NB7L72M 2.5V / 3.3V Differential 2 x 2 Crosspoint Switch with CML Outputs Clock/Data Buffer/Translator http://onsemi.com Multi−Level Inputs w/ Internal Termination MARKING DIAGRAM* Description The NB7L72M is a high bandwidth, low voltage, fully differential 2 x 2 crosspoint switch with CML outputs. The NB7L72M design is optimized for low skew and minimal jitter as it produces two identical copies of Clock or Data operating up to 7 GHz or 10 Gb/s, respectively. As such, the NB7L72M is ideal for SONET, GigE, Fiber Channel, Backplane and other clock/data distribution applications. The differential IN/IN inputs incorporate internal 50 W termination resistors and will accept LVPECL, CML, or LVDS logic levels (see Figure 11). The 16 mA differential CML outputs provide matching internal 50 W terminations and produce 400 mV output swings when externally terminated with a 50 W resistor to VCC (see Figure 9). The NB7L72M is the 2.5 V/3.3 V version of the and NB7V72M and is offered in a low profile 3x3 mm 16−pin QFN package. Application notes, models, and support documentation are available at www.onsemi.com. The NB7L72M is a member of the GigaComm™ family of high performance clock products. 1 NB7L 72M ALYWG G A = Assembly Location L = Wafer Lot Y = Year W = Work Week G = Pb−Free Package (Note: Microdot may be in either location) *For additional marking information, refer to Application Note AND8002/D. + SEL0 IN0 Features • • • • • • • • • • • • QFN−16 MN SUFFIX CASE 485G Maximum Input Data Rate > 10 Gb/s Data Dependent Jitter < 10 ps pk−pk Maximum Input Clock Frequency > 7 GHz Random Clock Jitter < 0.5 ps RMS, Max 150 ps Typical Propagation Delay 30 ps Typical Rise and Fall Times Differential CML Outputs, 400 mV peak−to−peak, typical Operating Range: VCC = 2.375 V to 3.6 V with GND = 0 V Internal 50 W Input Termination Resistors QFN−16 Package, 3mm x 3mm −40°C to +85°C Ambient Operating Temperature These are Pb−Free Devices Q0 VT0 IN0 Q0 0 1 Q1 IN1 VT1 Q1 + IN1 SEL1 0 Figure 1. Logic Diagram1 ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 7 of this data sheet. © Semiconductor Components Industries, LLC, 2012 April, 2013 − Rev. 3 1 Publication Order Number: NB7L72M/D NB7L72M VT0 16 IN0 1 IN0 2 SEL0 GND VCC 15 14 Exposed Pad (EP) Table 1. INPUT/OUTPUT SELECT TRUTH TABLE 13 12 Q0 11 Q0 SEL0* SEL1* Q0 Q1 L L IN0 IN0 L H IN0 IN1 H L IN1 IN0 H H IN1 IN1 NB7L72M IN1 3 10 Q1 IN1 4 9 Q1 *Defaults HIGH when left open 5 VT1 6 7 SEL1 GND 8 VCC Figure 2. Pin Configuration (Top View) Table 2. PIN DESCRIPTION Pin Name I/O Description 1 IN0 LVPECL, CML, LVDS Input Noninverted Differential Input. (Note 1) 2 IN0 LVPECL, CML, LVDS Input Inverted Differential Input. (Note 1) 3 IN1 LVPECL, CML, LVDS Input Inverted Differential Input. (Note 1) 4 IN1 LVPECL, CML, LVDS Input Noninverted Differential Input. (Note 1) 5 VT1 − 6 SEL1 LVCMOS Input 7 GND 8 VCC − 9 Q1 CML Output Noninverted Differential Output. (Note 1) 10 Q1 CML Output Inverted Differential Output. (Note 1) 11 Q0 CML Output Inverted Differential Output. (Note 1) 12 Q0 CML Output Noninverted Differential Output. (Note 1) 13 VCC − Positive Supply