CAT6201, CAV6201B 300 mA / 13 V Adjustable CMOS LDO Regulator Description The CAT6201/CAV6201B is a 13 V rated 300 mA CMOS low dropout regulator that provides fast response time to load current and line voltage changes in an automotive environment. CAT6201/CAV6201B features a low RON P−channel pass element with internal control circuitry which prevents reverse current flow should the voltage at VOUT exceed VIN as in the case of the car’s battery voltage accidentally being applied to VOUT. Thermal protection and current limiting circuitry combine to protect the pass device against faults and abuse. Current limiting is user controlled through a single resistor to ground. A fault output (FLT) provides an alert should an over−current event or thermal shutdown occur. CAT6201/CAV6201B comes on−line gracefully even though it may be driving heavy capacitive loads thanks to built−in soft−start circuitry. Its output is protected against accidental connection to voltages greater than VIN and will not conduct current backwards into its supply. CAT6201/CAV6201B is available in 8−pad 2 mm x 3 mm TDFN package. http://onsemi.com TDFN−8 VP2 SUFFIX CASE 511AK PIN CONNECTIONS VIN • • • • • • • • • • Guaranteed 300 mA Continuous Output Current Low Dropout Voltage of 250 mV Typical at 300 mA Input Voltage Range: 3.3 V to 13.5 V User Adjustable Output Voltage User Programmable Current Limit Fault Output to Indicate Under−voltage, Current Limiting or Thermal Shutdown has Occurred Fault Blanking: 3 ms VOUT Withstands Battery Fault Voltages of up to 14 V Soft−Start Prevents Current Surges Stable with Ceramic Output Capacitor ±1.5% Output Voltage Initial Accuracy ±2.5% Accuracy Over Temperature Thermal Protection 8 Pad TDFN Package CAV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant © Semiconductor Components Industries, LLC, 2013 December, 2013 − Rev. 3 1 VADJ EN ILIM BYP GND TDFN−8 (Top View) Features • • • • • • VOUT 1 FLT MARKING DIAGRAMS HKB LAA YM G HKB L AA Y M G = CAT6201VP2−GT3 or = CAV6201BVP2−GT3 = Assembly Location = Last Two Digits of = Assembly Lot Number = Production Year (Last Digit) = Production Month (1−9, O, N, D) = Pb−Free Microdot ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 10 of this data sheet. Publication Order Number: CAT6201/D CAT6201, CAV6201B VIN VIN VOUT VOUT ILIM 1 mF 100 kW CAT6201/ CAV6201B 2.2 mF VADJ BYP GND 10 nF Figure 1. CAT6201/CAV6201B Typical Application FLT Bias Control Current Sensing VOUT Power PMOS CIN Over Current REXT 1.25 V Ref − EN BYP CBYP + Enable & Soft Start + − COUT ILIM R1 VADJ Error Amplifier GND Figure 2. CAT6201/CAV6201B Functional Block Diagram http://onsemi.com 2 R2 CAT6201, CAV6201B Table 1. PIN FUNCTION DESCRIPTION Pin No. Pin Name Description 1 VIN Supply voltage input 2 FLT Fault indicator (active low) 3 EN Enable input (active high) 4 BYP A capacitor between BYP and GND controls the regulator’s turn−on speed and improves PSRR 5 GND Ground reference 6 ILIM Current limit control pin 7 VADJ Output voltage adjustment 8 VOUT LDO Output Voltage Pad − Backside pad in center of package provides thermal contact for cooling, typically via the PCB ground plane. This pad is electrically active and connected to GND internally. An external Ground connection is not required and the pad may be left floating. Table 2. ABSOLUTE MAXIMUM RATINGS Rating Value Unit VIN, VOUT, EN 0 to 16 V All other pins −0.3 to +6.0 V +150 _C Internally Limited (Note 1) mW −65 to +150 _C Lead Temperature (soldering, 5 sec.) 260 _C ESD Rating (Human Body Model) 1000 V ESD Rating (Machine Model) 200 V Junction Temperature, TJ Power Dissipation, PD Storage Temperature Range, TS Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. The