Ordering number : ENA1982D LV5683P Bi-CMOS IC Multi Voltage Regulator IC for Car Audio Systems http://onsemi.com Overview The LV5683P is a multi voltage regulator suitable for USB silicon tuner car-audio systems. This IC has 4 outputs, VDD 5V(3.3V), AUDIO(8.5V), SWU(3.3V) and USB5V(CD 8V: available). About protection circuits, it has Over-current-protection, Over-voltage-protection and Thermal-shut-down. VCC1(SWU and USB supply) is independent terminal from VCC, and accepts lower voltage (ex. From DC/DC converter) which enables to reduce power dissipation. HZIP15 Features • 4 system regulator VDD(LCD micon) : VOUT 5.0V(3.3V), IO max 300mA, reverse current prevention. Audio : VOUT 8.5V, IO max 400mA SWU(systems) : VOUT 3.3V, IO max 500mA USB : VOUT 5.0V(8.0V available for CD), IO max 1100mA • Over-current-protection • Thermal-shut-down Typ 175ºC • Over-voltage-protection: Typ 21V(except VDD) • Applied Pch-LDMOS for output stages. (Warning)The protector functions only improve the IC’s tolerance and they do not guarantee the safety of the IC if used under the conditions out of safety range or ratings. Use of the IC such as use under overcurrent protection range or thermal shut down state may degrade the IC’s reliability and eventually damage the IC. Specifications Absolute Maximum Ratings at Ta = 25°C Parameter Conditions Conditions Ratings Unit Supply voltage VCC max 36 V Allowable Power dissipation Pd max IC unit 1.3 W (*Ta ≤ 25°C) With Al heatsink(50×50×1.5mm3) 5.3 W Infinite heat rediation 26 W Peak supply voltage VCC peak See below pulse wave. 50 V Operating ambient temperature Topr -40 to +85 °C Storage temperature Tstg -55 to +150 °C Junction temperature Tj max 150 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. ORDERING INFORMATION See detailed ordering and shipping information on page 10 of this data sheet. Semiconductor Components Industries, LLC, 2013 December, 2013 D0413 NK 20131127-S00004/52312 SY/ 30712 SY/O2611 SY 20111014-S00006/O1211 SY 20110928-S00007 No.A1982-1/10 LV5683P Peak voltage testing pulse wave 50V 90% 10% 16V 5msec 100msec Recommended Operating condition at Ta = 25°C Parameter Conditions Ratings Unit Power supply voltage rating 1 VDD output(5V/3.3V) 7 to 16 V Power supply voltage rating 2 USB(5V) output, SWU output: VCC=VCC1 7.5 to 16 V Power supply voltage rating 3 AUDIO output 10 to 16 V Power supply voltage rating 4 USB(8V) output: VCC=VCC1 10.5 to 16 V Electrical Characteristics at Ta = 25°C, VCC = VCC1 =14.4V (*1) Ratings Parameter Symbol Conditions Unit min Quiescent current ICC typ VDD no load, ALL EN terminal = ⎡L⎦ max 50 100 μA 0.5 V AUDIO_EN Input Low input voltage VIL1 0 High input voltage VIH1 2.8 Input impedance RIN1 280 400 5.5 V 520 kΩ V SWU_EN Input Low input voltage VIL2 0 0.5 High input voltage VIH2 2.8 5.5 V Input impedance RIN2 280 520 kΩ V 400 USB_EN input Low input voltage VIL3 0 0.5 High input voltage VIH3 2.8 5.5 V Input impedance RIN3 280 400 520 kΩ 5.0 5.25 VDD (5V/3.3V)output(reverse current prevention diode implemented) VDD output voltage 1 VO11 IO11 = 200mA, IKVDD=OPEN, or VDDout 4.75 VDD output current 1 IO11 VO11 ≥ 4.7V 300 VDD output voltage 2 VO12 IO12 = 200mA, IKVDD=GND 3.13 VDD output current 2 IO12 VO12 ≥ 3.1V 300 Line regulation ΔVOLN1 7V < VCC < 16V, IO1 = 200mA Load regulation ΔVOLD1 Dropout voltage 1 VDROP1 VCC ripple rejection RREJ1 f=120Hz, VCC=1VPP, IO1=200mA VDD reverse current IREV VO11=5.0V, VCC=0V USB output voltage 1 VO21 IO21 = 1000mA, IKUSB=OPEN, or USBout USB output current 1 IO21 VO21 ≥ 7.45V 1100 USB output voltage 2 VO22 IO22 = 1000mA, IKUSB=GND 4.75 USB