MC74LCX04 D

MC74LCX04
Low-Voltage CMOS Hex
Inverter
With 5 V−Tolerant Inputs
The MC74LCX04 is a high performance hex inverter operating
from a 2.0 to 5.5 V supply. High impedance TTL compatible inputs
significantly reduce current loading to input drivers while TTL
compatible outputs offer improved switching noise performance. A VI
specification of 5.5 V allows MC74LCX04 inputs to be safely driven
from 5 V devices if VCC is less than 5.0 V.
Current drive capability is 24 mA at the outputs.
http://onsemi.com
Features
•
•
•
•
•
•
Designed for 2.0 V to 5.5 V VCC Operation
5 V Tolerant Inputs − Interface Capability With 5 V TTL Logic
LVTTL Compatible
•
PIN ASSIGNMENT
VCC
A3
O3
A4
O4
A5
O5
14
13
12
11
10
9
8
1
2
3
4
5
6
7
A0
O0
A1
O1
A2
O2
GND
LVCMOS Compatible
24 mA Balanced Output Sink and Source Capability
Near Zero Static Supply Current (10 mA) Substantially Reduces
System Power Requirements
Latchup Performance Exceeds 500 mA
•
• ESD Performance:
•
TSSOP−14
DT SUFFIX
CASE 948G
SOIC−14 NB
D SUFFIX
CASE 751A
Human Body Model >2000 V;
Machine Model >200 V
NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
A0
A1
A2
A3
A4
A5
1
2
3
4
5
6
13
12
11
10
9
8
14−Lead (Top View)
MARKING DIAGRAMS
14
LCX04G
AWLYWW
1
O0
SOIC−14 NB
O1
14
LCX
04
ALYWG
G
O2
O3
1
O4
TSSOP−14
A
WL, L
YY, Y
WW, W
G or G
O5
Figure 1. Logic Diagram
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 2014
August, 2014 − Rev. 9
1
Publication Order Number:
MC74LCX04/D
MC74LCX04
TRUTH TABLE
PIN NAMES
Pins
Function
An
On
Data Inputs
Outputs
An
On
L
H
H
L
MAXIMUM RATINGS
Symbol
VCC
Parameter
Value
DC Supply Voltage
Condition
Unit
−0.5 to +7.0
V
−0.5 ≤ VI ≤ +7.0
VI
DC Input Voltage
VO
DC Output Voltage
IIK
DC Input Diode Current
−50
VI < GND
mA
IOK
DC Output Diode Current
−50
VO < GND
mA
+50
VO > VCC
mA
−0.5 ≤ VO ≤ VCC +0.5
V
Output in HIGH or LOW State (Note 1)
V
IO
DC Output Source/Sink Current
±50
mA
ICC
DC Supply Current Per Supply Pin
±100
mA
IGND
DC Ground Current Per Ground Pin
±100
mA
TSTG
Storage Temperature Range
−65 to +150
°C
MSL
Moisture Sensitivity
Level 1
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. IO absolute maximum rating must be observed.
RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
Parameter
Supply Voltage
Operating
Data Retention Only
Min
Typ
Max
Unit
2.0
1.5
2.5, 3.3
2.5, 3.3
5.5
5.5
V
0
5.5
V
0
VCC
V
VI
Input Voltage
VO
Output Voltage
(HIGH or LOW State) (3−State)
IOH
HIGH Level Output Current
VCC = 3.0 V − 3.6 V
VCC = 2.7 V − 3.0 V
VCC = 2.3 V − 2.7 V
−24
−12
−8
mA
IOL
LOW Level Output Current
VCC = 3.0 V − 3.6 V
VCC = 2.7 V − 3.0 V
VCC = 2.3 V − 2.7 V
+24
+12
+8
mA
TA
Operating Free−Air Temperature
−55
+125
°C
0
10
ns/V
Dt/DV
Input Transition Rise or Fall Rate, VIN from 0.8 V to 2.0 V, VCC = 3.0 V
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
http://onsemi.com
2
MC74LCX04
DC ELECTRICAL CHARACTERISTICS
TA = −55°C to +125°C
Symbol
VIH
VIL
VOH
VOL
Characteristic
Condition
HIGH Level Input Voltage (Note 2)
LOW Level Input Voltage (Note 2)
Min
2.3 V ≤ VCC ≤ 2.7 V
1.7
2.7 V ≤ VCC ≤ 3.6 V
2.0
0.7
2.7 V ≤ VCC ≤ 3.6 V
0.8
LOW Level Output Voltage
VCC − 0.2
VCC = 2.3 V; IOH = −8 mA
1.8
VCC = 2.7 V; IOH = −12 mA
2.2
VCC = 3.0 V; IOH = −18 mA
2.4
VCC = 3.0 V; IOH = −24 mA
2.2
Unit
V
2.3 V ≤ VCC ≤ 2.7 V
2.3 V ≤ VCC ≤ 3.6 V; IOH = −100 mA
HIGH Level Output Voltage
Max
V
V
2.3 V ≤ VCC ≤ 3.6 V; IOL = 100 mA
0.2
VCC = 2.3 V; IOL = 8 mA
0.6
VCC = 2.7 V; IOL = 12 mA
0.4
VCC = 3.0 V; IOL = 16 mA
0.4
VCC = 3.0 V; IOL = 24 mA
0.55
V
Power Off Leakage Current
VCC = 0, VIN = 5.5 V or VOUT = 5.5 V
10
mA
IIN
Input Leakage Current
VCC = 3.6 V, VIN = 5.5 V or GND
±5
mA
ICC
Quiescent Supply Current
VCC = 3.6 V, VIN = 5.5 V or GND
10
mA
Increase in ICC per Input
2.3 ≤ VCC ≤ 3.6 V; VIH = VCC − 0.6 V
500
mA
IOFF
DICC
2. These values of VI are used to test DC electrical characteristics only.
AC CHARACTERISTICS (tR = tF = 2.5 ns; RL = 500 W)
Limits
TA = −55°C to +125°C
VCC = 3.3 V ± 0.3 V
VCC = 2.7 V
VCC = 2.5 V ± 0.2 V
CL = 50 pF
CL = 50 pF
CL = 30 pF
Symbol
Parameter
Waveform
Min
Max
Min
Max
Min
Max
Unit
tPLH
Propagation Delay Time
1
1.5
5.2
1.5
6.0
1.5
6.2
ns
tPHL
Input to Output
1.5
5.2
1.5
6.0
1.5
6.2
tOSHL
Output−to−Output Skew
1.0
tOSLH
(Note 3)
1.0
ns
3. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.
The specification applies to any outputs switching in the same direction, either HIGH−to−LOW (tOSHL) or LOW−to−HIGH (tOSLH); parameter
guaranteed by design.
DYNAMIC SWITCHING CHARACTERISTICS
TA = +25°C
Symbol
VOLP
VOLV
Characteristic
Condition
Min
Typ
Max
Unit
Dynamic LOW Peak Voltage
VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V
0.8
V
(Note 4)
VCC = 2.5 V, CL = 30 pF, VIH = 2.5 V, VIL = 0 V
0.6
V
Dynamic LOW Valley Voltage
VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V
−0.8
V
(Note 4)
VCC = 2.5 V, CL = 30 pF, VIH = 2.5 V, VIL = 0 V
−0.6
V
4. Number of outputs defined as “n”. Measured with “n−1” outputs switching from HIGH−to−LOW or LOW−to−HIGH. The remaining output is
measured in the LOW state.
