MC74LCX02 D

MC74LCX02
Low-Voltage CMOS Quad
2-Input NOR Gate
With 5 V−Tolerant Inputs
The MC74LCX02 is a high performance, quad 2−input NOR gate
operating from a 2.3 to 3.6 V supply. High impedance TTL compatible
inputs significantly reduce current loading to input drivers while TTL
compatible outputs offer improved switching noise performance. A VI
specification of 5.5 V allows MC74LCX02 inputs to be safely driven
from 5 V devices.
Current drive capability is 24 mA at the outputs.
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SOIC−14 NB
D SUFFIX
CASE 751A
TSSOP−14
DT SUFFIX
CASE 948G
Features
•
•
•
•
•
•
PIN ASSIGNMENT
Designed for 2.3 V to 3.6 V VCC Operation
5 V Tolerant Inputs − Interface Capability With 5 V TTL Logic
VCC
O2
B2
A2
O3
B3
A3
LVTTL Compatible
14
13
12
11
10
9
8
LVCMOS Compatible
24 mA Balanced Output Sink and Source Capability
Near Zero Static Supply Current (10 mA) Substantially Reduces
System Power Requirements
Latchup Performance Exceeds 500 mA
•
• ESD Performance: Human Body Model >2000 V;
•
Machine Model >200 V
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
1
2
3
4
5
6
7
O0
A0
B0
O1
A1
B1
GND
MARKING DIAGRAMS
14
A0
B0
A1
B1
A2
B2
A3
B3
LCX02G
AWLYWW
2
1
3
O0
1
5
4
6
SOIC−14 NB
O1
11
14
13
12
LCX
02
ALYWG
G
O2
8
10
9
O3
1
TSSOP−14
Figure 1. Logic Diagram
A
WL, L
Y
WW, W
G or G
PIN NAMES
Pins
Function
An, Bn
Data Inputs
On
Outputs
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 2014
August, 2014 − Rev. 10
1
Publication Order Number:
MC74LCX02/D
MC74LCX02
TRUTH TABLE
Inputs
Outputs
An
Bn
On
L
L
H
L
H
L
H
L
L
H
H
L
H = High Voltage Level
L = Low Voltage Level
For ICC reasons, DO NOT FLOAT Inputs
MAXIMUM RATINGS
Symbol
VCC
Parameter
Value
DC Supply Voltage
VI
DC Input Voltage
VO
DC Output Voltage
IIK
DC Input Diode Current
IOK
DC Output Diode Current
Condition
Unit
−0.5 to +7.0
V
−0.5 ≤ VI ≤ +7.0
V
−0.5 ≤ VO ≤ VCC + 0.5
Output in HIGH or LOW State (Note 1)
V
−50
VI < GND
mA
−50
VO < GND
mA
+50
VO > VCC
mA
IO
DC Output Source/Sink Current
±50
mA
ICC
DC Supply Current Per Supply Pin
±100
mA
IGND
DC Ground Current Per Ground Pin
±100
mA
TSTG
Storage Temperature Range
MSL
Moisture Sensitivity
°C
−65 to +150
Level 1
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. IO absolute maximum rating must be observed.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Operating
Data Retention Only
Min
Type
Max
Unit
2.0
1.5
2.5, 3.3
2.5, 3.3
3.6
3.6
V
0
5.5
V
0
VCC
V
VCC
Supply Voltage
VI
Input Voltage
VO
Output Voltage
(HIGH or LOW State)
(3−State)
IOH
HIGH Level Output Current
VCC = 3.0 V − 3.6 V