maximum allowable power dissipation at any TA (ambient temperature) is PDmax = (TJmax – TA) / θJA. Exceeding the maximum allowable power dissipation will result in excessive die temperature, and the regulator will go into thermal shutdown. Table 3. RECOMMENDED OPERATING CONDITIONS (Note 2) Parameter VIN, VOUT, EN All other pins Junction Temperature Range, TJ Range Unit 3.3 to 13.5 V 0 to 6.0 V −40 to +125 _C Package Thermal Resistance (SOIC), θJA 235 _C/W Package Thermal Resistance (TDFN), θJA 92 _C/W 2. The device is not guaranteed to work outside its operating rating. http://onsemi.com 3 CAT6201, CAV6201B Pin Function VIN is the supply pin for both the LDO’s operation and the load the LDO is driving. It is recommended that a 1 mF ceramic bypass capacitor be placed between the VIN pin and ground in close proximity to the device. When using longer connections to the power supply, CIN value can be increased without limit. The operating input voltage range is from 3.3 V to 13.5 V. FLT is an active low open−drain output indicating one of 3 fault conditions: 1. Input under−voltage: input is below the intended output voltage 2. Over−current. Brief over−current events are masked by a 3 ms time delay. CAT6201/CAV6201B will limit current anytime the load tries to draw more than the maximum allowed, however reporting of this event will occur only if the event lasts longer than the delay timer. Events terminating before the timer reaches its full count are ignored and the timer is reset. 3. Over−temperature shutdown has occurred. EN is an active HIGH logic level input for switching the regulator’s output between ON and OFF. A weak internal pull down assures that if EN pin is left open, the circuit is disabled. BYP controls the soft−start feature for the regulator. When large capacitive loads are present at the regulator’s output, enabling the regulator will produce large current surges on the VIN supply line. To reduce these surges the regulator can be turned on gently by connecting a capacitor between the BYP pin and ground. The larger the capacitance value the more slowly VOUT approaches its programmed value. The table below gives a list of common capacitor values and their resulting turn−on times. If the soft−start feature is not desired, this pin should be left floating. Capacitance [nF] tON [ms] 0 0.2 10 1 100 10 short circuit current, measured at VOUT = 0 V, which is typically 100 mA greater than ILIM. A resistor REXT placed between ILIM and GND selects the trip current according to a formula: I LIM + I LIM0 ) Current_Limit_Factor(CLF) R EXT (eq. 1) ILIM0 is the built−in minimum current limit (typically 150 mA), and CLF is a numerical value (typical 30,000 Volts) which relates the allowable load current to a resistance value. The value of this resistor is determined by the following equation: R EXT(W) + CLF(V) I LIM(A) * I LIM0(A) (eq. 2) It is recommended that ILIM be set to at least 50% higher than the maximum intended continuous IOUT. Example: Set ILIMIT = 600 mA R EXT(W) + 30, 000 V + 68 KW 0.6 A * 0.15 A (eq. 3) VADJ is the output voltage control pin. A resistor divider placed between VOUT and GND whose center point connects to VADJ sets the LDO regulator’s output voltage. Typical VADJ value is 1.25 V. The current through the resistor divider can be anywhere between 10 mA and 1 mA. The higher this current is, the lower the noise. For best performance R1 and R2 should have similar temperature coefficients, otherwise output voltage accuracy will be compromised. ǒ V OUT + V ADJ 1 ) Ǔ R1 R2 (eq. 4) VOUT is the LDO regulator output. A small 2.2 mF ceramic bypass capacitor is required between VOUT and ground. For better transient response, its value can