ONSEMI CAT6201

CAT6201
300 mA / 13 V Adjustable
CMOS LDO Regulator
Description
The CAT6201 is a 13 V rated 300 mA CMOS low dropout regulator
that provides fast response time to load current and line voltage
changes in an automotive environment.
CAT6201 features a low RON P−channel pass element with internal
control circuitry which prevents reverse current flow should the
voltage at VOUT exceed VIN as in the case of the car’s battery voltage
accidentally being applied to VOUT.
Thermal protection and current limiting circuitry combine to protect
the pass device against faults and abuse. Current limiting is user
controlled through a single resistor to ground. A fault output (FLT)
provides an alert should an over−current event or thermal shutdown
occur.
CAT6201 comes on−line gracefully even though it may be driving
heavy capacitive loads thanks to built−in soft−start circuitry. Its output
is protected against accidental connection to voltages greater than VIN
and will not conduct current backwards into its supply.
CAT6201 is available in 8−pad 2 mm x 3 mm TDFN package.
http://onsemi.com
TDFN−8
VP2 SUFFIX
CASE 511AK
PIN CONNECTIONS
VIN
VADJ
EN
ILIM
BYP
GND
TDFN−8
(Top View)
Features
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Guaranteed 300 mA Continuous Output Current
Low Dropout Voltage of 250 mV Typical at 300 mA
Input Voltage Range: 3.3 V to 13.5 V
User Adjustable Output Voltage
User Programmable Current Limit
Fault Output to Indicate Under−voltage, Current Limiting or Thermal
Shutdown has Occurred
Fault Blanking: 3 ms
VOUT Withstands Battery Fault Voltages of up to 14 V
Soft−Start Prevents Current Surges
Stable with Ceramic Output Capacitor
±1.5% Output Voltage Initial Accuracy
±2.5% Accuracy Over Temperature
Thermal Protection
8 Pad TDFN Package
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
© Semiconductor Components Industries, LLC, 2012
September, 2012 − Rev. 2
VOUT
1
FLT
1
MARKING DIAGRAMS
HKB
LAA
YM
G
HKB
L
AA
Y
M
G
= CAT6201VP2−GT3
= Assembly Location
= Last Two Digits of
= Assembly Lot Number
= Production Year (Last Digit)
= Production Month (1−9, O, N, D)
= Pb−Free Microdot
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 10 of this data sheet.
Publication Order Number:
CAT6201/D
CAT6201
VIN
VIN
VOUT
VOUT
ILIM
1 mF
100 kW
CAT6201
2.2 mF
VADJ
BYP
GND
10 nF
Figure 1. CAT6201 Typical Application
FLT
Bias Control
Current
Sensing
VOUT
Power PMOS
CIN
Over Current
REXT
1.25 V Ref
−
EN
BYP
CBYP
+ −
+
Enable &
Soft Start
Error
Amplifier
GND
Figure 2. CAT6201 Functional Block Diagram
http://onsemi.com
2
COUT
ILIM
R1
VADJ
R2
CAT6201
Table 1. PIN FUNCTION DESCRIPTION
Pin No.
Pin Name
Description
1
VIN
Supply voltage input
2
FLT
Fault indicator (active low)
3
EN
Enable input (active high)
4
BYP
A capacitor between BYP and GND controls the regulator’s turn−on speed and improves PSRR
5
GND
Ground reference
6
ILIM
Current limit control pin
7
VADJ
Output voltage adjustment
8
VOUT
LDO Output Voltage
Pad
−
Backside pad in center of package provides thermal contact for cooling, typically via the PCB ground
plane. This pad is electrically active and connected to GND internally. An external Ground connection
is not required and the pad may be left floating.
Table 2. ABSOLUTE MAXIMUM RATINGS
Rating
Value
Unit
0 to 16
V
−0.3 to +6.0
V
+150
_C
Internally Limited (Note 1)
mW
−65 to +150
_C
Lead Temperature (soldering, 5 sec.)
260
_C
ESD Rating (Human Body Model)
1000
V
ESD Rating (Machine Model)
200
V
VIN, VOUT
All other pins
Junction Temperature, TJ
Power Dissipation, PD
Storage Temperature Range, TS
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. The maximum allowable power dissipation at any TA (ambient temperature) is PDmax = (TJmax – TA) / θJA. Exceeding the maximum allowable
power dissipation will result in excessive die temperature, and the regulator will go into thermal shutdown.
