MC74HC1G00 Single 2-Input NAND Gate The MC74HC1G00 is a high speed CMOS 2−input NAND gate fabricated with silicon gate CMOS technology. The internal circuit is composed of multiple stages, including a buffer output which provides high noise immunity and stable output. • • • • • • • • High Speed: tPD = 7 ns (Typ) at VCC = 5 V Low Power Dissipation: ICC = 1 mA (Max) at TA = 25°C http://onsemi.com High Noise Immunity MARKING DIAGRAMS Balanced Propagation Delays (tPLH = tPHL) Symmetrical Output Impedance (IOH = IOL = 2 mA) 5 Chip Complexity: FETs = 40 These Devices are Pb−Free and are RoHS Compliant NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable 1 H1 MG G SC70−5/SC−88A/SOT−353 DF SUFFIX CASE 419A 5 H1 MG G 1 IN B 1 IN A 2 GND 5 3 VCC 4 SOT23−5/TSOP−5/SC59−5 DT SUFFIX CASE 483 H1 M G OUT Y = Specific Device Code = Date Code = Pb−Free Package (Note: Microdot may be in either location) Figure 1. Pinout (Top View) PIN ASSIGNMENT IN A & IN B OUT Y Figure 2. Logic Symbol 1 IN B 2 IN A 3 GND 4 OUT Y 5 VCC FUNCTION TABLE Output Inputs A B Y L L H H L H L H H H H L ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. © Semiconductor Components Industries, LLC, 2013 June, 2013 − Rev. 11 1 Publication Order Number: MC74HC1G00/D MC74HC1G00 MAXIMUM RATINGS Symbol Parameter Value Unit VCC DC Supply Voltage *0.5 to )7.0 V VIN DC Input Voltage *0.5 to VCC )0.5 V VOUT DC Output Voltage *0.5 to VCC )0.5 V IIK DC Input Diode Current $20 mA IOK DC Output Diode Current $20 mA IOUT DC Output Sink Current $12.5 mA ICC DC Supply Current per Supply Pin $25 mA TSTG Storage Temperature Range *65 to )150 _C TL Lead Temperature, 1 mm from Case for 10 Seconds 260 _C TJ Junction Temperature Under Bias qJA Thermal Resistance PD Power Dissipation in Still Air at 85_C MSL Moisture Sensitivity FR Flammability Rating VESD ESD Withstand Voltage ILATCHUP Latchup Performance )150 _C SC70−5/SC−88A (Note 1) TSOP−5 350 230 _C/W SC70−5/SC−88A TSOP−5 150 200 mW Level 1 Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) u2000 u200 N/A V Above VCC and Below GND at 125_C (Note 5) $500 mA Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace with no air flow. 2. Tested to EIA/JESD22−A114−A. 3. Tested to EIA/JESD22−A115−A. 4. Tested to JESD22−C101−A. 5. Tested to EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit VCC DC Supply Voltage 2.0 6.0 V VIN DC Input Voltage 0.0 VCC V VOUT DC Output Voltage 0.0 VCC V TA Operating Temperature Range *55 )125 _C tr , tf Input Rise and Fall Time 0 0 0 0 1000 600 500 400 ns VCC = 2.0 V VCC = 3.0 V VCC = 4.5 V VCC = 6.0 V 47.9 100 178,700 20.4 110 79,600 9.4 120 37,000 4.2 130 17,800 2.0 140 8,900 1.0 TJ = 80_C 117.8 419,300 TJ = 90_C 1,032,200 90 TJ = 100_C 80 TJ = 110_C Time, Years TJ = 120_C Time, Hours FAILURE RATE OF PLASTIC = CERAMIC UNTIL INTERMETALLICS OCCUR TJ = 130_C Junction Temperature °C NORMALIZED FAILURE RATE DEVICE JUNCTION TEMPERATURE VERSUS TIME TO 0.1% BOND FAILURES 1 1 10 100 1000 TIME, YEARS Figure 3. Failure Rate vs. Time Junction Temperature http://onsemi.com 2 MC74HC1G00 DC ELECTRICAL CHARACTERISTICS VCC Symbol Parameter Test Conditions (V) Min 1.5 2.1 3.15 4.20 VIH Minimum High−Level Input Voltage 2.0 3.0 4.5 6.0 VIL Maximum Low−Level Input Voltage 2.0 3.0 4.5 6.0 VOH Minimum High−Level Output Voltage VIN = VIH or VIL VIN = VIH or VIL IOH = −20 mA VIN = VIH or VIL IOH = −2 mA IOH = −2.6 mA VOL Maximum Low−Level Output Voltage VIN = VIH or VIL VIN = VIH or VIL IOL = 20 mA TA = 25_C Typ TA v 85_C Max Min *55_C v TA v 