VCC = 2.7 V − 3.0 V
VCC = 2.3 V − 2.7 V
−24
−12
−8
mA
IOL
LOW Level Output Current
VCC = 3.0 V − 3.6 V
VCC = 2.7 V − 3.0 V
VCC = 2.3 V − 2.7 V
+24
+12
+8
mA
TA
Operating Free−Air Temperature
Dt/DV
Input Transition Rise or Fall Rate, VIN from 0.8 V to 2.0 V, VCC = 3.0 V
−40
+85
°C
0
10
ns/V
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
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2
MC74LCX02
DC ELECTRICAL CHARACTERISTICS
TA = −40°C to +85°C
Symbol
VIH
VIL
VOH
VOL
Characteristic
HIGH Level Input Voltage (Note 2)
LOW Level Input Voltage (Note 2)
HIGH Level Output Voltage
LOW Level Output Voltage
Condition
Min
2.3 V ≤ VCC ≤ 2.7 V
1.7
2.7 V ≤ VCC ≤ 3.6 V
2.0
Max
Unit
V
2.3 V ≤ VCC ≤ 2.7 V
0.7
2.7 V ≤ VCC ≤ 3.6 V
0.8
2.3 V ≤ VCC ≤ 3.6 V; IOH = −100 mA
VCC − 0.2
VCC = 2.3 V; IOH = −8 mA
1.8
VCC = 2.7 V; IOH = −12 mA
2.2
VCC = 3.0 V; IOH = −18 mA
2.4
VCC = 3.0 V; IOH = −24 mA
2.2
V
V
2.3 V ≤ VCC ≤ 3.6 V; IOL = 100 mA
0.2
VCC = 2.3 V; IOL = 8 mA
0.6
V
VCC = 2.7 V; IOL = 12 mA
0.4
VCC = 3.0 V; IOL = 16 mA
0.4
VCC = 3.0 V; IOL = 24 mA
0.55
VCC = 0, VIN = 5.5 V or VOUT = 5.5 V
10
mA
IOFF
Power Off Leakage Current
IIN
Input Leakage Current
VCC = 3.6 V, VIN = 5.5 V or GND
±5
mA
ICC
Quiescent Supply Current
VCC = 3.6 V, VIN = 5.5 V or GND
10
mA
DICC
Increase in ICC per Input
2.3 ≤ VCC ≤ 3.6 V; VIH = VCC − 0.6 V
500
mA
2. These values of VI are used to test DC electrical characteristics only.
AC CHARACTERISTICS (tR = tF = 2.5 ns; RL = 500 W)
Limits
TA = −40°C to +85°C
Symbol
VCC = 3.3 V ± 0.3 V
VCC = 2.7 V
VCC = 2.5 V ± 0.2 V
CL = 50 pF
CL = 50 pF
CL = 30 pF
Parameter
Waveform
Min
Max
Min
Max
Min
Max
Unit
tPLH
Propagation Delay Time
1
1.5
5.5
1.5
6.2
1.5
6.6
ns
tPHL
Input−to−Output
1.5
5.5
1.5
6.2
1.5
6.6
tOSHL
Output−to−Output Skew
1.0
tOSLH
(Note 3)
1.0
ns
3. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.
The specification applies to any outputs switching in the same direction, either HIGH−to−LOW (tOSHL) or LOW−to−HIGH (tOSLH); parameter
guaranteed by design.
DYNAMIC SWITCHING CHARACTERISTICS
TA = +25°C
Symbol
VOLP
VOLV
Characteristic
Condition
Min
Typ
Max
Unit
Dynamic LOW Peak Voltage
VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V
0.8
V
(Note 4)
VCC = 2.5 V, CL = 30 pF, VIH = 2.5 V, VIL = 0 V
0.6
V
Dynamic LOW Valley Voltage
VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V
−0.8
V
(Note 4)
VCC = 2.5 V, CL = 30 pF, VIH = 2.5 V, VIL = 0 V
−0.6
V
4. Number of outputs defined as “n”. Measured with “n−1” outputs switching from HIGH−to−LOW or LOW−to−HIGH. The remaining output is
measured in the LOW state.
