
Positive Threshold
Voltage
3.0
4.5
5.5
1.50
2.35
2.80
1.88
2.66
3.21
2.25
3.10
3.70
1.50
2.35
2.80
2.25
3.10
3.70
1.50
2.35
2.80
2.25
3.10
3.70
V
VT−
Negative Threshold
Voltage
3.0
4.5
5.5
0.65
1.10
1.45
1.03
1.62
2.02
1.40
2.10
2.60
0.65
1.10
1.45
1.40
2.10
2.60
0.65
1.10
1.45
1.40
2.10
2.60
V
VH
Hysteresis Voltage
3.0
4.5
5.5
0.30
0.40
0.50
0.85
1.05
1.20
1.60
2.00
2.25
0.30
0.40
0.50
1.60
2.00
2.25
0.30
0.40
0.50
1.60
2.00
2.25
V
VIN = VCC or GND
2.0
1.9
2.0
1.9
1.9
VIN = VIH or VIL
IOH = −50 mA
3.0
4.5
2.9
4.4
3.0
4.5
2.9
4.4
2.9
4.5
IOH = −4 mA
IOH = −8 mA
3.0
4.5
2.58
3.94
2.48
3.80
2.34
3.66
VIN = VIH or VIL
IOL = 50 mA
2.0
3.0
4.5
IOL = 4 mA
IOL = 8 mA
VOH
VOL
Minimum High−Level
Output Voltage
IOH = −50mA
Maximum Low−Level
Output Voltage
0.0
0.0
0.0
V
V
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
V
3.0
4.5
0.36
0.36
0.44
0.44
0.52
0.52
V
IIN
Maximum Input
Leakage Current
VIN = 5.5 V or GND
0 to
5.5
±0.1
±1.0
±1.0
mA
ICC
Maximum Quiescent
Supply Current
VIN = VCC or GND
5.5
1.0
20
40
mA
AC ELECTRICAL CHARACTERISTICS Cload = 50 pF, Input tr/tf = 3.0 ns
TA = 25°C
Symbol
tPLH,
tPHL
CIN
Parameter
Maximum Propagation
Delay, A or B to Y
Min
Test Conditions
TA ≤ 85°C
−55 ≤ TA ≤ 125°C
Typ
Max
Min
Max
Min
Max
Unit
ns
VCC = 3.3 ± 0.3 V
CL = 15 pF
CL = 50 pF
4.6
6.1
11.9
15.4
1.0
1.0
14.0
17.5
1.0
1.0
16.1
19.6
VCC = 5.0 ± 0.5 V
CL = 15 pF
CL = 50 pF
3.6
4.3
7.7
9.7
1.0
1.0
9.0
11.0
1.0
1.0
10.3
12.3
5.5
10
Maximum Input Capacitance
10
10
pF
Typical @ 25°C, VCC = 5.0 V
CPD
11
Power Dissipation Capacitance (Note 6)
pF
6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic
power consumption; PD = CPD VCC2 fin + ICC VCC.
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3
MC74VHC1G132
A or B
VCC
50%
GND
tPLH
Y
tPHL
50% VCC
Figure 4. Switching Waveforms
TEST POINT
OUTPUT
DEVICE
UNDER
TEST
CL *
*Includes all probe and jig capacitance
Figure 5. Test Circuit
ORDERING INFORMATION
Device
Package
Shipping†
M74VHC1G132DFT1G
NLVVHC1G132DFT1G*
M74VHC1G132DFT2G
SC70−5/SC−88A/SOT−353
(Pb−Free)
3000 Units / Tape & Reel
NLVVHC1G132DFT2G*
M74VHC1G132DTT1G
NLVVHC1G132DTT1G*
SOT23−5/TSOP−5SC59−5
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
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4
MC74VHC1G132
PACKAGE DIMENSIONS
SC−88A (SC−70−5/SOT−353)
CASE 419A−02
ISSUE L
A
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
G
5
4
−B−
S
1
2
DIM
A
B
C
D
G
H
J
K
N
S
3
D 5 PL
0.2 (0.008)
B
M
M
N
J
C
K
H
SOLDER FOOTPRINT
0.50
0.0197
0.65
0.025
0.65
0.025
0.40
0.0157
1.9
0.0748
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5
SCALE 20:1
mm Ǔ
ǒinches
INCHES
MIN
MAX
0.071
0.087
0.045
0.053
0.031
0.043
0.004
0.012
0.026 BSC
--0.004
0.004
0.010
0.004
0.012
0.008 REF
0.079
0.087
MILLIMETERS
MIN
MAX
1.80
2.20
1.15
1.35
0.80
1.10
0.10
0.30
0.65 BSC
--0.10
0.10
0.25
0.10
0.30
0.20 REF
2.00
2.20
MC74VHC1G132
PACKAGE DIMENSIONS
TSOP−5
CASE 483−02
ISSUE K
D 5X
NOTE 5
2X
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE. DIMENSION A.
5. OPTIONAL CONSTRUCTION: AN ADDITIONAL
TRIMMED LEAD IS ALLOWED IN THIS LOCATION.
TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2
FROM BODY.
0.20 C A B
0.10 T
M
2X
0.20 T
B
5
1
4
2
B
S
3
K
DETAIL Z
G
A
A
TOP VIEW
DIM
A
B
C
D
G
H
J
K
M
S
DETAIL Z
J
C
0.05
H
SIDE VIEW
C
SEATING
PLANE
END VIEW
MILLIMETERS
MIN
MAX
3.00 BSC
1.50 BSC
0.90
1.10
0.25
0.50
0.95 BSC
0.01
0.10
0.10
0.26
0.20
0.60
0_
10 _
2.50
3.00
SOLDERING FOOTPRINT*
0.95
0.037
1.9
0.074
2.4
0.094
1.0
0.039
0.7
0.028
SCALE 10:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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MC74VHC1G132/D