MUN5334DW1, NSBC124XPDXV6 Complementary Bias Resistor Transistors R1 = 22 kW, R2 = 47 kW www.onsemi.com NPN and PNP Transistors with Monolithic Bias Resistor Network This series of digital transistors is designed to replace a single device and its external resistor bias network. The Bias Resistor Transistor (BRT) contains a single transistor with a monolithic bias network consisting of two resistors; a series base resistor and a base-emitter resistor. The BRT eliminates these individual components by integrating them into a single device. The use of a BRT can reduce both system cost and board space. PIN CONNECTIONS (3) (2) R1 • Simplifies Circuit Design Reduces Board Space Reduces Component Count S and NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable* These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant R2 Q1 Q2 R2 Features • • • • (1) (4) R1 (5) (6) MARKING DIAGRAMS 6 SOT−363 CASE 419B 34 M G G 1 MAXIMUM RATINGS (TA = 25°C both polarities Q1 (PNP) & Q2 (NPN), unless otherwise noted) Rating Symbol Max Unit Collector-Base Voltage VCBO 50 Vdc Collector-Emitter Voltage VCEO 50 Vdc IC 100 mAdc Input Forward Voltage VIN(fwd) 40 Vdc Input Reverse Voltage VIN(rev) 7 Vdc Collector Current − Continuous Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. SOT−563 CASE 463A 1 34 M G 34 M G G = Specific Device Code = Date Code* = Pb-Free Package (Note: Microdot may be in either location) *Date Code orientation may vary depending upon manufacturing location. ORDERING INFORMATION Package Shipping† MUN5334DW1T1G, NSVMUN5334DW1T1G* SOT−363 3,000/Tape & Reel NSBC124XPDXV6T1G, NSVBC124XPDXV6T1G* SOT−563 4,000/Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2016 March, 2016 − Rev. 2 1 Publication Order Number: DTC124XP/D MUN5334DW1, NSBC124XPDXV6 THERMAL CHARACTERISTICS Characteristic Symbol Max Unit 187 256 1.5 2.0 mW MUN5334DW1 (SOT−363) ONE JUNCTION HEATED PD Total Device Dissipation (Note 1) TA = 25°C (Note 2) Derate above 25°C (Note 1) (Note 2) Thermal Resistance, Junction to Ambient (Note 1) (Note 2) RqJA mW/°C 670 490 °C/W 250 385 2.0 3.0 mW MUN5334DW1 (SOT−363) BOTH JUNCTION HEATED (Note 3) PD Total Device Dissipation (Note 1) TA = 25°C (Note 2) Derate above 25°C (Note 1) (Note 2) Thermal Resistance, Junction to Ambient (Note 2) RqJA (Note 1) Thermal Resistance, Junction to Lead (Note 1) (Note 2) RqJL Junction and Storage Temperature Range TJ, Tstg 493 325 188 208 mW/°C °C/W °C/W −55 to +150 °C 357 2.9 mW mW/°C NSBC124XPDXV6 (SOT−563) ONE JUNCTION HEATED PD Total Device Dissipation (Note 1) TA = 25°C Derate above 25°C (Note 1) Thermal Resistance, Junction to Ambient RqJA (Note 1) 350 °C/W NSBC124XPDXV6 (SOT−563) BOTH JUNCTION HEATED (Note 3) PD Total Device Dissipation (Note 1) TA = 25°C Derate above 25°C (Note 