MC74HC1G08 D

MC74HC1G08
Single 2-Input AND Gate
The MC74HC1G08 is a high speed CMOS 2−input AND gate
fabricated with silicon gate CMOS technology.
The internal circuit is composed of multiple stages, including a
buffer output which provides high noise immunity and stable output.
The MC74HC1G08 output drive current is 1/2 compared to
MC74HC series.
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MARKING
DIAGRAMS
Features
•
High Speed: tPD = 7 ns (Typ) at VCC = 5 V
Low Power Dissipation: ICC = 1 mA (Max) at TA = 25°C
High Noise Immunity
Balanced Propagation Delays (tpLH = tpHL)
Symmetrical Output Impedance (IOH = IOL = 2 mA)
Chip Complexity: FET = 44
NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
These Devices are Pb−Free / Halogen−Free and are RoHS Compliant
IN B
1
IN A
2
GND
3
5
VCC
4
OUT Y
&
SC−88A / SOT−353 / SC−70
DF SUFFIX
CASE 419A
H2 M G
G
1
5
H2 M G
G
TSOP−5 / SOT−23 / SC−59
DT SUFFIX
CASE 483
H2
M
G
1
= Device Code
= Date Code*
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or position may vary
depending upon manufacturing location.
PIN ASSIGNMENT
1
Figure 1. Pinout
IN A
IN B
5
M
•
•
•
•
•
•
•
IN B
2
IN A
3
GND
4
OUT Y
5
VCC
FUNCTION TABLE
OUT Y
Inputs
Figure 2. Logic Symbol
Output
A
B
Y
L
L
H
H
L
H
L
H
L
L
L
H
ORDERING INFORMATION
See detailed ordering and shipping information in the
package dimensions section on page 4 of this data sheet.
© Semiconductor Components Industries, LLC, 2012
October, 2012 − Rev. 14
1
Publication Order Number:
MC74HC1G08/D
MC74HC1G08
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
*0.5 to )7.0
V
V
VCC
DC Supply Voltage
VIN
DC Input Voltage
*0.5 to VCC )0.5
DC Output Voltage
VOUT
*0.5 to VCC )0.5
V
IIK
DC Input Diode Current
$20
mA
IOK
DC Output Diode Current
$20
mA
IOUT
DC Output Sink Current
$12.5
mA
ICC
DC Supply Current per Supply Pin
$25
mA
*65 to )150
°C
TSTG
Storage Temperature Range
TL
Lead Temperature, 1 mm from Case for 10 Seconds
TJ
Junction Temperature Under Bias
qJA
Thermal Resistance
PD
Power Dissipation in Still Air at 85°C
MSL
Moisture Sensitivity
FR
Flammability Rating
VESD
Latchup Performance
°C
°C
SC70−5/SC−88A/SOT−353 (Note 1)
SOT23−5/TSOP−5/SC59−5
350
230
°C/W
SC70−5/SC−88A/SOT−353
SOT23−5/TSOP−5/SC59−5
150
200
mW
Level 1
Oxygen Index: 28 to 34
ESD Withstand Voltage
ILATCHUP
260
)150
UL 94 V−0 @ 0.125 in
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
u2000
u200
N/A
V
Above VCC and Below GND at 125°C (Note 5)
$500
mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 20 ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
VCC
DC Supply Voltage
2.0
6.0
V
VIN
DC Input Voltage
0.0
VCC
V
DC Output Voltage
Operating Temperature Range
Input Rise and Fall Time
VCC = 2.0 V
VCC = 3.0 V
VCC = 4.5 V
VCC = 6.0 V
80
1,032,200
117.8
90
419,300
47.9
100
178,700
20.4
110
79,600
9.4
120
37,000
4.2
130
17,800
2.0
140
8,900
1.0
V
°C
0
0
0
0
1000
600
500
400
ns
TJ = 80°C
Time, Years
VCC
)125
TJ = 90°C
Time, Hours
0.0
*55
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
TJ = 110°C
Junction
Temperature °C
NORMALIZED FAILURE RATE
DEVICE JUNCTION TEMPERATURE VERSUS
TIME TO 0.1% BOND FAILURES
TJ = 130°C
tr , tf
TJ = 120°C
TA
TJ = 100°C
VOUT
1
1
10
TIME, YEARS
100
1000
Figure 3. Failure Rate vs. Time Junction Temperature
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2
MC74HC1G08
DC ELECTRICAL CHARACTERISTICS
VCC
Symbol
Parameter
Test Conditions
(V)
Min
1.5
2.1
3.15
4.20
VIH
Minimum High−Level
Input Voltage
2.0
3.0
4.5
6.0
VIL
Maximum Low−Level
Input Voltage
2.0
3.0
4.5
6.0
VOH
Minimum High−Level
Output Voltage
VIN = VIH or VIL
VIN = VIH or VIL
