MC74LCX158 D

MC74LCX158
Low-Voltage CMOS Quad
2-Input Multiplexer
With 5 V−Tolerant Inputs (Inverting)
The MC74LCX158 is a high performance, quad 2−input inverting
multiplexer operating from a 2.3 to 3.6 V supply. High impedance
TTL compatible inputs significantly reduce current loading to input
drivers while TTL compatible outputs offer improved switching noise
performance. A VI specification of 5.5 V allows MC74LCX158 inputs
to be safely driven from 5 V devices.
Four bits of data from two sources can be selected using the Select
and Enable inputs. The four outputs present the selected data in the
inverted form. The MC74LCX158 can also be used as a function
generator. Current drive capability is 24 mA at the outputs.
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MARKING
DIAGRAMS
16
SOIC−16
D SUFFIX
CASE 751B
16
1
1
Features









LCX158G
AWLYWW
16
Designed for 2.3 to 3.6 V VCC Operation
5 V Tolerant Inputs − Interface Capability With 5 V TTL Logic
LVTTL Compatible
LVCMOS Compatible
24 mA Balanced Output Sink and Source Capability
Near Zero Static Supply Current (10 mA) Substantially Reduces
System Power Requirements
Latchup Performance Exceeds 500 mA
ESD Performance:
 Human Body Model >2000 V
 Machine Model >200 V
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
16
1
LCX
158
ALYWG
G
TSSOP−16
DT SUFFIX
CASE 948F
1
A
WL, L
Y
WW, W
G or G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
 Semiconductor Components Industries, LLC, 2012
October, 2012 − Rev. 7
1
Publication Order Number:
MC74LCX158/D
MC74LCX158
VCC
E
A3
B3
Y3
A2
B2
Y2
16
15
14
13
12
11
10
9
1
2
A0
3
B0
4
5
Y0
A1
6
B1
7
8
Y1 GND
S
Figure 1. Pinout: 16−Lead Plastic Package (Top View)
PIN NAMES
Pins
TRUTH TABLE
Function
An
Source 0 Data Inputs
Bn
Source 1 Data Inputs
E
Enable Input
S
Select Input
Yn
Outputs
Inputs
Outputs
Output
Enable
Select
Y0−Y3
H
X
H
L
L
A0−A3
L
H
B0−B3
X = Don’t Care
A0−A3, B0−B3 = The levels of the respective
Data−Word Inputs
PIN DESCRIPTIONS
INPUTS
OUTPUTS
A0−A3 (Pins 2, 5, 11, 14)
Y0−Y3 (Pins 4, 7, 9, 12)
Nibble A inputs. The data present on these pins is
transferred to the outputs when the Select input is at a low
level and the Output Enable input is at a low level. The data
is presented to the outputs in inverted form for the LCX158.
Data outputs. The selected input nibble is presented at
these outputs when the Output Enable input is at a low level.
The data present on these pins is in its inverted form for the
LCX158. For the Output Enable input at a high level, the
outputs are at a high level for the LCX158.
B0−B3 (Pins 3, 6, 10, 13)
Nibble B inputs. The data present on these pins is
transferred to the outputs when the Select input is at a high
level and the Output Enable input is at a low level. The data
is presented to the outputs in inverted form for the LCX158.
Select (Pin 1)
Nibble select. This input determines the data word to be
transferred to the outputs. A low level on this input selects
the A inputs and a high level selects the B inputs.
CONTROL INPUTS
Enable (Pin 15)
Output Enable input. A low level on this input allows the
selected data to be presented at the outputs. A high level on
this input sets all of the outputs to a high level for the
LCX158.