Table 3. RECOMMENDED OPERATING CONDITIONS (Note 2)
Parameter
VIN, VOUT
All other pins
Junction Temperature Range, TJ
Range
Unit
3.3 to 13.5
V
0 to 6.0
V
−40 to +125
_C
Package Thermal Resistance (SOIC), θJA
235
_C/W
Package Thermal Resistance (TDFN), θJA
92
_C/W
2. The device is not guaranteed to work outside its operating rating.
http://onsemi.com
3
CAT6201
Pin Function
VIN is the supply pin for both the LDO’s operation and the
load the LDO is driving. It is recommended that a 1 mF
ceramic bypass capacitor be placed between the VIN pin and
ground in close proximity to the device. When using longer
connections to the power supply, CIN value can be increased
without limit. The operating input voltage range is from
3.3 V to 13.5 V.
FLT is an active low open−drain output indicating one of 3
fault conditions:
1. Input under−voltage: input is below the intended
output voltage
2. Over−current. Brief over−current events are
masked by a 3 ms time delay. CAT6201 will limit
current anytime the load tries to draw more than
the maximum allowed, however reporting of this
event will occur only if the event lasts longer than
the delay timer. Events terminating before the
timer reaches its full count are ignored and the
timer is reset.
3. Over−temperature shutdown has occurred.
EN is an active HIGH logic level input for switching the
regulator’s output between ON and OFF. A weak internal
pull down assures that if EN pin is left open, the circuit is
disabled.
BYP controls the soft−start feature for the regulator. When
large capacitive loads are present at the regulator’s output,
enabling the regulator will produce large current surges on
the VIN supply line. To reduce these surges the regulator can
be turned on gently by connecting a capacitor between the
BYP pin and ground. The larger the capacitance value the
more slowly VOUT approaches its programmed value. The
table below gives a list of common capacitor values and their
resulting turn−on times. If the soft−start feature is not
desired, this pin should be left floating.
Capacitance [nF]
tON [ms]
0
0.2
10
1
100
10
of its nominal value and should not be confused with ISC, the
short circuit current, measured at VOUT = 0 V, which is
typically 100 mA greater than ILIM.
A resistor REXT placed between ILIM and GND selects the
trip current according to a formula:
I LIM + I LIM0 )
Current_Limit_Factor(CLF)
R EXT
(eq. 1)
ILIM0 is the built−in minimum current limit (typically
150 mA), and CLF is a numerical value (typical 30,000
Volts) which relates the allowable load current to a
resistance value. The value of this resistor is determined by
the following equation:
R EXT(W) +
CLF(V)
I LIM(A) * I LIM0(A)
(eq. 2)
It is recommended that ILIM be set to at least 50% higher
than the maximum intended continuous IOUT.
Example: Set ILIMIT = 600 mA
R EXT(W) +
30, 000 V
+ 68 KW
0.6 A * 0.15 A
(eq. 3)
VADJ is the output voltage control pin. A resistor divider
placed between VOUT and GND whose center point
connects to VADJ sets the LDO regulator’s output voltage.
Typical VADJ value is 1.25 V. The current through the
resistor divider can be anywhere between 10 mA and 1 mA.
The higher this current is, the lower the noise.
For best performance R1 and R2 should have similar
temperature coefficients, otherwise output voltage accuracy
will be compromised.
ǒ
V OUT + V ADJ 1 )
Ǔ
R1
R2
(eq. 4)
VOUT is the LDO regulator output. A small 2.2 mF ceramic
bypass capacitor is required between VOUT and ground.
For better transient response, its value can be increased to
4.7 mF. This capacitor should be located near the device.
VOUT is protected against short circuits and over−temp
operation by internal circuitry. In the event of an
over−current, the LDO behaves like a current source,
limiting current at the output. The maximum current
allowed is set by REXT, the resistor between ILIM and GND.
If the load attempts to draw more than the allowed current,
VOUT and IOUT decrease together and thus limit the total
power delivered.
VOUT is protected against the application of voltages
greater than VIN. For example, in automotive applications,
if CAT6201 is powering a remote load and damage occurs
to a wiring harness shorting a powered line, Battery + for
instance, to VOUT, CAT6201 will not be damaged by this
higher voltage being applied to VOUT.
GND is the ground reference for the LDO in the TDFN
package, center metal pad is internally connected to GND.
If electrical contact is made with this pad, it should be to
GND and/or the ground plane of the PCB. Connection to the
ground plane enhances thermal conductivity drawing heat
out of the package and into the surrounding PCB.