output current 2 IO22 VO22 ≥ 4.6V 1100 Line regulation ΔVOLN2 10.5V < VCC1 < 16V, IO2 = 1000mA Load regulation ΔVOLD2 Dropout voltage VDROP2 VCC1 ripple rejection RREJ2 f=120Hz, VCC1=1VPP, IO2=1000mA V mA 3.3 3.47 V mA 50 100 mV 1mA < IO11, IO12 < 200mA 80 150 mV IO1 = 200mA (implemented diode) 1.5 2.5 40(*2) 50(*2) V dB 10 100 μA 8.0 8.4 V 5.0 5.25 USB/CD output ; USB_EN = High 7.6 mA V mA 50 100 mV 10mA < IO21, IO22 < 1000mA 100 200 mV IO21, IO22 = 1000mA 1.0 2.0 40(*2) 50(*2) V dB Continued on next page. No.A1982-2/10 LV5683P Continued from preceding page. Ratings Parameter Symbol Conditions Unit min typ max AUDIO output ; AUDIO_EN = High AUDIO output voltage VO3 IO3 = 300mA 8.1 AUDIO output current IO3 VO3 ≥ 8V 400 8.5 8.9 V Line regulation ΔVOLN3 10V < VCC < 16V, IO3 = 300mA 30 100 mV Load regulation ΔVOLD3 1mA < IO3 < 300mA 70 140 mV Dropout voltage VDROP3 IO3 = 300mA 0.6 1.05 V VCC ripple rejection RREJ3 f = 120Hz, VCC=1VPP, IO3=300mA mA 40(*2) 50(*2) 3.3 dB SWU (3.3V) Output ; SEU_EN = High SWU output voltage VO4 IO4 = 400mA 3.13 SWU output current IO4 VO4 ≥ 3.1V 500 3.47 V Line regulation ΔVOLN4 7.5V < VCC1 < 16V, IO4 = 400mA 30 100 mV Load regulation ΔVOLD4 1mA < IO4 < 400mA 80 150 mV mA VCC1 ripple rejection RREJ4 f = 120Hz, VCC1=1VPP, IO4=400mA 40(*2) 50(*2) dB *1: The entire specification has been defined based on the tests performed under the conditions where Tj and Ta(=25°C) are almost equal. There tests were performed with pulse load to minimize the increase of junction temperature(Tj). *2 : design certification Allowable power dissipation derating curve Pd max -- Ta Allowable power dissipation, Pd max - W 8 7 6 (a) IC unit(HZIP15) (b) With Al heatsink(50×50×1.5mm3) Al heatsink mounting conditions Tightening torque: 39N·cm, using silicone grease 5.3 5 Al heat sink (50 × 50 × 1.5mm3) 4 3 2 1.3 IC unit 1 0 0 25 50 75 100 125 150 Ambient temperature, Ta - C No.A1982-3/10 LV5683P Package Dimensions unit : mm HZIP15 CASE 945AB ISSUE A GENERIC MARKING DIAGRAM* XXXXXXXXXX YMDDD SOLDERING FOOTPRINT* Through Hole Area (Unit: mm) Package name HZIP15 2.54 1.2 (1.91) 2.54 2.54 XXXXX = Specific Device Code Y = Year M = Month DDD = Additional Traceability Data *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ ”, may or may not be present. 2.54 NOTE: The measurements are not to guarantee but for reference only. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. No.A1982-4/10 LV5683P 1 5 7 11 GND SWU 12 USB 10 9 USB_EN IKESB SWU_EN VCC 8 VCC 1 6 (NC) 4 3 IKVDD (NC) VDD 2 LV5683P AUDIO AUDIO_EN (NC) Pin assignment 14 15 13 Block Diagram B+ VCC + 8 Start up OverVoltage Protection + AUDIO(8.5V) 3 + 400mA Vref + 5 AUDIO_EN 2 6 VDD(5V/3.3V) + 300mA IKVDD: VDD(3.3/5.0V) select IKVDD=OPEN or VDD out 5.0V IKVDD=GND: 3.3V OUTPUT SWU_EN 10 9 Control + USB_EN 12 Thermal VCC1 + ex.) DC-DC 13 USB/CD(5V/8V) + 1100mA 11 IKUSB: USB(5/8V) select IKUSB=OPEN or USB out: 8V IKUSB=GND: 5V Shut Down + GND 14 15 SWU(3.3V) + 500mA No.A1982-5/10 LV5683P Pin Function Pin No. Pin name Description 1 N.C. - 2 AUDIO_EN AUDIO output CTRL Equivalent Circuit - VCC 8 2 14 3 AUDIO AUDIO output when AUDIO_EN = High, ON 8.5V/0.4A GND VCC 8 3 14 4 N.C. - 5 VDD VDD output 5.0V, 3.3V/0.3A GND - VCC 8 5 14 6 IKVDD VDD output voltage select OPEN : VDD = 5.0V GND VCC 8 GND : VDD = 3.3V 6 14 7 N.C. - 8 VCC VCC 9 VCC1 VCC1 GND - 8 VCC 9 14 GND Continued on next page. No.A1982-6/10 LV5683P Continued from preceding page. Pin No. 10 Pin name SWU_EN Description Equivalent Circuit SWU output CTRL 9 VCC1 10 14 11 IKUSB GND USB output voltage select 9 OPEN : VDD = 8.0V VCC1 GND : VDD = 5.0V 11 12 USB_EN 14 GND 9 VCC1 USB output CTRL 12 14 13 USB USB output when USB_EN = High, ON 5.0V, 8.0V/1.1A GND VCC1 9 13 14 14 GND GND 15 SWU SWU output when SWU_EN = High, ON 3.3V/0.5A GND 9 VCC1 15 14 GND No.A1982-7/10 LV5683P Timing Chart 21V VCC (8PIN) VCC1 (9PIN) VDD (5PIN) USB_EN (12PIN) USB (13PIN) AUDIO_EN (2PIN) AUDIO (3PIN) SWU_EN (10PIN) SWU (15PIN) No.A1982-8/10 LV5683P HZIP15 Heat sink attachment Heat sinks are used to lower the semiconductor device junction temperature by leading the head generated by the device to the outer environment and dissipating that heat. a. Unless otherwise specified, for power ICs with tabs and power ICs with attached heat sinks, solder must not be applied to the heat sink or tabs. b. Heat sink attachment · Use flat-head screws to attach heat sinks. · Use also washer to protect the package. · Use tightening torques in the ranges 39-59Ncm(4-6kgcm) . · If tapping screws are used, do not use screws with a diameter larger than the holes in the semiconductor device itself. · Do not make gap, dust, or other contaminants to get between the semiconductor device and the tab or heat sink. · Take care a position of via hole . · Do not allow dirt, dust, or other contaminants to get between the semiconductor device and the tab or heat sink. · Verify that there are no press burrs or screw-hole burrs on the heat sink. · Warping in heat sinks and printed circuit boards must be no more than 0.05 mm between screw holes, for either concave or convex warping. · Twisting must be limited to under 0.05 mm. · Heat sink and semiconductor device are mounted in parallel. Take care of electric or compressed air drivers · The speed of these torque wrenches should never exceed 700 rpm, and should typically be about 400 rpm. Binding head machine screw Countersunk head mashine screw Heat sink gap Via hole c. Silicone grease · Spread the silicone grease evenly when mounting heat sinks. · Our company recommends YG-6260 (Momentive Performance Materials Japan LLC) d. Mount · First mount the heat sink on the semiconductor device, and then mount that assembly on the printed circuit board. · When attaching a heat sink after mounting a semiconductor device into the printed circuit board, when tightening up a heat sink with the screw, the mechanical stress which is impossible to the semiconductor device and the pin doesn't hang. e. When mounting the semiconductor device to the heat sink using jigs, etc., · Take care not to allow the device to ride onto the jig or positioning dowel. · Design the jig so that no unreasonable mechanical stress is not applied to the semiconductor device. f. Heat sink screw holes · Be sure that chamfering and shear drop of heat sinks must not be larger than the diameter of screw head used. · When using nuts, do not make the heat sink hole diameters larger than the diameter of the head of the screws used. A hole diameter about 15% larger than the diameter of the screw is desirable. · When tap screws are used, be sure that the diameter of the holes in the heat sink are not too small. A diameter about 15% smaller than the diameter of the screw is desirable. g. There is a method to mount the semiconductor device to the heat sink by using a spring band. But this method is not recommended because of possible displacement due to fluctuation of the spring force with time or vibration. No.A1982-9/10 LV5683P ORDERING INFORMATION Device LV5683P-E Package HZIP15 (Pb-Free) Shipping (Qty / Packing) 20 / Fan-Fold ON Semiconductor and the ON logo are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PS No.A1982-10/10