MC74LCX86 D

MC74LCX86
Low-Voltage CMOS Quad
2-Input XOR Gate
With 5 V−Tolerant Inputs
The MC74LCX86 is a high performance, quad 2−input XOR gate
operating from a 2.3 to 3.6 V supply. High impedance TTL compatible
inputs significantly reduce current loading to input drivers while TTL
compatible outputs offer improved switching noise performance. A VI
specification of 5.5 V allows MC74LCX86 inputs to be safely driven
from 5.0 V devices.
Current drive capability is 24 mA at the outputs.
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MARKING
DIAGRAMS
14
14
Features









SOIC−14
D SUFFIX
CASE 751A
1
Designed for 2.3 to 3.6 V VCC Operation
5.0 V Tolerant Inputs − Interface Capability With 5.0 V TTL Logic
LVTTL Compatible
LVCMOS Compatible
24 mA Balanced Output Sink and Source Capability
Near Zero Static Supply Current (10 mA) Substantially Reduces System
Power Requirements
Latchup Performance Exceeds 500 mA
ESD Performance:
Human Body Model >2000 V
Machine Model >200 V
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
LCX86G
AWLYWW
1
14
14
1
TSSOP−14
DT SUFFIX
CASE 948G
1
A
L, WL
Y, YY
W, WW
G or G
LCX
86
ALYWG
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
 Semiconductor Components Industries, LLC, 2012
October, 2012 − Rev. 8
1
Publication Order Number:
MC74LCX86/D
MC74LCX86
1
A0
VCC
A2
B2
O2
A3
B3
O3
B0
14
13
12
11
10
9
8
A1
3
2
4
6
5
B1
11
12
B2
3
4
5
6
7
A0
B0
O0
A1
B1
O1
GND
O2
10
A3
2
O1
13
A2
1
O0
8
9
B3
Figure 1. Pinout: 14−Lead (Top View)
O3
Figure 2. Logic Diagram
PIN NAMES
TRUTH TABLE
Pins
Function
Inputs
Outputs
An, Bn
Data Inputs
An
On
Outputs
L
L
L
L
H
H
H
L
H
H
H
L
Bn
On
MAXIMUM RATINGS
Symbol
VCC
Parameter
Value
DC Supply Voltage
VI
DC Input Voltage
VO
DC Output Voltage
IIK
DC Input Diode Current
IOK
DC Output Diode Current
Condition
Units
−0.5 to +7.0
V
−0.5  VI  +7.0
V
−0.5  VO  VCC + 0.5
Note 1
V
−50
VI < GND
mA
−50
VO < GND
mA
+50
VO > VCC
mA
IO
DC Output Source/Sink Current
50
mA
ICC
DC Supply Current Per Supply Pin
100
mA
IGND
DC Ground Current Per Ground Pin
100
mA
TSTG
Storage Temperature Range
MSL
Moisture Sensitivity
−65 to +150
C
Level 1
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
1. Output in HIGH or LOW State. IO absolute maximum rating must be observed.
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2
MC74LCX86
RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
Parameter
Supply Voltage
Operating
Data Retention Only
Min
Typ
Max
2.0
1.5
3.3
3.3
3.6
3.6
VI
Input Voltage
0
5.5
0
Units
V
V
VO
Output Voltage (HIGH or LOW State)
VCC
V
IOH
HIGH Level Output Current, VCC = 3.0 V − 3.6 V
−24
mA
IOL
LOW Level Output Current, VCC = 3.0 V − 3.6 V
24
mA
IOH
HIGH Level Output Current, VCC = 2.7 V − 3.0 V
−12
mA
IOL
LOW Level Output Current, VCC = 2.7 V − 3.0 V
12
mA
TA
Operating Free−Air Temperature
−40
+85
C
0
10
ns/V
Dt/DV
Input Transition Rise or Fall Rate, VIN from 0.8 V to 2.0 V,
VCC = 3.0 V
DC ELECTRICAL CHARACTERISTICS
TA = −40C to +85C
Symbol
Characteristic
Condition
Min
2.0
VIH
HIGH Level Input Voltage (Note 2)
2.7 V  VCC  3.6 V
VIL
LOW Level Input Voltage (Note 2)
2.7 V  VCC  3.6 V
VOH
HIGH Level Output Voltage
VOL
IOFF
LOW Level Output Voltage
V
0.8
2.7 V  VCC  3.6 V; IOH = −100 mA
VCC − 0.2
VCC = 2.7 V; IOH = −12 mA
2.2
VCC = 3.0 V; IOH = −18 mA
2.4
VCC = 3.0 V; IOH = −24 mA
2.2
Units
V
V
2.7 V  VCC  3.6 V; IOL = 100 mA
0.2
VCC = 2.7 V; IOL= 12 mA
0.4
VCC = 3.0 V; IOL = 16 mA
0.4
VCC = 3.0 V; IOL = 24 mA
0.55
V
VCC = 0, VIN = 5.5 V or VOUT = 5.5 V
10
mA
IIN
Input Leakage Current
VCC = 3.6 V, VIN = 5.5 V or GND
5
mA
ICC
Quiescent Supply Current
VCC = 3.6 V, VIN = 5.5 V or GND
10
mA
2.3  VCC  3.6 V; VIH = VCC − 0.6 V
500
mA
DICC
Power Off Leakage Current
Max
Increase in ICC per Input
2. These values of VI are used to test DC electrical characteristics only.
AC CHARACTERISTICS (tR = tF = 2.5ns; CL = 50pF; RL = 500W)
Limits
TA = −40C to +85C
VCC = 3.0 V to 3.6 V
Symbol
Parameter
tPLH
tPHL
Propagation Delay Input to Output
tOSHL
tOSLH
Output−to−Output Skew (Note 3)
VCC = 2.7 V
Waveform
Min
Max
Max
Units
1,2
1.5
1.5
6.5
6.5
7.0
7.0
ns
1.0
1.0
ns
3. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.
