MC10ELT21, MC100ELT21 5 V Differential PECL to TTL Translator Description The MC10ELT/100ELT21 is a differential PECL to TTL translator. Because PECL (Positive ECL) levels are used, only +5 V and ground are required. The small outline 8-lead package and the single gate of the ELT21 makes it ideal for those applications where space, performance and low power are at a premium. The VBB pin, an internally generated voltage supply, is available to this device only. For single-ended input conditions, the unused differential input is connected to VBB as a switching reference voltage. VBB may also rebias AC coupled inputs. When used, decouple VBB and VCC via a 0.01 mF capacitor and limit current sourcing or sinking to 0.5 mA. When not used, VBB should be left open. The 100 Series contains temperature compensation. www.onsemi.com MARKING DIAGRAMS* 8 8 SOIC−8 D SUFFIX CASE 751 • • • • • • 3.5 ns Typical Propagation Delay 24 mA TTL Output Flow Through Pinouts Operating Range: VCC = 4.75 V to 5.25 V with GND = 0 V Q Output Will Default LOW with Inputs Left Open or < 1.3 V These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant 1 TSSOP−8 DT SUFFIX CASE 948R H K 1 = MC10 = MC100 1 KLT21 ALYW G 1 8 8 Features 8 HLT21 ALYW G 1 8 HT21 ALYWG G A L Y W G 1 KT21 ALYWG G = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) *For additional marking information, refer to Application Note AND8002/D. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. © Semiconductor Components Industries, LLC, 2015 August, 2015 − Rev. 13 1 Publication Order Number: MC10ELT21/D MC10ELT21, MC100ELT21 Table 1. PIN DESCRIPTION NC D0 1 8 TTL 2 VCC 7 Pin VBB 3 NC 6 4 TTL Outputs D0, DO PECL Differential Outputs VBB Reference Voltage Output VCC Positive Supply GND Ground NC No Connect Q0 PECL D0 Function Q0 5 GND Figure 1. 8−Lead Pinout and Logic Diagram (Top View) Table 2. ATTRIBUTES Characteristics Value Internal Input Pulldown Resistor 50 kW Internal Input Pullup Resistor ESD Protection N/A Human Body Model > 2 kV Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1) Pb−Free Pkg SOIC−8 TSSOP−8 Flammability Rating Level 1 Level 3 Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in Transistor Count 81 Devices Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test 1. For additional information, see Application Note AND8003/D. Table 3. MAXIMUM RATINGS Symbol Parameter Condition 1 Condition 2 Rating Unit 7 V 0 to 6 V ± 0.5 mA −40 to +85 °C VCC PECL Power Supply GND = 0 V VIN PECL Input Voltage GND = 0 V IBB VBB Sink/Source TA Operating Temperature Range Tstg Storage Temperature Range −65 to +150 °C qJA Thermal Resistance (Junction−to−Ambient) 0 lfpm 500 lfpm SOIC−8 SOIC−8 190 130 °C/W °C/W qJC Thermal Resistance (Junction−to−Case) Standard Board SOIC−8 41 to 44 °C/W qJA Thermal Resistance (Junction−to−Ambient) 0 lfpm 500 lfpm TSSOP−8 TSSOP−8 185 140 °C/W °C/W Tsol Wave Solder <2 to 3 sec @ 260°C 265 °C Pb−Free VI VCC Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. www.onsemi.com 2 MC10ELT21, MC100ELT21 Table 4. 10ELT SERIES PECL INPUT DC CHARACTERISTICS VCC = 5.0 V; GND = 0.0 V (Note 2) −40°C Symbol Characteristic Min Typ 25°C Max Min Typ 85°C Max Min Typ Max Unit VIH Input HIGH Voltage (Single−Ended) 3770 4110 3870 4190 3930 4265 mV VIL Input LOW Voltage (Single−Ended) 3050 3500 3050 3520 3050 3555 mV VBB Output Voltage Reference 3.57 3.7 3.65 3.75 3.69 3.81 V VIHCMR Input HIGH Voltage Common Mode Range (Differential Configuration) (Note 3) 2.2 5.0 2.2 5.0 2.2 5.0 V IIH Input HIGH Current 175 mA IIL Input LOW Current 255 0.5 175 0.5 mA 0.3 NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. 2. Output parameters vary 1:1 with VCC. VCC can vary ± 0.25 V. 3. VIHCMR min varies 1:1 with GND, VIHCMR max varies 1:1 with VCC. Table 5. 100ELT SERIES PECL INPUT DC CHARACTERISTICS VCC = 5.0 V; GND = 0.0 V (Note 4) −40°C Symbol Characteristic Min Typ 25°C Max Min Typ 85°C Max Min Typ Max Unit VIH Input HIGH Voltage (Single−Ended) 3835 4120 3835 4120 3835 4120 mV VIL Input LOW Voltage (Single−Ended) 3190 3525 3190 3525 3190 3525 mV VBB Output Voltage Reference 3.62 3.74 3.62 3.74 3.62 3.745 V VIHCMR Input HIGH Voltage Common Mode Range (Differential Configuration) (Note 5) 2.2 5.0 2.2 5.0 2.2 5.0 V IIH Input HIGH Current 175 mA IIL Input LOW Current 255 0.5 175 0.5 mA 0.5 NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. 