INTERSIL X9530B15I-T2

X9530
®
Data Sheet
March 10, 2005
Temperature Compensated Laser Diode
Controller
FEATURES
• Compatible with Popular Fiber Optic Module
Specifications such as Xenpak, SFF, SFP, and
GBIC
• Package
—14 Pin TSSOP
—15 Lead 2.7 x 3.5mm CSP (Chip-Scale
Package)
• Two Programmable Current Generators
—±1.6 mA max.
—8-bit (256 Step) Resolution
• Integrated 6 bit A/D Converter
• Temperature Compensation
—Internal or External Sensor
—-40°C to +100°C Range
—2.2°C/step resolution
—EEPROM Look-up Tables
• Hot Pluggable
• 2176-bit EEPROM
—17 Pages
—16 Bytes per Page
• Write Protection Circuitry
—Intersil BlockLock™
—Logic Controlled Protection
—2-wire Bus with 3 Slave Address Bits
• 3V to 5.5V, Single Supply Operation
FN8211.0
DESCRIPTION
The X9530 is a highly integrated laser diode bias
controller which incorporates two digitally controlled
Programmable Current Generators, temperature
compensation with dedicated look-up tables, and
supplementary EEPROM array. All functions of the
device are controlled via a 2-wire digital serial
interface.
Two temperature compensated Programmable
Current Generators, vary the output current with
temperature according to the contents of the
associated nonvolatile look-up table. The look-up table
may be programmed with arbitrary data by the user,
via the 2-wire serial port, and either an internal or
external temperature sensor may be used to control
the output current response. These temperature
compensated pro-grammable currents maybe used to
control the modulation current and the bias current of
a laser diode.
The integrated General Purpose EEPROM is included
for product data storage and can be used for
transceiver module information storage in laser diode
applications.
LASER DIODE BIAS CONTROL APPLICATIONS
• SONET and SDH Transmission Systems
• 1G and 10G Ethernet, and Fibre Channel Laser
Diode Driver Circuits
TYPICAL APPLICATION
GBIC / SFP / XFP Module
VCC
High Speed
Data Input
X9530
I1
MOD_DEF(0)
SDA
MOD_DEF(1)
SCK
1
I2
IMODSET
Laser
Diode
Driver
Circuit
LD
MPD
ILD
IMON
IPINSET/IBIASSET
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-352-6832 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2005. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
X9530
BLOCK DIAGRAM
Voltage
Reference
VRef
R2
Mux
Look-up
Table 2
Mux
DAC 2
I2
Mux
Look-up
Table 1
Mux
DAC 1
I1
ADC
VSense
Temperature
Sensor
SDA
SCL
WP
R1
Control
& Status
2-Wire
Interface
General
Purpose
Memory
A2, A1, A0
PIN CONFIGURATION
1
2
3
4
5
6
A0
A1
A2
Vcc
WP
SCL
SDA
14
13
12
11
10
9
8
7
I2
VRef
VSense
Vss
R2
R1
I1
TSSOP 14L
DEVICE DESCRIPTION
The X9530 combines two Programmable Current
Generators, and integrated EEPROM with Block
Lock™
protection,
in
one
package.
The
Programmable Current Generators are ideal for use in
fiber optic Modulation Current require temperature
control. The combination of the X9530 functionality
and Intersil’s Chip-Scale package lowers system cost,
increases reliability, and reduces board space
requirements.
Two on-chip Programmable Current Generators may
be independently programmed to either sink or source
current. The maximum current generated is
determined by using an externally connected
programming resistor, or by selecting one of three
predefined values. Both current generators have a
maximum output of ±1.6 mA, and may be controlled to
an absolute resolution of 0.39% (256 steps / 8 bit).
Both current generators may be driven using an onboard temperature sensor, an external sensor, or
Control Registers. The internal temperature sensor
2
A
B
C
D
E
3
2
1
A0
I2
VRef
Vcc
A1 VSense
SCL
A2
Vss
SDA Vss
R2
WP
R1
I1
Top View - Bumps Down CSP – B15
operates over a very broad temperature range (-40°C
to +100°C). The sensor output (internal or external)
drives a 6-bit A/D converter, whose output selects one
of 64 bytes from each nonvolatile look-up table (LUT).
The contents of the selected LUT row (8-bit wide)
drives the input of an 8-bit D/A converter, which
generates the output current.
All control and setup parameters of the X9530,
including the look-up tables, are programmable via the
2-wire serial port.
The general purpose memory portion of the device is a
CMOS serial EEPROM array with Intersil’s Block
LockTM protection. This memory may be used to store
fiber optic module manufacturing data, serial numbers,
or various other system parameters.
The EEPROM array is internally organized as 272 x 8
bits with 16-Byte pages, and utilizes Intersil’s
proprietary Direct Write™ cells, providing a minimum
endurance of 100,000 Page Write cycles and a
minimum data retention of 100 years.
FN8211.0
March 10, 2005
X9530
PIN ASSIGNMENTS
TSSOP
CSP
Pin
Pin
Pin
Name
1
A3
A0
Device Address Select Pin 0. This pin determines the LSB of the device address
required to communicate using the 2-wire interface. The A0 pin has an on-chip pulldown resistor.
2
B2
A1
Device Address Select Pin 1. This pin determines the intermediate bit of the device
address required to communicate using the 2-wire interface. The A1 pin has an on-chip
pull-down resistor.
3
C2
A2
Device Address Select Pin 2. This pin determines the MSB of the device address required to communicate using the 2-wire interface. The A2 pin has an on-chip pull-down
resistor.
4
B3
Vcc
Supply Voltage.
5
E3
WP
Write Protect Control Pin. This pin is a CMOS compatible input. When LOW, Write
Protection is enabled preventing any “Write” operation. When HIGH, various areas of
the memory can be protected using the Block Lock bits BL1 and BL0. The WP pin has
an on-chip pull-down resistor, which enables the Write Protection when this pin is left
floating.
6
C3
SCL
Serial Clock. This is a TTL compatible input pin. This input is the 2-wire interface clock
controlling data input and output at the SDA pin.
7
D3
SDA
Serial Data. This pin is the 2-wire interface data into or out of the device. It is TTL
compatible when used as an input, and it is Open Drain when used as an output. This
pin requires an external pull up resistor.
8
E2
I1
Current Generator 1 Output. This pin sinks or sources current. The magnitude and direction of the current is fully programmable and adaptive. The resolution is 8 bits.
9
E1
R1
Current Programming Resistor 1. A resistor between this pin and Vss can set the
maximum output current available at pin I1. If no resistor is used, the maximum current
must be selected using control register bits.
10
D1
R2
Current Programming Resistor 2. A resistor between this pin and Vss can set the
maximum output current available at pin I2. If no resistor is used, the maximum current
must be selected using control register bits.
11
C1, D2
Vss
Ground.
12
B1
VSense
Sensor Voltage Input. This voltage input may be used to drive the input of the on-chip
A/D converter.
13
A1
VRef
Reference Voltage Input or Output. This pin can be configured as either an Input or
an Output. As an Input, the voltage at this pin is provided by an external source. As an
Output, the voltage at this pin is a buffered output voltage of the on-chip bandgap reference circuit. In both cases, the voltage at this pin is the reference for the A/D
converter and the two D/A converters.
14
A2
I2
Current Generator 2 Output. This pin sinks or sources current. The magnitude and direction of the current is fully programmable and adaptive. The resolution is 8 bits.
3
Pin Description
FN8211.0
March 10, 2005
X9530
PRINCIPLES OF OPERATION
CONTROL AND STATUS REGISTERS
The Control and Status Registers provide the user
with a mechanism for changing and reading the value
of various parameters of the X9530. The X9530
contains seven Control, one Status, and several
Reserved registers, each being one Byte wide (See
Figure 1). The Control registers 0 through 6 are
located at memory addresses 80h through 86h
respectively. The Status register is at memory address
87h, and the Reserved registers at memory address
88h through 8Fh.
All bits in Control register 6 always power-up to the
logic state “0”. All bits in Control registers 0 through 5
power-up to the logic state value kept in their
corresponding nonvolatile memory cells. The
nonvolatile bits of a register retain their stored values
even when the X9530 is powered down, then powered
back up. The nonvolatile bits in Control 0 through
Control 5 registers are all preprogrammed to the logic
state “0” at the factory.
Bits indicated as “Reserved” are ignored when read,
and must be written as “0”, if any Write operation is
performed to their registers.
A detailed description of the function of each of the
Control and Status register bits follows:
Control Register 0
This register is accessed by performing a Read or
Write operation to address 80h of memory.