The specification applies to any outputs switching in the same direction, either HIGH−to−LOW (tOSHL) or LOW−to−HIGH (tOSLH); parameter
guaranteed by design.
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3
MC74LCX86
DYNAMIC SWITCHING CHARACTERISTICS
TA = +25C
Symbol
Characteristic
Condition
Min
Typ
Max
Units
VOLP
Dynamic LOW Peak Voltage (Note 4)
VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V
0.8
V
VOLV
Dynamic LOW Valley Voltage (Note 4)
VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V
0.8
V
4. Number of outputs defined as “n”. Measured with “n−1” outputs switching from HIGH−to−LOW or LOW−to−HIGH. The remaining output is
measured in the LOW state.
CAPACITIVE CHARACTERISTICS
Symbol
Condition
Typical
Units
Input Capacitance
VCC = 3.3 V, VI = 0 V or VCC
7
pF
COUT
Output Capacitance
VCC = 3.3 V, VI = 0 V or VCC
8
pF
CPD
Power Dissipation Capacitance
10 MHz, VCC = 3.3 V, VI = 0 V or VCC
25
pF
CIN
Parameter
ORDERING INFORMATION
Package
Shipping†
MC74LCX86DR2G
SOIC−14
(Pb−Free)
2500 Tape & Reel
MC74LCX86DTR2G
TSSOP−14
(Pb−Free)
2500 Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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4
MC74LCX86
2.7 V
1.5 V
An, Bn
1.5 V
0V
tPLH
tPHL
VOH
1.5 V
On
1.5 V
VOL
WAVEFORM 1 - NON-INVERTING PROPAGATION DELAYS
tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns
2.7 V
1.5 V
An, Bn
1.5 V
0V
tPHL
tPLH
VOH
1.5 V
On
1.5 V
VOL
WAVEFORM 2 - INVERTING PROPAGATION DELAYS
tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns
Figure 3. AC Waveforms
VCC
PULSE
GENERATOR
DUT
RT
CL
CL = 50pF or equivalent (Includes jig and probe capacitance)
RL = R1 = 500 W or equivalent
RT = ZOUT of pulse generator (typically 50 W)
Figure 4. Test Circuit
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5
RL
MC74LCX86
PACKAGE DIMENSIONS
TSSOP−14
CASE 948G
ISSUE B
14X K REF
0.10 (0.004)
0.15 (0.006) T U
M
T U
V
S
S
N
2X
14
L/2
0.25 (0.010)
8
M
B
−U−
L
PIN 1
IDENT.
N
F
7
1
0.15 (0.006) T U
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
S
S
DETAIL E
K
A
−V−
ÉÉÉ
ÇÇÇ
ÇÇÇ
ÉÉÉ
K1
J J1
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
SECTION N−N
−W−
C
0.10 (0.004)
−T− SEATING
PLANE
D
H
G
DETAIL E
SOLDERING FOOTPRINT*
7.06
1
0.65
PITCH
14X
0.36
14X
1.26
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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6
MILLIMETERS
MIN
MAX
4.90
5.10
4.30
4.50
−−−
1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.50
0.60
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0_
8_
INCHES
MIN MAX
0.193 0.200
0.169 0.177
−−− 0.047
0.002 0.006
0.020 0.030
0.026 BSC
0.020 0.024
0.004 0.008
0.004 0.006
0.007 0.012
0.007 0.010
0.252 BSC
0_
8_
MC74LCX86
PACKAGE DIMENSIONS
SOIC−14 NB
CASE 751A−03
ISSUE K
D
A
B
14
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF AT
MAXIMUM MATERIAL CONDITION.
4. DIMENSIONS D AND E DO NOT INCLUDE
MOLD PROTRUSIONS.
5. MAXIMUM MOLD PROTRUSION 0.15 PER
SIDE.
A3
E
H
L
1
0.25
M
DETAIL A
7
B
13X
M
b
0.25
M
C A
S
B
S
e
DETAIL A
h
A
X 45 _
M
A1
C
SEATING
PLANE
DIM
A
A1
A3
b
D
E
e
H
h
L
M
MILLIMETERS
MIN
MAX
1.35
1.75
0.10
0.25
0.19
0.25
0.35
0.49
8.55
8.75
3.80
4.00
1.27 BSC
5.80
6.20
0.25
0.50
0.40
1.25
0_
7_
INCHES
MIN
MAX
0.054 0.068
0.004 0.010
0.008 0.010
0.014 0.019
0.337 0.344
0.150 0.157
0.050 BSC
0.228 0.244
0.010 0.019
0.016 0.049
0_
7_
SOLDERING FOOTPRINT*
6.50
14X
1.18
1
1.27
PITCH
14X
0.58
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
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limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
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7
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For additional information, please contact your local
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MC74LCX86/D