ILIM stands for Current Limit and is the control input for
setting the point at which the current limit is invoked. ILIM
is defined as the current at which VOUT is still within 80%
http://onsemi.com
4
CAT6201
Table 4. ELECTRICAL CHARACTERISTICS
(VIN = VOUT + 1 V, VEN = High, IOUT = 1 mA, CIN = 1 mF, COUT = 2.2 mF, REXT = 68 kW, ambient temperature of 25°C (over recommended
operating conditions unless specified otherwise). Bold numbers apply for the entire junction temperature range.)
Symbol
VIN
Parameter
Conditions
Input Voltage
Min
Max
Unit
3.3
13.5
V
12.5
VOUT
Output Voltage
VADJ
VADJ
ADJ Voltage
1.231
Typ
1.250
1.268
0.5
2.0
V
IADJ
ADJ Input Current
TCOUT
Output Voltage
Temp. Coefficient
IOUT = 10 mA
VR−LINE
Line Regulation
VOUT + 1 V < VIN < 13.5 V
VR−LOAD
Load Regulation
IOUT = 1 mA to 300 mA
0.7
2
%
Dropout Voltage (Note 3)
IOUT = 300 mA
250
350
mV
Ground Current
IOUT = 0 mA
100
150
mA
IOUT = 300 mA
160
300
Shutdown Ground
Current
VEN < 0.4 V
0.5
2
Power Supply
Rejection Ratio
f = 1 kHz, CBYP = 10 nF
62
f = 20 kHz, CBYP = 10 nF
52
TON
Turn−On Time
CBYP = 10 nF
VOUT = 0% − 100%
700
ISC
Output short circuit
current
VOUT < 0.8 V
REXT = 68 K
100
−0.2
±0.1
−0.4
VDROP
IGND
IGND−SD
PSRR
500
VOUT < 0.8 V
ILIM = OPEN
ILIM
Output current limit
+0.2
%/V
+0.4
650
mA
dB
ms
800
mA
mA
200
VOUT = 80% of VOUT measured
at a load of 1 mA
REXT = 68 K
400
450
600
VOUT = 80% of VOUT measured
at a load of 1 mA
ILIM = OPEN
120
150
180
VOUT < 0.8 V
mA
ppm/°C
CLF
Current Limit Factor
24
30
36
KV
tFD
Fault Delay
1.5
3
6
ms
VIN−UVLO
Under voltage
lockout threshold
2.85
3.1
3.25
V
ESR
ROUT equivalent
series resistance
5
500
mW
ENABLE INPUT
VHI
Logic High Level
VIN = 3.3 to 13.5 V
VLO
Logic Low Level
VIN = 3.3 to 13.5 V
IEN
Enable Input Current
VEN = 0.4 V
VEN = VIN
V
2
0.4
V
0.15
1
mA
3
5
THERMAL PROTECTION
TSD
Thermal Shutdown
140
°C
THYS
Thermal Hysteresis
10
°C
3. Dropout voltage is defined as the input−to−output differential at which the output voltage drops 2% below its nominal value. During test, the
input voltage stays always above the minimum 3.3 V. The given values are for VOUT = 7.5 V.
http://onsemi.com
5
CAT6201
TYPICAL CHARACTERISTICS (shown for 7.5 V output)
(VIN = 8.5 V, R1 = 5.1 kW, R2 = 1 kW, CIN = 1 mF, COUT = 2.2 mF, CBYP = 10 nF, REXT = 68 kW,
FLT not connected, TA = 25°C unless otherwise specified.)
8
7.50
1 mA
6
OUTPUT VOLTAGE (V)
OUTPUT VOLTAGE (V)
7
300 mA
5
4
3
2
7.45
7.40
7.35
1
0
0
2
4
6
8
10
12
7.30
14
12
13
Figure 4. Line Regulation
14
1.27
VADJ, ADJUSTABLE VOLTAGE (V)
OUTPUT VOLTAGE (V)
11
Figure 3. Dropout Characteristics
7.40
7.35
0
50
100
150
200
250
1.26
1 mA
1.25
150 mA
1.24
300 mA
1.23
1.22
−40 −20
300
0
20
60
40
80
100
120 140
OUTPUT LOAD CURRENT (mA)
TJ, JUNCTION TEMPERATURE (°C)
Figure 5. Load Regulation
Figure 6. Adjustable Voltage vs. Temperature
175
GROUND CURRENT (mA)
175
GROUND CURRENT (mA)
10
INPUT VOLTAGE (V)
7.45
150
125
100
75
9
INPUT VOLTAGE (V)
7.50
7.30
8
0
50
100
150
200
250
150
125
100
75
−25
300
0
25
50
75
100
OUTPUT LOAD CURRENT (mA)
TEMPERATURE (°C)
Figure 7. Ground Current vs. Load Current
Figure 8. Ground Current vs. Temperature
http://onsemi.com
6
125
CAT6201
TYPICAL CHARACTERISTICS (shown for 7.5 V output)
(VIN = 8.5 V, R1 = 5.1 kW, R2 = 1 kW, CIN = 1 mF, COUT = 2.2 mF, CBYP = 10 nF, REXT = 68 kW,
FLT not connected, TA = 25°C unless otherwise specified.)