be increased to 4.7 mF. This capacitor should be located near the device. VOUT is protected against short circuits and over−temp operation by internal circuitry. In the event of an over−current, the LDO behaves like a current source, limiting current at the output. The maximum current allowed is set by REXT, the resistor between ILIM and GND. If the load attempts to draw more than the allowed current, VOUT and IOUT decrease together and thus limit the total power delivered. VOUT is protected against the application of voltages greater than VIN. For example, in automotive applications, if CAT6201/CAV6201B is powering a remote load and damage occurs to a wiring harness shorting a powered line, Battery + for instance, to VOUT, CAT6201/CAV6201B will not be damaged by this higher voltage being applied to VOUT. GND is the ground reference for the LDO in the TDFN package, center metal pad is internally connected to GND. If electrical contact is made with this pad, it should be to GND and/or the ground plane of the PCB. Connection to the ground plane enhances thermal conductivity drawing heat out of the package and into the surrounding PCB. ILIM stands for Current Limit and is the control input for setting the point at which the current limit is invoked. ILIM is defined as the current at which VOUT is still within 80% of its nominal value and should not be confused with ISC, the http://onsemi.com 4 CAT6201, CAV6201B Table 4. ELECTRICAL CHARACTERISTICS (VIN = VOUT + 1 V, VEN = High, IOUT = 1 mA, CIN = 1 mF, COUT = 2.2 mF, REXT = 68 kW, ambient temperature of 25°C (over recommended operating conditions unless specified otherwise). Bold numbers apply for the entire junction temperature range.) Symbol VIN Parameter Conditions Input Voltage Min Max Unit 3.3 13.5 V 12.5 VOUT Output Voltage VADJ VADJ ADJ Voltage 1.232 IADJ ADJ Input Current TCOUT Output Voltage Temp. Coefficient IOUT = 10 mA VR−LINE Line Regulation VOUT + 1 V < VIN < 13.5 V Typ 1.250 1.268 0.5 2.0 100 −0.2 ±0.1 −0.4 VR−LOAD V mA ppm/°C +0.2 %/V +0.4 Load Regulation IOUT = 1 mA to 300 mA 0.7 2 % Dropout Voltage (Note 3) IOUT = 300 mA 250 350 mV Ground Current IOUT = 0 mA 100 150 mA IOUT = 300 mA 160 300 Shutdown Ground Current VEN < 0.4 V 0.5 2 Power Supply Rejection Ratio f = 1 kHz, CBYP = 10 nF 62 f = 20 kHz, CBYP = 10 nF 52 TON Turn−On Time CBYP = 10 nF VOUT = 0% − 100% 700 ISC Output short circuit current VOUT < 0.8 V REXT = 68 K VDROP IGND IGND−SD PSRR 500 VOUT < 0.8 V ILIM = OPEN ILIM Output current limit 650 dB ms 800 mA mA 200 VOUT = 80% of VOUT measured at a load of 1 mA REXT = 68 K 400 450 600 VOUT = 80% of VOUT measured at a load of 1 mA ILIM = OPEN 120 150 180 VOUT < 0.8 V mA CLF Current Limit Factor 24 30 36 KV tFD Fault Delay 1.5 3 6 ms VIN−UVLO Under voltage lockout threshold 2.85 3.1 3.25 V ESR ROUT equivalent series resistance 5 500 mW ENABLE INPUT VHI Logic High Level VIN = 3.3 to 13.5 V VLO Logic Low Level VIN = 3.3 to 13.5 V IEN Enable Input Current VEN = 0.4 V VEN = VIN V 2 0.4 V 0.15 1 mA 3 5 THERMAL PROTECTION TSD Thermal Shutdown 140 °C THYS Thermal Hysteresis 10 °C 3. Dropout voltage is defined as the input−to−output differential at which the output voltage drops 2% below its nominal value. During test, the input voltage stays always above the minimum 3.3 V. The given values are for VOUT = 7.5 V. http://onsemi.com 5 CAT6201, CAV6201B TYPICAL CHARACTERISTICS (shown for 7.5 V output) (VIN = 8.5 V, R1 = 5.1 kW, R2 = 1 kW, CIN = 1 mF, COUT = 2.2 mF, CBYP = 10 nF, REXT = 68 kW, FLT not connected, TA = 25°C unless otherwise specified.) 