ESD7471, SZESD7471 Ultra-Low Capacitance ESD Protection Micro−Packaged Diodes for ESD Protection The ESD7471 is designed to protect voltage sensitive components that require ultra-low capacitance from ESD and transient voltage events. Excellent clamping capability, low capacitance, high breakdown voltage, high linearity, low leakage, and fast response time make these parts ideal for ESD protection on designs where board space is at a premium. It has industry leading capacitance linearity over voltage making it ideal for RF applications. This capacitance linearity combined with the extremely small package and low insertion loss makes this part well suited for use in antenna line applications for wireless handsets and terminals. http://onsemi.com MARKING DIAGRAM Features • • • • • • • • • Industry Leading Capacitance Linearity Over Voltage Ultra−Low Capacitance: 0.35 pF Max Stand−off Voltage: 5.3 V Low Leakage: < 1 nA Low Dynamic Resistance: < 1 W IEC61000−4−2 Level 4 ESD Protection 1000 ESD IEC61000−4−2 Strikes ±8 kV Contact / Air Discharged SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant Typical Applications • • • • RF Signal ESD Protection RF Switching, PA, and Antenna ESD Protection Near Field Communications USB 2.0, USB 3.0 XDFN2 CASE 711AM D M G DM G = Specific Device Code = Date Code = Pb−Free Package ORDERING INFORMATION Package Shipping† ESD7471N2T5G XDFN2 (Pb−Free) 8000 / Tape & Reel SZESD7471N2T5G XDFN2 (Pb−Free) 8000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. MAXIMUM RATINGS (TA = 25°C unless otherwise noted) Rating Symbol Value Unit IEC 61000−4−2 Contact (ESD) (Note 1) IEC 61000−4−2 Air (ESD) (Note 1) ESD ESD ±20 ±20 KV kV IEC 61000−4−5 (ESD) (Note 2) ESD 2.2 A Total Power Dissipation (Note 3) @ TA = 25°C Thermal Resistance, Junction−to−Ambient °PD° RqJA 300 400 mW °C/W TJ, Tstg −55 to +150 °C TL 260 °C Junction and Storage Temperature Range Lead Solder Temperature − Maximum (10 Second Duration) Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. At least 10 discharges at TA = 25°C, per IEC61000−4−2 waveform. 2. Non−repetitive current pulse at TA = 25°C, per IEC61000−4−5 waveform. 3. Mounted with recommended minimum pad size, DC board FR−4 © Semiconductor Components Industries, LLC, 2014 September, 2014 − Rev. 1 1 Publication Order Number: ESD7471/D ESD7471, SZESD7471 ELECTRICAL CHARACTERISTICS I (TA = 25°C unless otherwise noted) IPP Parameter Symbol IPP Maximum Reverse Peak Pulse Current VC Clamping Voltage @ IPP VRWM IR VBR IT IT VC VBR VRWM IR IR VRWM VBR VC IT Working Peak Reverse Voltage V Maximum Reverse Leakage Current @ VRWM Breakdown Voltage @ IT IPP Test Current Bi−Directional TVS *See Application Note AND8308/D for detailed explanations of datasheet parameters. ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Parameter Reverse Working Voltage Breakdown Voltage Symbol Condition Min Typ VRWM VBR IT = 1 mA (Note 4) Max Unit 5.3 V 7.0 V Reverse Leakage Current IR VRWM = 5.3 V <1 50 nA Clamping Voltage VC IPP = 1 A (Note 5) 13 15 V Junction Capacitance CJ VR = 0 V, f = 1 MHz VR = 0 V, f = 1 GHz 0.24 0.24 0.35 0.35 pF Dynamic Resistance RDYN TLP Pulse 0.8 W Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 4. Breakdown voltage is tested from pin 1 to 2 and pin 2 to 1. 5. Non−repetitive current pulse at 25°C, per IEC61000−4−5 waveform. http://onsemi.com 2 ESD7471, SZESD7471 TYPICAL CHARACTERISTICS 1 1.E−04 0.9 1.E−05 0.8 CAPACITANCE (pF) 1.E−03 I (A) 1.E−06 1.E−07 1.E−08 1.E−09 1.E−10 0.7 0.6 0.5 0.4 0.3 0.2 1.E−11 0.1 1.E−12 −12 −10 −8 −6 −4 −2 0 2 VOLTAGE (V) 4 6 8 10 0 12 −6 −5 −4 −3 −2 −1 0 1 2 3 4 5 6 Vbias (V) Figure 1. IV Characteristics Figure 2. CV Characteristics 2 2.0 0 1.8 1.6 −2 1.4 (dB) −4 1.2 −6 1.0 −8 0.8 0.6 −10 0.4 −12 0.2 −14 3.5 4.5 5.5 6.5 FREQUENCY (GHz) Figure 3. RF Insertion Loss Figure 4. Capacitance over Frequency 1E9 1E10 2E10 8 16 1.5 2.5 7.5 8.5 9.5 8 6 12 −12 6 −10 10 8 4 6 4 2 −8 4 −6 −4 2 −2 2 2 4 6 8 0 0 10 12 14 16 18 20 22 24 26 VC, VOLTAGE (V) 0 2 Figure 5. Positive TLP I−V Curve 4 6 8 0 10 12 14 16 18 20 22 24 26 VC, VOLTAGE (V) Figure 6. Negative TLP I−V Curve http://onsemi.com 3 EQUIVALENT VIEC (kV) −14 EQUIVALENT VIEC (kV) TLP CURRENT (A) TLP CURRENT (A) 0.5 −16 14 0 0 0 VOLTAGE (V) 1E8 ESD7471, SZESD7471 PACKAGE DIMENSIONS XDFN2 1.0x0.6, 0.65P (SOD−882) CASE 711AM ISSUE O NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. EXPOSED COPPER ALLOWED AS SHOWN. 0.10 C ÉÉ ÉÉ A B D PIN 1 INDICATOR E DIM A A1 b D E e L 0.05 C TOP VIEW NOTE 3 0.10 C A 0.10 C A1 C SIDE VIEW MILLIMETERS MIN MAX 0.34 0.44 −−− 0.05 0.43 0.53 1.00 BSC 0.60 BSC 0.65 BSC 0.20 0.30 RECOMMENDED SOLDER FOOTPRINT* SEATING PLANE 1.20 2X e 2X 0.47 0.60 b e/2 0.05 M PIN 1 C A B 1 DIMENSIONS: MILLIMETERS 2X L 0.05 M *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. C A B BOTTOM VIEW ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. 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