700
GROUND CURRENT (mA)
500
400
300
200
VOUT = 0
REXT = ∞
100
0
2
4
6
8
10
12
150
125
100
75
50
25
0
14
10
1.50
1.25
1.00
0.75
12
2
4
6
8
10
12
2
0
14
4
5
6
7
8
9
10
INPUT VOLTAGE (V)
INPUT VOLTAGE (V)
Figure 11. Enable Threshold vs. Input Voltage
Figure 12. Fault Bar Voltage vs. Input Voltage
2.25
6
5
4
3
REXT = ∞
100
200
REXT = 100 KW
300
400
500
REXT =
68 KW
600
700
2.00
1.75
1.50
1.25
1.00
0.75
VIN = VEN = 8 V
0.50
0.25
0
6
7
8
9
10
11
12
13
OUTPUT CURRENT (mA)
OUTPUT VOLTAGE (V)
Figure 13. Output Voltage vs. Load Current
Figure 14. Output Current (Sink) vs. Output
Voltage
http://onsemi.com
7
14
4
7
0
10
6
2.50
0
8
8
8
1
6
Figure 10. Ground Current vs. Input Voltage
1.75
2
4
Figure 9. Output Short−circuit Current vs.
Input Voltage
12
0
2
INPUT VOLTAGE (V)
2.00
0.50
0
INPUT VOLTAGE (V)
FAULTBAR VOLTAGE (V)
ENABLE THRESHOLD VOLTAGE (V)
175
REXT = 69 kW
600
0
OUTPUT VOLTAGE (V)
200
OUTPUT CURRENT (SINK) (mA)
SHORT−CIRCUIT CURRENT (mA)
800
14
CAT6201
TYPICAL CHARACTERISTICS (shown for 7.5 V output)
(VIN = 8.5 V, R1 = 5.1 kW, R2 = 1 kW, CIN = 1 mF, COUT = 2.2 mF, CBYP = 10 nF, REXT = 68 kW,
TA = 25°C unless otherwise specified. All transient characteristics are generated using the evaluation board CAT6201EVAL1.)
Figure 15. Enable Turn−On (No Load)
Figure 16. Enable Turn−On (22 W Load)
Figure 17. Enable Operation (No Load)
Figure 18. Enable Operation (22 W Load)
Figure 19. Load Transient Response
(1 mA to 330 mA)
Figure 20. Fault Operation
(VIN = 7 V and 22 W Load)
http://onsemi.com
8
CAT6201
PACKAGE DIMENSIONS
TDFN8, 2x3
CASE 511AK−01
ISSUE A
D
A
e
b
E2
E
PIN#1
IDENTIFICATION
A1
PIN#1 INDEX AREA
D2
TOP VIEW
SIDE VIEW
SYMBOL
MIN
NOM
MAX
A
0.70
0.75
0.80
A1
0.00
0.02
0.05
A2
0.45
0.55
0.65
A3
A2
A3
b
0.20
0.25
0.30
D
1.90
2.00
2.10
D2
1.30
1.40
1.50
E
2.90
3.00
3.10
E2
1.20
1.30
1.40
L
BOTTOM VIEW
0.20 REF
e
FRONT VIEW
0.50 TYP
0.20
0.30
L
0.40
Notes:
(1) All dimensions are in millimeters.
(2) Complies with JEDEC MO-229.
http://onsemi.com
9
CAT6201
ORDERING INFORMATION
Device Order Number
Specific
Device Marking
Package Type
Lead Finish
Shipping (Note 5)
HKB
TDFN−8
NiPdAu
3,000 / Tape & Reel
CAT6201VP2−GT3
4. For additional package and temperature options, please contact your nearest ON Semiconductor Sales office.
5. For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
6. For detailed information and a breakdown of device nomenclature and numbering systems, please see the ON Semiconductor Device
Nomenclature document, TND310/D, available at www.onsemi.com.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where
personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and
its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly,
any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture
of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
http://onsemi.com
10
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
CAT6201/D