MC10H124 D

MC10H124
Quad TTL-to-MECL
Translator With TTL Strobe
Input
Description
http://onsemi.com
The MC10H124 is a quad translator for interfacing data and control
signals between a saturated logic section and the MECL section of
digital systems. The 10H part is a functional/pinout duplication of the
standard MECL 10K™ family part, with 100% improvement in
propagation delay, and no increase in power−supply current.
MARKING DIAGRAMS*
16
Features
MC10H124L
AWLYYWW
• Propagation Delay, 1.5 ns Typical
• Improved Noise Margin 150 mV
•
•
•
5
16
7
3
1
10
12
15
11
13
14
MC10H124P
AWLYYWWG
16
4
2
6
1
CDIP−16
L SUFFIX
CASE 620A
(Over Operating Voltage and Temperature Range)
Voltage Compensated
MECL 10K Compatible
Pb−Free Packages are Available*
1
PDIP−16
P SUFFIX
CASE 648
1
10H124
ALYWG
SOEIAJ−16
CASE 966
1 20
GND = PIN 16
VCC ( +5.0 VDC) = PIN 9
VEE ( -5.2 VDC) = PIN 8
Figure 1. Logic Diagram
20 1
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
PLLC−20
FN SUFFIX
CASE 775
QFN−16
MN SUFFIX
CASE 485G
A
WL, L
YY, Y
WW, W
G or G
10H124G
AWLYYWW
MC100
H124MN
ALYWG
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
*For additional marking information, refer to
Application Note AND8002/D.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
© Semiconductor Components Industries, LLC, 2010
June, 2010 − Rev. 11
1
Publication Order Number:
MC10H124/D
MC10H124
GND COUT DOUT DOUT Exposed Pad (EP)
BOUT
1
16
GND
AOUT
2
15
COUT
BOUT
3
14
DOUT
AOUT
4
13
AIN
5
16
BOUT
1
DOUT
AOUT
2
12
COUT
BOUT
6
11
DIN
AOUT
BIN
7
10
CIN
VEE
8
9
VCC
COMMON
STROBE
15
14
13
12
COUT
11
DIN
3
10
CIN
4
9
VCC
MC10H124
5
6
7
8
AIN COMMON BIN VEE
STROBE
Pin assignment for QFN16 Package.
Pin assignment is for Dual−in−Line Package.
For PLCC pin assignment, see Table 1.
Figure 2. Pin Assignment
Table 1. DIP CONVERSION TABLE
16−Pin DIL to 20−Pin PLCC
16 PIN DIL
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
20 PIN PLCC
2
3
4
5
7
8
9
10
12
13
14
15
17
18
19
20
Table 2. MAXIMUM RATINGS
Rating
Unit
VEE
Symbol
Power Supply (VCC = 5.0 V)
Characteristic
−8.0 to 0
Vdc
VCC
Power Supply (VEE = −5.2 V)
0 to +7.0
Vdc
VI
Input Voltage (VCC = 5.0 V) TTL
0 to VCC
Vdc
Iout
Output Current − Continuous
− Surge
50
100
mA
TA
Operating Temperature Range
0 to +75
°C
Tstg
Storage Temperature Range − Plastic
− Ceramic
−55 to +150
−55 to +165
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
http://onsemi.com
2
MC10H124
Table 3. ELECTRICAL CHARACTERISTICS (VEE = −5.2 V ±5%, VCC = 5.0 V ± 5.0%)
0°
Symbol
Characteristic
25°
75°
Min
Max
Min
Max
Min
Max
Unit
IE
Negative Power
Supply Drain Current
−
72
−
66
−
72
mA
ICCH
ICCL
Positive Power
Supply Drain Current
−
−
16
25
−
−
16
25
−
−
18
25
mA
IR
Reverse Current
Pin 6
Pin 7
−
−
200
50
−
−
200
50
−
−
200
50
Forward Current
Pin 6
Pin 7
−
−
−12.8
−3.2
−
−
−12.8
−3.2
−
−
−12.8
−3.2
IF
mA
mA
V(BR)in
Input Breakdown Voltage
5.5
−
5.5
−
5.5
−
Vdc
VI
Input Clamp Voltage
−
−1.5
−
−1.5
−
−1.5
Vdc
VOH
High Output Voltage
−1.02
−0.84
−0.98
−0.81
−0.92
−0.735
Vdc
VOL
Low Output Voltage
−1.95
−1.63
−1.95
−1.63
−1.95
−1.60
Vdc
VIH
High Input Voltage
2.0
−
2.0
−
2.0
−
Vdc
VIL
Low Input Voltage
−
0.8
−
0.8
−
0.8
Vdc
1. Each MECL 10H™ series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been
established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 Ifpm is maintained.