BL1, BL0: BLOCK LOCK PROTECTION BITS
(NON-VOLATILE)
BL1
BL0
These two bits are used to inhibit any write operation
to certain addresses within the memory array. The
protected region of memory is determined by the
values of the two bits as shown in the table below:
Protected Addresses
(Size)
Partition of array
locked
0
0
None (Default)
None (Default)
0
1
00h to 7Fh (128 bytes)
GPM
1
0
00h to 7Fh and 90h to
CFh (192 bytes)
GPM, LUT1
1
1
00h to 7Fh and 90h to
10Fh (256 bytes)
GPM, LUT1, LUT2
If the user attempts to perform a write operation to a
protected region of memory, the operation is aborted
without changing any data in the array.
4
Notice that if the Write Protect (WP) input pin of the
X9530 is active (LOW), then any write operation to
the memory is inhibited, irrespective of the Block
Lock bit settings.
VRM: VOLTAGE REFERENCE PIN MODE
(NON-VOLATILE)
The VRM bit configures the Voltage Reference pin
(VRef) as either an input or an output. When the VRM
bit is set to “0” (default), the voltage at pin VRef is an
output from the X9530’s internal voltage reference.
When the VRM bit is set to “1”, the voltage reference
for the VRef pin is external. See Figure 2.
ADCIN: A/D CONVERTER INPUT SELECT
(NON-VOLATILE)
The ADCIN bit selects the input of the on-chip A/D
converter. When the ADCIN bit is set to “0” (default),
the output of the on-chip temperature sensor is the
input to the A/D converter. When the ADCIN bit is set
to “1”, the input to the A/D converter is the voltage at
the VSense pin. See Figure 4.
ADCFILTOFF: ADC FILTERING CONTROL
(NON-VOLATILE)
When this bit is “1”, the status register at 87h is
updated after every conversion of the ADC. When this
bit is “0” (default), the status register is updated after
four consecutive conversions with the same result.
NV1234: CONTROL REGISTERS 1, 2, 3, AND 4 VOLATILITY MODE SELECTION BIT (NON-VOLATILE)
When the NV1234 bit is set to “0” (default), bytes
written to Control registers 1, 2, 3, and 4 are stored in
volatile cells, and their content is lost when the X9530
is powered down. When the NV1234 bit is set to “1”,
bytes written to Control registers 1, 2, 3, and 4 are
stored in both volatile and nonvolatile cells, and their
value doesn’t change when the X9530 is powered
down and powered back up. See “Writing to Control
Registers” on page 17.
I1DS: CURRENT GENERATOR 1 DIRECTION SELECT BIT
(NON-VOLATILE)
The I1DS bit sets the polarity of Current Generator 1,
DAC1. When this bit is set to “0” (default), the Current
Generator 1 of the X9530 is configured as a Current
Source. Current Generator 1 is configured as a
Current Sink when the I1DS bit is set to “1”. See
Figure 5.
FN8211.0
March 10, 2005
X9530
Figure 1. Control and Status Register Format
Byte
Address
80h
Non-Volatile
MSB
LSB
7
6
5
4
I2DS
I1DS
NV1234
ADCfiltOff
Control
1, 2, 3, 4
Volatility
0: Volatile
1: Nonvolatile
ADC
filtering
0: On
1: Off
I1 and I2 Direction
0: Source
1: Sink
3
2
ADCIN
VRM
ADC Input
0: Internal
1: External
Voltage
Reference
Mode
0: Internal
1: External
1
0
BL1
BL0
Register
Name
Control 0
Block Lock
00: None Locked
01: GPM Locked
10: GPM, LUT1, Locked
11: GPM, LUT1, LUT2
Locked
Direct Access to LUT1
81h
Volatile or
Non-Volatile
Reserved
Reserved
L1DA5
L1DA4
L1DA3
L1DA2
L1DA1
L1DA0
Control 1
L2DA5
L2DA4
L2DA3
L2DA2
L2DA1
L2DA0
Control 2
D1DA5
D1DA4
D1DA3
D1DA2
D1DA1
D1DA0
Control 3
Control 4
Direct Access to LUT2
82h
Volatile or
Non-Volatile
Reserved
Reserved
Direct Access to DAC1
83h
Volatile or
Non-Volatile
D1DA7
D1DA6
Direct Access to DAC2
84h
Volatile or
Non-Volatile
D2DA7
D2DA6
D2DA5
D2DA4
D2DA3
D2DA2
D2DA1
D2DA0
85h
Non-Volatile
D2DAS
L2DAS
D1DAS
L1DAS
I2FSO1
I2FSO0
I1FSO1
I1FSO0
Direct
Access
to DAC2
0: Disabled
1: Enabled
Direct
Access
to LUT2
0: Disabled
1: Enabled
Direct
Access
to DAC1
0: Disabled
1: Enabled
Direct
Access
to LUT1
0: Disabled
1: Enabled
WEL
Reserved
Reserved Reserved
86h
Volatile
Control 5
R2 Selection
00: External
01: Low Internal
10: Middle Internal
11: High Internal
R1 Selection
00: External
01: Low Internal
10: Middle Internal
11: High Internal
Reserved
Reserved
Reserved
Reserved
Control 6
AD1
AD0
Reserved
Reserved
Status
Write
Enable
Latch
0: Write
Disabled
1: Write
Enabled
ADC Output
87h
Volatile
AD5
AD4
AD3
AD2
Registers in byte addresses 88h through 8Fh are reserved.
5
FN8211.0
March 10, 2005
X9530
I2DS: CURRENT GENERATOR 2 DIRECTION SELECT BIT
(NON-VOLATILE)
The I2DS bit sets the polarity of Current Generator 2,
DAC2. When this bit is set to “0” (default), the Current
Generator 2 of the X9530 is configured as a Current
Source. Current Generator 2 is configured as a
Current Sink when the I2DS bit is set to “1”. See
Figure 5.
Control Register 1
This register is accessed by performing a Read or Write
operation to address 81h of memory. This byte’s volatility
is determined by bit NV1234 in Control register 0.
D1DA7 - D1DA0: D/A 1 DIRECT ACCESS BITS
When bit D1DAS (bit 5 in Control register 5) is set to
“1”, the input to the D/A converter 1 is the content of
bits D1DA7 - D1DA0, and it is not a row of LUT1.
When bit D1DAS is set to “0” (default) these eight bits
are ignored by the X9530. See Figure 6.
Control Register 4
This register is accessed by performing a Read or
Write operation to address 84h of memory. This byte’s
volatility is determined by bit NV1234 in Control
register 0.
D2DA7 - D2DA0: D/A 2 DIRECT ACCESS BITS
L1DA5 - L1DA0: LUT1 DIRECT ACCESS BITS
When bit L1DAS (bit 4 in Control register 5) is set to
“1”, LUT1 is addressed by these six bits, and it is not
addressed by the output of the on-chip A/D converter.
When bit L1DAS is set to “0”, these six bits are ignored
by the X9530. See Figure 7.
A value between 00h (0010) and 3Fh (6310) may be
written to these register bits, to select the corresponding
row in LUT1. The written value is added to the base
address of LUT1 (90h).
Control Register 2
This register is accessed by performing a read or write
operation to address 82h of memory. This byte’s
volatility is determined by bit NV1234 in Control
register 0.
L2DA5 - L2DA0: LUT2 DIRECT ACCESS BITS
When bit L2DAS (bit 6 in Control register 5) is set to
“1”, LUT2 is addressed by these six bits, and it is not
addressed by the output of the on-chip A/D converter.
When bit L2DAS is set to “0”, these six bits are ignored
by the X9530. See Figure 7.
A value between 00h (0010) and 3Fh (6310) may be
written to these register bits, to select the corresponding
row in LUT2. The written value is added to the base
address of LUT2 (D0h).
When bit D2DAS (bit 7 in Control register 5) is set to
“1”, the input to the D/A converter 2 is the content of
bits D2DA7 - D2DA0, and it is not a row of LUT2.
When bit D2DAS is set to “0” (default) these eight bits
are ignored by the X9530. (See Figure 6).
Control Register 5
This register is accessed by performing a Read or
Write operation to address 85h of memory.
I1FSO1 - I1FSO0: CURRENT GENERATOR 1 FULL SCALE
OUTPUT SET BITS (NON-VOLATILE)
These two bits are used to set the full scale output
current at the Current Generator 1 pin, I1. If both bits
are set to “0” (default), an external resistor connected
between pin R1 and Vss, determines the full scale
output current available at pin I1. The other three
options are indicated in the table below. The direction
of this current is set by bit I1DS in Control register 0.
See Figure 5.
I1FSO1
0
0
1
1
I1FSO0
0
1
0
1
I1 Full Scale Output Current
Set externally via pin R1 (Default)
±0.4mA*
±0.85 mA*
±1.3 mA*
*No external resistor should be connected in these cases between
R1 and VSS.