1) Thermal Resistance, Junction to Ambient RqJA (Note 1) Junction and Storage Temperature Range TJ, Tstg 1. FR−4 @ Minimum Pad. 2. FR−4 @ 1.0 × 1.0 Inch Pad. 3. Both junction heated values assume total power is sum of two equally powered channels. www.onsemi.com 2 500 4.0 250 −55 to +150 mW mW/°C °C/W °C MUN5334DW1, NSBC124XPDXV6 ELECTRICAL CHARACTERISTICS (TA = 25°C both polarities Q1 (PNP) & Q2 (NPN), unless otherwise noted) Symbol Characteristic Min Typ Max − − 100 − − 500 − − 0.13 50 − − 50 − − 80 150 − − − 0.25 − − 0.8 0.9 − − − − 1.3 1.3 − − − − 0.2 4.9 − − Unit OFF CHARACTERISTICS Collector-Base Cutoff Current (VCB = 50 V, IE = 0) ICBO Collector-Emitter Cutoff Current (VCE = 50 V, IB = 0) ICEO Emitter-Base Cutoff Current (VEB = 6.0 V, IC = 0) IEBO Collector-Base Breakdown Voltage (IC = 10 mA, IE = 0) V(BR)CBO Collector-Emitter Breakdown Voltage (Note 4) (IC = 2.0 mA, IB = 0) V(BR)CEO nAdc nAdc mAdc Vdc Vdc ON CHARACTERISTICS hFE DC Current Gain (Note 4) (IC = 5.0 mA, VCE = 10 V) Collector-Emitter Saturation Voltage (Note 4) (IC = 10 mA, IB = 1.0 mA) VCE(sat) Input Voltage (Off) (VCE = 5.0 V, IC = 100 mA) (NPN) (VCE = 5.0 V, IC = 100 mA) (PNP) Vi(off) Input Voltage (On) (VCE = 0.2 V, IC = 3.0 mA) (NPN) (VCE = 0.2 V, IC = 3.0 mA) (PNP) Vi(on) Output Voltage (On) (VCC = 5.0 V, VB = 2.5 V, RL = 1.0 kW) VOL Output Voltage (Off) (VCC = 5.0 V, VB = 0.5 V, RL = 1.0 kW) VOH Input Resistor R1 15.4 22 28.6 Resistor Ratio R1/R2 0.38 0.47 0.56 4. Pulsed Condition: Pulse Width = 300 ms, Duty Cycle ≤ 2%. PD, POWER DISSIPATION (mW) 400 350 300 250 200 (1) SOT−363; 1.0 × 1.0 Inch Pad (2) SOT−563; Minimum Pad (1) (2) 150 100 50 0 −50 −25 0 25 50 75 100 125 150 AMBIENT TEMPERATURE (°C) Figure 1. Derating Curve www.onsemi.com 3 V Vdc Vdc Vdc Vdc kW MUN5334DW1, NSBC124XPDXV6 1 1000 IC/IB = 10 VCE = 10 V hFE, DC CURRENT GAIN VCE(sat), COLLECTOR−EMITTER VOLTAGE (V) TYPICAL CHARACTERISTICS − NPN TRANSISTOR MUN5334DW1, NSBC124XPDXV6 25°C 0.1 150°C −55°C 0.01 0 10 20 30 40 100 −55°C 10 1 0.1 50 1 10 IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA) Figure 2. VCE(sat) vs. IC 100 2.8 2.4 IC, COLLECTOR CURRENT (mA) f = 10 kHz IE = 0 A TA = 25°C 2 1.6 1.2 0.8 0.4 0 10 20 30 40 50 −55°C 10 1 25°C 0.1 0.01 150°C VO = 5 V 0 4 8 12 16 20 24 VR, REVERSE VOLTAGE (V) Vin, INPUT VOLTAGE (V) Figure 4. Output Capacitance Figure 5. Output Current vs. Input Voltage 100 Vin, INPUT VOLTAGE (V) Cob, OUTPUT CAPACITANCE (pF) 100 Figure 3. DC Current Gain 3.2 0 150°C 25°C −55°C 25°C 10 1 150°C VO = 0.2 V 0.1 0 10 20 30 40 IC, COLLECTOR CURRENT (mA) Figure 6. Input Voltage vs. Output Current www.onsemi.com 4 50 28 MUN5334DW1, NSBC124XPDXV6 1 1000 IC/IB = 10 VCE = 10 V hFE, DC CURRENT GAIN VCE(sat), COLLECTOR−EMITTER VOLTAGE (V) TYPICAL CHARACTERISTICS − PNP TRANSISTOR