Outputs are terminated through a 50 W resistor to −2.0 V.
Table 4. AC CHARACTERISTICS
0°
Symbol
Characteristic
25°
75°
Min
Max
Min
Max
Min
Max
Unit
tpd
Propagation Delay
0.55
2.5
0.55
2.65
0.85
3.1
ns
tr
Rise Time
0.5
1.5
0.5
1.6
0.5
1.7
ns
tf
Fall Time
0.5
1.5
0.5
1.6
0.5
1.7
ns
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
http://onsemi.com
3
MC10H124
APPLICATIONS INFORMATION
The MC10H124 has TTL−compatible inputs and MECL
complementary open−emitter outputs that allow use as an
inverting/non−inverting translator or as a differential line
driver. When the common strobe input is at the low−logic
level, it forces all true outputs to a MECL low−logic state
and all inverting outputs to a MECL high−logic state.
An advantage of this device is that TTL−level information
can be transmitted differentially, via balanced twisted pair
lines, to MECL equipment, where the signal can be received
by the MC10H115 or MC10H116 differential line receivers.
The power supply requirements are ground, +5.0 V, and
−5.2 V.
ORDERING INFORMATION
Package
Shipping†
MC10H124FN
PLCC−20
46 Units / Rail
MC10H124FNG
PLCC−20
(Pb−Free)
46 Units / Rail
MC10H124FNR2
PLCC−20
500 / Tape & Reel
MC10H124FNR2G
PLCC−20
(Pb−Free)
500 / Tape & Reel
MC10H124L
CDIP−16
25 Units / Rail
MC10H124M
SOEIAJ−16
50 Units / Rail
MC10H124MG
SOEIAJ−16
(Pb−Free)
50 Units / Rail
MC10H124MEL
SOEIAJ−16
2000 / Tape & Reel
MC10H124MELG
SOEIAJ−16
(Pb−Free)
2000 / Tape & Reel
MC10H124P
PDIP−16
25 Units / Rail
MC10H124PG
PDIP−16
(Pb−Free)
25 Units / Rail
MC10H125MNG
QFN−16, 3 x 3 mm
(Pb−Free)
123 Units / Rail
MC10H124MNTXG
QFN−16, 3 x 3 mm
(Pb−Free)
3000 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
Resource Reference of Application Notes
AN1405/D
− ECL Clock Distribution Techniques
AN1406/D
− Designing with PECL (ECL at +5.0 V)
AN1503/D
− ECLinPSt I/O SPiCE Modeling Kit
AN1504/D
− Metastability and the ECLinPS Family
AN1568/D
− Interfacing Between LVDS and ECL
AN1672/D
− The ECL Translator Guide
AND8001/D
− Odd Number Counters Design
AND8002/D
− Marking and Date Codes
AND8020/D
− Termination of ECL Logic Devices
AND8066/D
− Interfacing with ECLinPS
AND8090/D
− AC Characteristics of ECL Devices
http://onsemi.com
4
MC10H124
PACKAGE DIMENSIONS
20 LEAD PLLC
CASE 775−02
ISSUE F
B
0.007 (0.180)
Y BRK
−N−
M
T L-M
0.007 (0.180)
U
M
N
S
T L-M
S
G1
0.010 (0.250)
S
N
S
D
−L−
−M−
Z
W
20
D
1
X
V
S
T L-M
S
N
S
VIEW D−D
A
0.007 (0.180)
M
T L-M
S
N
S
R
0.007 (0.180)
M
T L-M
S
N
S
Z
C
H
−T−
VIEW S
G1
0.010 (0.250) S T L-M
SEATING
PLANE
F
VIEW S
S
N
T L-M
S
N
S
K
0.004 (0.100)
J
M
K1
E
G
0.007 (0.180)
S
NOTES:
1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M,
1982.
2. DIMENSIONS IN INCHES.
3. DATUMS −L−, −M−, AND −N− DETERMINED WHERE TOP
OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD
PARTING LINE.
4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT
DATUM −T−, SEATING PLANE.
5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.
6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER
THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE
BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY
MISMATCH BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION
TO BE GREATER THAN 0.037 (0.940). THE DAMBAR
INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO
BE SMALLER THAN 0.025 (0.635).