Control Register 3
This register is accessed by performing a Read or Write
operation to address 83h of memory. This byte’s volatility
is determined by bit NV1234 in Control register 0.
6
FN8211.0
March 10, 2005
X9530
I2FSO1–I2FSO0: CURRENT GENERATOR 2 FULL
SCALE OUTPUT CURRENT SET BITS (NON-VOLATILE)
D2DAS: D/A 2 DIRECT ACCESS SELECT BIT (NONVOLATILE)
These two bits are used to set the full scale output
current at the Current Generator 2 pin, I2. If both bits
are set to “0” (default), an external resistor connected
between pin R2 and Vss, determines the full scale
output current available at pin I2. The other three
options are indicated in the table below. The direction
of this current is set by bit I2DS in Control Register 0.
When bit D2DAS is set to “0” (default), the input to the
D/A converter 2 is a row of LUT2. When bit D2DAS is
set to “1”, that input is the content of the Control
register 4.
I2FSO1
I2FSO0
I2 Full Scale Output Current
0
0
Set externally via pin R2 (Default)
0
1
±0.4mA*
1
0
±0.85 mA*
1
1
±1.3 mA*
*No external resistor should be connected in these cases between
R2 and VSS.
L1DAS: LUT1 DIRECT ACCESS SELECT BIT (NONVOLATILE)
When bit L1DAS is set to “0” (default), LUT1 is
addressed by the output of the on-chip A/D converter.
When bit L1DAS is set to “1”, LUT1 is addressed by
bits L1DA5 - L1DA0.
D1DAS: D/A 1 DIRECT ACCESS SELECT BIT (NONVOLATILE)
When bit D1DAS is set to “0” (default), the input to the
D/A converter 1 is a row of LUT1. When bit D1DAS is
set to “1”, that input is the content of the Control
register 3.
Control Register 6
This register is accessed by performing a Read or
Write operation to address 86h of memory.
WEL: WRITE ENABLE LATCH (VOLATILE)
The WEL bit controls the Write Enable status of the
entire X9530 device. This bit must be set to “1” before
any other Write operation (volatile or nonvolatile).
Otherwise, any proceeding Write operation to memory
is aborted and no ACK is issued after a Data Byte.
The WEL bit is a volatile latch that powers up in the “0”
state (disabled). The WEL bit is enabled by writing
100000002 to Control register 6. Once enabled, the
WEL bit remains set to “1” until the X9530 is powered
down, and then up again, or until it is reset to “0” by
writing 000000002 to Control register 6.
A Write operation that modifies the value of the WEL
bit will not cause a change in other bits of Control
register 6.
Status Register - ADC Output
This register is accessed by performing a Read
operation to address 87h of memory.
AD5 - AD0: A/D CONVERTER OUTPUT BITS (READ
L2DAS: LUT2 DIRECT ACCESS SELECT BIT (NONVOLATILE)
When bit L2DAS is set to “0” (default), LUT2 is
addressed by the output of the on-chip A/D converter.
When bit L2DAS is set to “1”, LUT2 is addressed by
bits L2DA5 - L2DA0.
7
ONLY)
These six bits are the binary output of the on-chip A/D
converter. The output is 0000002 for minimum input
and 1111112 for full scale input.
FN8211.0
March 10, 2005
X9530
default these output bits are used to select a row in the
look-up tables associated with the X9530’s Current
Generators. When bit ADCfiltOff is “0” (default), bits
AD[5:0] are updated each time the ADC performs four
consecutive conversions with the same exact result.
When bit ADCfiltOff is “1”, these bits are updated after
every ADC conversion.
VOLTAGE REFERENCE
The voltage reference to the A/D and D/A converters
on the X9530, may be driven from the on-chip voltage
reference, or from an external source via the VRef pin.
Bit VRM in Control Register 0 selects between the two
options (See Figure 2).
The default value of VRM is “0”, which selects the
internal reference. When the internal reference is
selected, it’s output voltage is also an output at pin
VRef with a nominal value of 1.21 V. If an external
voltage reference is preferred, the VRM bit of the
Control Register 0 must be set to “1”.
A block diagram of the A/D converter is shown in
Figure 3. The voltage reference input (see “VOLTAGE
REFERENCE” for details), sets the maximum
amplitude of the ramp generator output. The A/D
converter input signal (see “A/D Converter Input
Select” below for details) is compared to the ramp
generator output. The control and encode logic
produces a binary encoded output, with a minimum
value of 00h (010), and a full scale output value of 3Fh
(6310).
Figure 2. Voltage Reference Structure
VRM: bit 2 in Control register 0.
The A/D converter input voltage range (VINADC) is
from 0 V to V(VRef).
On-chip
Voltage
Reference
VRef Pin
A/D Converter Input Select
The input signal to the A/D converter on the X9530,
may be the output of the on-chip temperature sensor,
or an external source via the VSense pin. Bit ADCIN in
Control register 0 selects between the two options
(See Figure 4). It’s default value is “0”, which selects
the internal temperature sensor.
A/D Converter and
D/A Converters reference
A/D CONVERTER
If an external source is intended as the input to the
A/D converter, the ADCIN bit of the Control register 0
must be set to “1”.
The X9530 contains a general purpose, on-chip, 6-bit
Analog to Digital (A/D) converter whose output is
available at the Status Register as bits AD[5:0]. By
Figure 3. A/D Converter Block Diagram
Comparator
A/D Converter Input
Control and
Encode Logic
From VRef
Ramp
Generator
Conversion Reset
6
A/D Converter
Output
(To LUTs
and Status
Register)
Clock
8
FN8211.0
March 10, 2005
X9530
Figure 4. A/D Converter Input Select Structure
ADCIN: bit 3 in Control register 0.
VSense
Pin
To A/D
Converter
Input
On-chip
Temperature
Sensor
The X9530 memory array contains two 64-byte look-up
tables. One is associated to pin I1’s output current
generator and the other to pin I2’s output current
generator, through their corresponding D/A converters.
The output of each look-up table is the byte contained in
the selected row. By default these bytes are the inputs
to the D/A converters driving pins I1 and I2.
The byte address of the selected row is obtained by
adding the look-up table base address (90h for LUT1,
and D0h for LUT2) and the appropriate row selection
bits. See Figure 6.
VRef
A/D Converter Range
From Figure 3 we can see that the operating range of
the A/D converter input depends on the voltage
reference. And from Figure 4 we see that the internal
temperature Sensor output also varies with the voltage
reference (VRef).
The table below summarizes the voltage range
restrictions on the VSense and VRef pins in different
configurations :
VSense and VRef ranges
VRef
A/D Converter Input
Ranges
Internal
Internal Temp. Sensor
Not Applicable
Internal
VSense Pin
0 ≤ V(VSense) ≤
V(VRef)
External
VSense Pin
0 ≤ V(VRef) ≤ 1.3 V
0 ≤ V(VSense) ≤
V(VRef)
External
LOOK-UP TABLES
Internal Temp. Sensor
All voltages referred to Vss.
9
Not a Valid Case
By default the look-up table selection bits are the 6-bit
output of the A/D converter. Alternatively, the A/D
converter can be bypassed and the six row selection
bits are the six LSBs of Control Registers 1 and 2, for
the LUT1 and LUT2 respectively. The selection
between these options is illustrated in Figure 7, and
described in “I2DS: Current Generator 2 Direction Select
Bit (Non-volatile)” on page 6, and “Control Register 2”
on page 6.
CURRENT GENERATOR BLOCK
The Current Generator pins I1 and I2 are outputs of
two independent current mode D/A converters.
D/A Converter Operation
The Block Diagram for each of the D/A converters is
shown in Figure 5.
The input byte of the D/A converter selects a voltage
on the non-inverting input of an operational amplifier.
The output of the amplifier drives the gate of a FET,
whose source is connected to ground via resistor R1.
This node is also fed back to the inverting input of the
amplifier. The drain of the FET is connected to the
output current pin (I1) via a “polarity select” circuit
block.
FN8211.0
March 10, 2005
X9530
Figure 5. D/A Converter Block Diagram
Vcc
Polarity
Select
Circuit
I1DS or I2DS: bits
6 or 7 in Control
register 0.