IOH = −20 mA
VIN = VIH or VIL
IOH = −2 mA
IOH = −2.6 mA
VOL
Maximum Low−Level
Output Voltage
VIN = VIH or VIL
VIN = VIH or VIL
IOL = 20 mA
TA = 255C
Typ
TA v 855C
Max
Min
Max
1.5
2.1
3.15
4.20
0.5
0.9
1.35
1.80
*555C v TA v 1255C
Min
Max
1.5
2.1
3.15
4.20
0.5
0.9
1.35
1.80
V
0.5
0.9
1.35
1.80
2.0
3.0
4.5
6.0
1.9
2.9
4.4
5.9
2.0
3.0
4.5
6.0
1.9
2.9
4.4
5.9
1.9
2.9
4.4
5.9
4.5
6.0
4.18
5.68
4.31
5.80
4.13
5.63
4.08
5.58
Unit
V
V
2.0
3.0
4.5
6.0
0.0
0.0
0.0
0.0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
VIN = VIH or VIL
IOL = 2 mA
IOL = 2.6 mA
4.5
6.0
0.17
0.18
0.26
0.26
0.33
0.33
0.40
0.40
V
IIN
Maximum Input
Leakage Current
VIN = 6.0 V or GND
6.0
$0.1
$1.0
$1.0
mA
ICC
Maximum Quiescent
Supply Current
VIN = VCC or GND
6.0
1.0
10
40
mA
AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 6.0 ns)
TA = 255C
TA v 855C
*555C v TA v 1255C
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Symbol
Parameter
Test Conditions
tPLH,
tPHL
Maximum Propagation
Delay, Input A or B to Y
VCC = 5.0 V
tTLH,
tTHL
Output Transition Time
CIN
Maximum Input
Capacitance
Min
Typ
Max
CL = 15 pF
3.5
15
VCC = 2.0 V
VCC = 3.0 V
VCC = 4.5 V
VCC = 6.0 V
CL = 50 pF
20
11
8
7
VCC = 5.0 V
CL = 15 pF
VCC = 2.0 V
VCC = 3.0 V
VCC = 4.5 V
VCC = 6.0 V
CL = 50 pF
Min
Max
Min
Max
Unit
20
25
ns
100
27
20
17
125
35
25
21
155
90
35
26
3
10
15
20
25
16
11
9
125
35
25
21
155
45
31
26
200
60
38
32
5
10
10
10
ns
pF
Typical @ 255C, VCC = 5.0 V
CPD
Power Dissipation Capacitance (Note 6)
10
pF
6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic
power consumption; PD = CPD VCC2 fin + ICC VCC.
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3
MC74HC1G08
tr
INPUT
A or B
OUTPUT Y
tf
VCC
90%
50%
10%
GND
tPHL
tPLH
90%
50%
10%
tTLH
tTHL
Figure 4. Switching Waveforms
VCC
OUTPUT
INPUT
CL*
*Includes all probe and jig capacitance.
A 1−MHz square input wave is recommended for propagation delay tests.
Figure 5. Test Circuit
ORDERING INFORMATION
Device
Package
MC74HC1G08DFT1G
SC70−5/SC−88A/SOT−353
(Pb−Free)
MC74HC1G08DFT2G
SC70−5/SC−88A/SOT−353
(Pb−Free)
MC74HC1G08DTT1G
SOT23−5/TSOP−5/SC59−5
(Pb−Free)
NLVHC1G08DFT1G*
SC70−5/SC−88A/SOT−353
(Pb−Free)
NLVHC1G08DFT2G*
SC70−5/SC−88A/SOT−353
(Pb−Free)
NLVHC1G08DTT1G*
SOT23−5/TSOP−5/SC59−5
(Pb−Free)
Shipping†
3000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
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4
MC74HC1G08
PACKAGE DIMENSIONS
SC−88A (SC−70−5/SOT−353)
CASE 419A−02
ISSUE K
A
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
G
5
4
−B−
S
1
2
DIM
A
B
C
D
G
H
J
K
N
S
3
D 5 PL
0.2 (0.008)
M
B
M
N
J
C
H
K
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5
INCHES
MIN
MAX
0.071
0.087
0.045
0.053
0.031
0.043
0.004
0.012
0.026 BSC
--0.004
0.004
0.010
0.004
0.012
0.008 REF
0.079
0.087
MILLIMETERS
MIN
MAX
1.80
2.20
1.15
1.35
0.80
1.10
0.10
0.30
0.65 BSC
--0.10
0.10
0.25
0.10
0.30
0.20 REF
2.00
2.20
MC74HC1G08
PACKAGE DIMENSIONS
TSOP−5
CASE 483−02
ISSUE H
D 5X
NOTE 5
2X
0.10 T
2X
0.20 T
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
5. OPTIONAL CONSTRUCTION: AN
ADDITIONAL TRIMMED LEAD IS ALLOWED
IN THIS LOCATION. TRIMMED LEAD NOT TO
EXTEND MORE THAN 0.2 FROM BODY.
0.20 C A B
M
5
1
4
2
L
3
B
S
K
DETAIL Z
G
A
DIM
A
B
C
D
G
H
J
K
L
M
S
DETAIL Z
J
C
0.05
SEATING
PLANE
H
T
MILLIMETERS
MIN
MAX
3.00 BSC
1.50 BSC
0.90
1.10
0.25
0.50
0.95 BSC
0.01
0.10
0.10
0.26
0.20
0.60
1.25
1.55
0_
10 _
2.50
3.00
SOLDERING FOOTPRINT*
0.95
0.037
1.9
0.074
2.4
0.094
1.0
0.039
0.7
0.028
SCALE 10:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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MC74HC1G08/D