8 7.50 1 mA 6 OUTPUT VOLTAGE (V) OUTPUT VOLTAGE (V) 7 300 mA 5 4 3 2 7.45 7.40 7.35 1 0 0 2 4 6 8 10 12 7.30 14 12 13 Figure 4. Line Regulation 14 1.27 VADJ, ADJUSTABLE VOLTAGE (V) OUTPUT VOLTAGE (V) 11 Figure 3. Dropout Characteristics 7.40 7.35 0 50 100 150 200 250 1.26 1 mA 1.25 150 mA 1.24 300 mA 1.23 1.22 −40 −20 300 0 20 60 40 80 100 120 140 OUTPUT LOAD CURRENT (mA) TJ, JUNCTION TEMPERATURE (°C) Figure 5. Load Regulation Figure 6. Adjustable Voltage vs. Temperature 175 GROUND CURRENT (mA) 175 GROUND CURRENT (mA) 10 INPUT VOLTAGE (V) 7.45 150 125 100 75 9 INPUT VOLTAGE (V) 7.50 7.30 8 0 50 100 150 200 250 150 125 100 75 −25 300 0 25 50 75 100 OUTPUT LOAD CURRENT (mA) TEMPERATURE (°C) Figure 7. Ground Current vs. Load Current Figure 8. Ground Current vs. Temperature http://onsemi.com 6 125 CAT6201, CAV6201B TYPICAL CHARACTERISTICS (shown for 7.5 V output) (VIN = 8.5 V, R1 = 5.1 kW, R2 = 1 kW, CIN = 1 mF, COUT = 2.2 mF, CBYP = 10 nF, REXT = 68 kW, FLT not connected, TA = 25°C unless otherwise specified.) 700 GROUND CURRENT (mA) 500 400 300 200 VOUT = 0 REXT = ∞ 100 0 2 4 6 8 10 12 150 125 100 75 50 25 0 14 10 1.50 1.25 1.00 0.75 12 2 4 6 8 10 12 2 0 14 4 5 6 7 8 9 10 INPUT VOLTAGE (V) INPUT VOLTAGE (V) Figure 11. Enable Threshold vs. Input Voltage Figure 12. Fault Bar Voltage vs. Input Voltage 2.25 6 5 4 3 REXT = ∞ 100 200 REXT = 100 KW 300 400 500 REXT = 68 KW 600 700 2.00 1.75 1.50 1.25 1.00 0.75 VIN = VEN = 8 V 0.50 0.25 0 6 7 8 9 10 11 12 13 OUTPUT CURRENT (mA) OUTPUT VOLTAGE (V) Figure 13. Output Voltage vs. Load Current Figure 14. Output Current (Sink) vs. Output Voltage http://onsemi.com 7 14 4 7 0 10 6 2.50 0 8 8 8 1 6 Figure 10. Ground Current vs. Input Voltage 1.75 2 4 Figure 9. Output Short−circuit Current vs. Input Voltage 12 0 2 INPUT VOLTAGE (V) 2.00 0.50 0 INPUT VOLTAGE (V) FAULTBAR VOLTAGE (V) ENABLE THRESHOLD VOLTAGE (V) 175 REXT = 69 kW 600 0 OUTPUT VOLTAGE (V) 200 OUTPUT CURRENT (SINK) (mA) SHORT−CIRCUIT CURRENT (mA) 800 14 CAT6201, CAV6201B TYPICAL CHARACTERISTICS (shown for 7.5 V output) (VIN = 8.5 V, R1 = 5.1 kW, R2 = 1 kW, CIN = 1 mF, COUT = 2.2 mF, CBYP = 10 nF, REXT = 68 kW, TA = 25°C unless otherwise specified. All transient characteristics are generated using the evaluation board CAT6201EVAL1.) Figure 15. Enable Turn−On (No Load) Figure 16. Enable Turn−On (22 W Load) Figure 17. Enable Operation (No Load) Figure 18. Enable Operation (22 W Load) Figure 19. Load Transient Response (1 mA to 330 mA) Figure 20. Fault Operation (VIN = 7 V and 22 W Load) http://onsemi.com 8 CAT6201, CAV6201B PACKAGE DIMENSIONS TDFN8, 2x3 CASE 511AK−01 ISSUE A D A e b E2 E PIN#1 IDENTIFICATION A1 PIN#1 INDEX AREA D2 TOP VIEW SIDE VIEW SYMBOL MIN NOM MAX A 0.70 0.75 0.80 A1 0.00 0.02 0.05 A2 0.45 0.55 0.65 A3 A2 A3 b 0.20 0.25 0.30 D 1.90 2.00 2.10 D2 1.30 1.40 1.50 E 2.90 3.00 3.10 E2 1.20 1.30 1.40 L BOTTOM VIEW 0.20 REF e FRONT VIEW 0.50 TYP 0.20 0.30 L 0.40 Notes: (1) All dimensions are in millimeters. (2) Complies with JEDEC MO-229. http://onsemi.com 9 CAT6201, CAV6201B ORDERING INFORMATION Specific Device Marking Package Type Lead Finish Shipping (Note 5) CAT6201VP2−GT3 HKB TDFN−8 NiPdAu 3,000 / Tape & Reel CAV6201BVP2−GT3 HKB TDFN−8 NiPdAu 3,000 / Tape & Reel Device Order Number 4. For additional package and temperature options, please contact your nearest ON Semiconductor Sales office. 5. For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 6. For detailed information and a breakdown of device nomenclature and numbering systems, please see the ON Semiconductor Device Nomenclature document, TND310/D, available at www.onsemi.com. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. 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This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 http://onsemi.com 10 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative CAT6201/D