Voltage 14 GND − Negative Supply Voltage 15 SEL0 LVCMOS Input 16 VT0 − Internal 50 W Termination Pin for IN0 and IN0 − EP − The Exposed Pad (EP) on the QFN−16 package bottom is thermally connected to the die for improved heat transfer out of package. The exposed pad must be attached to a heat−sinking conduit. The pad is electrically connected to the die, and is recommended to be electrically and thermally connected to GND on the PC board. Internal 50 W Termination Pin for IN1 and IN1. Input Select logic pin for IN0 or IN1 Inputs to Q1 output. See Table 1, Input/Output Select Truth Table; pin defaults HIGH when left open. Negative Supply Voltage Positive Supply Voltage Input Select logic pin for IN0 or IN1 Inputs to Q0 output. See Table 1, Input/Output Select Truth Table; pin defaults HIGH when left open. 1. In the differential configuration when the input termination pins (VT0, VT1) are connected to a common termination voltage or left open, and if no signal is applied on INx/INx input, then the device will be susceptible to self−oscillation. 2. All VCC and GND pins must be externally connected to a power supply for proper operation. http://onsemi.com 2 NB7L72M Table 3. ATTRIBUTES Characteristics Value ESD Protection Human Body Model Machine Model > 4 kV > 200 V QFN−16 Level 1 RPU − Input Pullup Resistor 75 kW Moisture Sensitivity (Note 3) Flammability Rating Oxygen Index: 28 to 34 Transistor Count UL 94 V−0 @ 0.125 in 212 Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test 3. For additional information, see Application Note AND8003/D. Table 4. MAXIMUM RATINGS Symbol Parameter Condition 1 Condition 2 Rating Unit VCC Positive Power Supply GND = 0 V 4.0 V VIN Positive Input Voltage GND = 0 V −0.5 to VCC +0.5 V VINPP Differential Input Voltage |IN − IN| 1.89 V IIN Input Current Through RT (50 W Resistor) $40 mA IOUT Output Current Through RT (50 W Resistor) $40 mA TA Operating Temperature Range −40 to +85 °C Tstg Storage Temperature Range −65 to +150 °C qJA Thermal Resistance (Junction−to−Ambient) (Note 4) QFN−16 QFN−16 42 35 °C/W °C/W qJC Thermal Resistance (Junction−to−Case) (Note 4) QFN−16 4 °C/W Tsol Wave Solder 265 °C 0 lfpm 500 lfpm Pb−Free Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 4. JEDEC standard multilayer board − 2S2P (2 signal, 2 power) with 8 filled thermal vias under exposed pad. http://onsemi.com 3 NB7L72M Table 5. DC CHARACTERISTICS, Multi−Level Inputs VCC = 2.375 V to 3.6 V, GND = 0 V, TA = −40°C to +85°C (Note 5) Symbol Characteristic Min Typ Max Unit 2.375 3.0 2.5 3.3 2.625 3.6 V 80 135 175 mA VCC – 40 3260 2460 VCC – 20 3280 2480 VCC 3300 2500 mV VCC – 650 2650 VCC – 600 1900 VCC – 500 2800 VCC – 500 2000 VCC – 400 2900 VCC – 350 2150 mV 1050 VCC − 100 mV POWER SUPPLY CURRENT VCC Power Supply Voltage VCC = 2.5 V VCC = 3.3 V ICC Power Supply Current (Inputs and Outputs Open) CML OUTPUTS VOH Output HIGH Voltage (Note 6) VOL Output LOW Voltage (Note 6) VCC = 3.3 V VCC = 2.5 V VCC = 3.3 V VCC = 2.5 V DIFFERENTIAL CLOCK INPUTS DRIVEN SINGLE−ENDED (Note 7) (Figures 5 and 7) Vth Input Threshold Reference Voltage Range (Note 8) VIH Single−Ended