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3
MC74LCX02
CAPACITIVE CHARACTERISTICS
Symbol
Condition
Typical
Unit
CIN
Input Capacitance
Parameter
VCC = 3.3 V, VI = 0 V or VCC
7
pF
COUT
Output Capacitance
VCC = 3.3 V, VI = 0 V or VCC
8
pF
CPD
Power Dissipation Capacitance
10 MHz, VCC = 3.3 V, VI = 0 V or VCC
25
pF
Vcc
Vmi
An, Bn
Vmi
0V
tPHL
tPLH
VOH
Vmo
On
Vmo
VOL
WAVEFORM 1 − PROPAGATION DELAYS
tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns
Vcc
Symbol
3.3 V + 0.3 V
2.7 V
2.5 V + 0.2 V
Vmi
1.5 V
1.5 V
Vcc/2
Vmo
1.5 V
1.5 V
Vcc/2
Figure 2. AC Waveforms
VCC
PULSE
GENERATOR
DUT
RT
CL =
CL =
RL =
RT =
CL
RL
50 pF at VCC = 3.3 + 0.3 V or equivalent (includes jig and probe capacitance)
30 pF at VCC = 2.5 + 0.2 V or equivalent (includes jig and probe capacitance)
R1 = 500 W or equivalent
ZOUT of pulse generator (typically 50 W)
Figure 3. Test Circuit
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4
MC74LCX02
ORDERING INFORMATION
Package
Shipping†
MC74LCX02DG
SOIC−14 NB
(Pb−Free)
55 Units / Rail
MC74LCX02DR2G
SOIC−14 NB
(Pb−Free)
2500 Tape & Reel
MC74LCX02DTG
TSSOP−14
(Pb−Free)
96 Units / Rail
MC74LCX02DTR2G
TSSOP−14
(Pb−Free)
2500 Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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5
MC74LCX02
PACKAGE DIMENSIONS
TSSOP−14
DT SUFFIX
CASE 948G
ISSUE B
14X K REF
0.10 (0.004)
0.15 (0.006) T U
M
T U
V
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
S
S
N
2X
14
L/2
0.25 (0.010)
8
M
B
−U−
L
PIN 1
IDENT.
F
7
1
0.15 (0.006) T U
N
S
DETAIL E
K
A
−V−
ÉÉÉ
ÇÇÇ
ÇÇÇ
ÉÉÉ
K1
J J1
SECTION N−N
−W−
C
0.10 (0.004)
−T− SEATING
PLANE
D
H
G
DETAIL E
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MILLIMETERS
MIN
MAX
4.90
5.10
4.30
4.50
−−−
1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.50
0.60
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0_
8_
SOLDERING FOOTPRINT*
7.06
1
0.65
PITCH
14X
0.36
14X
1.26
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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6
INCHES
MIN MAX
0.193 0.200
0.169 0.177
−−− 0.047
0.002 0.006
0.020 0.030
0.026 BSC
0.020 0.024
0.004 0.008
0.004 0.006
0.007 0.012
0.007 0.010
0.252 BSC
0_
8_
MC74LCX02
PACKAGE DIMENSIONS
SOIC−14 NB
CASE 751A−03
ISSUE K
D
A
B
14
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF AT
MAXIMUM MATERIAL CONDITION.
4. DIMENSIONS D AND E DO NOT INCLUDE
MOLD PROTRUSIONS.
5. MAXIMUM MOLD PROTRUSION 0.15 PER
SIDE.
8
A3
E
H
L
1
0.25
M
DETAIL A
7
B
13X
M
b
0.25
M
C A
S
B
S
e
DETAIL A
h
A
X 45 _
M
A1
C
SEATING
PLANE
DIM
A
A1
A3
b
D
E
e
H
h
L
M
MILLIMETERS
MIN
MAX
1.35
1.75
0.10
0.25
0.19
0.25
0.35
0.49
8.55
8.75
3.80
4.00
1.27 BSC
5.80
6.20
0.25
0.50
0.40
1.25
0_
7_
INCHES
MIN
MAX
0.054 0.068
0.004 0.010
0.008 0.010
0.014 0.019
0.337 0.344
0.150 0.157
0.050 BSC
0.228 0.244
0.010 0.019
0.016 0.049
0_
7_
SOLDERING FOOTPRINT*
6.50
14X
1.18
1
1.27
PITCH
14X
0.58
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and the
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For additional information, please contact your local
Sales Representative
MC74LCX02/D