4. Input parameters vary 1:1 with VCC. VCC can vary ± 0.25 V. 5. VIHCMR min varies 1:1 with GND, VIHCMR max varies 1:1 with VCC. Table 6. TTL OUTPUT DC CHARACTERISTICS VCC = 4.75 V to 5.25 V; TA = −40°C to 85°C) Symbol Characteristic Condition Min Typ 2.4 Max Unit (Note 6) V 0.5 V VOH Output HIGH Voltage IOH = −3.0 mA VOL Output LOW Voltage IOL = 24 mA ICCH Power Supply Current 20 29 mA ICCL Power Supply Current 22 32 mA IOS Output Short Circuit Current −60 mA −150 NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. 6. Maximum level is VCC − 0.7 by design. www.onsemi.com 3 MC10ELT21, MC100ELT21 AC CHARACTERISTICS VCC = 4.75 V to 5.25 V; GND = 0.0 V (Note 7) −40°C Symbol Characteristic Min Typ 25°C Max Min Typ 85°C Max Min Typ Max 100 Unit fmax Maximum Toggle Frequency MHz tJITTER Random Clock Jitter (RMS) tPLH Propagation Delay @ 1.5 V 2.0 5.5 2.0 5.5 2.0 5.5 ns tPHL Propagation Delay @ 1.5 V 2.0 5.5 2.0 5.5 2.0 5.5 ns VPP Input Swing (Note 8) 200 1000 200 1000 200 1000 mV tr/tf Output Rise/Fall Time (10−90%) 35 ps 750 ps NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. 7. RL = 500 W to GND and CL = 20 pF to GND. Refer to Figure 2. 8. VPP(min) is the minimum input swing for which AC parameters are guaranteed. The device has a DC gain of ≈ 40. APPLICATION TTL RECEIVER CHARACTERISTIC TEST *CL includes fixture capacitance CL * RL AC TEST LOAD GND Figure 2. TTL Output Loading Used for Device Evaluation www.onsemi.com 4 MC10ELT21, MC100ELT21 ORDERING INFORMATION Package Shipping† MC10ELT21DG SOIC−8 (Pb−Free) 98 Units / Rail MC10ELT21DR2G SOIC−8 (Pb−Free) 2500 / Tape & Reel MC10ELT21DTG TSSOP−8 (Pb−Free) 100 Units / Rail MC10ELT21DTR2G TSSOP−8 (Pb−Free) 2500 / Tape & Reel MC100ELT21DG SOIC−8 (Pb−Free) 98 Units / Rail MC100ELT21DR2G SOIC−8 (Pb−Free) 2500 / Tape & Reel MC100ELT21DTG TSSOP−8 (Pb−Free) 100 Units / Rail MC100ELT21DTR2G TSSOP−8 (Pb−Free) 2500 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Resource Reference of Application Notes AN1405/D − ECL Clock Distribution Techniques AN1406/D − Designing with PECL (ECL at +5.0 V) AN1503/D − ECLinPSt I/O SPiCE Modeling Kit AN1504/D − Metastability and the ECLinPS Family AN1568/D − Interfacing Between LVDS and ECL AN1672/D − The ECL Translator Guide AND8001/D − Odd Number Counters Design AND8002/D − Marking and Date Codes AND8020/D − Termination of ECL Logic Devices AND8066/D − Interfacing with ECLinPS AND8090/D − AC Characteristics of ECL Devices www.onsemi.com 5 MC10ELT21, MC100ELT21 PACKAGE DIMENSIONS SOIC−8 NB CASE 751−07 ISSUE AK NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751−01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07. −X− A 8 5 S B 0.25 (0.010) M Y M 1 4 K −Y− G C N DIM A B C D G H J K M N S X 45 _ SEATING PLANE −Z− 0.10 (0.004) H M D 0.25 (0.010) M Z Y S X J S SOLDERING FOOTPRINT* 1.52 0.060 7.0 0.275 4.0 0.155 0.6 0.024 1.270 0.050 SCALE 6:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 6 MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8_ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0 _ 8 _ 0.010 0.020 0.228 0.244 MC10ELT21, MC100ELT21 PACKAGE DIMENSIONS TSSOP−8 DT SUFFIX CASE 948R−02 ISSUE A 8x 0.15 (0.006) T U K REF 0.10 (0.004) S 2X L/2 8 1 PIN 1 IDENT S T U V S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 6. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. S 5 0.25 (0.010) B −U− L 0.15 (0.006) T U M M 4 A −V− F DETAIL E C 0.10 (0.004) −T− SEATING PLANE D −W− G DETAIL E DIM A B C D F G K L M MILLIMETERS MIN MAX 2.90 3.10 2.90 3.10 0.80 1.10 0.05 0.15 0.40 0.70 0.65 BSC 0.25 0.40 4.90 BSC 0_ 6_ INCHES MIN MAX 0.114 0.122 0.114 0.122 0.031 0.043 0.002 0.006 0.016 0.028 0.026 BSC 0.010 0.016 0.193 BSC 0_ 6_ ECLinPS is a trademark of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. 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