Input HIGH Voltage Vth + 100 VCC mV VIL Single−Ended Input LOW Voltage GND Vth − 100 mV VISE Single−Ended Input Voltage (VIH − VIL) 200 2800 mV DIFFERENTIAL DATA/CLOCK INPUTS DRIVEN DIFFERENTIALLY (Figures 6 and 8) (Note 9) VIHD Differential Input HIGH Voltage (INn, INn) 1100 VCC mV VILD Differential Input LOW Voltage (INn, INn) GND VCC − 100 mV VID Differential Input Voltage (INn, INn) (VIHD − VILD) 100 1200 mV VCMR Input Common Mode Range (Differential Configuration, Note 10) (Figure 9) 950 VCC − 50 mV IIH Input HIGH Current INn, INn (VTIN/VTIN Open) −150 150 mA IIL Input LOW Current INn, INn (VTIN/VTIN Open) −150 150 mA CONTROL INPUTS (SEL0, SEL1) VIH Input HIGH Voltage for Control Pins 2.0 VCC mV VIL Input LOW Voltage for Control Pins GND 0.8 mV IIH Input HIGH Current −150 150 mA IIL Input LOW Current −150 150 mA TERMINATION RESISTORS RTIN Internal Input Termination Resistor 40 50 60 W RTOUT Internal Output Termination Resistor 40 50 60 W NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 5. Input and output parameters vary 1:1 with VCC. 6. CML outputs loaded with 50 W to VCC for proper operation. 7. Vth, VIH, VIL,, and VISE parameters must be complied with simultaneously. 8. Vth is applied to the complementary input when operating in single−ended mode. 9. VIHD, VILD, VID and VCMR parameters must be complied with simultaneously. 10. VCMR min varies 1:1 with GND, VCMR max varies 1:1 with VCC. The VCMR range is referenced to the most positive side of the differential input signal. http://onsemi.com 4 NB7L72M Table 6. AC CHARACTERISTICS VCC = 2.375 V to 3.6 V; GND = 0 V; TA = −40°C to 85°C (Note 11) Symbol Characteristic Min fMAX Maximum Input Clock Frequency fDATAMAX Maximum Operating Data Rate (PRBS23) VOUTPP Output Voltage Amplitude (@ VINPPmin) (See Figures 3 and 10, Note 12) tPLH, tPHL Propagation Delay to Differential Outputs, @ 1GHz, Measured at Differential Cross−point tPLH TC Propagation Delay Temperature Coefficient tSKEW Output−to−Output Skew (within device) (Note 13) Device−to−Device Skew (tpdmax – tpdmin) tDC Output Clock Duty Cycle (Reference Duty Cycle = 50%) fin v 8.5GHz tjitter RJ – Output Random Jitter (Note 14) DJ – Deterministic Jitter (Note 15) VINPP Input Voltage Swing (Differential Configuration) (Note 16) tr,, tf Output Rise/Fall Times @ 1 GHz (20% − 80%), Typ VOUT w 250 mV VOUT w 200 mV 7.0 8.5 fin ≤ 8.5 GHz 200 400 110 150 Max 10 INn/INn to Qn/Qn SELn to Qn/Qn Gbps mV 180 50 45 fin v 8.5 GHz v 10 Gbps 25 ps Dfs/°C 10 20 ps 50 55 % 0.2 0.5 10 ps RMS ps pk−pk 1200 mV 50 ps 100 Q, Q Unit GHz 30 NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 11. Measured using a 400 mV source, 50% duty cycle clock source. All output loading with external 50 W to VCC. Input edge rates w40 ps (20% − 80%). 12. Output voltage swing is a single−ended measurement operating in differential mode. 13. Skew is measured between outputs under identical transitions and conditions. Duty cycle skew is defined only for differential operation when the delays are measured from cross−point of the inputs to the cross−point of the outputs. 14. Additive RMS jitter with 50% duty cycle clock signal. 