VRef
DAC1 or
DAC2
Input byte
Voltage
Divider
I1 or I2 Pin
+
-
R1 or R2 Pin
11
00
R1_Middle_Current or
R2_Middle_Current
R1_High_Current or
R2_High_Current
10
Vss
01
R1_Low_Current or
R2_Low_Current
I1FSO[1:0]
or I2FSO[1:0]
bits 1 and 0, or
3 and 2 in Control
register 5
Vss
R1_External or R2_External
Optional external resistor
Vss
Vss
Figure 6. Look-up Table (LUT) Operation
D2DA[7:0] : Control register 4
6
8
D0h
A
D
D
E
R
8
…
LUT2 Row
Selection bits
LUT2
10Fh
8
D1
D0 Out
8
DAC 2
Input Byte
Select
D0h
D2DAS: Bit 7 of
Control register 5
D1DA[7:0] : Control register 3
6
8
90h
A
D
D
E
R
8
…
LUT1 Row
Selection bits
LUT1
CFh
8
8
D1
D0 Out
DAC 1
Input Byte
Select
90h
D1DAS: Bit 5 of
Control register 5
10
FN8211.0
March 10, 2005
X9530
By examining the block diagram in Figure 5, we see
that the maximum current through pin I1 is set by fixing
values for V(VRef) and R1. The output current can
then be varied by changing the data byte at the D/A
converter input.
In general, the magnitude of the current at the D/A
converter output pins (I1, I2) may be calculated by:
Ix = (V(VRef) / (384 • Rx)) • N
where x = 1,2 and N is the decimal representation of
the input byte to the corresponding D/A converter.
The value for the resistor Rx (x = 1,2) determines the
full scale output current that the D/A converter may
sink or source. The full scale output current has a
maximum value of ±1.6 mA, which is obtained using a
resistance of 510Ω for Rx. This resistance may be
connected externally to pin Rx of the X9530, or may
be selected from one of three internal values. Bits
I1FSO1 and I1FSO0 select the full scale output
current setting for I1 as described in “I1FSO1 I1FSO0: Current Generator 1 Full Scale Output Set
Bits (Non-volatile)” on page 6. Bits I2FSO1 and
I2FSO0 select the maximum current setting for I2 as
described in “I2FSO1–I2FSO0: Current Generator 2
Full Scale Output Current Set Bits (Non-volatile)” on
page 7. When an internal resistor is selected for R1 or
R2, then no resistor should be connected externally at
the corresponding pin.
Bits I1DS and I2DS in Control Register 0 select the
direction of the currents through pins I1 and I2
independently (See “I1DS: Current Generator 1
Direction Select Bit (Non-volatile)” on page 4 and
“Control and Status Register Format” on page 5).
D/A Converter Output Current Response
When the D/A converter input data byte changes by
an arbitrary number of bits, the output current changes
from an intial current level (Ix) to some final level
(Ix + ∆Ix). The transition is monotonic and glitchless.
D/A Converter Control
The data byte inputs of the D/A converters can be
controlled in three ways:
– 1) With the A/D converter and through the look-up
tables (default),
– 2) Bypassing the A/D converter and directly accessing the look-up tables,
– 3) Bypassing both the A/D converter and look-up
tables, and directly setting the D/A converter input
byte.
Figure 7. Look-Up Table Addressing
L2DA[5:0]:
Control
Register 2
Voltage
Reference
D1
Out
D0
LUT2 Row
Selection bits
Select
6
ADC
Voltage Input
AD[5:0]
Status
Register
L2DAS: bit 6 in
Control register 5
L1DA[5:0]: 6
Control
Register 1
D1
Out
D0
Select
LUT1 Row
Selection bits
L1DAS: bit 4 in
Control register 5
The options are summarized in the following tables:
11
FN8211.0
March 10, 2005
X9530
D/A Converter 1 Access Summary
L1DAS
D1DAS
Control Source
0
0
A/D converter through LUT1
(Default)
1
0
Bits L1DA5 - L1DA0 through LUT1
X
1
Bits D1DA7 - D1DA0
“X” = Don’t Care Condition (May be either “1” or “0”)
D/A Converter 2 Access Summary
L2DAS
D2DAS
Control Source
0
0
A/D converter through LUT2
(Default)
1
0
Bits L2DA5 - L2DA0 through LUT2
X
1
Bits D2DA7 - D2DA0
“X” = Don’t Care Condition (May be either “1” or “0”)
The A/D converter is shared between the two current
generators but the look-up tables, D/A converters,
control bits, and selection bits can be set completely
independently.
Bits D1DAS and D2DAS are used to bypass the A/D
converter and look-up tables, allowing direct access to
the inputs of the D/A converters with the bytes in
control registers 4 and 5 respectively. See Figure 6,
and the descriptions of the control bits.
Bits I1DS and I2DS in Control Register 0 select the
direction of the currents through pins I1 and I2
independently See Figure 5, and the descriptions of
the control bits.
12
POWER-ON RESET
When power is applied to the Vcc pin of the X9530, the
device undergoes a strict sequence of events before
the current outputs of the D/A converters are enabled.
When the voltage at Vcc becomes larger than the
power-on reset threshold voltage (VPOR), the device
recalls all control bits from non-volatile memory into
volatile registers. Next, the analog circuits are
powered up. When the voltage at Vcc becomes larger
than a second voltage threshold (VADCOK), the ADC is
enabled. In the default case, after the ADC performs
four consecutive conversions with the same exact
result, the ADC output is used to select a byte from
each look-up table. Those bytes become the input of
the DACs. During all the previous sequence the input
of both DACs are 00h. If bit ADCfiltOff is “1”, only one
ADC conversion is necessary. Bits D1DAS, D2DAS,
L1DAS, and L2DAS, also modify the way the two
DACs are accessed the first time after power-up, as
described in “Control Register 5” on page 6.
The X9530 is a hot pluggable device. Voltage
distrubances on the Vcc pin are handled by the poweron reset circuit, allowing proper operation during hot
plug-in applications.
SERIAL INTERFACE
Serial Interface Conventions
The device supports a bidirectional bus oriented
protocol. The protocol defines any device that sends
data onto the bus as a transmitter, and the receiving
device as the receiver. The device controlling the
transfer is called the master and the device being
controlled is called the slave. The master always
initiates data transfers, and provides the clock for both
transmit and receive operations. The X9530 operates
as a slave in all applications.
FN8211.0
March 10, 2005
X9530
Figure 8. D/A Converter Power-on Reset Response
Voltage
Vcc
VADCOK
0V
Time
Current
Ix
ADC TIME
Ix x 10%
Serial Clock and Data
Data states on the SDA line can change only while
SCL is LOW. SDA state changes while SCL is HIGH
are reserved for indicating START and STOP
conditions. See Figure 10. On power-up of the X9530,
the SDA pin is in the input mode.
Serial Start Condition
All commands are preceded by the START condition,
which is a HIGH to LOW transition of SDA while SCL
is HIGH. The device continuously monitors the SDA
and SCL lines for the START condition and does not
respond to any command until this condition has been
met. See Figure 9.
Serial Stop Condition
All communications must be terminated by a STOP
condition, which is a LOW to HIGH transition of SDA
while SCL is HIGH. The STOP condition is also used
to place the device into the Standby power mode after
a read sequence. A STOP condition can only be
issued after the transmitting device has released the
bus. See Figure 9.
Time
The device responds with an ACK after recognition of
a START condition followed by a valid Slave Address
byte. A valid Slave Address byte must contain the
Device Type Identifier 1010, and the Device Address
bits matching the logic state of pins A2, A1, and A0.
See Figure 13.
If a write operation is selected, the device responds
with an ACK after the receipt of each subsequent
eight-bit word.
In the read mode, the device transmits eight bits of
data, releases the SDA line, and then monitors the line
for an ACK. The device continues transmitting data if
an ACK is detected. The device terminates further
data transmissions if an ACK is not detected. The
master must then issue a STOP condition to place the
device into a known state.
The X9530 acknowledges all incoming data and
address bytes except: 1) The “Slave Address Byte”
when the “Device Identifier” or “Device Address” are
wrong; 2) All “Data Bytes” when the “WEL” bit is “0”,
with the exception of a “Data Byte” addresses to
location 86h; 3) “Data Bytes” following a “Data Byte”
addressed to locations 80h, 85h, or 86h.
Serial Acknowledge
An ACK (Acknowledge), is a software convention used
to indicate a successful data transfer. The transmitting
device, either master or slave, releases the bus after
transmitting eight bits. During the ninth clock cycle, the
receiver pulls the SDA line LOW to acknowledge the
reception of the eight bits of data. See Figure 11.
13
FN8211.0
March 10, 2005
X9530
Figure 9. Valid Start and Stop Conditions
SCL
SDA
STOP
START
Figure 10. Valid Data Changes on the SDA Bus
SCL
SDA
Data Stable
Data Change
Data Stable
Figure 11. Acknowledge Response From Receiver
SCL from
Master
1
8
9
SDA Output from
Transmitter
SDA Output from
Receiver
START
14
ACK
FN8211.0
March 10, 2005
X9530
X9530 Memory Map
Addressing Protocol Overview
The X9530 contains a 2176 bit array of mixed volatile
and nonvolatile memory. This array is split up into four
distinct parts, namely: (Refer to Figure 12.)
