MBR440MFS D

MBR440MFS, NRVB440MFS
SWITCHMODE
Power Rectifiers
These state−of−the−art devices have the following features:
Features
• Low Power Loss / High Efficiency
• New Package Provides Capability of Inspection and Probe After
•
•
•
•
•
•
Board Mounting
Guardring for Stress Protection
Low Forward Voltage Drop
175°C Operating Junction Temperature
NRVB Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
WF Suffix for Products with Wettable Flanks
These are Pb−Free and Halide−Free Devices
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SCHOTTKY BARRIER
RECTIFIERS
4 AMPERES
40 VOLTS
5,6
1,2,3
MARKING
DIAGRAM
Mechanical Characteristics:
•
•
•
•
•
Case: Epoxy, Molded
Epoxy Meets Flammability Rating UL 94−0 @ 0.125 in.
Lead Finish: 100% Matte Sn (Tin)
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
Device Meets MSL 1 Requirements
Applications
• Ideally Suited for use as an Output Rectifier in High Frequency
•
•
(up to 2 MHz) Automotive and Non−Automotive Applications
Output Rectification in Compact Portable Consumer Applications
Freewheeling Diode used with Inductive Loads
A
1
SO−8 FLAT LEAD
CASE 488AA
STYLE 2
B440
A
Y
W
ZZ
A
A
C
B440
AYWZZ
C
Not Used
= Specific Device Code
= Assembly Location
= Year
= Work Week
= Lot Traceability
ORDERING INFORMATION
Device
Package
Shipping†
MBR440MFST1G
SO−8 FL
(Pb−Free)
1500 /
Tape & Reel
MBR440MFST3G
SO−8 FL
(Pb−Free)
5000 /
Tape & Reel
NRVB440MFST1G
SO−8 FL
(Pb−Free)
1500 /
Tape & Reel
NRVB440MFST3G
SO−8 FL
(Pb−Free)
5000 /
Tape & Reel
NRVB440MFSWFT1G
SO−8 FL
(Pb−Free)
1500 /
Tape & Reel
NRVB440MFSWFT3G
SO−8 FL
(Pb−Free)
5000 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2013
August, 2013 − Rev. 1
1
Publication Order Number:
MBR440MFS/D
MBR440MFS, NRVB440MFS
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
40
Average Rectified Forward Current
(Rated VR, TC = 165°C)
IF(AV)
4.0
A
Peak Repetitive Forward Current,
(Rated VR, Square Wave, 20 kHz, TC = 165°C)
IFRM
8.0
A
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)
IFSM
40
A
Storage Temperature Range
Tstg
−65 to +175
°C
Operating Junction Temperature
TJ
−55 to +175
°C
EAS
10
mJ
Unclamped Inductive Switching Energy (10 mH Inductor, Non−repetitive)
V
ESD Rating (Human Body Model)
3B
ESD Rating (Machine Model)
M4
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction−to−Case, Steady State
(Assumes 600 mm2 1 oz. copper bond pad, on a FR4 board)
Symbol
Typ
Max
Unit
RθJC
−
2.4
°C/W
0.58
0.59
0.63
0.65
10
0.070
15
0.8
ELECTRICAL CHARACTERISTICS
Instantaneous Forward Voltage (Note 1)
(iF = 4 Amps, TJ = 125°C)
(iF = 4 Amps, TJ = 25°C)
vF
Instantaneous Reverse Current (Note 1)
(Rated dc Voltage, TJ = 125°C)
(Rated dc Voltage, TJ = 25°C)
iR
1. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%.