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2
MC74LCX158
A0
B0
A1
Nibble
Inputs
B1
A2
B2
A3
B3
Enable
Select
2
4
3
Y0
5
7
6
Y1
Data
Outputs
11
9
10
Y2
14
12
13
Y3
15
1
Figure 2. Expanded Logic Diagram
ORDERING INFORMATION
Package
Shipping†
MC74LCX158DG
SOIC−16
(Pb−Free)
48 Units / Rail
MC74LCX158DR2G
SOIC−16
(Pb−Free)
2500 Tape & Reel
MC74LCX158DTG
TSSOP−16
(Pb−Free)
96 Units / Rail
MC74LCX158DTR2G
TSSOP−16
(Pb−Free)
2500 Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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3
MC74LCX158
MAXIMUM RATINGS
Symbol
VCC
Parameter
Value
DC Supply Voltage
VI
DC Input Voltage
VO
DC Output Voltage
IIK
DC Input Diode Current
IOK
DC Output Diode Current
Condition
Units
−0.5 to +7.0
V
−0.5  VI  +7.0
V
−0.5  VO  VCC + 0.5
Output in HIGH or LOW State (Note 1)
V
−50
VI < GND
mA
−50
VO < GND
mA
+50
VO > VCC
mA
IO
DC Output Source/Sink Current
50
mA
ICC
DC Supply Current Per Supply Pin
100
mA
IGND
DC Ground Current Per Ground Pin
100
mA
TSTG
Storage Temperature Range
−65 to +150
C
MSL
Moisture Sensitivity
Level 1
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
1. IO absolute maximum rating must be observed.
RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
Parameter
Supply Voltage
Operating
Data Retention Only
Min
Typ
Max
2.0
1.5
2.3 to 3.3
3.6
3.6
VI
Input Voltage
0
5.5
VO
Output Voltage
(HIGH or LOW State)
(3−State)
0
VCC
IOH
HIGH Level Output Current
VCC = 3.0 V − 3.6 V
VCC = 2.7 V − 3.0 V
VCC = 2.3 V − 2.7 V
−24
−12
−8
IOL
LOW Level Output Voltage
VCC = 3.0 V − 3.6 V
VCC = 2.7 V − 3.0 V
VCC = 2.3 V − 2.7 V
+24
+12
+8
TA
Operating Free−Air Temperature
Dt/DV
Input Transition Rise or Fall Rate, VIN from 0.8 V to 2.0 V, VCC = 3.0 V
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4
Units
V
V
V
mA
mA
−40
+85
C
0
10
ns/V
MC74LCX158
DC ELECTRICAL CHARACTERISTICS
TA = −40C to +85C
Symbol
Characteristic
Condition
Min
VIH
Minimum HIGH Level Input Voltage (Note 2)
2.3 V  VCC  2.7 V
2.7 V  VCC  3.0 V
3.0 V  VCC  3.6 V
1.7
2.0
2.0
VIL
Maximum LOW Level Input Voltage (Note 2)