All Serial Interface operations must begin with a
START, followed by a Slave Address Byte. The Slave
address selects the X9530, and specifies if a Read or
Write operation is to be performed.
– General Purpose Memory (GPM)
– Look-up Table 1 (LUT1)
– Look-up Table 2 (LUT2)
– Control and Status Registers
The GPM is all nonvolatile EEPROM, located at
memory addresses 00h to 7Fh.
Figure 12. X9530 Memory Map
Address
Size
10Fh
Look-up Table 2
FFh
64 Bytes
(LUT2)
D0h
CFh
Look-up Table 1
8Fh
Even though the 2176 bit memory consists of four
differing functions, it is physically realized as one
contiguous array, organized as 17 pages of 16 bytes
each.
The X9530 2-wire protocol provides one address byte,
therefore, only 256 bytes can be addressed directly.
The next few sections explain how to access the
different areas for reading and writing.
64 Bytes
Figure 13. Slave Address (SA) Format
(LUT1)
90h
It should be noted that the Write Enable Latch (WEL)
bit must first be set in order to perform a Write
operation to any other bit. (See “WEL: Write Enable
Latch (Volatile)” on page 7.) Also, all communication
to the X9530 over the 2-wire serial bus is conducted
by sending the MSB of each byte of data first.
Control & Status
16 Bytes
SA7
SA6 SA5
SA4
SA3
SA2
SA1
0
AS2
AS1
AS0
SA0
Registers
80h
7Fh
1
General Purpose
1
R/W
128 Bytes
Memory (GPM)
Device Type
Identifier
00h
7
0
Device
Address
Read or
Write
0
The Control and Status registers of the X9530 are
used in the test and setup of the device in a system.
These registers are realized as a combination of both
volatile and nonvolatile memory. These registers
reside in the memory locations 80h through 8Fh. The
reserved bits within registers 80h through 86h, must
be written as “0” if writing to them, and should be
ignored when reading. The reserved registers, from
88h through 8Fh, must not be written, and their
content should be ignored.
Slave Address
Bit(s)
Description
SA7 - SA4
Device Type Identifier
SA3 - SA1
Device Address
SA0
Read or Write Operation Select
Both look-up tables LUT1 and LUT2 are realized as
nonvolatile EEPROM, and extend from memory
locations 90h–CFh and D0h–10Fh respectively. These
look-up tables are dedicated to storing data solely for
the purpose of setting the outputs of Current
Generators I1 and I2 respectively.
All bits in both look-up tables are preprogrammed to
“0” at the factory.
15
FN8211.0
March 10, 2005
X9530
Slave Address Byte
Following a START condition, the master must output
a Slave Address Byte (Refer to Figure 13.). This byte
includes three parts:
– The four MSBs (SA7 - SA4) are the Device Type
Identifier, which must always be set to 1010 in order
to select the X9530.
– The next three bits (SA3 - SA1) are the Device
Address bits (AS2 - AS0). To access any part of the
X9530’s memory, the value of bits AS2, AS1, and
AS0 must correspond to the logic levels at pins A2,
A1, and A0 respectively.
– The LSB (SA0) is the R/W bit. This bit defines the
operation to be performed on the device being
addressed. When the R/W bit is “1”, then a Read
operation is selected. A “0” selects a Write
operation (Refer to Figure 13.)
Nonvolatile Write Acknowledge Polling
After a nonvolatile write command sequence is
correctly issued (including the final STOP condition),
the X9530 initiates an internal high voltage write cycle.
Figure 14. Acknowledge Polling Sequence
Byte load completed by issuing
STOP. Enter ACK Polling
Issue START
Issue Slave Address
Byte (Read or Write)
ACK returned?
Issue STOP
NO
YES
During acknowledge polling, the master first issues a
START condition followed by a Slave Address Byte.
The Slave Address Byte contains the X9530’s Device
Type Identifier and Device Address. The LSB of the
Slave Address (R/W) can be set to either 1 or 0 in this
case. If the device is busy within the high voltage
cycle, then no ACK is returned. If the high voltage
cycle is completed, an ACK is returned and the master
can then proceed with a new Read or Write operation.
(Refer to Figure 14.).
Byte Write Operation
In order to perform a Byte Write operation to the
memory array, the Write Enable Latch (WEL) bit of the
Control 6 Register must first be set to “1”. (See “WEL:
Write Enable Latch (Volatile)” on page 7.)
For any Byte Write operation, the X9530 requires the
Slave Address Byte, an Address Byte, and a Data Byte
(See Figure 15). After each of them, the X9530
responds with an ACK. The master then terminates the
transfer by generating a STOP condition. At this time, if
all data bits are volatile, the X9530 is ready for the next
read or write operation. If some bits are nonvolatile, the
X9530 begins the internal write cycle to the nonvolatile
memory. During the internal nonvolatile write cycle, the
X9530 does not respond to any requests from the
master. The SDA output is at high impedance.
A Byte Write operation can access bytes at locations
00h through FEh directly, when setting the Address
Byte to 00h through FEh respectively. Setting the
Address Byte to FFh accesses the byte at location
100h. The other sixteen bytes, at locations FFh and
101h through 10Fh can only be accessed using Page
Write operations. The byte at location FFh can only be
written using a “Page Write” operation.
Writing to Control bytes which are located at byte
addresses 80h through 8Fh is a special case
described in the section “Writing to Control Registers”.
YES
High Voltage
complete. Continue command
sequence.
This cycle typically requires 5 ms. During this time,
any Read or Write command is ignored by the X9530.
Write Acknowledge Polling is used to determine
whether a high voltage write cycle is completed.
NO
Issue STOP
Continue normal Read or Write
command sequence
PROCEED
16
FN8211.0
March 10, 2005
X9530
Figure 15. Byte Write Sequence
Write
S
t
a
r
t
Signals from
the Master
Signal at SDA
10 10
S
t
o
p
Data
Byte
Address
Byte
Slave
Address
0
Signals from
the Slave
A
C
K
A
C
K
Page Write Operation
The 2176-bit memory array is physically realized as
one contiguous array, organized as 17 pages of 16
bytes each. In order to perform a Page Write operation
to the memory array, the Write Enable Latch (WEL) bit
in Control register 6 must first be set (See “WEL: Write
Enable Latch (Volatile)” on page 7.)
A Page Write operation is initiated in the same manner
as the byte write operation; but instead of terminating
the write cycle after the first data byte is transferred,
the master can transmit up to 16 bytes (See Figure
16). After the receipt of each byte, the X9530
responds with an ACK, and the internal byte address
counter is incremented by one. The page address
remains constant. When the counter reaches the end
of the page, it “rolls over” and goes back to the first
byte of the same page.
For example, if the master writes 12 bytes to a 16-byte
page starting at location 11 (decimal), the first 5 bytes
are written to locations 11 through 15, while the last 7
bytes are written to locations 0 through 6 within that
page. Afterwards, the address counter would point to
location 7. If the master supplies more than 16 bytes of
data, then new data overwrites the previous data, one
byte at a time (See Figure 17).
A
C
K
The master terminates the loading of Data Bytes by
issuing a STOP condition, which initiates the
nonvolatile write cycle. As with the Byte Write
operation, all inputs are disabled until completion of
the internal write cycle.
A Page Write operation cannot be performed on the
page at locations 80h through 8Fh. Next section
describes the special cases within that page.
A Page Write operation starting with byte address
FFh, accesses the page between locations 100h and
10Fh. The first data byte of such operation is written to
location 100h.
Writing to Control Registers
The byte at location 80h, and bytes at locations 85h
through 8Fh are written using Byte Write operations.
They cannot be written using a Page Write operation.
Control bytes 1 through 4, at locations 81h through
84h respectively, are written during a single operation
(See Figure 18). The sequence must be: a START,
followed by a Slave Address byte, with the R/W bit
equal to “0”, followed by 81h as the Address Byte, and
then followed by exactly four Data Bytes, and a STOP
condition. The first data byte is written to location 81h,
the second to 82h, the third to 83h, and the last one to
84h.
Figure 16. Page Write Operation
Write
S
t
a
r
t
Signals from
the Master
2 < n < 16
Address
Byte
Slave
Address
Data Byte (1)
S
t
o
p
Data Byte (n)
Signal at SDA
10 1 0
Signals from
the Slave
0
A
C
K
17
A
C
K
A
C
K
A
C
K
FN8211.0
March 10, 2005
X9530
Figure 17. Example: Writing 12 bytes to a 16-byte page starting at location 11.