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2
V
mA
MBR440MFS, NRVB440MFS
TYPICAL CHARACTERISTICS
100
iF, INSTANTANEOUS FORWARD
CURRENT (A)
TA = 175°C
10
TA = 125°C
TA = 150°C
1
TA = 25°C
TA = −40°C
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0
0.1
0.2
0.3
0.4
0.5
0.6
0.8
0.7
0.9 1.0
Figure 2. Maximum Instantaneous Forward
Characteristics
1.E+00
TA = 175°C
1.E−04
TA = 150°C
1.E−02
TA = 125°C
1.E−03
TA = 150°C
1.E−04
TA = 25°C
1.E−05
TA = 175°C
1.E−01
TA = 125°C
1.E−03
TA = 25°C
1.E−05
1.E−06
1.E−07
TA = −40°C
1.E−06
TA = −40°C
1.E−07
1.E−08
1.E−08
0
5
10
15
20
25
30
35
40
1.E−09
0
5
10
15
20
25
30
35
VR, INSTANTANEOUS REVERSE VOLTAGE (V)
VR, INSTANTANEOUS REVERSE VOLTAGE (V)
Figure 3. Typical Reverse Characteristics
Figure 4. Maximum Reverse Characteristics
1000
C, JUNCTION CAPACITANCE (pF)
TA = −40°C
Figure 1. Typical Instantaneous Forward
Characteristics
1.E−02
TJ = 25°C
100
0
TA = 25°C
VF, INSTANTANEOUS FORWARD VOLTAGE (V)
1.E−01
10
TA = 150°C
1
VF, INSTANTANEOUS FORWARD VOLTAGE (V)
1.E+00
1.E−09
1.E−10
TA = 125°C
0.1
0.9
TA = 175°C
10
IR, INSTANTANEOUS REVERSE CURRENT (A)
0
IR, INSTANTANEOUS REVERSE CURRENT (A)
0.1
IF(AV), AVERAGE FORWARD CURRENT (A)
iF, INSTANTANEOUS FORWARD
CURRENT (A)
100
10
20
30
40
10
9
RqJC = 2.4°C/W
8
7
DC
6
5
Square Wave
4
3
2
1
0
60
80
100
120
140
160
VR, REVERSE VOLTAGE (V)
TC, CASE TEMPERATURE (°C)
Figure 5. Typical Junction Capacitance
Figure 6. Current Derating TO−220AB
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3
40
MBR440MFS, NRVB440MFS
TYPICAL CHARACTERISTICS
PF(AV), AVERAGE FORWARD
POWER DISSIPATION (W)
8
IPK/IAV = 20
7
IPK/IAV = 10
TJ = 175°C
6
5
IPK/IAV = 5
4
Square Wave
3
2
DC
1
0
0
1
2
3
4
IF(AV), AVERAGE FORWARD CURRENT (A)
Figure 7. Forward Power Dissipation
100
50% Duty Cycle
R(t) (°C/W)
20%
10 10%
5%
2%
1
0.1
0.01
Assumes 25°C ambient and soldered to
a 600 mm2 − oz copper pad on PCB
1%
Single Pulse
0.000001 0.00001
0.0001
0.001
0.01
0.1
PULSE TIME (sec)
Figure 8. Thermal Characteristics
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4
1
10
100
1000
MBR440MFS, NRVB440MFS
PACKAGE DIMENSIONS
DFN5 5x6, 1.27P
(SO−8FL)
CASE 488AA
ISSUE G
2X
0.20 C
D
2
A
B
D1
2X
0.20 C
3
q
E
2
2
DIM
A
A1
b
c
D
D1
D2
E
E1
E2
e
G
K
L
L1
M
q
4X
E1
1
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION D1 AND E1 DO NOT INCLUDE
MOLD FLASH PROTRUSIONS OR GATE
BURRS.
c
A1
4
TOP VIEW
C
3X
e
0.10 C
SEATING
PLANE
DETAIL A
A
STYLE 2:
PIN 1. ANODE
2. ANODE
3. ANODE
4. NO CONNECT
5. CATHODE
0.10 C
SIDE VIEW
8X
DETAIL A
SOLDERING FOOTPRINT*
b
0.10
C A B
0.05
c
3X
0.750
4
K
0.965
1.330
E2
L1
M
2X
0.905
2X
0.495
4.530
3.200
G
4X
1.000
e/2
1
PIN 5
(EXPOSED PAD)
4X
1.270
L
MILLIMETERS
MIN
NOM
MAX
0.90
1.00
1.10
0.00
−−−
0.05
0.33
0.41
0.51
0.23
0.28
0.33
5.15 BSC
4.50
4.90
5.10
3.50
−−−
4.22
6.15 BSC
5.50
5.80
6.10
3.45
−−−
4.30
1.27 BSC
0.51
0.61
0.71
1.20
1.35
1.50
0.51
0.61
0.71
0.05
0.17
0.20
3.00
3.40
3.80
0_
−−−
12 _
0.475
D2
BOTTOM VIEW
2X
1.530
4.560
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC
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particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
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5
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MBR440MFS/D