2.3 V  VCC  2.7 V
2.7 V  VCC  3.0 V
3.0 V  VCC  3.6 V
VOH
Minimum HIGH Level Output Voltage
2.3 V  VCC  3.6 V; IOH = −100 mA
VCC = 2.3 V; IOH = −8 mA
VCC = 2.7 V; IOH = −12 mA
VCC = 3.0 V; IOH = −18 mA
VCC = 3.0 V; IOH = −24 mA
VOL
Maximum LOW Level Output Voltage
2.3 V  VCC  3.6 V; IOH = 100 mA
VCC = 2.3 V; IOH = 8 mA
VCC = 2.7 V; IOH = 12 mA
VCC = 3.0 V; IOH = 16 mA
VCC = 3.0 V; IOH = 24 mA
0.2
0.7
0.4
0.4
0.55
V
IOFF
Power Off Leakage Current
VCC = 0, VIN = 5.5 V or VOUT = 5.5 V
10
mA
VCC = 3.6 V, VIN = 5.5 V or GND
5
mA
VCC = 3.6 V, VIN = 5.5 V or GND
10
mA
2.3  VCC  3.6 V; VIH = VCC − 0.6 V
500
mA
IIN
Input Leakage Current
ICC
Quiescent Supply Current
DICC
Increase in ICC per Input
Max
Units
V
0.7
0.8
0.8
VCC − 0.2
1.7
2.2
2.4
2.2
V
V
2. These values of VI are used to test DC electrical characteristics only.
AC CHARACTERISTICS
Limits
TA = −40C to +85C
Symbol
Parameter
VCC = 3.0 V  3.6 V
VCC = 2.7 V
VCC = 2.3 V to 2.7 V
CL = 50 pF
CL = 50 pF
CL = 30 pF
Min
Max
Min
Max
Min
Max
Units
tPLH
tPHL
Propagation Delay
A or B to Y
1.0
1.0
6.5
6.5
1.0
1.0
7.5
7.5
1.0
1.0
8.5
8.5
ns
tPLH
tPHL
Propagation Delay
S to Y
1.0
1.0
7.0
7.0
1.0
1.0
8.0
8.0
1.0
1.0
9.0
9.0
ns
tPLH
tPHL
Propagation Delay
Output Enable to Y
1.0
1.0
7.0
7.0
1.0
1.0
8.0
8.0
1.0
1.0
9.0
9.0
ns
tOSHL
tOSLH
Output−to−Output Skew
1.0
1.0
ns
DYNAMIC SWITCHING CHARACTERISTICS
TA = +25C
Symbol
Characteristic
Condition
Min
Typ
Max
Units
VOLP
Dynamic LOW Peak Voltage (Note 3)
VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V
0.8
V
VOLV
Dynamic LOW Valley Voltage (Note 3)
VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V
0.8
V
3. Number of outputs defined as “n”. Measured with “n−1” outputs switching from HIGH−to−LOW or LOW−to−HIGH. The remaining output is
measured in the LOW state.
CAPACITIVE CHARACTERISTICS
Symbol
Typical
Units
Input Capacitance
VCC = 3.3 V, VI = 0 V or VCC
7
pF
COUT
Output Capacitance
VCC = 3.3 V, VI = 0 V or VCC
8
pF
CPD
Power Dissipation Capacitance
10 MHz, VCC = 3.3 V, VI = 0 V or VCC
25
pF
CIN
Parameter
Condition
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5
MC74LCX158
2.7 V
1.5 V
A, B, S
1.5 V
0V
tPHL
tPLH
VOH
Yn
1.5 V
1.5 V
VOL
WAVEFORM 1 − INVERTING PROPAGATION DELAYS
tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns
2.7 V
E, S
1.5 V
1.5 V
0V
tPHL
tPLH
VOH
1.5 V
Yn
1.5 V
VOL
WAVEFORM 2 − INVERTING PROPAGATION DELAYS
tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns
Figure 3. AC Waveforms
VCC
PULSE
GENERATOR
DUT
RT
CL
CL = 50 pF or equivalent (Includes jig and probe capacitance)
RL = R1 = 500 W or equivalent
RT = ZOUT of pulse generator (typically 50 W)
Figure 4. Test Circuit
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6
RL
MC74LCX158
PACKAGE DIMENSIONS
TSSOP−16
DT SUFFIX
CASE 948F
ISSUE B
16X K REF
0.10 (0.004)
0.15 (0.006) T U
M
T U
S
V
S
K
S
ÉÉÉ
ÇÇÇ
ÇÇÇ
ÉÉÉ
K1
2X
L/2
16
9
J1
B
−U−
L
SECTION N−N
J
PIN 1
IDENT.
N
8
1
0.25 (0.010)
M
0.15 (0.006) T U
S
A
−V−
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH. PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
N
F
DETAIL E
−W−
C
0.10 (0.004)
−T− SEATING
PLANE
D
H
G
DETAIL E
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
SOLDERING FOOTPRINT*
7.06
1
0.65
PITCH
16X
0.36
16X
1.26
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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7
MILLIMETERS
MIN
MAX
4.90
5.10
4.30
4.50
−−−
1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.18
0.28
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0_
8_
INCHES
MIN
MAX
0.193 0.200
0.169 0.177
−−− 0.047
0.002 0.006
0.020 0.030
0.026 BSC
0.007
0.011
0.004 0.008
0.004 0.006
0.007 0.012
0.007 0.010
0.252 BSC
0_
8_
MC74LCX158
PACKAGE DIMENSIONS
SOIC−16
D SUFFIX
CASE 751B−05
ISSUE K
−A−
16
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
9
−B−
1
P
8 PL
0.25 (0.010)
8
M
B
S
G
R
K
DIM
A
B
C
D
F
G
J
K
M
P
R
F
X 45 _
C
−T−
SEATING
PLANE
J
M
D
16 PL
0.25 (0.010)
M
T B
S
A
MILLIMETERS
MIN
MAX
9.80
10.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.386
0.393
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.229
0.244
0.010
0.019
S
SOLDERING FOOTPRINT*
8X
6.40
16X
1
1.12
16
16X
0.58
1.27
PITCH
8
9
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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MC74LCX158/D