5 bytes
5 bytes
7 bytes
Address=6
Address=0
Address=11
Address=7
Address Pointer
Ends Up Here
The four registers Control 1 through 4, have a
nonvolatile and a volatile cell for each bit. At power-up,
the content of the nonvolatile cells is automatically
recalled and written to the volatile cells. The content of
the volatile cells controls the X9530’s functionality. If
bit NV1234 in the Control 0 register is set to “1”, a
Write operation to these registers writes to both the
volatile and nonvolatile cells. If bit NV1234 in the
Control 0 register is set to “0”, a Write operation to
these registers only writes to the volatile cells. In both
cases the newly written values effectively control the
X9530, but in the second case, those values are lost
when the part is powered down.
If bit NV1234 is set to “0”, a Byte Write operation to
Control registers 0 or 5 causes the value in the
nonvolatile cells of Control registers 1 through 4 to be
recalled into their corresponding volatile cells, as
during power-up. This doesn’t happen when the WP
pin is LOW, because Write Protection is enabled. It is
generally recommended to configure Control registers
0 and 5 before writing to Control registers 1 through 4.
Address=15
When reading any of the control registers 1, 2, 3, or 4,
the Data Bytes are always the content of the
corresponding nonvolatile cells, even if bit NV1234 is
"0" (See “Control and Status Register Format”).
Read Operation
A Read operation consist of a three byte instruction
followed by one or more Data Bytes (See Figure 19).
The master initiates the operation issuing the following
sequence: a START, the Slave Address byte with the
R/W bit set to “0”, an Address Byte, a second START,
and a second Slave Address byte with the R/W bit set
to “1”. After each of the three bytes, the X9530
responds with an ACK. Then the X9530 transmits
Data Bytes as long as the master responds with an
ACK during the SCL cycle following the eigth bit of
each byte. The master terminates the read operation
(issuing a STOP condition) following the last bit of the
last Data Byte (See Figure 19).
Figure 18. Writing to Control Registers 1, 2, 3, and 4
Four Data Bytes
Signals from
the Master
S
t
a
r
t
Write
Slave
Address
Address
Byte = 81h
Data Byte for
Control 1
S
t
o
p
Data Byte for
Control 4
Signal at SDA
10 10
Signals from
the Slave
10 0 0 0 0 01
0
A
C
K
18
A
C
K
A
C
K
A
C
K
FN8211.0
March 10, 2005
X9530
Figure 19. Read Sequence
Signals
from the
Master
S
t
a
r
t
Signal at
SDA
Slave
Address
with
R/W = 0
10 1 0
S
t
a
r
t
Address
Byte
10 10
0
A
C
K
Signals from
the Slave
A
C
K
The Data Bytes are from the memory location indicated
by an internal pointer. This pointer initial value is
determined by the Address Byte in the Read operation
instruction, and increments by one during transmission of
each Data Byte. After reaching the memory location
10Fh the pointer “rolls over” to 00h, and the device
continues to output data for each ACK received.
A Read operation internal pointer can start at any
memory location from 00h through FEh, when the
Address Byte is 00h through FEh respectively. But it
starts at location 100h if the Address Byte is FFh.
When reading any of the control registers 1, 2, 3, or 4,
the Data Bytes are always the content of the
corresponding nonvolatile cells, even if bit NV1234 is
"0" (See “Control and Status Register Format”).
19
Slave
Address
with
R/W = 1
A
C
K
S
t
o
p
A
C
K
1
A
C
K
First Read
Data Byte
Last Read
Data Byte
Data Protection
There are four levels of data protection designed into
the X9530: 1- Any Write to the device first requires
setting of the WEL bit in Control 6 register; 2- The
Block Lock can prevent Writes to certain regions of
memory; 3- The Write Protection pin disables any
writing to the X9530; 4- The proper clock count, data bit
sequence, and STOP condition is required in order to
start a nonvolatile write cycle, otherwise the X9530
ignores the Write operation.
WP: Write Protection Pin
When the Write Protection (WP) pin is active (LOW),
any Write operations to the X9530 is disabled, except
the writing of the WEL bit.
FN8211.0
March 10, 2005
X9530
APPLICATIONS INFORMATION
Temperature Sensing
The X9530’s on-chip temperature sensor functions
similarly to other semiconductor temperature sensors.
The surface mount package (TSSOP) and the Chip
Scale Package both allow good thermal conduction
from the PC board to the die, so the X9530 will provide
an accurate measure of the temperature of the board.
If there is no ambient air movement over the device
package or the board, then the measured temperature
will be very close to that of the board. If there is air
movement over the package and the air temperature
is substantially different from that of the PC board,
then the measured temperature will be at a value
between that of the board and the air. If the X9530 is
intended to sense the temperature of a particular
component on the board, the X9530 should be located
as close as possible to that component to minimize
contributions from other devices or the differential
temperatures across the board.
X9530 LASER DIODE BIAS APPLICATION
EXAMPLE
The X9530 is ideally suited to the control of temperature
sensitive parameters in fiber optic applications. Figure
20 shows the typical topology of a laser driver circuit
used in many fiber optic transceiver modules.
This example uses a common anode connected Laser
Diode (LD), in conjunction with a PIN Monitor PhotoDiode (MPD). The laser diode current (ILD) is a
summation of the Bias Current (IBIAS), Modulation
Current (IMOD) and the Automatic Power Control (APC)
error signal current (IMON). The APC circuit uses the
MPD current (IMON) as an input, and ensures that a
constant average optical power output of the LD is
maintaned. The modulation circuitry is driven by an
external high speed data source.
Typical control parameters of a LD driver circuit such
as the one shown in Figure 20 may be:
– IMODSET : Sets the IMOD level,
– IBIASSET : Sets the IBIAS level,
– IPINSET: Sets the average optical power output.
In this example the I1 output of the X9530 drives the
IMODSET input of the laser diode circuit. By loading the
appropriate values into the look-up table (LUT1) of the
device, it can dynamically change the modulation
current of the driver circuit. This may be used to
compensate for the effect of reduced laser light output
at elevated temperatures.
Depending upon the type of driver circuit used, the I2
output of the X9530 may be used to control either
IBIASSET or IPINSET parameters. The example in Figure
21 uses I2 to control the IPINSET parameter, while
IBIASSET is set at a fixed value using a Intersil Digital
potentiometer.
Similar to the control of the modulation current, I2 may
be used to compensate for changes in IMON over
temperature. By loading the appropriate values into
the look-up table (LUT2) of the device, this would have
the effect of dynamically controlling the average
optical power output of the LD (via the APC circuit)
over temperature.
The lookup table values for this fiber optic application
could be determined in two ways. One way is to use
well-defined data for LD and monitor photo diode drift
over temperature, and calculate the appropriate I1 and
I2 values needed at each temperature setting. Another
way is to test the assembled module over temperature
and load values into the tables at each setting. This
will require APC on/off control to determine each
MODSET value. See Intersil application note AN156
for a full design analysis with LD driver application.
If design requirements are such that no temperature
compensation is necessary for the average optical
power output of the LD, then the I2 output pin could be
used to set the bias current. IBIASET of the driver circuit
may be controlled by I2 of the X9530, and the same
current level could be set with control 4 register. This
would provide a constant (temperature independant)
setting for the bias current.
As previously described, the X9530 also contains
general purpose EEPROM memory which may be
accessed by the 2 wire serial bus. In the case of
pluggable fiber optic applications such as GBIC, SFP
or SFF this memory may be used for the storage of
transceiver module parameters.
Figure 21 shows how the X9530 may be used to
control these parameters while providing accurate
temperature compensation.
20
FN8211.0
March 10, 2005
X9530
Figure 20. Typical Laser Driver Circuit Topology
Laser Diode Driver Circuit
VCC
Modulation
Currrent
Generation
High Speed
Data Input
LD
MPD
ILD
IMON
IMOD
IMODSET
Bias
Currrent
Generation
IBIASMAX
+
Σ
IBIAS
+
+
Σ
–
IAPC (Error Signal)
Automatic
Power
Control
(APC)
IBIASSET
IPINSET
Figure 21. X9530 Application Example Block Diagram
GBIC / SFP / XFP Module
VCC
High Speed
Data Input
LD
MPD
ILD
IMON
IBIASSET
X9530
INTERSIL
XDCP
I1
MOD_DEF(0)
SDA
MOD_DEF(1)
SCK
21
I2
IMODSET
Laser
Diode
Driver
Circuit
IPINSET
FN8211.0
March 10, 2005
X9530
ABSOLUTE MAXIMUM RATINGS
COMMENT
All voltages are referred to Vss.
Temperature under bias ................... -65°C to +100°C
Storage temperature ........................ -65°C to +150°C
Voltage on every pin except Vcc ................ -1.0V to +7V
Voltage on Vcc Pin .............................................0 to 5.5V
D.C. Output Current at pin SDA ...................... 0 to 5 mA
D.C. Output Current at pins R1, R2,
VRef and VSense.................................... -0.50 to 1 mA
D.C. Output Current at pins I1 and I2 ............... -3 to 3mA
Lead temperature (soldering, 10 seconds) ........ 300°C
Stresses above those listed under “Absolute Maximum
Ratings” may cause permanent damage to the device.