http://onsemi.com
3
MC74LCX04
CAPACITIVE CHARACTERISTICS
Symbol
Typical
Unit
Input Capacitance
VCC = 3.3 V, VI = 0 V or VCC
7
pF
COUT
Output Capacitance
VCC = 3.3 V, VI = 0 V or VCC
8
pF
CPD
Power Dissipation Capacitance
10 MHz, VCC = 3.3 V, VI = 0 V or VCC
25
pF
CIN
Parameter
Condition
VCC
Vmi
An
Vmi
0V
tPHL
tPLH
VOH
Vmo
On
Vmo
VOL
WAVEFORM 1 − PROPAGATION DELAYS
tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns
VCC
3.3 V + 0.3 V
2.7 V
2.5 V + 0.2 V
Vmi
1.5 V
1.5 V
VCC/2
Vmo
1.5 V
1.5 V
VCC/2
Symbol
Figure 2. AC Waveforms
VCC
PULSE
GENERATOR
DUT
RT
CL =
CL =
RL =
RT =
CL
RL
50 pF at VCC = 3.3 ±0.3 V or equivalent (includes jig and probe capacitance)
30 pF at VCC = 2.5 ±0.2 V or equivalent (includes jig and probe capacitance)
R1 = 500 W or equivalent
ZOUT of pulse generator (typically 50 W)
Figure 3. Test Circuit
http://onsemi.com
4
MC74LCX04
ORDERING INFORMATION
Package
Shipping†
MC74LCX04DG
SOIC−14 NB
(Pb−Free)
55 Units / Rail
MC74LCX04DR2G
SOIC−14 NB
(Pb−Free)
2500 Tape & Reel
MC74LCX04DTG
TSSOP−14
(Pb−Free)
96 Units / Rail
MC74LCX04DTR2G
TSSOP−14
(Pb−Free)
2500 Tape & Reel
NLV74LCX04DTR2G*
TSSOP−14
(Pb−Free)
2500 Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable
http://onsemi.com
5
MC74LCX04
PACKAGE DIMENSIONS
TSSOP−14
CASE 948G
ISSUE B
14X K REF
0.10 (0.004)
0.15 (0.006) T U
M
T U
V
S
S
S
N
2X
14
L/2
0.25 (0.010)
8
M
B
−U−
L
PIN 1
IDENT.
F
7
1
0.15 (0.006) T U
N
S
DETAIL E
ÇÇÇ
ÉÉÉ
ÇÇÇ
ÉÉÉ
ÇÇÇ
K
A
−V−
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
K1
J J1
SECTION N−N
−W−
C
0.10 (0.004)
−T− SEATING
PLANE
D
H
G
DETAIL E
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MILLIMETERS
INCHES
MIN
MAX
MIN MAX
4.90
5.10 0.193 0.200
4.30
4.50 0.169 0.177
−−−
1.20
−−− 0.047
0.05
0.15 0.002 0.006
0.50
0.75 0.020 0.030
0.65 BSC
0.026 BSC
0.50
0.60 0.020 0.024
0.09
0.20 0.004 0.008
0.09
0.16 0.004 0.006
0.19
0.30 0.007 0.012
0.19
0.25 0.007 0.010
6.40 BSC
0.252 BSC
0_
8_
0_
8_
SOLDERING FOOTPRINT*
7.06
1
0.65
PITCH
14X
0.36
14X
1.26
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
6
MC74LCX04
PACKAGE DIMENSIONS
D
SOIC−14 NB
CASE 751A−03
ISSUE K
A
B
14
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF AT
MAXIMUM MATERIAL CONDITION.
4. DIMENSIONS D AND E DO NOT INCLUDE
MOLD PROTRUSIONS.
5. MAXIMUM MOLD PROTRUSION 0.15 PER
SIDE.
8
A3
E
H
L
1
0.25
M
DETAIL A
7
B
13X
M
b
0.25
M
C A
S
B
S
e
DETAIL A
h
A
X 45 _
M
A1
C
SEATING
PLANE
DIM
A
A1
A3
b
D
E
e
H
h
L
M
MILLIMETERS
MIN
MAX
1.35
1.75
0.10
0.25
0.19
0.25
0.35
0.49
8.55
8.75
3.80
4.00
1.27 BSC
5.80
6.20
0.25
0.50
0.40
1.25
0_
7_
INCHES
MIN
MAX
0.054 0.068
0.004 0.010
0.008 0.010
0.014 0.019
0.337 0.344
0.150 0.157
0.050 BSC
0.228 0.244
0.010 0.019
0.016 0.049
0_
7_
SOLDERING FOOTPRINT*
6.50
14X
1.18
1
1.27
PITCH
14X
0.58
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and the
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed
at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation
or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets
and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each
customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended,
or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which
the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or
unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable
copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
http://onsemi.com
7
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
MC74LCX04/D