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
INCHES
MIN
MAX
0.385
0.395
0.385
0.395
0.165
0.180
0.090
0.110
0.013
0.021
0.050 BSC
0.026
0.032
0.020
−−−
0.025
−−−
0.350
0.356
0.350
0.356
0.042
0.048
0.042
0.048
0.042
0.056
−−− 0.020
2_
10 _
0.310
0.330
0.040
−−−
MILLIMETERS
MIN
MAX
9.78
10.03
9.78
10.03
4.20
4.57
2.29
2.79
0.33
0.53
1.27 BSC
0.66
0.81
0.51
−−−
0.64
−−−
8.89
9.04
8.89
9.04
1.07
1.21
1.07
1.21
1.07
1.42
−−−
0.50
2_
10 _
7.88
8.38
1.02
−−−
http://onsemi.com
5
0.007 (0.180)
M
T L-M
S
N
S
MC10H124
PACKAGE DIMENSIONS
SOEIAJ−16
CASE 966−01
ISSUE A
16
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
LE
9
Q1
E HE
1
M_
L
8
Z
DETAIL P
D
e
VIEW P
A
DIM
A
A1
b
c
D
E
e
HE
L
LE
M
Q1
Z
A1
b
0.13 (0.005)
c
0.10 (0.004)
M
CDIP−16
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620A−01
ISSUE O
B
A
A
16
9
1
8
B
M
L
16X
0.25 (0.010)
E
F
C
K
T
N
SEATING
PLANE
G
16X
0.25 (0.010)
M
D
T A
http://onsemi.com
6
M
J
T B
MILLIMETERS
MIN
MAX
--2.05
0.05
0.20
0.35
0.50
0.10
0.20
9.90
10.50
5.10
5.45
1.27 BSC
7.40
8.20
0.50
0.85
1.10
1.50
10 _
0_
0.70
0.90
--0.78
INCHES
MIN
MAX
--0.081
0.002
0.008
0.014
0.020
0.007
0.011
0.390
0.413
0.201
0.215
0.050 BSC
0.291
0.323
0.020
0.033
0.043
0.059
10 _
0_
0.028
0.035
--0.031
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
5 THIS DRAWING REPLACES OBSOLETE
CASE OUTLINE 620-10.
DIM
A
B
C
D
E
F
G
H
K
L
M
N
INCHES
MIN
MAX
0.750
0.785
0.240
0.295
--0.200
0.015
0.020
0.050 BSC
0.055
0.065
0.100 BSC
0.008
0.015
0.125
0.170
0.300 BSC
0_
15 _
0.020
0.040
MILLIMETERS
MIN
MAX
19.05
19.93
6.10
7.49
--5.08
0.39
0.50
1.27 BSC
1.40
1.65
2.54 BSC
0.21
0.38
3.18
4.31
7.62 BSC
0_
15 _
0.51
1.01
MC10H124
PACKAGE DIMENSIONS
PDIP−16
CASE 648−08
ISSUE T
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS
WHEN FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE
MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
−A−
16
9
1
8
B
F
C
L
S
−T−
H
SEATING
PLANE
K
G
D
M
J
16 PL
0.25 (0.010)
M
T A
M
http://onsemi.com
7
DIM
A
B
C
D
F
G
H
J
K
L
M
S
INCHES
MIN
MAX
0.740 0.770
0.250 0.270
0.145 0.175
0.015 0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008 0.015
0.110 0.130
0.295 0.305
0_
10 _
0.020 0.040
MILLIMETERS
MIN
MAX
18.80 19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0_
10 _
0.51
1.01
MC10H124
PACKAGE DIMENSIONS
QFN16 3x3, 0.5P
CASE 485G−01
ISSUE E
D
ÇÇÇ
ÇÇÇ
ÇÇÇ
PIN 1
LOCATION
2X
A
B
DETAIL A
ALTERNATE TERMINAL
CONSTRUCTIONS
E
ÉÉ
ÉÉ
EXPOSED Cu
0.10 C
TOP VIEW
(A3)
DETAIL B
0.05 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
L1
0.10 C
2X
L
L
A1
DETAIL B
A
0.05 C
ÉÉ
ÉÉ
ÇÇ
A3
MOLD CMPD
ALTERNATE
CONSTRUCTIONS
NOTE 4
A1
SIDE VIEW
C
SEATING
PLANE
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
MILLIMETERS
MIN
MAX
0.80
1.00
0.00
0.05
0.20 REF
0.18
0.30
3.00 BSC
1.65
1.85
3.00 BSC
1.65
1.85
0.50 BSC
0.18 TYP
0.30
0.50
0.00
0.15
RECOMMENDED
SOLDERING FOOTPRINT*
0.10 C A B
16X
L
DETAIL A
D2
8
4
16X
16X
0.58
PACKAGE
OUTLINE
1
9
2X
E2
K
2X
1.84 3.30
1
16X
16
e
e/2
BOTTOM VIEW
16X
0.30
b
0.10 C A B
0.05 C
0.50
PITCH
NOTE 3
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ECLinPS is a trademark of Semiconductor Components Industries, LLC (SCILLC).
MECL 10H and MECL 10K are trademarks of Motorola, Inc.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent
rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other
applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur.
Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries,
affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury
or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an
Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
http://onsemi.com
8
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
MC10H124/D