This is a stress rating only; functional operation of the
device (at these or any other conditions above those
listed in the operational sections of this specification) is
not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device
reliability.
OPERATING CONDITIONS
Parameter
Min.
-40
0
3
-0.3
Temperature
Temperature while writing to memory
Voltage on Vcc Pin
Voltage on any other Pin
Max.
+100
+70
5.5
Vcc + 0.3
Units
°C
°C
V
V
ELECTRICAL CHARACTERISTICS
All typical values are for 25°C ambient temperature and 5 V at pin Vcc. Maximum and minimum specifications are
over the recommended operating conditions. All voltages are referred to the voltage at pin Vss unless otherwise
specified. All bits in control registers are “0” unless otherwise specified. 510Ω, 0.1%, resistor connected between R1
and Vss, and another between R2 and Vss unless otherwise specified. 400kHz TTL input at SCL unless otherwise
specified. SDA pulled to Vcc through an external 2kΩ resistor unless otherwise specified. 2-wire interface in “standby”
(see notes 1 and 2 on page 22), unless otherwise specified. WP, A0, A1, and A2 floating unless otherwise specified.
VRef pin unloaded, unless otherwise specified.
Symbol
Parameter
Min
Typ
Max
Unit
Test Conditions / Notes
Iccstby
Standby current into Vcc
pin
2
mA
R1 and R2 floating, VRef unloaded.
Iccfull
Full operation current into
Vcc pin
9
mA
2-wire interface reading from
memory, I1 and I2 both connected to
Vss, DAC input bytes: FFh, VRef
unloaded.
Iccwrite
Nonvolatile Write current
into Vcc pin
mA
Average from START condition until
tWP after the STOP condition
WP: Vcc, R1 and R2 floating,
VRef unloaded.
IPLDN
On-chip pull down
current at WP, A0, A1,and
A2
20
µA
V(WP), V(A0), V(A1), and V(A2) from
0V to Vcc
VILTTL
SCL and SDA, input Low
voltage
0.8
V
VIHTTL
SCL and SDA, input High
voltage
2.0
IINTTL
SCL and SDA input
current
-1
10
µA
Pin voltage between 0 and Vcc, and
SDA as an input.
VOLSDA
SDA output Low voltage
0
0.4
V
I(SDA) = 2 mA
IOHSDA
SDA output High current
0
100
µA
V(SDA) = Vcc
VILCMOS
WP, A0, A1, and A2 input
Low voltage
0
0.2 x
Vcc
V
22
4
0
1
V
FN8211.0
March 10, 2005
X9530
ELECTRICAL CHARACTERISTICS (CONTINUED)
All typical values are for 25°C ambient temperature and 5 V at pin Vcc. Maximum and minimum specifications are
over the recommended operating conditions. All voltages are referred to the voltage at pin Vss unless otherwise
specified. All bits in control registers are “0” unless otherwise specified. 510Ω, 0.1%, resistor connected between R1
and Vss, and another between R2 and Vss unless otherwise specified. 400kHz TTL input at SCL unless otherwise
specified. SDA pulled to Vcc through an external 2kΩ resistor unless otherwise specified. 2-wire interface in “standby”
(see notes 1 and 2 on page 22), unless otherwise specified. WP, A0, A1, and A2 floating unless otherwise specified.
VRef pin unloaded, unless otherwise specified.
Symbol
Parameter
Min
Typ
VIHCMOS
WP, A0, A1, and A2 input
High voltage
0.8 x
Vcc
VRefout
Output Voltage at VRef at
25°C
1.205
RVref
VRef pin input resistance
20
40
kΩ
TCOref
Temperature coefficient of
VRef output voltage
-100
+100
ppm/°
C
VRef Range
Voltage range when VRef
is an input
1
1.3
V
See note 3.
TSenseRange
Temperature sensor
range
-40
100
°C
See note 4.
IR
Current from pin R1 or R2
to Vss
0
1600
µA
VPOR
Power-on reset threshold
voltage
1.5
2.8
V
VccRamp
Vcc Ramp Rate
0.2
50
mV /
µs
VADCOK
ADC enable minimum
voltage
2.6
2.8
V
1.21
Max
Unit
Vcc
V
1.215
V
Test Conditions / Notes
-20 µA ≤ I(VRef) ≤ 20 µA
VRM bit = “1”, 25°C
See note 4 and 5.
See Figure 8.
Notes: 1. The device goes into Standby: 200 ns after any STOP, except those that initiate a nonvolatile write cycle. It goes into Standby tWC after
a STOP that initiates a nonvolatile write cycle. It also goes into Standby 9 clock cycles after any START that is not followed by the correct Slave Address Byte.
2. tWC is the time from a valid STOP condition at the end of a write sequence to the end of the self-timed internal nonvolatile write cycle. It
is the minimum cycle time to be allowed for any nonvolatile write by the user, unless Acknowledge Polling is used.
3. For this range of V(VRef) the full scale sink mode current at I1 and I2 follows V(VRef) with a linearity error smaller than 1%.
4. These parameters are periodically sampled and not 100% tested.
5. TCOref = [Max V(VREF) - Min V(VREF)] x 106/(1.21V x 140°C)
23
FN8211.0
March 10, 2005
X9530
D/A CONVERTER CHARACTERISTICS
All typical values are for 25°C ambient temperature and 5 V at pin Vcc. Maximum and minimum specifications are over the
recommended operating conditions. All voltages are referred to the voltage at pin Vss unless otherwise specified. All bits in
control registers are “0” unless otherwise specified. 510Ω, 0.1%, resistor connected between R1 and Vss, and another
between R2 and Vss unless otherwise specified. 400kHz TTL input at SCL unless otherwise specified. SDA pulled to Vcc
through an external 2kΩ resistor unless otherwise specified. 2-wire interface in “standby” (see notes 1 and 2 on page 22),
unless otherwise specified. WP, A0, A1, and A2 floating unless otherwise specified.
Symbol
Parameter
Min
Typ
Max
Unit
Test Conditions / Notes
IFS00
I1 or I2 full scale current, with external
resistor setting
1.56
1.58
1.6
mA
IFS01
I1 or I2 full scale current, with internal
low current setting option
0.3
0.4
0.5
mA
IFS10
I1 or I2 full scale current, with internal
middle current setting option
0.64
0.85
1.06
mA
DAC input Byte = FFh,
Source or sink mode, V(I1)
and V(I2) are Vcc - 1.2V in
source mode and 1.2V in sink
mode.
See notes 1 and 2.
IFS11
I1 or I2 full scale current, with internal
high current setting option
1
1.3
1.6
mA
OffsetDAC
I1 or I2 D/A converter offset error
1
1
LSB
FSErrorDAC
I1 or I2 D/A converter full scale error
-2
2
LSB
DNLDAC
I1 or I2 D/A converter
Differential Nonlinearity
-0.5
0.5
LSB
INLDAC
I1 or I2 D/A converter Integral Nonlinearity with respect to a straight line
through 0 and the full scale value
-1
1
LSB
VISink
I1 or I2 Sink Voltage Compliance
1.2
Vcc
V
In this range the current at I1
or I2 vary < 1%
VISource
I1 or I2 Source Voltage Compliance
0
Vcc-1.2
V
In this range the current at I1
or I2 vary < 1%
IOVER
I1 or I2 overshoot on D/A Converter
data byte transition
0
µA
IUNDER
I1 or I2 undershoot on D/A Converter
data byte transition
0
µA
trDAC
I1 or I2 rise time on D/A Converter data
byte transition; 10% to 90%
30
µs
DAC input byte changing from
00h to FFh and vice
versa, V(I1) and V(I2) are
Vcc - 1.2V in source mode
and 1.2V in sink mode.
See note 3.
TCOI1I2
Temperataure coefficient of output
current I1 or I2 when using internal
resistor setting
Notes: 1. LSB is defined as
[ 23 x V(VRef)
255 ]
5
±200
ppm/
°C
See Figure 5.
Bits I1FSO[1:0] ¦ 002 or
Bits I2FSO[1:0] ¦ 002,
VRMbit = “1”
divided by the resistance between R1 or R2 to Vss.
2. OffsetDAC: The Offset of a DAC is defined as the deviation between the measured and ideal output, when the DAC input is 01h. It is
expressed in LSB.
FSErrorDAC: The Full Scale Error of a DAC is defined as the deviation between the measured and ideal output, when the input is FFh. It
is expressed in LSB. The OffsetDAC is subtracted from the measured value before calculating FSErrorDAC.