MUN5334DW1, NSBC124XPDXV6 25°C 150°C 0.1 −55°C 0.01 0 10 20 30 40 100 −55°C 10 1 0.1 50 1 IC, COLLECTOR CURRENT (mA) 100 Figure 8. DC Current Gain 10 100 9 8 7 IC, COLLECTOR CURRENT (mA) f = 10 kHz IE = 0 A TA = 25°C 6 5 4 3 2 1 0 10 20 30 40 50 −55°C 10 1 0.1 25°C 0.01 150°C 0.001 VO = 5 V 0 2 4 6 8 10 12 14 16 18 20 VR, REVERSE VOLTAGE (V) Vin, INPUT VOLTAGE (V) Figure 9. Output Capacitance Figure 10. Output Current vs. Input Voltage 100 Vin, INPUT VOLTAGE (V) Cob, OUTPUT CAPACITANCE (pF) 10 IC, COLLECTOR CURRENT (mA) Figure 7. VCE(sat) vs. IC 0 150°C 25°C −55°C 25°C 10 1 150°C VO = 0.2 V 0.1 0 10 20 30 40 IC, COLLECTOR CURRENT (mA) Figure 11. Input Voltage vs. Output Current www.onsemi.com 5 50 22 MUN5334DW1, NSBC124XPDXV6 PACKAGE DIMENSIONS SC−88/SC70−6/SOT−363 CASE 419B−02 ISSUE Y 2X aaa H D D A D 6 5 GAGE PLANE 4 2 L L2 E1 E 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.20 PER END. 4. DIMENSIONS D AND E1 AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY AND DATUM H. 5. DATUMS A AND B ARE DETERMINED AT DATUM H. 6. DIMENSIONS b AND c APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN 0.08 AND 0.15 FROM THE TIP. 7. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 TOTAL IN EXCESS OF DIMENSION b AT MAXIMUM MATERIAL CONDITION. THE DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OF THE FOOT. H DETAIL A 3 aaa C 2X bbb H D 2X 3 TIPS e B 6X ddd TOP VIEW A2 A 6X ccc C A1 SIDE VIEW DIM A A1 A2 b C D E E1 e L L2 aaa bbb ccc ddd b C M C A-B D DETAIL A SEATING PLANE END VIEW c MILLIMETERS MIN NOM MAX −−− −−− 1.10 0.00 −−− 0.10 0.70 0.90 1.00 0.15 0.20 0.25 0.08 0.15 0.22 1.80 2.00 2.20 2.00 2.10 2.20 1.15 1.25 1.35 0.65 BSC 0.26 0.36 0.46 0.15 BSC 0.15 0.30 0.10 0.10 RECOMMENDED SOLDERING FOOTPRINT* 6X 6X 0.30 0.66 2.50 0.65 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 6 INCHES NOM MAX −−− 0.043 −−− 0.004 0.035 0.039 0.008 0.010 0.006 0.009 0.078 0.086 0.082 0.086 0.049 0.053 0.026 BSC 0.010 0.014 0.018 0.006 BSC 0.006 0.012 0.004 0.004 MIN −−− 0.000 0.027 0.006 0.003 0.070 0.078 0.045 MUN5334DW1, NSBC124XPDXV6 PACKAGE DIMENSIONS SOT−563, 6 LEAD CASE 463A ISSUE G D −X− 6 5 1 e 2 A 4 E −Y− 3 b NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. L DIM A b C D E e L HE HE C 5 PL 6 0.08 (0.003) M X Y MILLIMETERS MIN NOM MAX 0.50 0.55 0.60 0.17 0.22 0.27 0.08 0.12 0.18 1.50 1.60 1.70 1.10 1.20 1.30 0.5 BSC 0.10 0.20 0.30 1.50 1.60 1.70 INCHES NOM MAX 0.021 0.023 0.009 0.011 0.005 0.007 0.062 0.066 0.047 0.051 0.02 BSC 0.004 0.008 0.012 0.059 0.062 0.066 MIN 0.020 0.007 0.003 0.059 0.043 SOLDERING FOOTPRINT* 0.3 0.0118 0.45 0.0177 1.35 0.0531 1.0 0.0394 0.5 0.5 0.0197 0.0197 SCALE 20:1 mm Ǔ ǒinches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 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