15. Additive Peak−to−Peak data dependent jitter with input NRZ data at PRBS23. 16. Input voltage swing is a single−ended measurement operating in differential mode. OUTPUT VOLTAGE AMPLITUDE (mV) 500 450 VCC Q AMP (mV) 400 350 INn 300 50 W VTn 250 200 50 W INn 0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 fin, Clock Input Frequency (GHz) Figure 3. CLOCK Output Voltage Amplitude (VOUTPP) vs. Input Frequency (fin) at Ambient Temperature (Typ) Figure 4. Input Structure http://onsemi.com 5 NB7L72M IN VIH Vth IN VIL IN IN Vth Figure 5. Differential Input Driven Single−Ended VCC Vthmax Figure 6. Differential Inputs Driven Differentially VIHmax VILmax VIH Vth VIL Vth VILD VILmin GND Figure 7. Vth Diagram VCC Figure 8. Differential Inputs Driven Differentially VIHDmax VCMmax IN VILDmax IN VCMR IN GND VIHD IN VIHmin Vthmin VCMmin VID = |VIHD(IN) − VILD(IN)| IN VINPP = VIH(IN) − VIL(IN) IN VIHDtyp VID = VIHD − VILD Q VILDtyp VOUTPP = VOH(Q) − VOL(Q) Q VIHDmin tPHL VILDmin tPLH Figure 9. VCMR Diagram Figure 10. AC Reference Measurement NB7L72M Receiver VCC VCC (Receiver) 50 W 50 W Q 50 W 50 W Q 16 mA GND Figure 11. Typical CML Output Structure and Termination http://onsemi.com 6 NB7L72M VCC 50 W Z = 50 W DUT Driver Device 50 W Q D Receiver Device Z = 50 W Q D Figure 12. Typical Termination for CML Output Driver and Device Evaluation VCC VCC VCC ZO = 50 W LVPECL Driver NB7L72M NB7L72M ZO = 50 W IN 50 W VT = VCC − 2 V ZO = 50 W VCC LVDS Driver 50 W IN 50 W VT = Open ZO = 50 W 50 W IN GND IN Figure 13. LVPECL Interface VCC GND GND VCC ZO = 50 W CML Driver VCC NB7L72M ZO = 50 W IN 50 W Differential Driver 50 W IN GND VCC NB7L72M VT = VCC ZO = 50 W GND Figure 14. LVDS Interface IN 50 W VT = VREFAC* ZO = 50 W 50 W IN GND GND GND Figure 16. Capacitor−Coupled Differential Interface (VT Connected to External VREFAC) Figure 15. Standard 50 W Load CML Interface *VREFAC bypassed to ground with a 0.01 mF capacitor ORDERING INFORMATION Package Shipping† NB7L72MMNG QFN−16 (Pb−free) 123 Units / Rail NB7L72MMNTXG QFN−16 (Pb−free) 3000 / Tape & Reel NB7L72MMNHTBG QFN−16 (Pb−free) 100 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 7 NB7L72M PACKAGE DIMENSIONS QFN16 3x3, 0.5P CASE 485G ISSUE F D PIN 1 LOCATION 2X 0.10 C 2X A B ÇÇÇ ÇÇÇ ÇÇÇ ÇÇÇ DETAIL A ALTERNATE TERMINAL CONSTRUCTIONS E ÉÉÉ ÉÉÉ TOP VIEW (A3) DETAIL B 0.05 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. L1 EXPOSED Cu 0.10 C L L ÉÉ ÉÉ ÇÇ A3 A1 DETAIL B A 0.05 C MOLD CMPD ALTERNATE CONSTRUCTIONS NOTE 4 A1 SIDE VIEW C SEATING PLANE DIM A A1 A3 b D D2 E E2 e K L L1 MILLIMETERS MIN NOM MAX 0.80 0.90 1.00 0.00 0.03 0.05 0.20 REF 0.18 0.24 0.30 3.00 BSC 1.65 1.75 1.85 3.00 BSC 1.65 1.75 1.85 0.50 BSC 0.18 TYP 0.30 0.40 0.50 0.00 0.08 0.15 RECOMMENDED SOLDERING FOOTPRINT* 0.10 C A B 16X L DETAIL A PACKAGE OUTLINE D2 8 4 16X 16X 0.58 1 9 2X E2 K 2X 1.84 3.30 1 16X 16 e e/2 BOTTOM VIEW 16X 0.30 b 0.50 PITCH 0.10 C A B 0.05 C NOTE 3 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. GigaComm is a trademark of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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