125_C Max Min 1.5 2.1 3.15 4.20 0.5 0.9 1.35 1.80 Max 1.5 2.1 3.15 4.20 0.5 0.9 1.35 1.80 V 0.5 0.9 1.35 1.80 2.0 3.0 4.5 6.0 1.9 2.9 4.4 5.9 2.0 3.0 4.5 6.0 1.9 2.9 4.4 5.9 1.9 2.9 4.4 5.9 4.5 6.0 4.18 5.68 4.31 5.80 4.13 5.63 4.08 5.58 Unit V V 2.0 3.0 4.5 6.0 0.0 0.0 0.0 0.0 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 VIN = VIH or VIL IOL = 2 mA IOL = 2.6 mA 4.5 6.0 0.17 0.18 0.26 0.26 0.33 0.33 0.40 0.40 V IIN Maximum Input Leakage Current VIN = 6.0 V or GND 6.0 $0.1 $1.0 $1.0 mA ICC Maximum Quiescent Supply Current VIN = VCC or GND 6.0 1.0 10 40 mA AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 6.0 ns) TA = 25_C Symbol Parameter Test Conditions tPLH, tPHL Maximum Propagation Delay, Input A or B to Y tTLH, tTHL Output Transition Time CIN Maximum Input Capacitance CPD Power Dissipation Capacitance (Note 6) Min Typ TA v 85_C Max Min *55_C v TA v 125_C Max Min Max Unit ns VCC = 5.0 V CL = 15 pF 3.5 15 20 25 VCC = 2.0 V VCC = 3.0 V VCC = 4.5 V VCC = 6.0 V CL = 50 pF 19 10.5 7.5 6.5 100 27 20 17 125 35 25 21 155 90 35 26 VCC = 5.0 V CL = 15 pF 3 10 15 20 VCC = 2.0 V VCC = 3.0 V VCC = 4.5 V VCC = 6.0 V CL = 50 pF 25 16 11 9 125 35 25 21 155 45 31 26 200 60 38 32 5 10 10 10 ns pF Typical @ 25_C, VCC = 5.0 V 10 pF 6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC. http://onsemi.com 3 MC74HC1G00 VCC INPUT A or B 90% 50% 10% tf tr VCC CL* GND tPLH OUTPUT Y OUTPUT INPUT tPHL 90% 50% 10% tTLH *Includes all probe and jig capacitance. A 1−MHz square input wave is recommended for propagation delay tests. tTHL Figure 4. Switching Waveforms Figure 5. Test Circuit DEVICE ORDERING INFORMATION Device Nomenclature Logic Circuit Indicator Temp Range Identifier MC MC74HC1G00DFT2G MC74HC1G00DTT1G Device Order Number MC74HC1G00DFT1G Technology Device Function Package Suffix Tape and Reel Suffix 74 HC1G 00 DF MC 74 HC1G 00 MC 74 HC1G 00 Package Type Tape and Reel Size† T1 SC70−5/SC−88A/ SOT−353 (Pb−Free) 178 mm (7 in) 3000 Unit DF T2 SC70−5/SC−88A/ SOT−353 (Pb−Free) 178 mm (7 in) 3000 Unit DT T1 SOT23−5/TSOP−5/ SC59−5 (Pb−Free) 178 mm (7 in) 3000 Unit NLV74HC1G00DFT1G* †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable. http://onsemi.com 4 MC74HC1G00 PACKAGE DIMENSIONS SC−88A (SC−70−5/SOT−353) CASE 419A−02 ISSUE L A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A−01 OBSOLETE. NEW STANDARD 419A−02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. G 5 4 −B− S 1 2 DIM A B C D G H J K N S 3 D 5 PL 0.2 (0.008) B M M N J C K H SOLDER FOOTPRINT 0.50 0.0197 0.65 0.025 0.65 0.025 0.40 0.0157 1.9 0.0748 http://onsemi.com 5 SCALE 20:1 mm Ǔ ǒinches INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC --0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC --0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20 MC74HC1G00 PACKAGE DIMENSIONS TSOP−5 CASE 483−02 ISSUE K D 5X NOTE 5 2X NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSION A. 5. OPTIONAL CONSTRUCTION: AN ADDITIONAL TRIMMED LEAD IS ALLOWED IN THIS LOCATION. TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2 FROM BODY. 0.20 C A B 0.10 T M 2X 0.20 T B 5 1 4 2 B S 3 K DETAIL Z G A A TOP VIEW DIM A B C D G H J K M S DETAIL Z J C 0.05 H SIDE VIEW C SEATING PLANE END VIEW MILLIMETERS MIN MAX 3.00 BSC 1.50 BSC 0.90 1.10 0.25 0.50 0.95 BSC 0.01 0.10 0.10 0.26 0.20 0.60 0_ 10 _ 2.50 3.00 SOLDERING FOOTPRINT* 0.95 0.037 1.9 0.074 2.4 0.094 1.0 0.039 0.7 0.028 SCALE 10:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. 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