DNLDAC: The Differential Non-Linearity of a DAC is defined as the deviation between the measured and ideal incremental change in
the output of the DAC, when the input changes by one code step. It is expressed in LSB. The measured values are adjusted for Offset
and Full Scale Error before calculating DNLDAC.
INLDAC: The Integral Non-Linearity of a DAC is defined as the deviation between the measured and ideal transfer curves, after adjusting the measured transfer curve for Offset and Full Scale Error. It is expressed in LSB.
3. These parameters are periodically sampled and not 100% tested.
24
FN8211.0
March 10, 2005
X9530
A/D CONVERTER CHARACTERISTICS
All typical values are for 25°C ambient temperature and 5 V at pin Vcc. Maximum and minimum specifications are over the
recommended operating conditions. All voltages are referred to the voltage at pin Vss unless otherwise specified. All bits in control
registers are “0” unless otherwise specified. 510Ω, 0.1%, resistor connected between R1 and Vss, and another between R2 and Vss
unless otherwise specified. 400kHz TTL input at SCL unless otherwise specified. SDA pulled to Vcc through an external 2kΩ resistor
unless otherwise specified. 2-wire interface in “standby” (see notes 1 and 2 on page 22), unless otherwise specified. WP, A0, A1, and A2
floating unless otherwise specified.
Symbol
Parameter
Min
Typ
Max
Unit
Test Conditions / Notes
9
ms
Proportional to A/D converter
input voltage. This value is
maximum at full scale input
of A/D converter.
ADCfiltOff = “1”
kΩ
VSense as an input,
ADCIN bit = “1”
ADCTIME
A/D converter conversion
time
RINADC
VSense pin input
resistance
100
CINADC
VSense pin input
capacitance
1
7
pF
VSense as an input,
ADCIN bit = “1”,
Frequency = 1 MHz
See note 3.
VINADC
VSense input signal range
0
V(VRef)
V
This is the A/D Converter
Dynamic Range. ADCIN bit = “1”
OffsetADC
A/D converter offset error
-0.25
0.25
LSB
FSErrorADC
A/D converter full scale error
-1
1
LSB
DNLADC
A/D Converter Differential
Nonlinearity
-0.5
0.5
LSB
INLADC
A/D converter Integral
Nonlinearity
-0.5
0.5
LSB
TempStepADC
Temperature step causing
one step increment of ADC
output
2.1
2.3
°C
Out25ADC
ADC output at 25°C
2.2
See notes 1 and 2
0111012
Notes: 1. “LSB” is defined as V(VRef)/63, “Full Scale” is defined as V(VRef).
31/2 x V(VRef)
2. OffsetADC: For an ideal converter, the first transition of its transfer curve occurs a
above zero. Offset error is the
255
amount of deviation between the measured first transition point and the ideal point.
1
FSErrorADC: For an ideal converter, the last transition of its transfer curve occurs at 251 /2 x V(VRef) .Full Scale Error is the amount
255
of deviation between the measured last transition point and the ideal point,
after subtracting the Offset from the measured curve.
DNLADC: DNL is defined as the difference between the ideal and the measured code transitions for successive A/D code outputs
expressed in LSBs. The measured transfer curve is adjusted for Offset and Fullscale errors before calculating DNL.
INLADC: The deviation of the measured transfer function of an A/D converter from the ideal transfer function. The INL error is also
defined as the sum of the DNL errors starting from code 00h to the code where the INL measurement is desired. The measured transfer curve is adjusted for Offset and Fullscale errors before calculating INL.
3. These parameters are periodically sampled and not 100% tested.
[
[
25
]
]
FN8211.0
March 10, 2005
X9530
2-WIRE INTERFACE A.C. CHARACTERISTICS
Symbol
Max
Units
Test Conditions / Notes
400
kHz
Pulse width Suppression Time at
inputs
50
ns
See “2-Wire Interface Test
Conditions” (below),
tAA(4)
SCL Low to SDA Data Out Valid
900
ns
tBUF(4)
Time the bus free before start of new
transmission
tLOW
Clock Low Time
fSCL
tIN
Parameter
Min
SCL Clock Frequency
(4)
tHIGH
Clock High Time
Typ
1(3)
1300
ns
1.3
1200(3)
µs
0.6
1200(3)
µs
tSU:STA
Start Condition Setup Time
600
ns
tHD:STA
Start Condition Hold Time
600
ns
tSU:DAT
Data In Setup Time
100
ns
tHD:DAT
Data In Hold Time
0
µs
tSU:STO
Stop Condition Setup Time
600
ns
tDH
Data Output Hold Time
50
ns
tR
(4)
tF(4)
tSU:WP(4)
SDA and SCL Rise Time
20
+0.1Cb(1)
300
ns
SDA and SCL Fall Time
20
+0.1Cb(1)
300
ns
WP Setup Time
600
ns
tHD:WP
WP Hold Time
600
ns
Cb(4)
Capacitive load for each bus line
(4)
See Figure 22, Figure 23
and Figure 24.
400
pF
2-WIRE INTERFACE TEST CONDITIONS
Input Pulse Levels
10 % to 90 % of Vcc
Input Rise and Fall Times, between 10% and 90%
10 ns
Input and Output Timing Threshold Level
1.4V
External Load at pin SDA
2.3 kΩ to Vcc and 100 pF to Vss
NONVOLATILE WRITE CYCLE TIMING
Symbol
tWC
(2)
Parameter
Nonvolatile Write Cycle Time
Min
Typ
Max
Units
Test Conditions / Notes
5
10
ms
See Figure 24
Notes: 1. Cb = total capacitance of one bus line (SDA or SCL) in pF.
2. tWC is the time from a valid STOP condition at the end of a write sequence to the end of the self-timed internal nonvolatile write cycle. It
is the minimum cycle time to be allowed for any nonvolatile write by the user, unless Acknowledge Polling is used.
3. The minimum frequency requirement applies between a START and a STOP condition.
4. These parameters are periodically sampled and not 100% tested.
26
FN8211.0
March 10, 2005
X9530
TIMING DIAGRAMS
Figure 22. Bus Timing
tHIGH
tF
SCL
tLOW
tR
tSU:DAT
tSU:STA
tHD:DAT
tHD:STA
SDA IN
tSU:STO
tAA
tDH
tBUF
SDA OUT
Figure 23. WP Pin Timing
STOP
START
SCL
Clk 1
SDA IN
tSU:WP
tHD:WP
WP
Figure 24. Non-Volatile Write Cycle Timing
SCL
SDA
8th bit of last byte
ACK
tWC
Stop
Condition
27
Start Condition
FN8211.0
March 10, 2005
X9530
14-Lead Plastic, TSSOP, Package Code V14
.025 (.65) BSC
.169 (4.3)
.252 (6.4) BSC
.177 (4.5)
.193 (4.9)
.200 (5.1)
.041 (1.05)
.0075 (.19)
.0118 (.30)
.002 (.05)
.006 (.15)
.010 (.25)
Gage Plane
0° - 8°
Seating Plane
.019 (.50)
.029 (.75)
Detail A (20X)
.031 (.80)
.041 (1.05)
See Detail “A”
NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)
28
FN8211.0
March 10, 2005
X9530
15-Bump Chip Scale Package (CSP B15)
Package Outline Drawing
a
d
A3
A2
A1
B3
B2
B1
C3
C2
C1
D3
D2
D1
E3
E2
E1
9530BZ
YWW I
LOT#
f
b
k
m
l
Top View (Marking Side)
j
e
Bottom View (Bumped Side)
e
Side View
c
Side View
Package Dimension
Ball Matrix:
Millimeters
Symbol
Min
Nominal
Max
A
3
2
1
A0
I2
VRef
Package Width
a
2.661
2.691
2.721
B
Vcc
A1
VSense
Package Length
b
3.474
3.504
3.534
C
SCL
A2
Vss
Package Height
c
0.644
0.677
0.710
D
SDA
Vss
R2
Body Thickness
d
0.444
0.457
0.470
E
WP
I1
R1
Ball Height
e
0.220
0.240
0.260
Ball Diameter
f
0.310
0.330
0.350
Ball Pitch - Width
j
Ball Pitch - Length
k
Ball to Edge Spacing – Width
l
0.671
0.696
0.721
Ball to Edge Spacing – Length
m
0.427
0.452
0.477
29
0.65
0.65
FN8211.0
March 10, 2005
X9530
ORDERING INFORMATION
X9530
P
I
Temperature Grade: I = -40 to 100°C
Device
Package
V14 = 14-Lead TSSOP
B15 = 15-Lead Chip-Scale (Contact Factory for Availability)
ORDERING CODES
X9530V14I or X9530B15I
X9530B15I is offered only in
Tape and Reel
X9530B15I-T1 2500 pcs reel
X9530B15I-T2 1000 pcs reel
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
30
FN8211.0
March 10, 2005